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Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP 2017, Poly Technical University of Bucharest) July 10, 2014 Prof. M.-C. Frank Chang National Chiao Tung University, Hsinchu, Taiwan Email: [email protected] 1

Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

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Page 1: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Next Generation Communication, Radar, Imaging

Systems-on-Chip

High-Speed Electronics Laboratory

(RTSP 2017, Poly Technical University of Bucharest)July 10, 2014

Prof. M.-C. Frank Chang

National Chiao Tung University, Hsinchu, Taiwan

Email: [email protected]

1

Page 2: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Outline

� Introduction

� Advantages and Challenges in Building Radio, Radar and Imager at (Sub)-mm-Wave or Terahertz Frequency Range

� Mm-Wave to Terahertz CMOS Systems-on-Chip

� Wireless/Wireline Links

� Broadband Self-Healing Radio-on-a-Chip

High-Speed Electronics Laboratory

� Broadband Self-Healing Radio-on-a-Chip

� 144-495GHz Radar and Imaging

� Digital Controlled Artificial Dielectric (DiCAD) with Tunable Permittivity for Reconfigurable Terahertz Systems

� Historical Artificial Dielectric

� Synthesizing DiCAD in Deep-Scaled CMOS

� Reconfigurable/Scalable DiCAD Circuit Designs

Page 3: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Electromagnetic Wave Spectrum

High-Speed Electronics Laboratory

1 Tera-Hertz = 1012/sec (one trillion times per sec)

(Courtesy JPL)US National GDP $16.8 trillion

Page 4: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Galactic Evolution Since Big Bang

2.7K Cosmic Microwave Background from COBE

High-Speed Electronics Laboratory

Cosmic Microwave Background (CMB) was detected by Arno

Penzias and Rob Wilson in 1964 by using a Dicke Radiometer with

perfectly fitted Planck Blackbody radiation temperature of 2.7K Dicke Radiometer at Crawford

Hill of ATT Bell Laboratories

Page 5: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Earth Science Applications

• Stratospheric and Tropospheric Chemistry

‐ ozone layer modeling

‐ economics vs. environment

‐ water distribution/pollutants

• Clouds: Global Warming

‐ ice crystal: size & distribution

• Aerosols, Volcanism, Dust

High-Speed Electronics Laboratory

Herschel Space

Observatory

Ozone at 2.5 THz

Remote Sensing with Fine Height Resolution (≈ 1 km) via Limb Scanning

heterodyne measurements yield Temp, Pressure, and ppm abundances

(Courtesy JPL)

Page 6: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

CMB Polarization at mm-Wave

High-Speed Electronics Laboratory

Page 7: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Potential Advantages

• Higher data rate at a fixed fractional bandwidth

• Quasi-optical nature

• Easier formation of radiation beam

Terahertz Advantages & Issues

High-Speed Electronics Laboratory

Issues

• Technology constraints (Terahertz Gap)

• High Path loss due to H2O/O2 absorption

Page 8: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Prof. J. C. Bose and Terahertz

High-Speed Electronics Laboratory

Prof. J. C. Bose laid the foundation of Terahertz Technology

Page 9: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Can We Generate THz Signal Performance/Cost-Effectively ?

(By Using TSMC CMOS)

High-Speed Electronics Laboratory

Page 10: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Generating THz Signals

• Quantum cascade lasers (QCL)

• Free electron lasers (FEL)

• Laser driven THz emitters

• Solid state circuits

• III/V technologies (multiplier chain in waveguides)

III/V in Waveguide

QCL FEL

Laser THz emitter

High-Speed Electronics Laboratory

chain in waveguides)

• Silicon SoC technologies (compact, monolithic integrated with digital circuits)

• SiGe HBT technologies

• CMOS technologies

CMOS THz source

2x2 mm2

Page 11: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Terahertz Gap

1.0E+00

1.0E+01

1.0E+02

1.0E+03

Ou

tpu

t P

ow

er

W

mWQuantum Cascade CMOS/SiGe

Gunn Diodes

GaAs/InP

Multiplier

BWO Gas Laser

High-Speed Electronics Laboratory

1.0E-05

1.0E-04

1.0E-03

1.0E-02

1.0E-01

0.01 0.1 1 10

THz

Ou

tpu

t P

ow

er

µµµµW

Cascade Lasers

CMOS/SiGe

Multiplier

0.3 ∼ 30.3 ∼ 30.3 ∼ 30.3 ∼ 3 THz

Page 12: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Generating Harmonics from Oscillator

C LR

I

Amp

+

+

...

Freq.

domain

Oscillation waveforms

High-Speed Electronics Laboratory

f 3f 5f

...

Question:

How to suppress power at fundamental frequency (f )but enhance signal power at specific harmonics (N*f ) ?

Page 13: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

THz Harmonic Oscillator

Enhancing 2nd harmonic:

Push-push oscillator

Triple-push oscillator

f 2f

...

Freq. domain

Freq. domainEnhancing 3rd harmonic:

High-Speed Electronics Laboratory

Triple-push oscillator

Quadruple …

Quintuple …

f 2f

...

Freq. domain

3f

Enhancing N-th harmonic:

Page 14: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Phase Locked 550GHz Radiator Element

•TPCO front-end plus frequency dividers

•Digital back-end plus off-chip 106MHz reference source.

TPCO: triple-push Colpitts oscillator

ILFD: injection-locked frequency divider

PLL: phase locked loop

High-Speed Electronics Laboratory

PLL: phase locked loop

SSPD: sub-sampling phase detector

Gm: transconductance cell

LPF: low pass filter

DiCAD enables 2nd and 3rd ILFDs to work in a wide band range from 41 to 52 GHz, potentially support THz range from 0.49 to 0.62THz.

Page 15: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Generating Locked Signal at 550GHz Using SoC

Slot antenna

VGG

TLbias

1/4 λ@fund.

0o

120o

240o

60o

180o

300o

0o

120o

240o

60o

180o

300o

120o

0o

240o

60o

300o

120o

240o

120o

240o

60o

300o

120o

0o

240o

0o

120o

240o

60o

180o

300o

120o

240o

60o

300o

120o

0o

240o

0o

120o

240o

60o

180o

300o

120o

240o

60o

300o

120o

0o

240o

0o

180o

0o

180o

0o

180o

0o

180o Antenna Design

Simulated Antenna Input Matching

High-Speed Electronics Laboratory

Osc. Element: Source Core:

300120

0o 180

o0

o 180o

120 300

0o 180

o

120 300

0o 180

o

120 300

0o

180o

0o

180o

0o

180o

0o

180o

Phase of fundamental current (in black): 180o

Note:Phase of third harmonic current (in red): 180

o

Sync. Bridge:

• 2x4 differential antenna array driven by 8 pairs of synchronized VCOs at 550GHz.

• In-phase feeding enabling spatial power combining

550GHz Coherent VCO array

[3] Yan Zhao, M.-C. Frank Chang, et. al, “A 0.54-0.55 THz 2x4 Coherent Source Array with EIRP of 24.4 dBm in 65nm CMOS Technology", to be presented in IEEE International Microwave Symposium (IMS), 2015,

Page 16: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Radiation Power Test Setup

Golay

Cell THz

Power

Meter

Frequency &

Phase Noise

Measurement

0.55THz die

+Si-lens+PCB

Horn+

harmonic mixer

(500-700GHz)

Radiation

Power

0.55THz die

+Si-lens+PCB

Lockin

Amp.

IF (0-40GHz)

LO (Ka-band)

To Spectrum Analyzer

From Freq Synth.

RBW=300kHz

Marker Delta=-24.5dB

P.N.=-79.3dBc/Hz@1MHz

Characterizing 0.54-0.55THz VCO Array Radiator

High-Speed Electronics Laboratory

• Silicon lens on backside of Si-substrate

• 0.54 to 0.55 THz frequency tuning range

• 126uW total radiation power at 0.55 THz

• -79dBc/Hz@1MHz phase noise at 0.55 THz

• 4 separate antenna beams in E-plane

Meter

Optical

Chopper

Measurement

Pulse Gen.15Hz

15Hz

Non-transparent

membrane to

block IR radiation

Assembled THz source

Page 17: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Can We Receive THz Signal Performance/Cost-Effectively?

(By Using TSMC CMOS)

High-Speed Electronics Laboratory

(By Using TSMC CMOS)

Page 18: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Passive Image Capture Testing

Person 1 HeadImage Capture Experiment Details

�Uses a 20dBi standard horn

�No reflectors or lens so λ/D is terrible

�Shows that we are sensitive

�Scans of 100 x 100 pixels

�Integration time of 10ms

�Scan time of about 6 minutes (yes we had to stand still this long)

High-Speed Electronics Laboratory

Person 2

Arm

Head

(yes we had to stand still this long)

Page 19: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Block Diagram of Hybrid Radiometer

High-Speed Electronics Laboratory

Page 20: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

CMOS SoC Photograph

Heterodyne Receiver SoC

�Integrated ADC for calibration

�Integrated power and temp sensors

�Integrated USB control port

Block Power

RX Chain 60 mW

LO 55 mW

High-Speed Electronics Laboratory

LO Amplifier

55 mW

Synthesizer 79 mW

IF Amplifier 10 mW

Control 3 mW

ADC 20 mW

CMOS Total 227 mW

InP Pre-Amp 30mW

Page 21: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Packaged Passive Imager Prototype

Probe

SoC

High-Speed Electronics LaboratoryWE3F-2

InP MMICs

SoC in Package

Pre-Amplifiers

Page 22: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

InP MMIC Pre-amplifiers

High-Speed Electronics Laboratory

MMIC Pre-Amplifier� Traditional MMIC techniques in awesome NGC technology (InP HEMT 35nm)

� Reasonable 25-30 dB gain in the frequency band of interest.

� Burns about 30mW total for both stages.

Page 23: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

For Radar and Imaging Systems

High-Speed Electronics Laboratory

Page 24: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Digital Regeneration Receiver(Non-Coherent Receiver)

High-Speed Electronics Laboratory

Adding a digital latch circuit allows the oscillator

to restart each clock. When the oscillator starts it

triggers the digital reset creating a pulse width

inversely proportional to input power

Page 25: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

183GHz CMOS Active Imager Measurement Value

Frequency 183 GHz

NF 9.9 dB

Power 13.5mW

Sensitivity -72 dBm

Area 13100 um2

NEP 1.5fw/Hz0.5

Gain 1.3ms/W

Electrical Measurements

Frequency Response Time-Encoded Output

Imaging Results

High-Speed Electronics Laboratory

Frequency Response Time-Encoded Output

Sample-Targets (metals and non-metals)A) Metallic Wrench B) Computer floppy diskC) Football D) Roll of tape*All items were concealed in cardboard boxes

Page 26: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

495 GHz CMOS Super-Regenerative Receiver495 GHz Regenerative Receiver

based on 40nm TSMC CMOS technology

with total power consumption of

5mW under 1V supply voltage

High-Speed Electronics Laboratory

495GHz Image Capture

495 GHz Chopper Signal1. Sensitivity measurement of antenna-less 245 GHz

http://www.ee.ucla.edu/~atang/250_demo.mp42. 495 GHz antenna-less imager

http://www.ee.ucla.edu/~atang/494_demo.mp43. Imaging Radar Demo

http://www.ee.ucla.edu/~atang/Radar_Demo.mp4

Terahertz System Demonstrations

Page 27: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Tri-Color (350/200/50GHz) IRR Imager(Inter-modulated Regenerative Receiver)

• First reported architecture for RX to operate above Fmax

High-Speed Electronics Laboratory

Chopper Sync

350 GHz Chopper Response350 GHz Chopper Response

CMOS Tri-band ReceiverCMOS Tri-band Receiver

• First reported architecture for RX to operate above Fmax

• Fastest reported silicon receiver (SiGe or CMOS)• First multi-band sub-millimeter-wave receiver (3 bands)

Page 28: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

144 GHz CMOS Sub-Ranging 3D ImagingRadar with <0.7cm Depth Resolution (Coherent Receiver)

High-Speed Electronics Laboratory

• First mm-wave 3D imaging radar in silicon!

Page 29: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

For Communications

High-Speed Electronics Laboratory

Page 30: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Near Field Coupled “WaveConnector”

High-Speed Electronics Laboratory

• Near-field-Communication at multi-Giga-Bit/sec– Ultra-high data rate (>10Gbps) for short distance and

secured communications

– Protocol-transparent, near-universal applications

1 cm mm-Wave Wireless Link:

http://www.youtube.com/watch?v=WH92oeedNlU

Page 31: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

1Gbps 100m Optically Collimated Link at 160GHz

High-Speed Electronics Laboratory

100 cm mm-Wave Wireless Link: https://www.youtube.com/watch?v=uFDrHLZKNuM

Page 32: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

1Gbps 100m Optically Collimated Link at 160GHz

High-Speed Electronics Laboratory

Data Link Energy Efficiency: ~3pJ/bit/meter

Page 33: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Terahertz Link through Plastic Waveguide

Solid Dielectric Waveguide

PA/modulator coupler coupler

Choice of material: Non-polar plastic materials with low loss tangent.

High-Speed Electronics Laboratory

Material εr

tanδ (××××10-4)

<1GHz [1]

tanδ (××××10-4)

in Ka-band [2]

Teflon 2-2.1 <2 2-3

Polyethylene 2.2-2.4 <2 3-4

Polystyrene 2.4-2.6 <5 8-10

Polypropylene 1.5-2.2 <5 5

Page 34: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Terahertz via Hollow Plastic Cable

Noble gas filled Hollow Dielectric Waveguide

PA/modulator coupler coupler

Lowest order mode

High-Speed Electronics Laboratory

r1

r2

123

1,3: air2: dielectric

HE11 (dipole mode)

Plastic Cable for (sub)-mm-Wave Communications: https://www.youtube.com/watch?v=WQRSOdLNlGk

Page 35: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Reduced Loss via Hollow Plastic Cable

Thick Thin

High-Speed Electronics Laboratory

Solid Cable Thick

Hollow CableHollow Cable

with Cladding

Thin

Hollow Cable

Page 36: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Transceiver Circuits and System for Hollow Plastic Cable Data Link

High-Speed Electronics Laboratory

Transceiver diagrams with an air-core hollow plastic waveguide

Link system power budget and transceiver schematics

Page 37: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

Multi-Giga-bit/sec Data Link via Hollow Plastic Water Cable

High-Speed Electronics Laboratory

Page 38: Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation Communication, Radar, Imaging Systems-on-Chip High-Speed Electronics Laboratory (RTSP

• Terahertz communication is constrained by technology / air absorption, but may be benefitted from its quasi-optical characteristics

• Terahertz has great potential to offer multi-Giga-bit/sec inter-server / container data links for modern data centers with low power (<1pJ/bit/m) and low cost by using

� Collimated beam transmission in free space

Summary

High-Speed Electronics Laboratory

� Collimated beam transmission in free space

� Guided I/O signaling via plastic cable

• Circuit/Device Innovations are key enablers to facilitate Radio, Radar and Imaging Systems-on-Chip with high performance yield and cost-effectiveness

� On-Chip Self-healing for performance yield

� DiCAD for dynamic permittivity tuning