Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes.

Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.

The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging.

For more information, visit: https://doi.org/10.1142/11303

For more information, visit: https://doi.org/10.1142/10975

Editors-in-Chief

Avram Bar-Cohen (University of Maryland, USA)

Jeffrey C. Suhling (Auburn University, USA)

Andrew A. O. Tay (Singapore University of Technology and Design, Singapore)

Set 1Interconnect and Wafer Bonding

Technology

Readership: It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

In 4 Volumes

Set 3: Thermal Packaging Applications

Edited by

Avram Bar-Cohen (University of Maryland, USA)

The third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author’s 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.

Readership: Packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

► See page 2 for more details.

► See page 2 for more details.

In 3 Volumes

1080pp Aug 2019

978-981-120-111-0 (SET) US$1,350 £1,190 978-981-120-963-5 (SET) US$2,025 £1,780 (ebook-Institutions)

904pp Oct 2018

978-981-3239-66-1 (SET) US$1,200 £1,055 978-981-3239-67-8 (SET) US$1,800 £1,585 (ebook-Institutions)

Handbook Collection in Handbook Collection in Packaging Materials & Thermal PackagingPackaging Materials & Thermal Packaging

Now available on WorldSciNet Recommend this excellent resource to your librarian!

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Volume 1: Flip-Chip and Underfill Materials and TechnologyEditors: Pengli Zhu (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P R China)Gang Li (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P R China)C. P. Wong (Georgia Institute of Technology, USA)

Volume 2: Wire Bonding TechnologyEditorsDae Young Jung (State University of New York - Binghamton, USA)Stephen R. Cain (State University of New York - Binghamton, USA)William (Bill) T. Chen (Advanced Semiconductor Engineering, Inc. (ASE), Taiwan)Bahgat G. Sammakia (State University of New York - Binghamton, USA)

Volume 3: Flexible Chip I/O InterconnectsEditorsMuhannad S. Bakir (Georgia Institute of Technology, USA)Suresh K. Sitaraman (Georgia Institute of Technology, USA)

Volume 4: Wafer Bonding TechnologyEditorsKuan-Neng Chen (National Chiao Tung University, Taiwan)Chuan Seng Tan (Nanyang Technological University, Singapore)

Dr Avram Bar-Cohen is an internationally recognized leader in energy science and technology, Life Fellow of IEEE, and an Honorary Member of ASME. He is currently serving as a Principal Engineering Fellow at Raytheon Corporation — Space and Airborne Systems. His publications, lectures, short courses, and research, as well as his US government and professional service in IEEE and ASME, have helped to

create the scientific foundation for the thermal management of electronic components and systems. His current efforts focus on the system and thermal architecture of directed energy systems. He also continues to pursue and advocate for the emerging Gen3 Embedded Cooling paradigm for high heat flux electronic and photonic components in computational, RF, and laser systems.

Jeffrey C Suhling received his PhD degree in Engineering Mechanics in 1985 from the University of Wisconsin. He then joined the Department of Mechanical Engineering at Auburn University, where he currently holds the rank of Quina Distinguished Professor and Department Chair. From 2002–2008, he served as Center Director for the NSF

Center for Advance Vehicle Electronics. His research interests include solid mechanics, stress and strain analysis, material characterization, experimental mechanics, advanced and composite materials, finite element analysis and computational mechanics, additive manufacturing, electronic packaging, and silicon sensors.

Dr Andrew Tay is currently an Adjunct Fellow at the Singapore University of Technology and Design and a consultant. He is a former Professor of Mechanical Engineering at the National University of Singapore where he worked from 1975 to 2014. He has also been Visiting Professor of Guilin University of Electronic Technology in 2012 and of Central South University,

Changsha, China, in 2017. He obtained his B.E. (Hons I and University Medal) and PhD in Mechanical Engineering from the University of New South Wales, Australia.

Editors-in-Chief

The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging “learning curve,” the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

In 4 Volumes

IC chipDie attachadhesive

Bonding pad

Metal wire

Fig. 1.3. General configuration of wire bonding package and samples.

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Editors-in-Chief

About the Editor

In 3 Volumes

This Encyclopedia comes in 3 sets. To check out Set 1 and Set 2, please visit Set 1: Thermal Packaging Techniques and Set 2: Thermal Packaging Tools

Set 3: Thermal Packaging ApplicationsThe Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today’s technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.

The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.

Dr Avram Bar-Cohen is an internationally recognized leader in energy science and technology, Life Fellow of IEEE, and an Honorary Member of ASME. He is currently serving as a Principal Engineering Fellow at Raytheon Corporation — Space and Airborne Systems. His publications, lectures, short courses, and research, as well as his US government and professional service in IEEE and ASME, have helped to create the scientific foundation for the thermal management of electronic components and systems.

His current efforts focus on the system and thermal architecture of directed energy systems. He also continues to pursue and advocate for the emerging Gen3 Embedded Cooling paradigm for high heat flux electronic and photonic components in computational, RF, and laser systems.

Bar-Cohen is the first President of the newly-renamed IEEE Electronic Packaging Society (2018–2019) and has earlier served several terms on the CPMT Board of Governors, represented the Society as a Distinguished Lecturer for more than 15 years, and is a past Editor-in-Chief of CPMT Transactions (1995–2005). In 2014 he was honored by IEEE with the prestigious EPS (then CPMT) Field Award and had earlier been recognized with the CPMT Society’s Outstanding Sustained Technical Contributions Award (2002), the ITHERM Achievement Award (1998) and the THERMI Award (1997). Bar-Cohen has also received the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008), ASME’s Heat Transfer Memorial Award (1999), Edwin F. Church Medal (1994), and Worcester Reed Warner Medal (1990). From 2010 to 2016, Bar-Cohen served as a Program Manager in the Microsystem Technology Office at the US Defense Advanced Projects Agency in Virginia. Earlier he served as the Chair of Mechanical Engineering and Distinguished University Professor at the University of Maryland and is currently on a leave-of-absence from that institution. From 1998 to 2001 he directed the University of Minnesota Center for the Development of Technological Leadership and held the Sweatt Chair in Technological Leadership.

He is a past member of ASME’s Board on Professional Development and Board on Research and Technology Development, served a 3-year term as ASME VP of Research (1998–2000) and is also a past President of the Assembly of International Heat Transfer Conferences (2010–2014). Bar-Cohen is the Editor-in-Chief of the Encyclopedia of Thermal Packaging, co-editor-in-chief of the Encyclopedia of Packaging Materials, Processes, and Mechanics, the series editor-in-chief of the “World Scientific Series in Emerging Technology” and the co-series editor-in-chief of the “WSPC Series in Advanced Integration and Packaging” book series.

Fig. 6.11. Illustration of the CFD solution for Example 6.3. Temperature distribution on the cold plate top surface. Fig. 6.10. Finite-element mesh for Example 6.3.

Volume 4Cost Analysis of Electronic Systems (2nd Edition)by Peter Sandborn (University of Maryland, USA)

Volume 3Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Researchedited by Madhusudan Iyengar (Facebook, USA), Karl J L Geisler (3M, USA) & Bahgat Sammakia (Binghamton University, State University of New York, USA)

Volume 2Design and Modeling for 3D ICs and Interposersby Madhavan Swaminathan (Georgia Institute of Technology, USA) & Ki Jin Han (Ulsan National Institute of Science and Technology (UNIST), Korea)

Volume 1Cost Analysis of Electronic Systemsby Peter Sandborn (University of Maryland, USA)

UNDER CONTRACTEmbedded Passive Technologies in Electronic Packaging by C P Wong (The Chinese University of Hong Kong, Hong Kong), Rong Sun (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China) & Shihui Yu (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)

Wafer Level CSP and Embedded Active Packages by Jau et al. (Advanced Semiconductor Engineering Inc (ASE), Taiwan)

Thermoelectric Energy Conversion Devices and Systems by Kazuaki Yazawa & Ali Shakouri (Purdue University, USA)

Additive Manufacturing by Christopher Bailey (University of Greenwich, United Kingdom)

Solder Joints at Mechanical Shock by Shi-Wei Ricky Lee (Hong Kong University of Science and Technology, Hong Kong)

Power Module Design and Packaging edited by Guo-Quan (GQ) Lu (Virginia Tech, USA) & Joe Mei (Tianjin University, China)

Electronic Packaging Manufacturing and Assembly edited by Wei H Koh

WSPC Series in Advanced Integration and Packaging

Dr Avram Bar-Cohenrecipient of the 2014 IEEE CPMT AwardDepartment of Mechanical EngineeringUniversity of Maryland

In the 21st century, innovative integration and packaging drives success in the marketplace, establishing the “look and feel” of electronic products and their price point, and enabling differentiation and branding. The rapid development and proliferation of design methodologies, assembly techniques, and thermal solutions for components ranging from integrated circuits to photonics, and from sensors and MEMS to mixed signals and power amplifiers, drive the often frenetic pace of exploration, discovery, and innovation characteristic of the electronic industry. This recently introduced WSPC book series on “Advanced Integration and Packaging of Electronic Systems” (AIPack), with a particular focus on 2.5D and 3D form factors, will provide a “technology commons” for the packaging community, a place where ideas can be articulated, examined, and disseminated rapidly and efficiently through both print and electronic media. It is our hope that product developers will find AIPack a convenient and reliable source of technical information; that researchers and students will be guided to the challenges and barriers facing key technologies, and that technology managers and investors will find the tools and data needed to make broad technology assessments and comparisons for emerging packaging and integration technologies.

Series EditorsDr Shi-Wei Ricky Leerecipient of the David Feldman Outstanding Contribution Award Department of Mechanical and Aerospace Engineering Hong Kong University of Science and Technology

FORTHCOMINGSolder Materialsby Kwang-Lung Lin (National Cheng Kung University, Taiwan)

FORTHCOMINGEmbedded Dielectrics for Electronic Packagingby Shuhui Yu (Shenzhen Institutes of Advanced Technology, China & Chinese Academy of Sciences, China),Rong Sun (Shenzhen Institutes of Advanced Technology, China & Chinese Academy of Sciences, China), Ching-Ping Wong (The Chinese University of Hong Kong, Hong Kong & Georgia Institute of Technology, USA)

FORTHCOMINGCo-Design and Modelling for Advanced Integration and Packaging: Manufacturing and Reliabilityby Christopher Bailey (University of Greenwich, UK),Stoyan Stoyanov(University of Greenwich, UK) & Hua Lu(University of Greenwich, UK)

Volume 5MEMS Packagingedited by Y C Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan) &Ramesh Ramadoss (IoT Technologies Inc., USA)

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