June 2010

april 2011Americas Edition

auDio/viDEoGennum

DEvElopmENt toolsExarlattice semiconductorstmicroelectronics

Datacommicrelsmsc

DisplaYssharp

microcoNtrollErsNuvotonstmicroelectronics

poWEr maNaGEmENtlineage powerlinear technology

simplE.usEful.

proGrammablE.

see page 15

In ThIs Issue:

focus oNmEmorYGsi tEchNoloGY36mbit syncburst and Nbt srams

issihigh speed low power 4mb sram

microNparallel Nor flash for Embedded applications

phase change memory

realssD™ c400 solid state Drives

serial Nor flash for Embedded applications

stmicroElEctoNicsDual interface EEprom

Your Gateway

to today’s leading

technology products

LTspice - The Secret Ingredient for Your Design!

Come to our FREE half-day seminar and learn first hand from the program’s author, Mike Engelhardt.Become part of the phenomenon sweeping the engineering world and

join the largest independent users’ group of any SPICE program ever.

LTspice world tour 2011 is coming to a city near you.Don’t miss out - reserve your spot today.

www.nuhorizons.com/LTspice

Scan barcode for more information on the LTspice Seminar Series

PO

RTA

L C

ON

TE

NT

SFEATURED APPLICATION - FOCUS ON MEMORY Memory Applications Overview 4-5

Nu Horizons Wireless Product Matrix 6

GSI Technology 36Mbit SyncBurst and NBT SRAMs 7

ISSI High Speed Low Power 4Mb SRAM 8

Micron Parallel NOR Flash for Embedded Applications 9

Micron Phase Change Memory 10

Micron RealSSD™ C400 Solid State Drives 11

Micron Serial NOR Flash for Embedded Applications 12

STMicroelectronics Dual Interface EEPROM 13

DEVELOPMENT TOOLSExar Programmable Power Controller, Configuration

Board, and PowerArchitect ™ 3.0 Software14

Lattice Semiconductor Lattice Semiconductor Breakout Boards 15

STMicroelectronics STM8L-DISCOVERY 15

FEATURED COMPONENTSAudio / Visual Gennum’s 3rd Generation Video Optical Modules 16-17

DatacomMicrel — Low-power, Highly Integrated, 4/5-port Layer-2 Switch-on-a-Chip ICs

18

DatacomSMSC — Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet Controller

19

MicrocontrollersNuvoton — High Precision 24-bit ADC for Weight Scales and Precision Measurement Markets

20

MicrocontrollersSTMicroelectronics — 32-bit Flash microcontrollers, 120 MHz/150 DMIPS with ART Accelerator™ and advanced peripherals

21

Power ManagementLineage Power — Barracuda™ Power Modules; DC-DC Converters

22

Power ManagementLinear Technology — Octal PMBus Power Supply Monitor and Controller with EEPROM

23

Power ManagementLinear Technology — Offline Isolated Flyback LED Controller with Active PFC

24

APPLICATION NOTESLattice Semiconductor, Micrel, Wurth Midcom

Using a Micrel Ethernet PHY and a Lattice ECP3 FPGA to Create an Ethernet Subsystem

25

Lattice Semiconductor, Linear Technology

Creating a Power Subsystem for Lattice XP2 FPGAs using Linear Technology Power Devices

25

ADVERTISEMENTSLinear Technology Cooking with LTspice Seminar Series 2

SharpThe PN-E Series High Performance Professional LCD Monitors

26

Nu HorizonsDisplay and Semiconductor Technologies Available from Nu Horizons

27-31

Nu HorizonsEnhance Your Design...With Nu Horizons Education and Development Solutions

32

Nu Horizons Electronics is a leading

distributor of advanced technology

semiconductor, display, illumination,

power, system and telecommunication

solutions to a wide variety of commercial

original equipment manufacturers

(OEMs) and electronic manufacturing

services providers (EMS).

With sales facilities in 45 locations

across North America and Asia and

regional logistics centers throughout

the globe, Nu Horizons partners with

a limited number of best-in-class

suppliers to provide in-depth product

development, custom logistics and

life-cycle support to its customers.

Need more information right away?

Just use your smartphone to scan the barcodes throughout this publication and you'll link to more detailed information.

Note: You will need a QR Code Reader downloaded to your phone.

All registered trademarks displayed in this publication constitute the intellectual property of their respective holders. The technical information within this publication has been provided by Nu Horizons' suppliers. Nu Horizons does not assume any liability for its accuracy. Prices are subject to change without notice.

Many Microprocessor (MPU) or Microcontroller (MCU) applications require external data memory to store intermediate data used during computations or data transfer. Large audio files or video frames will typically require more memory that an MCU or MPU has internally. If large amounts of data need to be accessed then DRAM is usually the best alternative. For small amounts of data SRAM or PSRAM (DRAM with an SRAM interface and hidden refresh for those of you who skipped the memory Technology overview) are good choices. Data that needs to be modified frequently, like intermediate data during computation most will most likely need to use a Volatile technology- SRAM or DRAM. If the data is written to less frequently, perhaps to store configuration data that needs to be saved between power cycles (like brightness levels for LEDs displays in a kiosk) then EEPROM devices are a good fit. Small amounts of data can be easily written to, typically at the byte level, using EEPROM.

Many times the external memory controller within the MCU/MPU may dictate the choices available to the designer. Some processors have built-in SRAM, DRAM or EEPROM interfaces or even Flash controllers. Determine the types of interfaces your MCU/MPU supports (or even better select an MCU/MPU with your optimal memory interface in mind) and then select the best memory device from those supported by your MCU/MPU. Figure 1 shows three common architectures- one where a small amount of external data is required and an SRAM/PSRAM is sufficient, one where the data requirement is larger and a DRAM is needs and one where the data is modified infrequently and an EEPROM is the best choice.

Microprocessor /Microcontroller code storageOne of the more common applications for semiconductor memory is as external code storage for Microprocessors or Microcontrollers. Most Microprocessors units (MPU) require external code storage while most MCUs have internal code storage. In some applications however MCU internal code is not large enough for the application making it necessary to add external code storage to the design.

Deciding on the type of memory device to use for external storage will depend whether the processor will need to execute code directly out of the external device (Execute in Place) or if the code can first be read out of the code storage device and loaded into another memory from which the processor accesses code (Transfer and Execute). Many times the additional memory is a high capacity DRAM, perhaps with extra low power features. Initially it might seem like this takes an additional memory device, but if the processor needs an external data memory anyway (perhaps for storing large intermediate video or audio files), the use if it for code execution

as well may make sense. If the low power modes of the DRAM can reduce power significantly this can be an improvement over the use of a separate code only storage device. The data transfer from code storage to DRAM will require a small boot loader and will extend the initialization

time of the processor, but if these considerations are not critical then the Transfer and Execute approach can provide advantages.

For Execute in Place code storage Flash memory with random access, like that found with NOR devices can be utilized and provides high

capacity and low cost. NAND Flash is block oriented and thus can’t be used directly for Execute in Place applications, but is well suited for Transfer and Execute architectures. Code can be transferred a block at a time into DRAM (or even low power SRAM) and if a simple memory management controller is used not all the code needs to reside in the DRAM (or SRAM). This approach can further reduce power consumption since a smaller execution memory can be used.

coMMunications interface MeMoryCommunications processors, usually in the form of a specialized high-performance processor with integrated communications oriented peripherals, form the backbone of most modern communications

systems. These data hungry algorithms typically require external memory to buffer data and to help route packet data to the right receiving process. The example communications system in Figure 3 shows a communications processor between multiple asynchronous communications channels and a

4

FO

CU

S O

N M

EM

OR

Y

Memory ApplicationsWe will review a few common applications to illustrate how the different memory technologies advantages and disadvantages influence device selection.

Figure 1: MCU/MPU Data Storage Examples

Figure 2: MCU/MPU Code Storage Examples

Microprocessor / Microcontroller data storage

MCU/MPU

MCU/MPU

MCU/MPU

SRAM/PSRAMData Storage

DRAM Data Storage

EEPROM Data Storage

External data memoryUsing MCU/MPUs SRAM Interface

(Data used for small computation)

External data memoryUsing MCU/MPUs DRAM Interface

(Data used for large computation)

External data memoryUsing MCU/MPUs EEPROM Interface

(Data used for Configuration)

MCU/MPU

DRAM Data Storage

NOR Flash Code Storage

Code is accessed directly by the processor

(Execute in Place)

MCU/MPUDRAM or SRAM

Data/Code Storage

NAND Flash Code Storage

Code is transferred to the Data Memory and then accessed by the processor

(Transfer and Execute)

high-speed Gigabit Ethernet port. The communications channels need to be consolidated, packetized and transferred over the Gigabit Ethernet port. Communications traffic needs to meet specific Quality of Service (QoS) requirements so the Communications Processor needs to prioritize traffic in order to achieve the required service levels.

Communication systems typically require synchronization between various asynchronous communications channels and so it is in the example design. A FIFO memory is an excellent way to transition from one clock domain to another since the write port of the FIFO can run independently from the read port. The FIFO also provides the needed buffering so that data can be transferred at different burst rates, since channel inputs will not always be delivered at the same rate that the channel output needs to process data. In our example design an FPGA is used to consolidate the multiple Communications Channels, and then to transfer the data to the FIFO one buffer at a time. The Communications Processor reads the data from the FIFO, consolidates and packetizes the data for optimal transmission over the Gigabit Ethernet port. The FIFO effectively ‘bridges’ the processor time domain from the communications time domain.

During packet processing it will be important for the Communications Processor to have fast access to the routing tables and various QoS metrics needed to route packets efficiently. These tables will need to be updated frequently as traffic rates changes and sender/receiver pairs attach and detach. An RLDRAM is a good choice for the high-

speed, low latency and random access requirements of this type of algorithm. Many Communications Processors have RLDRAM interfaces built-in, making it easy to implement RLDRAM-based packet processing systems.

HandHeld instruMentation- code and data storageA variety of battery operated hand-held instrumentation applications- from simple power meter monitors to complex automatic electronic defibrillators- use MCU or MPU based processors to run the algorithms required to capture, process and record data from a variety of inputs that are usually analog. In the example design shown in Figure 4, a low-power MCU is used to sense analog inputs, process the inputs to create a digital recording and store a summary of the measurement in non-volatile memory that can be removed from the instrument for archival storage or further processing.

Applications for this type of design include environmental sensors (like temperature, chemical or radiation detectors), medical instruments (like blood glucose meters or heart rate monitors), inventory control scanner/recorders, or automotive sensors (tire pressure or air bag deployment devices)- just to name a few.

Hundreds of applications will use architectures similar to that shown in Figure 4.

The data storage memory needs to be removable and easily read/written to by the MPU. Standard interfaces like those used for Memory Cards (like CompactFlash, Secure Digital, or MicroSD) are possible options and provide a significant amount of data in a small and compact format. A

convenient option for Instrumentation designs that need to move captured data to a laptop computer for further processing is a USB Flash drive. The drive can be easily removed from the handheld device and inserted into a laptops USB port.

The intermediate data used by the data processing algorithm can be stored in low-power Mobile DDR SDRAM. In between measurements the Mobile DDR SDRAM can be put into a low-power mode that disables memory accesses to save power. Data in the memory is retained and can be accessed when a new measurement is required. Some applications might be able to save data from the SDRAM to Flash and then power down both the SDRAM and the MPU completely, reducing power consumption even more. When operation resumes the MPU will wake-up, read data from Flash and load it into SDRAM so processing can continue.

5

FO

CU

S O

N M

EM

OR

Y

Figure 3: Example Communication System Memory Requirements

Figure 4: Example Low-Power Data Memory for Example Handheld Instrumentation Application

Memory applications are as varied as memory technologies, but have

some common considerations (performance, cost, power and memory

use model) that can be used to help select the right technology for a

specific application.

RLDRAM

FIFO

FPGA

Communications Processor

Channel Consolidation and Packet Processing

Routines

MultipleCommunicationsChannels

High-speedGigabitEthernet

USB F lash Memory

Mobi le DDR

SDRAMLow-Power MPU

LCD Control,Data Processing,

User Interface KeypadLEDsSwitches

LCD Panel

Analog Inputs

Battery Charger/ Power Manager

Bat ter y

Mem

ory

Offe

ring

Mat

rix

Non-

Vola

tile

Vola

tile

Spec

ialty

M

emor

yEE

PROM

EPRO

MFl

ash

DRAM

SRAM

Serial EEPROM

Parallel EEPROM

Serial EPROM

Parallel EPROM

Serial NAND Flash

Serial NOR Flash

Parallel NOR Flash

Flash Cards

SSD Flash

DRAM

SDRAM

DDR SDRAM

DDR2 SDRAM

DDR3 SDRAM

RLDRAM

Mobile DDR SDRAM

PSRAM

SRAM

DDR SRAM

QDR SRAM

FIFO

NVRAM

Storage Controllers

X XX

X X

X

X XX

X

X

XX

XX

XX

X

XX

X X

XX

XX

XX

XX

XX

XX

XX

XX

X

XX

X

XX X

XX

X

XX

XX

XX

XX

XX

EEPR

OM: E

lectri

cally

Eras

able

Prog

ramma

ble R

ead O

nly M

emor

yEP

ROM:

Eras

able

Prog

ramma

ble R

ead O

nly M

emor

yFla

sh: E

EPRO

M typ

e mem

ory e

rased

in la

rge b

locks

NO

R: A

Flash

imple

menta

tion w

here

the m

emor

y cell

s are

interc

onne

cted u

sing a

NOR

topo

logy t

hat p

rovide

s a ra

ndom

acce

ss ca

pabil

ity, s

imila

r to s

tanda

rd m

emori

es.

NAND

: A Fl

ash i

mplem

entat

ion w

here

the m

emor

y cell

s are

interc

onne

cted u

sing a

NAN

D top

ology

that

prov

ides b

lock-

base

d acc

ess c

apab

ility,

simila

r to h

ard di

sks a

nd m

emor

y card

s. Se

rial In

terfac

e: An

inter

face m

ethod

whe

re da

ta is

read/w

ritten

seria

lly, o

ver a

small

numb

er of

pins t

o mini

mize

devic

e cos

t.Pa

ralle

l Inter

face:

An in

terfac

e meth

od w

here

data

is rea

d/writ

ten in

paral

lel, o

ver a

larg

e num

ber o

f pins

to m

axim

ize ba

ndwi

dth.

Flash

Car

ds: A

re hig

h cap

acity

data

stora

ge in

a ca

rd fo

rmat

typica

lly us

ed in

hand

-held

devic

es lik

e cam

eras,

cell p

hone

s and

porta

ble in

strum

ents.

SSD

Flash

: Soli

d Stat

e Driv

e Flas

h dev

ices o

ffer u

ltra-

high c

apac

ity in

a so

lid st

ate fo

rmat

to rep

lace t

raditio

nal m

echa

nical

(disk

) stor

age s

ystem

s.DR

AM: D

ynam

ic Ra

ndom

Acce

ss M

emor

y- H

igh ca

pacit

y mem

ory w

here

data

is sto

red on

a ca

pacit

or an

d mus

t be p

eriod

ically

refre

shed

or da

ta wi

ll be l

ost (t

heref

ore dy

nami

c).SD

RAM:

Sync

hron

ous D

RAM

uses

a clo

cked

inter

face (

sync

hron

ous)

to sim

plify

syste

m tim

ing.

DDR

SDRA

M: D

ouble

Data

Rate

SDRA

M clo

cks d

ata on

both

edge

s of t

he cl

ock t

o imp

rove b

andw

idth w

ithou

t larg

e inc

rease

s in p

in co

unt.

DDR2

SDRA

M: D

ouble

Data

Rate

Two S

DRAM

tran

sfers

data

at tw

ice th

e rate

of D

DR.

DDR3

SDRA

M: D

ouble

Data

Rate

Three

SDRA

M tra

nsfer

s data

at tw

ice th

e data

rate

of DD

R2.

RLDR

AM: R

educ

ed-L

atenc

y DRA

M off

ers fa

st SR

AM-li

ke ra

ndom

acce

ss an

d prov

ides s

ustai

ned b

andw

idth o

ver t

hat a

vaila

ble fr

om D

DR3-

type d

evice

s. Mo

bile D

DR SD

RAM:

Low

Powe

r SDR

AM de

signe

d for

batte

ry op

erated

hand

-held

mob

ile de

vices

PSRA

M: Ps

eudo

Stati

c DRA

M us

es D

RAM

techn

ology

for h

igh de

nsity

but im

pleme

nts a

stand

ard SR

AM in

terfac

e, hid

den r

efres

h and

SRAM

pin c

ompa

tibilit

y to s

impli

fy de

sign a

nd

reduc

e pow

er.SR

AM: S

tatic

Rand

om Ac

cess

Mem

ory

DDR

SRAM

: Dou

ble D

ata R

ate SR

AM tr

ansfe

rs da

ta in

burst

s at t

wice

the r

ate of

SRAM

by us

ing bo

th ed

ges o

f the

cloc

k.QD

R SR

AM: Q

uad D

ata R

ate SR

AM tr

ansfe

rs da

ta in

burst

s at t

wice

as fa

st as

SRAM

using

both

edge

s of t

he cl

ock a

nd ca

n rea

d and

writ

e sim

ultan

eous

ly.FIF

O: Fi

rst In

First

Out

memo

ry is

used

to bu

ffer d

ata be

twee

n two

diffe

rent t

ime d

omain

s like

thos

e freq

uentl

y enc

ounte

red in

comm

unica

tions

appli

catio

n.NV

RAM:

Non

-Vola

tile SR

AM pr

ovide

s batt

ery b

ack-

up w

hen p

ower

is rem

oved

to ke

ep da

ta fro

m be

ing lo

st.St

orag

e Con

trolle

rs: P

rovide

the c

ontro

l nec

essa

ry to

create

NAN

D Fla

sh-b

ased

USB

mem

ory s

ystem

s.

GSI Technology has introduced a new

screaming fast 36Mbit SyncBurst/NBT family

of SRAMs. GSI’s GS832xA family includes

pipelined, flow through, and NBT™ Fast

SRAMs with speeds up to 400 MHz in TQFP and

BGA packages. Both commercial and industrial

temperature ranges are offered as standard

products.

GSI Technology’s 36Mbit SyncBurst™

and NBT™ products are ready for customer

sampling now. Pricing ranges from $40.00 to

$60.00 in 1,000 piece quantities, depending on

speed and configuration.

FO

CU

S O

N M

EM

OR

Y

36Mbit SyncBurst and NBT SRAMsWith speeds up to 400MHz, these SRAMs are a perfect fit for upgrades to current designs that are needing a bit more speed, or for new designs that require higher speed bins.

A complete set of design options: SCD Burst, DCD Burst, NBT

x18, x32, x36 data bus widths

2.5 V/3.3 V & 1.8 V/2.5 V supply options

FLXDrive™ Programmable outputs

IEEE 1149.1 boundary scan

Industrial temperature range = standard

7

Scan barcode for more GSI SyncBurst and NBT SRAM information

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

Functions: Organizations:Package Options:

Supply Voltage:

Speeds (MHz): GSI Part#s:

SyncBurst™ (SCD)SyncBurst™ (DCD)NBT™

2Mb x 181Mb x 321Mb x 36

100 TQFP

2.5–3.3 V 400–150GS8320xxAGT-nnnGS8320ExxAGT-nnnGS8320ZxxAGT-nnn

1.8–2.5 V 333–150GS8320xxAGT-nnnVGS8320ExxAGT-nnnVGS8320ZxxAGT-nnnV

SyncBurst™ (SCD) with JTAGSyncBurst™ (DCD) with JTAGNBT™ with JTAG

2Mb x 181Mb x 321Mb x 36

165 BGA

2.5–3.3 V 400–150GS8321xxA(G)D-nnnGS8321ExxA(G)D-nnnGS8321ZxxA(G)D-nnn

1.8–2.5 V 333–150GS8321xxA(G)D-nnnVGS8321ExxA(G)D-nnnVGS8321ZxxA(G)D-nnnV

SyncBurst™ (SCD/DCD) with JTAG and FlexDrive™

2Mb x 181Mb x 36

119 BGA2.5–3.3 V 400–150 GS8322xxA(G)B-nnn

1.8–2.5 V 333–150 GS8322xxA(G)B-nnnV

165 BGA2.5–3.3 V 400–150 GS8322xxA(G)D-nnn

1.8–2.5 V 333–150 GS8322xxA(G)D-nnnV

512K x 72 209 BGA2.5–3.3 V 250–133 GS8322xx(G)C-nnn

1.8–2.5 V 250–133 GS8322xx(G)C-nnnV

NBT™ with JTAG and FlexDrive™

2Mb x 181Mb x 36

119 BGA2.5–3.3 V 400–150 GS8322ZA(G)B-nnn

1.8–2.5 V 333–150 GS8322ZA(G)B-nnnV

165 BGA2.5–3.3 V 400–150 GS8322ZA(G)D-nnn

1.8–2.5 V 333–150 GS8322ZA(G)D-nnnV

512K x 72 209 BGA2.5–3.3 V 250–133 GS8322Z(G)C-nnn

1.8–2.5 V 250–133 GS8322Z(G)C-nnnV

High Speed Low Power 4Mb SRAMSRAM with Error Correction

ISSI’s latest Error Correction based 4Mb High Speed Low Power SRAM

is currently sampling. This innovative design reinforces ISSI’s long-term

commitment to SRAMs with the highest quality and performance. This

industry’s first Error Correction Code (ECC) based Asynchronous SRAM meets

high quality requirements in automotive, industrial, military-aerospace, and

other applications.

Error Detection and Error Correction

Independent ECC with hamming code for each byte

Detect and correct one bit error per each byte

Better reliability than parity code schemes which can only detect an error but not correct an error

Backward Compatible: Drop in replacement to current in industry standard devices (without ECC)

APPLICATIONS:

Automotive

Military-Aerospace/Medical

Industrial

Telecom/Networking

FEATURES:

8

Scan barcode for more information on ISSI's4Mb SRAM solutions

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

FO

CU

S O

N M

EM

OR

Y

Memory Lower I-O

Array256Kx8

ECC Array

-

256K x4

Decoder

I/O Data Circuit

ECCColumn I/O

IO0 -7

Control Circuit

A0-A17

IO8 -15

8

ECC8

8

8

12

12

Memory Upper I-OArray256Kx8

ECC Array

-

256K x4

8 4 48

/CE/OE/WE/UB/LB

IS64WV25616EDBLL (A1) IS64WV25616EDBLL (A3) Comments

Temperature Support Industrial (-40oC to +85oC)

Automotive (-40oC to +125oC)

Contact ISSI for military temperature

Technology 65nm 65nm

Standby Current 9mA 20mA Typical value 2mA

Operating Current 45mA 65mA Typical value 25 mA

Data Retention Current 9mA 15mA Typical value 2mA

Packaging TSOP-II (44 pins) BGA (48 pins)

TSOP-II (44 pins) BGA (48 pins)

Pin compatible with industry standard 4Mb Async. SRAM

Speed 10ns 10ns

Copper Leadframe Yes YesImproved thermal

performance

Lead-free and Leaded Yes Yes RoHS Compliant

Availability Sampling Sampling

Parallel NOR Flash for Embedded ApplicationsFast, Dependable Performance

Today’s applications demand an

unprecedented combination of features—high

performance, high density, high reliability, and

low-power operation. Strike a balance among

performance needs, design requirements, and

cost by equipping your demanding platforms

with our reliable, high-performance parallel

NOR.

Our parallel NOR solutions are constructed

to meet the design requirements of consumer

and mobile products such as cell phones,

smartphones, e-readers, GPS/navigation,

and other portable, handheld, multitasking

applications. With high densities, execute-in-

place (XIP) performance, architectural flexibility,

and a track record of proven reliability, our

parallel NOR solutions are also ideal for long-

term placement in rigorous industrial settings.

9

Scan barcode for more Paralell NOR Flash information

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

FO

CU

S O

N M

EM

OR

Y

FEATURES: BENEFITS:

Density 2Mb–1Gb Industry-standard densities

Performance Burst, Page, Multibank, & Multi I/O A broad range of performance options across the product line

Security

Block/Sector LockingOTP Protection RegisterSmart Secure Krypto® Encrypted AccessHW/SW ProtectionModifiable Security Device StateProtection After Power-UpKrypto® Password Access Write Protection

Voltage 1.8V VDD, 3.0V VDD, 1.8V I/O, 3.0V I/O, 5.0V I/O Full product voltage range

FamilyCore

VoltageI/O Voltage Bus Width Density Range Burst

Multibank Option

Security Features

Access Time Package Options

P30 1.7-2.0 1.7-3.6 x16 64Mb–2Gb† X X 52 MHz burst TSOP, eBGA, QUAD+

P33 2.3-3.6 2.3-3.6 x16 64Mb–2Gb† X X 52 MHz burst TSOP, eBGA

M29EW 2.7-3.6 1.65-3.6 x8, x16 32Mb–2Gb† X100-110ns25ns page

TSOP, BGA

M29W 2.7-3.6 2.7-3.6 x8, x16 4Mb–256Mb X 45-90ns TSOP, TBGA

M29DW 2.7-3.6 2.7-3.6 x8, x16 32Mb, 128Mb–256Mb X 90ns TSOP, TFBGA

M29F†† 5 5 x16 2Mb–16Mb 55ns TSOP, SO, KGD

J3 2.7-3.6 2.7-3.6 x8, x16 32Mb–256Mb X75ns95ns (256Mb)

TSOP, eBGA

M28W 2.7-3.6 1.65-3.6 x16 16Mb–64Mb X 70-100ns TSOP, TFBGA

M58BW2.7-3.62.5-3.3(55ns)

2.7-3.62.5-3.3(55ns)

x32 16Mb–32Mb X45-70ns56-75 MHz burst

PQFP, LBGA

M58LT 1.7-2.0 2.7-3.6 x16 128Mb–256Mb X X X85ns52 MHz burst

TBGA

† Stacked solution†† Automotive temp available

PARALLEL NOR PRODUCT FAMILY OVERVIEW

10 For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

Phase Change MemoryChange your design, change the world

Are the constraints of traditional memory architectures holding back your groundbreaking

designs? New, revolutionary phase change memory (PCM) merges the best attributes of

NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory

chip.

With byte alterability (or overwrite capability), Micron PCM improves system-level

performance and simplifies software design. Higher endurance further reduces software

management and improves system-level reliability.

FEATURES:

P5Q Serial PCMMicron’s 128Mb 90nm serial device is purpose-built to meet the memory requirements of embedded systems, delivering multiple I/O capability and compatibility with familiar SPI NOR interfaces. Combining NOR and EEPROM technology benefits into one, P5Q serial PCM provides solutions for today and beyond.

Byte alterable: overwrite capability

Endurance: 1 million WRITE cycles

Density: 128Mb (90nm lithography)

I/O bus width: quad (single/dual supported)

66 MHz (maximum) single/dual I/O 50 MHz (maximum) quad I/O

Programming time: 0.9 MB/s

Single supply voltage: 2.7–3.6V

Package: SOIC-16

Choice of temperature ranges: –30°C to +85°C and 0°C to +70°C

P8P Parallel PCMMicron’s128Mb 90nm parallel device is designed to meet the memory requirements of embedded systems. P8P parallel PCM enhances overall performance, simplifies software management, and improves system-level reliability.

Byte alterable: overwrite capability

Endurance: 1 million WRITE cycles

Density: 128Mb (90nm lithography)

Programming time: 0.9 MB/

Voltage range: 2.7–3.6V VCC; 1.7–3.6V VCCQ

Packages: 56-pin TSOP; 64-ball Easy BGA (8x10mm)

Choice of temperature ranges: –30°C to +85°C and 0°C to +70°C

APPLICATIONS:

Power grid/power metering

Medical monitoring

Network/security cameras

Display systems

Industrial printers

Network routers

Data logging intensive applications

Scan barcode for more Micron Phase Change Memory information

FO

CU

S O

N M

EM

OR

Y

Parallel PCM Before

Serial PCM Before

Parallel PCM After

Serial PCM After

RealSSD™ C400 Solid State DrivesDesign In Industry-Leading PC Performance

Our RealSSD™ C400 SSDs are client-

focused hard drive replacements that provide

dramatic improvements in power, performance,

and reliability.These SSDs provide breakthrough

performance for notebook and desktop applications.

By combining our MLC NAND technology and

optimized NAND management algorithms, we’re

able to improve boot and application load times

and lower power consumption to create a better

overall user experience.

Our global network of experts are dedicated

to resolving issues and ensuring optimum

solutions. We control the SSD BOM for easy

supply chain management and our

extensive product qualification

translates to predictably reliable,

high-quality drives.

C400 ADVANTAGES FOR CLIENT APPLICATIONS:

Performance Improves boot times and speeds application launches, delivering information on demand.

Reliability

Withstands extreme shock and vibration, ensuring higher reliability in the most demanding environments.

Low Power Consumes significantly less power than typical hard drives.

Lightweight Weighs less than HDDs, providing high-capacity storage with maximum portability.

Compatibility

Backward compatible to SATA 3 Gb/s, making them easy-to-adopt, drop-in HDD replacements.

NAND Expertise

Leverages Micron’s proven quality and test capabilities to provide best-in-class drive reliability.

APPLICATIONS:

Notebooks

Consumer applications

High-performance desktops

Industrial computing

11

Scan barcode for more Micron RealSSD™ C400 information

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

FO

CU

S O

N M

EM

OR

Y

*Package height in millimeters.

Part Density Version Size* Voltage Read (MAX) Write (MAX)

MTFDDAA064MAM-1J1 64GB C400v 1.8“ (5mm) 3.3V 415 MB/s 95 MB/s

MTFDDAA128MAM-1J1 128GB C400 1.8“ (5mm) 3.3V 415 MB/s 175 MB/s

MTFDDAA256MAM-1K1 256GB C400 1.8“ (5mm) 3.3V 415 MB/s 260 MB/s

MTFDDAA512MAM-1K1 512GB C400 1.8“ (5mm) 3.3V 415 MB/s 260 MB/s

MTFDDAC064MAM-1J1 64GB C400v 2.5” (9.5mm) 5V 415 MB/s 95 MB/s

MTFDDAC128MAM-1J1 128GB C400 2.5“ (9.5mm) 5V 415 MB/s 175 MB/s

MTFDDAC256MAM-1K1 256GB C400 2.5” (9.5mm) 5V 415 MB/s 260 MB/s

MTFDDAC512MAM-1K1 512GB C400 2.5” (9.5mm) 5V 415 MB/s 260 MB/s

MTFDDAK064MAM-1J1 64GB C400v 2.5” (7mm) 5V 415 MB/s 95 MB/s

MTFDDAK128MAM-1J1 128GB C400 2.5” (7mm) 5V 415 MB/s 175 MB/s

MTFDDAK256MAM-1K1 256GB C400 2.5” (7mm) 5V 415 MB/s 260 MB/s

MTFDDAK512MAM-1K1 512GB C400 2.5” (7mm) 5V 415 MB/s 260 MB/s

12 For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

Serial NOR Flash for Embedded ApplicationsHigh-performance serial Flash memory with maximum design flexibility for the most demanding applications

ADVANTAGES FOR NEW MULTI-I/O N25Q FAMILY:

Best Performance in the Market: Max clock 108 MHz in all conditions Quad I/O equivalent clock frequency up to 432 MHz 54MB read throughput Voltage: 3V and 1.8V supply voltageMulti I/O Support: Legacy x1, dual, and quad I/O Erase Capability: Uniform subsector (4KB) and uniform sector 64KB granularity

Enhanced Flexibility: Configurable number of dummy cycles Output buffer strength configurable Volatile and nonvolatile configurability Advanced Write Protections: UID preprogrammed in factory and 64-byte OTP area; user lockable, nonvolatile protection and permanent block lockProgram/Erase SuspendPackaging focus is on footprint compatibility, reliability, and time-to-marketAutomotive grade products qualified to +125ºC

APPLICATIONS:

Due to its diverse attributes, serial Flash memory has found its way into several embedded applications, from printers to graphic cards; gaming consoles to PC BIOS; DVD/Blu Ray writers and players to answering machines; as well as video recorders, routers, Bluetooth devices, and Wi-Fi modules. Applications that require speed can use serial Flash with quad I/O or XIP mode. Applications not requiring high performance can take advantage of the simplicity of a single I/O implementation. New applications using serial Flash memory include WiMAX devices, set-top-boxes, low-end cellular phones, and netbooks.

Scan barcode for more Micron Serial NOR Flash Memory information

Micron offers the industry’s most comprehensive portfolio of serial NOR Flash memory, delivering a flexible spectrum of performance features and a broad density range to deliver long-term architectural continuity for embedded designs.

Micron serial Flash delivers flexibility and scalability with standard interfaces, enriched features, and backward compatibility to simplify your design and help you get to market quickly. What’s more, it's a product line that offers longevity and reliability.

Five serial NOR Flash lines are offered—the N25Q, M25P, M25PX , M25PE, and M45PE—to provide a complete choice of densities, feature sets, and packaging options. With its broad portfolio and multiple subsector erase options, Micron’s serial NOR Flash meets the requirements of many segments, including consumer electronics, handheld gaming, computing, networking, and enterprise applications. In addition, the N25Q, M25P, and M25PX families are AEC-Q100 qualified to meet the most exacting

requirements for automotive-grade and industrial applications.

FO

CU

S O

N M

EM

OR

Y

*2.7 –3.6V supported by all densities; 2.3–3.6V supported only for specific densities.

Product Family

Power Erasable Sectors Temp (°C)Density Range

Max Clock / Max Transfer

Rate Package Technology

N25Q2.7–3.6V; 1.7–2.0V

4KB Uniform, 64KB Uniform –40 to +85 32–256Mb108 MHz/ 54 MB/s

MLP, SO, TBGA 24 65nm

M25P 2.3–3.6V* 32KB or 64KB Uniform –40 to +85 512KB–16Mb50, 75 MHz/

6, 9 MB/sSO, MLP, TBGA 24 110nm, 150nm

M25PX 2.3–3.6V* 4KB Uniform, 64KB Uniform –40 to +85 8–16Mb75 MHz/19 MB/s

SO, MLP, TBGA 24 110nm

M25PE 2.3–3.6V* 256B, 4 KB, 64KB Uniform –40 to +85 1–16Mb75 MHz/9 MB/s

SO, MLP 110nm

M45PE 2.3–3.6V* 256B, 64KB Uniform –40 to +85 1–16Mb75 MHz/9 MB/s

SO, MLP 110nm

Dual Interface EEPROMM24LR64, 64-Kbit EEPROM with I²C and 13.56 MHz ISO 15693 RF interfaces

The innovative family of Dual Interface EEPROM provides new features

and capabilities. The EEPROM memory bank can be accessed either by a

standard I²C interface or by an ISO 15693 RF interface operating at 13.56

MHz. In addition, the family features a 32-bit password protection mechanism.

APPLICATIONS:

Two worlds connected

The ability to program or read a memory using either an RF or

a wired interface enables designers to imagine and develop

new functions and capabilities for their products. It is a good fit

for a wide range of applications including:

medical equipment

industrial equipment

factory and building automation

computers and peripherals

consumer electronics

DUAL INTERFACE EEPROM TOOLS Starter kit: RF-I²C enabled programmer with reference

antenna (order code: STARTKIT-M24LR-A)

Development kit: extensive tool for supporting product

integration (order code: DEVKIT-M24LR-A)

13

Scan barcode for more ST Dual Interface EEPROM information

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

FO

CU

S O

N M

EM

OR

Y

Part NumberRF

InterfaceSerial

InterfaceMemory Size

(Kbit)

Clock Frequency

(kHz)Password

Supply Voltage (V)

Package

M24LR64-RMN6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 SO8

M24LR64-RDW6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 TSSOP8

M24LR64-RMB6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 MLP2X3

FEATURES:

Industry standard interfaces:

I2C: 400 kHz, from 1.8 to 5.5 V

ISO 15693: 53 Kbit/s data rate, up to 1 m remote access range

64-Kbit EEPROM user memory

64-bit unique identifier

32-bit password protection

13.56 MHz carrier frequency

BENEFITS:

Most flexible solution for parameter updates

Passive RFID technology: no onboard power required to access the device in RF mode

High reliability EEPROM

Flexible password protection scheme

Simple and cost-effective implementation

Enabling new functions and capabilities for:

parameter update

firmware update

device calibration

product activation

traceability information management

asset tracking

identification

DEVICE SUMMARY:

DE

VE

LO

PM

EN

T T

OO

LS

Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development14

Programmable Power Controller, Configuration Board, and PowerArchitect ™ 3.0 Software

Everything You Need to Become an Expert Digital Power Designer!

Order Number Price

XRP7713EVB-DEMO-1-KIT $90

XRP7714EVB-DEMO-2P-KIT $90

Scan barcode for more Exar Programmable Power Development Kit information

Exar’s Programmable Power Development Kit affords the user a quick on-

ramp to finalizing digital power designs for a host of applications spanning

mobile to industrial to high-performance computing. The XRP7713 device

in the development kit is part of the PowerXR programmable power product

portfolio of highly configurable digital power step-down controllers that more

intelligently manage today’s power systems with up to four independent

digital-control loops while integrating an on-board standby power LDO. With

four 12-bit resolution digital pulse width modulators (DPWM) with integrated

gate drivers, the XRP7713 uses a digital PID control algorithm to perform

full digital loop control at switching frequencies up to 1.5MHz. These power

system controllers are fully addressable and configurable via an I²C interface

for monitoring, control and management of DC to DC pointof- load power

conversions.

These power ICs integrate the best of both worlds – the low cost and flexibility

of digital power management and control, and the robust power capabilities of

analog switching power supplies. PowerXR products will reduce development

time from weeks to hours enabling a significant time-to-market advantage.

Both PowerXR devices permit real-time power system adjustments during

design, in response to changing requirements or even after field-deployment.

Power Controller Features:

Three or Four switching buck (step-down) controllers with internal FETs

Output voltages programmable from 0.9V to 5.1V

Up to Six reconfigurable GPIO pins

Fully programmable via the I²C interface

Complete power monitoring and reporting

Benefits:

PowerXR integrate the best of both worlds – the low cost and flexibility of digital power management and control, and the robust power capabilities of analog switching power supplies.

Use of PowerXR devices reduce development time from weeks to hours enabling a significant time-to-market advantage.

PowerXR devices permit real-time power system adjustments during design, in response to changing requirements or even after field- deployment.

Applications:

Consumer: Set-top box, IP Cameras, Servers

Industrial – Medical Equipment

Medical Equipment

Networking and Telecommunications Equipment

Point-of-Sale

STM8L-DISCOVERYThe STM8L-DISCOVERY helps you to discover the STM8L ultralow power features

and to develop and share your applications. It is based on an STM8L152C6T6

and includes an ST-Link embedded debug tool interface, LCD (24 segments, 4

commons), LEDs and push buttons.

Features:

STM8L152C6T6 microcontroller, 32 KB Flash, 2 KB RAM, 1 KB EEPROM in 48-pin LQFP

On-board ST-Link with selection mode switch to use the kit as a stand- alone ST-Link (with SWIM connector for programming and debugging)

Two red LEDs; LD1 for USB communication, LD2 for 3.3 V power on

Designed to be powered by USB or an external supply of 5 V or 3.3 V

Can supply target application with 5 V and 3 V

Two user LEDs, LD3 and LD4 (green and blue)

Two push buttons (User and Reset)

IDD current measurement

LCD 28-pin DIP (24 segments, 4 commons)

Extension header for all QFP48 I/Os for quick connection to prototyping board for easy probing

Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development

Order Number Description Price

STM8L-DISCOVERY Discovery board for STM8L15x (32KB flash) MCUs $9.99

Scan barcode for more information regarding the STM8L-Discovery Kit

15

DE

VE

LO

PM

EN

T T

OO

LS

Lattice Semiconductor Breakout Boards

Simple. Useful. Programmable.

The Lattice Breakout Boards are simple evaluation kits that allow the user to quickly

evaluate the capabilities of the POWR104A, LC4256ZE or LCMXO2280C devices.

Each board includes 8 LEDs which can be used for implementing simple counters

or similar functionality. With a majority of the I/O accessible to the user through

headers on the board, it is possible for a user to interface the Breakout Board with

a current design or even other evaluation boards. Programming is achieved through

the USB interface, and a USB cable is provided so users can begin working with the

boards right away. A quick start guide is also included with each Breakout Board to

shorten the learning curve.

Order Number Description Price

POWR1014A-B-EVN POWR 1014A Breakout Board $29.99

LC4256ZE-B-EVN ispMACH4000ZE Breakout Board $29.99

LCMXO2280C-B-EVN MachXO Breakout Board $29.99

Scan barcode for more Breakout Boardsinformation

AU

DIO

/ V

IDE

O

Gennum’s 3rd Generation Video Optical Modules (VOMs)

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal16

The continued transition to HDTV within the professional broadcast industry, the advent of

1080p50/60 production, D-Cinema production and higher resolution / bit depth formats, are all

factors driving the widespread adoption and build out of 3G SDI capable broadcast infrastructure.

As this build out continues, broadcasters are increasingly looking to optical fiber interfaces for the

carriage and distribution of 3G SDI signaling within the plant. At these higher data rates, fiber optic

systems provide a number of advantages (to coax cabling), especially for long links. Optical fiber

installations also promise smaller and lighter trunking and in large installations on green-field sites,

the cost of installing a fiber infrastructure can be less than an equivalent coax cable installation.

Gennum’s video optical modules are engineered to provide industry leading optical performance

and robustness for mission-critical broadcast applications. The recently released second generation

offering extends Gennum’s leadership by providing new receiver technology with unmatched

overload, sensitivity and signal integrity.

Ro bust Performance

Not all optical modules are created equal. Gennum’s optical modules are built upon Gennum’s

excellence in both SDI and optical technology. Incorporating custom receiver silicon, Gennum

modules feature an exceptional dynamic range ensuring maximum interoperability with SMPTE297

compliant transmitters. Additionally, Gennum’s modules provide robust performance across all

operating conditions thereby ensuring a highly reliable optical link.

THIRD GENERATION PRODUCTS FEATURES:

AU

DIO

/ VID

EO

BENEFITS:

Robust performance across all operating conditions thereby ensuring a highly reliable optical link

Optimized for short reach optical applications and offer design improvement and enhanced functionality

Exceptional optical performance with pathological data:

Receiver overload: 0dBm

Best in class Receiver sensitivity: -23dBm

Digital diagnostic interface for monitoring and control of module

User writable EEPROM where equipment manufacturers can program their own information within the SFP to enable their equipment to identify qualified modules

SMPTE 297 compatible

Small Form Pluggable (SFP) package saves board space requirements

SFPs offer an improved mechanical design with a superior latching and delatching mechanism

Pin-out designed so that one slot can be populated with a dual transmitter, dual receiver, single transmitter, single receiver, or a transceiver

Both video and datacom pinout variants are available for all VOM products. This allows network equipment manufacturers to add optical SDI interfaces to any existing products that were designed per the SFP MSA pinout rather than the defacto standard Video SFP pinout.

Telecordia GR-468-CORE compliant

APPLICATIONS:

3G-SDI End Applications

Any professional video broadcast SMPTE compatible optical-to-electrical interfaces

High density video routers

Professional video cameras and monitors

17For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

Scan barcode for more information regarding Gennum's Video Optical Modules

DA

TA

CO

M

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal18

Micrel’s Low-power, Highly Integrated, 4/5-port Layer-2 Switch-on-a-Chip ICsThe KSZ8895/8864 product family achieves a 50 percent reduction in power consumption compared to the previous generation.

Micrel’s KSZ8895/8864 family are low-power, highly integrated, 4/5-port Layer-2 switch-on-a-chip ICs. Leveraging Micrel’s latest green physical transceiver and switch technology, the product family achieves a 50 percent reduction in power consumption compared to the previous generation. Meeting the increasing demands for Ethernet connectivity in consumer and industrial applications, the family features advanced power management and sophisticated Quality of Service (QoS) capabilities.

QoS features such as tag and port-based VLAN support and IPv6 priority classification make these devices ideal for today's most demanding IP content based applications in the digital home; IPTV, IP-STB (set top box), VoIP (voice over IP), residential gateways and GPON. The low emissions and Micrel's signature high reliability and quality also make these devices suitable for connectivity applications in the fast growing industrial automation and automotive markets.

APPLICATIONS:

Digital TV / IP-STB

VoIP Gateway

Industrial Ethernet

Industrial Control

Broadband Gateway/router

GPON ONU

AutomotiveScan barcode for more KSZ8895/8864 family information

FEATURES: BENEFITS:

Fully-compliant to IEEE 802.3/802.3u Standard Standard compliance ensures to work with other standard compliant, already deployed devices.

Single 3.3v supply with internal 1.2V LDO controller, and optional 3.3V, 2.5V or 1.8V VDDIO

Enables low-power design and offers flexibility in design.

Integration of termination resistors on the chip On-chip termination (eliminating 4 external resistors/transceiver) not only simplifies PCB design and reduces system BOM, but also improves overall signal integrity and EMI emission.

Energy Detect Power Down when the cable is not plugged; and power down/ slow oscillator mode when the device is not in use

Power consumption is optimized based on the status of the link or the device.

Rapid spanning tree (RSTP) support Provides faster spanning tree convergence after network topology change (<6 sec vs. 30-50 sec for STP).

2K Byte maximum packet size Improves the efficiency of bulk data transfer, and system performance

Internally generated 50Hz RMII reference clock The use of 25MHz crystal as input reference clock no longer eliminates the need for external oscillator. It reduces the system BOM in the RMII mode.

HP Auto MDI/MDIX crossover support Auto-MDI/MDIX eliminates the need for cross-over cable, thus reduces installation costs. Easy to use.

FEATURES & BENEFITS:

NetDetach technology allows the CPU to enter a low-power state when Ethernet is inactive

UniClock technology utilizes a single 25MHz crystal, reducing BOM component count and cost

Multiple Operating Systems are supported, including: Windows 7, Windows XP, Windows Vista®, Windows CE, PXE, DOS ODI, Mac and Linux – enabling support for a wide variety of applications

PME pin wake-up support reduces system power requirements

Supports TCP segmentation offload and full hardware TxRx check–sum offloads (IPV4, IPV6, TCP, UDP), reducing CPU loading

DA

TA

CO

M

Scan barcode for more LAN7500 information

Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet ControllerSMSC Introduces the LAN7500

SMSC’s LAN7500 is a Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet controller providing a high-performance and cost-effective USB to Ethernet connectivity solution. The LAN7500 contains an integrated 10/100/1000 Gigabit Ethernet PHY, USB PHY, Hi-Speed USB 2.0 device controller, 10/100/1000 Gigabit Ethernet MAC, TAP controller, EEPROM controller and a FIFO controller with a total of 32KB internal packet buffering. The device supports 10BASE-T, 100BASE-TX and 1000BASE-T Ethernet and implements Control, Interrupt, Bulk-in and Bulk-out USB endpoints. The Ethernet controller supports auto-negotiation, auto-polarity correction, HP Auto-MDIX* support and is compliant with IEEE 802.3/802.3u/802.3ab standards.

USB-based networking provides flexibility for the routing and placement of network connections anywhere in the system. USB-based solutions leverage the existing USB stack for the Ethernet driver. The LAN7500 is also available with a wide range of drivers including Windows®, Mac® and Linux®.

The LAN7500 also offers SMSC’s NetDetach™ and UniClock™ technologies. NetDetach allows for up to a 25% reduction in power by enabling the host CPU to enter a low-power state when Ethernet is inactive. UniClock simplifies the clocking scheme and reduces system BOM cost by using a single 25MHz crystal for both USB and Ethernet connectivity. Multiple power management features are provided, including various low-power modes and Magic Packet™, Wake-on LAN (WOL) and Link Status Change wake events. These wake events can be programmed to initiate a USB remote wakeup. The device is available in commercial (0º to 70ºC) and industrial temperature range (-40º to 85ºC) options.

19

APPLICATIONS:

Embedded Systems

Consumer Electronics Devices

Netbooks/Smartbooks/MIDs

Docking Stations

Digital TVs (DTVs)

Set-top Boxes

Personal Video Recorders (PVRs)

Network Printers

USB Port Replicators

Stand-alone USB to Ethernet Dongles

Industrial Designs

HIGHLIGHTS:

Single-chip, Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet controller

Implements NetDetach technology for reduced system power consumption

Supports EEPROM-less operation for reduced BOM costs

Requires only a single 25MHz crystal

Easy upgrade for USB-based 10/100 Ethernet (LAN9500/9500A) to 10/100/1000 Gigabit Ethernet

Supports IEEE 802.3/802.3u/802.3ab standards

Industrial temperature range option available (LAN7500i)

8x8mm, 56-pin QFN, lead-free RoHS-compliant package

*HP Auto-MDIX eliminates the need for special “crossover” cables when connecting LAN devices together.

**LANCheck and USBCheck online design review services require an SMSC e-Services account and are subject to the terms and conditions listed on SMSC’s website.

LAN7500 BLOCK DIAGRAM:

MIC

RO

CO

NT

RO

LL

ER

S

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal20

High Precision 24-bit ADC for Weight Scales and Precision Measurement Markets– NAU7801 / NAU7802The NAU780X is a high-performance, cost-effective, low-power 24-bit sigma-delta ADC designed specifically for Weight Scales, Industrial Process Control, Strain Gauges, Data Acquisition, Portable Instrumentation and Fluid/Gas Analyzers.

The NAU780X is a high-performance, cost-effective, low-power 24-bit sigma-delta ADC designed specifically for Weight Scales, Industrial Process Control, Strain Gauges, Data Acquisition, Portable Instrumentation and Fluid/Gas Analyzers. It delivers exceptional flexibility in performance and optimization of power consumption, while providing designers with development and test tools that can dramatically accelerate time to market. With the on-chip LDO and less external components, NAU780X can greatly reduce the BOM cost and PCB complexity.

The Nuvoton NAU780X is a precision low-power 24-bit ADC, with an onboard low-noise programmable gain amplifier (PGA), onboard RC or Crystal oscillator, and a precision 24-bit sigma-delta analog to digital converter (ADC)

capable of up to 23-bit ENOB (Effective Number Of Bits) performance. This device provides a complete front-end solution for bridge/sensor measurement such as in weigh scales, strain gauges, and many other high resolution, low sample rate applications.

The many built-in features enable high performance applications with very low external parts count. NAU780X includes low drop-out regulator and high precision oscillator. Moreover, this device provides a standard 2-wire interface compatible with I2C protocol for simple and straightforward connection to and interoperation with a wide range of possible host processors. Also, NAU780X reserves hardware space for the on-chip calibration registers and algorithm so as to ease the software calculation burden and time.

The Programmable Gain Amplifier (PGA) provides selectable gains from 1 to 128, depending on the usage of different applications. The A/D conversion is performed with a Sigma-Delta modulator and programmable FIR filter that provides a simultaneous 50Hz and 60Hz notch filter to effectively improve interference immunity.

The NAU780X’s powerful development platform and simple graphical user interface development tools enable designers to efficiently generate new designs, giving them interactive programmability and predefined configuration paths for test and development and shorten the time to market.

FEATURES:

2.7 ~ 5.5Vdc operation, and 16-pin (NAU7802) or 8-pin (NAU7801) SOP package versions Dual differential input pair inputs and built-in temperature measurement Built-in reference voltage supply and internal oscillator Less than 1uA standby current

BENEFITS:

Low external parts count for low BOM cost Available in small package, minimal impact to PCB size Add-On Features: Internal LDO regulator Integrated Oscillator Integrated Temperature Sensor

APPLICATIONS:

Consumer Weigh scales Temperature measurement

Medical Glucose & blood pressure meters

Industrial Sensor measurement

Scan barcode for more NAU780X information

Part No. Write Capability Package Option Pricing

NAU7801 I2C, 2-Wire 8-SOP, 8-DIP <US$1.25 in quantities of 1000

NAU7802 I2C, 2-Wire 16-SOP, 16-DIP <US$1.50 in quantities of 1000

Control Signal

ADC result

1

0Internal RC Oscillator

24-bit ADC

14

24

PGA

Temperature Sensor

Digital

Interface

OSCS

CRS[2:0]

PGA[1:0]

CHS

VBG XOUTAVDD XIN

SCLK

SDIO

DRDYVIN2P

VIN1P

VIN1N

VIN2N

AVSS REFP REFN DVSS

LDO

LDO

To serial InterfaceIO Power

2.7V~5.5V Input

digital logic

Bandgap Reference

VLDO [1:0]

DVDD

To Analog Circuit

21

MIC

RO

CO

NT

RO

LL

ER

S

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

Industrial PLC Inverters Power meters Printers, scanners Industrial networking

Appliances Motor drive Application control Consumer PC peripherals, gaming Digital cameras, GPS platforms

Building and security Alarm systems Access control HVAC

Home audio

Medical High-end glucose meters Power meters Battery-operated applications

APPLICATIONS:

DEVICE SUMMARY: STM32F & STM32L

Scan barcode for more STM32F-2 information

STM32 F-232-bit Flash microcontrollers, 120 MHz/150 DMIPS with ART Accelerator™ and advanced peripherals.

The STM32F is the foundation of the STM32 family. The STM32F family of 32-bit Flash microcontrollers is based on the breakthrough ARM Cortex™-M3 core, specifically developed for embedded applications. They combine high performance with first-class peripherals and low-power, low-voltage operation. They offer the maximum integration at accessible prices with a simple architecture and easy-to-use tools.

With five lines, the STM32F1xx series provides perfectly balanced products for a wide range of applications in the industrial, medical and consumer markets. The following five lines are pin-to-pin, peripherals and software compatible:

Value line STM32F100xx - 24 MHz CPU with motor control and CEC functions

Access line STM32F101xx - 36 MHz CPU, up to 1 Mbyte Flash

USB access line STM32F102xx - 48 MHz CPU with USB FS

Performance line STM32F103xx - 72 MHz, up to 1 Mbyte Flash with motor control, USB and CAN

Connectivity line STM32F105/107xx - 72 MHz CPU with Ethernet MAC, CAN and USB 2.0 OTG

The new leading-edge STM32F2xx series combines advanced 90nm process technology with the innovative adaptive real-time memory accelerator (ART accelerator™) and the multi-layer bus matrix. This series achieves 150 Dhrystone MIPS when executing code from Flash at 120MHz with 188 µA/MHz dynamic power consumption.

STM32 F-2 series: 120 MHz CPU with ART accelerator, 1 Mbyte Flash, Ethernet MAC, USB 2.0 HS OTG, camera interface, encryption

PO

WE

R M

AN

AG

EM

EN

T

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal22

Lineage Power ® Barracuda™ Power Modules; DC-DC ConvertersLineage Power's new family of DOSA-based high efficiency bus converters offer lower cost digital power alternatives to semi-regulated and unregulated products in the market today.

Lineage Power, a GE Energy Company, has been providing high efficiency, reliable power to the communications industry for nearly 100 years based on our Bell Labs heritage. Today, we are introducing our Lineage Power® Barracuda™ family of digitally controlled, fully-regulated bus converters for DC-DC Intermediate Bus Architectures.

The cost-effective, high-efficiency Barracuda series delivers digital power communication and control in standards-based eighth-brick and quarter-brick DOSA footprints. Power design engineers can deploy the new Barracuda modules in existing power designs as DOSA-compliant, drop-in upgrades for unregulated and semi-regulated bus converters challenged by recent industry-wide intellectual property issues. As part of the Lineage Power Total Efficiency™ architecture, the new Barracuda modules deliver efficiency of 96 percent and are priced comparable to current semi-regulated bus converters to encourage rapid adoption in new and existing product designs.

The Barracuda QBVW series is a digitally controlled drop-in alternative for unregulated and semi-regulated bus converter products. The PMBus™ Rev.1.1-

compliant Barracuda QBDW series features built-in I2C digital communications to enable design engineers to leverage the benefits of both digital communication and control. Both members of the Barracuda family are designed to provide a 9.6-12 Vdc intermediate bus voltage after which multiple, low voltage rails are generated using additional Point of Load (POL) converters such as DLynx™. This architecture is designed to power silicon devices such as processors and memory devices on circuit boards using POL converters. Barracuda converters can also be utilized for other applications requiring a fully-regulated output voltage in distributed power architectures deployed in networking, Power over Ethernet (PoE), computing and data storage devices.

New synchronization features, active load sharing and differential remote sense are combined with a digital PMBus interface that supports a wide range of commands to both control and monitor the Barracuda modules with a full range of protections and warnings, digital on/off, trim, margin, power good, rise time adjustment, and input under voltage lockout.

For more information, please visit www.ge.com/lineagepower.

FEATURES & BENEFITS:

Delivers up to 33Vdc output current

Standards-based DOSA™ footprint

PMBus™ compliant digital configuration, communication & control

Wide input range of 36-75Vdc

High efficiency of 96%

Positive remote On/Off logic

Remote sense and output voltage trim

Fully regulated output voltage

Output over current/voltage protection

Constant switching frequency

ISO9001 and ISO14001 certified manufacturing facilities

APPLICATIONS:

Intermediate Bus Architecture

Wireless networks

Access and optical network equipment

ATCA applications

Telecom networks

Scan barcode for more information on Lineage's Barracuda Series

LTC2978 - Octal PMBus Power Supply Monitor and Controller with EEPROMThe LTC2978 provides numerous functions with on-the-fly adjustments that make it an ideal device for digital power control in a wide variety of automotive, medical and telecommunication applications.

The LTC®2978 is an octal, PMBus compliant power supply monitor, supervisor, sequencer and margin controller. PMBus functions include warning and fault OV/UV threshold pairs for eight output channels and one input channel. Programmable fault response allows the power supplies to be disabled with optional retry after a fault has been detected. PMBus reads allow eight output voltages and one input voltage to be monitored. In addition, odd numbered channels can substitute sense resistor voltage measurements for output voltage measurements. PMBus commands support

power supply sequencing and precision point-of-load voltage servo to one of three programmed values: margin high, margin low and nominal. A programmable watchdog timer monitors microprocessor activity for a stalled condition and resets the micro if necessary. The 1-wire synchronization bus supports power supply sequencing across multiple LTC2978 devices. User programmable parameters can be stored in EEPROM. Voltage supervisor, voltage monitor and temperature faults can also be logged to EEPROM.

FEATURES:

PMBus Compliant Interface and Command Set

Configuration EEPROM

Fault Logging to Internal EEPROM

Differential Input, 15-Bit ∆∑ ADC with Less Than ±0.25% of Total Unadjusted Error

Monitors Eight Output Channels and One Input Voltage

8-Channel Sequencer

Programmable Watchdog Timer

Eight UV/OV Voltage Supervisors

Eight 10-Bit Voltage-Buffered IDACs with Soft Connect

Linear, Voltage Servo Adjusts Supply Voltages by Ramping Voltage-Buffered IDAC Outputs Up/Down

Supports Multichannel Fault Management

On-Chip Digital Temperature Sensor

Available in 64-Pin 9mm × 9mm QFN Package

APPLICATIONS:

Computers

Network Servers

Scan barcode for moreinformation on LTC2978

23

PO

WE

R M

AN

AG

EM

EN

T

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal

Octal Power Supply Controller with PMBus Interface

VPWR

VIN_EN

SDA

SCL

ALERTB

CONTROL0

WP

FAULTB00

SHARE_CLK

VIN_SNS

VDACP0

VSENSEP0

VDACM0

VSENSEM0

VOUT_EN0

PWRGD

WDI/RESETB

ASEL0

ASEL1

LTC2978*

PMBusINTERFACE

WRITE-PROTECT

TO/FROM OTHERLTC2978s

TO INTERMEDIATE BUS CONVERTER

ENABLE

4.5V < VIBUS < 15V

GND

TO µP RESETB INPUT

WATCHDOGTIMER INTERRUPT

*SOME DETAILS OMITTED FOR CLARITYONLY ONE OF EIGHT CHANNELS SHOWN

VIN

VOUT

R207.5k

R3041.2k

R1020k

2978 TA01

RUN/SSSGND

VFB

GND

LOAD

DIGITALLY MANAGED

POWERSUPPLY

PO

WE

R M

AN

AG

EM

EN

T

For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal24

LT3799 - Offline Isolated Flyback LED Controller with Active PFCThe LT3799 is optimized for LED applications requiring 4W to over 100W of LED power and also compatible with standard TRIAC in-wall dimmers.

The LT®3799 is an isolated flyback

controller with power factor correction

specifically designed for driving LEDs. The

controller operates using critical conduction

mode allowing the use of a small transformer.

Using a novel current sensing scheme, the

controller is able to deliver a well regulated

current to the secondary side without using an

opto-coupler. A strong gate driver is included

to drive an external high voltage MOSFET.

Utilizing an onboard multiplier, the LT3799

typically achieves power factors of 0.97. The

FAULT pin provides notification of open and

short LED conditions.

The LT3799 uses a micropower

hysteretic start-up to efficiently operate at

offline input voltages, with a third winding

to provide power to the part. An internal LDO

provides a well regulated supply for the part’s

internal circuitry and gate driver.

FEATURES:

Isolated PFC LED Driver with Minimum Number of External Components

TRIAC Dimmable

VIN and VOUT Limited Only by External Components

Active Power Factor Correction (Typical PFC > 0.97)

Low Harmonic Content

No Opto-Coupler Required

Accurate Regulated LED Current (±5% Typical)

Open LED and Shorted LED Protection

Thermally Enhanced 16-lead MSOP Package

APPLICATIONS:

Offline 4W to 100W+ LED Applications

High DC VIN LED Applications

Scan barcode for more LT3799 information

LED Current vs Input VoltageTRIAC Dimmable 20W LED Driver

3799 TA01a

20WLEDPOWER

VIN_SENSE

VIN DCM

FB

VREF

CTRL2

CTRL1

GATE

SENSE

VINTVCC

GND

LT3799

FAULTFAULT COMP+CT COMP–

560µF× 2

4.7pF10µF

2.2nF

4:1:1

0.1µF 0.1µF

20Ω

20Ω

0.05Ω

499k

499k 100k

100k

200Ω

6.34k 4.99k

100k

CTRL3

0.22µF90VTO 150V

AC 0.1µF

40.2k32.4k

16.2k100kNTC

100k

4.7µF

2k

1A

VIN (VAC)90

0.80

I LED

(A)

0.90

1.00

1.10

100 110 130120 140

1.20

0.85

0.95

1.05

1.15

150

3799 TA01b

Creating a Power Subsystem for Lattice XP2 FPGAs using Linear Technology Power Devices

Using a Micrel Ethernet PHY and a Lattice ECP3 FPGA to Create an Ethernet Subsystem

FPGAs now require extensive power subsystems to provide the variety of voltages and high-power required for parallel I/O banks, FPGA Core, and various clocking, delay and analog-like functions. Precise control of voltages, even in noisy environments and over wide current ranges can minimize a host of potential system problems. Using LTC power devices- regulators and/or power modules- is an excellent way to keep potential power problems away from your design. This application note provides a step-by-step guide for a design engineer who needs to quickly and efficiently create a Power subsystem using a LTC power products and a Lattice XP2 FPGA. It will review the LTC power devices and the Lattice XP2.

This combination of devices is excellent for a wide range of applications in the consumer, industrial, communications and networking industries.

For this example design we will target an LED display lighting application. The FPGA will be monitoring and controlling the flow of data to the LEDs used on a large display surface, similar to those used as highway, sports venues or other high-traffic high-visibility locations. The FPGA will be responsible for controlling the light output of the LEDs based on environmental conditions (temperature and ambient light), the age of the LEDs, and a variety of other factors to improve image quality and to save power. The FPGA will

require lots of IO capability, and a large number of general purpose logic elements. Some DSP and other simple arithmetic functions will be required for advanced light sensing features. Power is available from a low voltage, 12V DC supply source.

Linear Technology has a wide range of power products including discrete regulators and the new µModule DC/DC regulator LTM46XX Family of integrated regulators. These regulators are a good choice for I/O voltage requirements, which typically require lower current than device core voltages. High current applications can use the compact, high-current µModule DC/DC regulators.

Many modern applications use FPGAs to implement complex system level building blocks.

These building blocks can contain processors, DSPs, bus interface and even video and audio

functions. Getting high-speed data on and off the FPGA can be accomplished by using a standard

Ethernet interface and this leverages a wide range of established protocols, software platforms and

IP. FPGA’s usually requires an Ethernet Interface IP Core inside the FPGA and some external devices,

typically an Ethernet Physical (PHY) layer device and a connector.

As a target application example we will use a video inspection system used in an assembly

line application. This type of embedded video processor needs to fit into a very small form factor and

will monitor and control inspection of product produced by an assembly. Ethernet is being used to

communicate to the controller so that commands and data received by the controller can be relayed

to the central processing location. A large number of controllers will be distributed throughout the

factory at various stages of the manufacturing process. Because of the data transmission speed

required high-speed Ethernet is needed, but backwards compatibility to standard Ethernet is an

advantage. Significant DSP functionality is desired so that video images may be processed quickly

and any product quality issues spotted quickly.

Creating an Ethernet subsystem involves a variety of design considerations. This application

note provides a step-by-step guide for a designer who needs to quickly and efficiently create an

Ethernet subsystem using a Lattice ECP3 FPGA, and a Micrel Ethernet PHY.

Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development 25

AP

PL

ICA

TIO

N N

OT

ES

Scan barcode to accessapplication note

Scan barcode to accessapplication note

1

The PN-E Series High Performance Professional LCD MonitorsReliability, Versatility, Undeniable QualitySharp PN-E Series LCD monitors offer full 1080p resolution from analog and digital RGB as well as HD video. 24/7 rated and backed by a 3-year warranty. These displays are excellent for videoconferencing, meeting rooms, digital signage, and are available in four sizes (42”, 47”, 52”, 60”).

To learn more about these and other Sharp monitors, please visit http://www.sharppromonitors.com/

26

27

T E C H N O L O G Y I N C .

Cable Solutions Quadrangle

Display Enhancement Solutions Landmark Nu Horizons Custom Solutions

Displays Emerging Display Technologies (EDT) HT Displays Optrex OSD Displays Sharp Tianma United Radiant Technology Corp. (URT)

Embedded Solutions / Single Board Computers Aaeon Axiom Tek Connect Tech Digi International IEI Technology Reach Technology

Inverters Applied Concepts ERG Microsemi Zippy

LCD Controller Solutions Amulet Technologies Digital View Digitron Estecom-USA Kordis Spectrah URT

LCD Monitors Axiom Tek Digitron Estecom-USA IEI Slimage

Open Frame/Panel PC Solutions Aaeon Axiom Tek Digitron Estecom-USA IEI Technology Nu Horizons Custom Solutions Slimage Spectrah

Touchscreens Hantouch Touch International

Active Enhancements: ■ Hi Bright Backlights: CCFL LED

Passive Enhancements: ■ Anti-ReflectiveAntiGlareGlass/Acrylic ■ EMI/RFIShielding ■ IR Blocking Film ■ Optical Bonding ■ PrivacyFilters ■ ProtectiveDisplayShields

Total Solutions: ■ DisplayKitVerification ■ Fully Enclosed LCD Monitors ■ Fully Enclosed LCD Systems (Panel PC’s) ■ LCD Testing and Screening ■ Medical ■ NEMA Rated Products ■ OpenFrameConfigurations ■ Rack and Panel Mount Assemblies

Touch Controllers: ■ Serial ■ USB

Touch Screen Integration: ■ Capacitive ■ SurfaceAcousticWave(SAW) ■ IR - Infrared Touch ■ ProjectedCapacitive-Extreme-Touch ■ Resistive-4/5/8Wire

Value-Add Capabilities: ■ Class 1,000 Clean Room for all LCD Enhancements ■ Display Inspection ■ NVIS Night Vision ■ Optical Glass Bonding ■ Touch Screen Integration

Display Technologies available from Nu Horizons

Semiconductor Technologies available from Nu Horizons

• Audio (DAC’s, ADC’s, Codec’s, SPDIF, Sample Rate Conv., DSP, USB) • Memory (EEPROM, DAC + EEPROM) • Networking (T1/E1/T3/E3 xcvr, PCM) • Sensors (Hall Effect Sensor, 3d Compass) • Video (NTSC/PAL Encoder/Decoder, A/V Switches, Video Gain Amp)

• Discrete (Transistors, FET arrays, Thyristors, Triacs) • Display (Vacuum – Fluorescent Display Drivers) • LED Drivers (Constant Current Drivers) • Motor Control (Brushless DC, Bi-Polar Stepper) • Power (Linear Regulators, Buck/Boost/Fly back DC- DC, Charge Pumps) • Sensors (Hall Effect)

• Analog (Data Conversion, Power Management) • Communications (Bluetooth, LIN, CAN, POTS, GPS, RF, Zigbee) • Memory (Flash, EEPROM, Modules) • Microcontrollers (8051, AVR, ARM7TDMI, ARM926EJ, Cortex M3) • Multimedia & Imaging (IR, Video) • Network Storage (Data Storage) • Programmable Logic (FPGA, SPLD/CPLD) • Sensors (Biometrics, RF, Smart Cards)

• Fiber Optic Devices (10G FP TOSA & MM PIN ROSA, OTDR FP Lasers, 2.5G DWDM DML, DFB TOSA & APD ROSA) • Optocouplers (Transistor Output, High Speed, Solid State Relays) • RF Modules (Zigbee) • RF Semiconductors (RFIC Switch, GaAs FET, GaAs PA, Si LD-MOSFET, CATV Hybrid, Si RFIC)

• Power and Battery Management (IGBT and MOSFET gate drivers) • Sensor and Imaging Arrays (Hall Effect Sensors) • Signal Conditioning (Solid State Relays, Optocouplers) • Telecom (Embedded Modem, MF Trunk signaling, DTMF)

• Imaging Solutions (Fax Modems, Fax and MFP System Solutions, Digital Photo Frames) • Audio (Speakers-on-a-Chip, PC HD-Audio, PC HD- Audio Modem Combo) • Video (MPEG Encoders/Codecs, Video Decoders, Demodulators, Surveillance / Security) • Dial-Up Access Modems (PC Dial-Up Modems, Embedded Dial-Up Modems)

• Wireless (Bluetooth modules, ZigBee modules, 802.11 modules)

• Device Server Modules • Embedded MCU / MPU (ARM7TDMI, ARM9926EJ) • Networking Modules (Wired/Wireless 802.3 / 802.11bg / 802.15.4)

• Data Converters (ADC, DAC) • Interface (PLB / PCI / I2C / SPI / USB UARTs, RS232/485/422 Transceivers) • Power (Buck/Boost Regulator’s, Charge Pumps, LDO’s, Supervisors, PWM, Programmable Power) • Storage (Data Reduction, Data Security) • Telecom (T1/E1/DS1/DS3/E3 LIU’s, Carrier ETH SONET/SDH Framers, Mappers & Aggregators)

(Fiber Optics Division) • Optical Components (WDM Management, 850nm VCSELs & Detectors, 1310nm Lasers & Detectors, CML Transmitters,WSS) • Optical Transceivers (GBIC, XFP, MSA300, SFP, SFP+) • Passive Optics (WDM networks)

• Audio (SerDes with Emebed/De-Embed) • Datacom (Cable & Backplane SerDes, Redrivers, Retimers, PCIe Bridges, Crosspoint Switches, TIAs, LAs, Transceivers) • Video (Equalizers, Cable Drivers, Reclockers, SerDes, Video Optical Modules, TIAs, LAs, Laser Drivers, Timing, Crosspoint Switches, Cable Extenders)

• Memory (QDR/DDR SRAM, Zero-Wait SRAM (NBT), Sync Burst SRAM, Specialty Sync-SRAM)

• Memory (DDR DRAM,SDRAM, EDO & FPO DRAM, E2PROM, PSRAM, SRAM, DDR II Synchronous SRAM, Asynchronous SRAM) • Smart Card (Two-Wire Serial EEPROM, Secure, MCU Based, ICs)

• Power (MOSFET, IGBT, Diodes, Thyristors, DC/DC, PWM Control, LED/Lamp/Display Drivers) • RF Power (FETs, Drivers, Amplifiers, Microwave modules, RF Modules) • Solar Devices (Solar Cells, Solar Bits, Solar Die, Solar Battery Chargers)

• Programmable Clock Devices (Clock Generation, Differential Clock Distribution, Universal Fanout & Zero Delay Buffer, Clock Synthesis, Low Jitter SERDES Clock) • Programmable Power Manager Devices (for Processors, DSPs & Board Level; Watchdog timer, Voltage Supervision, Reset Generation, Sequencing, Voltage Measurement, Trimming & Marginning) • Programmable Logic (Non-Volatile Flash FPGA, SRAM FPGA, SERDES, 8/32 Bit Soft Processor, Ultra-Low Power CPLD, SPLD)

• Power Supplies - High Voltage (1 to 5 W, 10 to 200 W, Custom) - Low Voltage (Modular, Desktop, Wallmount, Medical, Open-Frame, U-Frame, Enclosed, LED Lighting, Custom)

• AC-DC Power Supplies (800W - 4,000W) • DC-DC Converters - Industry Standard (1/16-Brick, 1/8-Brick, 1/4- Brick, 1/2-Brick, 1x1”, 2x1”) - Intermediate Bus Converters (1/8-Brick, 1/4- Brick) - PowerAmplifiers(1/2-Brick, Full Brick) • Power & Battery Management (Power Modules) • Power Systems Engineering Services

• Data Converters (Delta Sigma, SAR, Voltage DAC, Current DAC) • Frequency Control (Silicon Timing) • Interface (RS-232, 422/485, CAN PHY) • Power Management (Switching Regulators, Linear Regulators, DC/DC µModules, LED Drivers, Hot Swap, PoE) • Signal Conditioning (Amplifiers, Comparators, Filters, Voltage References, Thermal Couple Compensators) • Wireless / RF (I/Q Modulators – Demodulators, Up & Down Converting Mixers, IF Amplifiers, PA, RF Log Detectors, RF Power Detector)

• Data Communications (10/100/1G/10G Ethernet Switches, 10/100/1000/10G PHYs) • Embedded MCU / MPU (ARM V5TE, PXA StrongARM, PPC & MIPS Systems Controller) • Power Management (POLA) • Storage (FAS/SATA/PATA, SAS/Fiberchannel, Storage Processors) • Video (Format Converter) • Wireless / RF (802.11 Modules)

• Analog (Drivers / Voltage & uC Supervisors / Filters / Switches / Regulators) • Bus Device ICs (USB / PC / PCMCIA / SMBus) • Ethernet (10/100/1000 PHYs, Controllers, Switches) • Linear ICs (Active Filters / Comparators / Op Amps / References / Timers) • Power Management ICs (Battery, Display, Hot- Swap, PCI/PCIX/PCIE, High Side, LDOs, DDR) • Precision Edge ICs (Clock distribution, generation, synthesizers / Multiplexers, PLLs, buffers, CDRs) • RF (290 – 980 ISM band / ASK/FSK / 200kbps max data rate, RF Modules) • System Management ICs (Fan Control / Thermal Supervisor I2C)28

• DRAM (DDR3 SDRAM, DDR2 SDRAM, DDR SDRAM, SDRAM, RLDRAM, PSRAM) • DRAM Modules (FBDIMM, RDIMM, SODIMM, UDIMM) • Mobil DRAM (Mobil SDRAM, Mobil DDR SDRAM) • Multichip Packages (MobilDRAM & NAND Flash Combinations) • NAND Flash Memory (Managed NAND, High Speed NAND, Solid State Storage, Embedded USB)

(Formerly C&D Technologies) • AC/DC Power Supplies (200 – 2000 Watts, 2.5VDC to 48 VDC Out – PCI Modules) • Data Acquisition (Electronic Imaging, A/D Converters, D/A Converters, Sample/Hold Amplifier, Multiplexers) • DC/DC Converters (0.25 to 340 Watts, 0.02 to 80 Amps, 1.2 to 48 VDC Out; 3 to 75 VDC In) • Digital Panel Meters (Voltmeters, Wire Meters, Process Monitors, AC/DC Ammeters) • Magnetics (Inductors & Transformers, Differential common-mode filters, Databus Isolators)

• AC-DC Power Supplies (125W-375W, 3.3vdo to 56vdo, 90-264vao in, 3”, 3.3” x 5” format) • DC-DC Open Frame Power Supplies (125W, 160W, 3.3-48vdo 3” X 5” format) • Power Systems Engineering Services

• Wireless/RF (2.4G / 900M / 433M Transceiver, MCU based RF, Audio streaming)

• Communications (Voice & Audio CODECs, Pro-X SLICs, USB Audio Codec) • Logic ICs (I/O Controllers, ISA Bridge, Power Management, Hardware Monitors, Clock Generators, Power I/C, Card Reader IC’s, IEEE1394) • MPU (8-bit 80C51 based, 32-bit ARM7TDMI) • Power (ACPI Controller, PWM, DDR Bus Term, Power Switch) • Voice Solutions (Record & Playback ICs)

(RohmSemiconductoristheofficialsaleschannelforOkiSemiconductor products) • Audio (CODECs, DACs, Amplifiers ) • Display Drivers (LCD / VFD Driver / Controllers) • Embedded MCU / MPU (4-Bit NX 63K / ARM7TDMI / ARM946E / Biometrics) • Memory (P2ROM, DRAM ) • Speech (BGM Mixer - ADPCM & ADPCM2, Voice Synthesizers & Recorders, Audio Codec) • Telecom (ADPCM – Linear – PCMA-Law - VoIP Codec’s, Echo Cancellers, Transceivers) • Video (NTSC / PAL / SECAM Encoders – Decoders, NR-FIFO)

• Analog Image Sensor (NTSC/PAL) • Digital Image Sensor (CIF, VGA, 1.3M / 2.0M / 3.2M / 5.17M Pixel) • Image Processors

(Including SaRonix)

• Analog Switches (3-17V SPDT-SPST-DPST-MUX, Custom HDMI/DVI-PCI-USB-LAN) • Bridges (PCI, PCIX, PCI Express – 32/64Bit – 66/133MHz) • Clock ICs ( VCXOs, Buffers, Drivers, Generators, Skew Controllers) • Crystals & Oscillators (Quartz Crystal Resonators) • Digital Switches (2-Port, Bus, Crossbar, DDR, Mux/DeMux, Low Voltage Translator) • Interface (Re-Drivers, Buffers, Flip-Flops, Gates, Latches, Registers, Transceivers, Voltage Translators) • Logic (ALVC, FCT, LCX, LPT) • PCI Express Solutions (Packet/Signal Switches, Bridge, PHY, Signal Conditioning, Clock-Buffers/ Generators/Crystals) • Translators (Voltage, I/O Signal)

• Frequency Control (Oscillators, Crystals, VCXO, TCXO, OCXO, Sine Wave Oscillator)

• Communications (CAN, LIN, ZigBee) • Discrete (Diodes, Power MOSFETS, Thyristors, Triacs, Transistors) • Embedded MCU / MPU (8/16/32 Bit MCUs) • Logic (Standard – High/Low Voltage, Interface, Multi-Purpose) • Memory (Fast Flash, Low Power SRAM, EEPROM)

®

• Frequency Control (Oscillators, Optical Timing Clocks, Sine Wave Oscillator) • RF Components (SAW Resonators, SAW RF & IF Filters, RFIC Transceivers) • RF Modules (ZigBee, 802.15.4, UHF Mesh, FHSS ISM, Bluetooth, 802.11b) • Standalone RF modules (FHSS, 802.15.4, 802.11b, and Bluetooth)

• Power (High Reliability Transistors)

• Flat Panel Displays (LCD – 2” to 65”) • Memory (Flash – NOR) • Optoelectronics (LEDs, LED Modules, Laser Diode, Photocoupler, IrDA, photo interrupters, Emitters/ Detectors, Sensors) • Power (LDO / Switching Regulators, LED Drivers, Solid State Relays)

• Digital Video Processors • Storage Products (Serial ATA - Parallel ATA, Parallel ATA Controller, RAID Storage Processors, SATA Controllers, SATA Port Multipliers) • Video Transport (HDMI, DVI and iTMDS Products - Receivers, Transmitters, Switches, PHYs)

• Controllers (Flash Memory Card Controller, USB Flash Controller) • Embedded Graphics (128-bit 2D/3D mobile graphics engine, Mobile Graphics Coprocessor) • Mobile Communication (Mobile Satellite TV Tuner IC) • Multimedia SoC (MP3/WMA Digital Audio Player,

USB 2.0 Megapixal Image Controller)

• Advanced I/O Controllers (USB-ATA, Southbridge) • Data Communications (10/100 MAC/PHY Controller, 10/100PHY, Multimedia Processors, ArcNET, CircNET, USB Ethernet) • Environmental (Temperature Sensors, Fan Control) • USB Solutions (Card Reader, Flash Drive, Disk Drive, Hub, PHY)

• Power Management (AC/DC, Battery Management, DC/DC, LDO, MPU - Supervisor, PoE, VDC References, AC Switches) • Discretes (Thyristors, Diodes, FETs, Transistors) • Signal Conditioning (Comparators, Op-Amps, Clamp Diode Arrays, Crowbar Diodes, EMI Filtering) • Logic (3.3V, 5V, Translators, Gates, Switches, Port - Expansion) • Sensors (Accelerometers, Proximity, Thermal, Touch) • Interface (Smartcard) • Wireless (Bluetooth, ZigBee, GPS, RFID) • Audio (Decoders, Power Amps, Analog CPU, Digital CPU, Radio) • Image Sensor (Camera Modules, Imaging Signal Processor, CMOS Arrays) • Video (Demodulator, Decoders) • Motor Control (Controllers, Drivers, MCU’s) • Microcontrollers (8-bit, 16-bit, ARM7TDMI, ARM926E, Cortex M3)

• Optoelectronics (LED Drivers, EL Lamp Drivers) • Power (Switching, Automotive, PFC, Backlight, LDO, High Voltage Interface / Driver’s, PoE) • Transducers (Ultrasound)

• AC/DC Power Supplies (Industrial and Medical - 300W - 1500W) • DC/DC Converters - Industry Standard (1/8-Brick, 1/4-Brick, 1/2- Brick, Full Brick) - Non-Isolated Point of Load - Intermediate Bus Converters (1/8-Brick, 1/4- Brick, 1/2-Brick)

• Connectivity (FEC, Framers, Mappers, Switches, TSI) • Ethernet Switching (10/100/1G/10G PHYs and MACs, Switches and Transceivers) • Transport Processing (PMDs [Laser Drivers, TIAs, Post-Amplifiers], 10/100/1G/10G PHYs PHYs, Crosspoint Switches, and Signal Integrity Devices)

• Memory (SDRAM / DDR1, Pseudo SRAM, Serial Flash, Parallel Flash)

• Filters • Inductors • Isolators • Transformers (Modem, Analog/Voice Switching, DSL, Cable Modem, RJ45, PoE)

29

ExarLinear TechnologyMicrelNuvoton

SMSCSTVitesse

SYSTEM MONITORING

Clock DistributionExarLatticeMicrelPericomST

Clock GenerationAKM SemiconductorExarLatticeLinear TechnologyMicrelPericom / SaRonixPletronicsRFM

Crystals, Oscillators, Drivers, Buffers, PLLs

TIMING

A/D AKM SemiconductorExarLinear TechnologyMurata Power SolutionsNuvotonST

D/AAKM SemiconductorLinear TechnologyMurata Power SolutionsST

CONVERTERS8-BitAtmelISSILattice (soft processor)NordicNuvotonOki/RohmRenesas ST

16-BitRenesasST

CENTRAL PROCESSOR

POWER & BATTERY MANAGEMENTBattery ManagementAllegro MicrosystemsLinear TechnologyMicrelST

DiscretesAllegro MicrosystemsIXYSMurata Power SolutionsRenesasSemicoaSTSupertexWurth Midcom

Hot SwapLatticeLinear TechnologyMicrelSupertex

Linear Regulators &ReferencesAllegro MicrosystemsAtmelExarLinear TechnologyMarvell (modules)MicrelOki/RohmSharp MicroelectronicsSTSupertex

Motor ControlAllegro MicrosystemsST

POELinear TechnologySTSupertex

Power ManagementExarIXYSLatticeLinear TechnologyMarvellMicrelMurata Power SolutionsST

Power Modules Lineage Power Linear TechnologyMarvellMurata Power SolutionsSynQor

SwitchingAllegro MicrosystemsExarLinear TechnologyMarvellMicrelOki/RohmSTSupertex

Allegro MicrosystemsAKM Semiconductor AtmelClareNuvoton Oki/Rohm

OmnivisionSharp MicroelectronicsSMSCST

SENSORS AND IMAGING ARRAYS

DiscretesST

DriversMicrelSTSupertex

AmplifiersLinear TechnologyMicrelST

IsolationCELClarePericomSharp MicroelectronicsST

ComparatorsLinear TechnologyMicrelST

FiltersLinear TechnologyMicrelST

SIGNAL CONDITIONING

POWER SUPPLIESAC-DC Low Power LHV PowerMurata Power SolutionsN2Power

Medium Power LHV Power Murata Power SolutionsN2PowerSynQor

High Power LHV Power Lineage Power

Front End LHV Power Lineage Power Murata Power Solutions

Medical LHV Power SynQor

Power Systems Engineering ServicesLineage Power Murata Power SolutionsN2PowerNu Horizons Value-Add

DC-DC Industrial Isolated / Industry Standard Bricks /Non-Isolated Point of LoadLHV Power Lineage PowerMurata Power SolutionsSynQor

Open FrameLHV Power N2Power

Board Level ModulesIntermediate Bus ConvertersLineage Power Murata Power SolutionsSynQor

Memory & Processor PowerMurata Power Solutions

InfraredSharp Microelectronics

LasersFinisar

LED DisplaysOptrexMurata Power Solutions

LED Arrays / ModulesSharp Microelectronics

LEDs / Laser DiodesSharp Microelectronics

Optical SystemsCELFinisar

OptoCouplersCELSharp Microelectronics

OPTOELECTRONICS

30

8-BitAtmelISSILattice (soft processor)NordicNuvotonOki/RohmRenesas ST

16-BitRenesasST

32-BitAtmelDigiLattice (soft processor)MarvellNuvotonOki/RohmRenesasST

CENTRAL PROCESSOR

ModemConexantST

VoIPMarvellNuvoton Oki/RohmRenesas

TransceiversClareExarFinisarGennumMarvellSTVitesse

TELECOMCentralOffice(CODECs, SLICs, DAA, xDSL)AtmelClareConexantExarNuvoton Oki/RohmRenesasSTVitesse

SwitchingExarVitesse

ISMAtmelLattice MicrelNordicRFMST

RFIDAtmelLattice ST

802.11 a/b/g/nConnectBlueDigiMarvellRFMSharpST

MicrowaveCELIXYSLattice

BluetoothConnectBlueRFM

ZigBeeAtmelCELConnectBlueOki/Rohm RenesasRFMST

Discretes (RF)AKM SemiconductorAtmelCELIXYSLTCMicrelRFMST

GPSAtmelST

WiMaxSharp Microelectronics

WIRELESS

ParallelLattice NuvotonPericom

Low Speed Serial (under 1 MB/sec) Exar Lattice Linear TechnologyMicrelOki/RohmRenesas SMSC ST

High Speed Serial(above 1 MB/sec) GennumLattice MarvellMicrelPericom Renesas SMSCST

Level TranslatorsAtmelLattice Linear TechnologyMicrelPericomST

BUS INTERFACE

DATACOMEthernet MACMarvellMicrelSMSC ST

WAN / TransportExarGennumMarvellVitesse

Ethernet SwitchingMarvellVitesse

USBRenesasSilicon MotionSMSC

OpticalConexantFinisarGennum

Non-VolatileEPROMAtmelOki/RohmST

E2PROMAKM SemiconductorAtmelISSIRenesasST

FlashAtmelISSIMicronRenesasSharp MicroelectronicsWinbond

Storage ControllersSilicon MotionSMSC

VolatileDRAMISSIMicronOki/RohmWinbond

SRAMAtmelGSI TechnologyISSIRenesasSharp MicroeletronicsSTWinbond

FIFOOki/Rohm

MEMORY

ASICAtmel

CPLDAtmelLattice

FPGAAtmelLattice

LOGICSPLDAtmelLattice

StandardMurata Power SolutionsPericomRenesasST

EthernetLatticeMarvellMicrelSMSCSTVitesse

Transformers / IsolatorsWurth Midcom

PHYSICAL LAYER

AKM SemiconductorConexantGennumLattice MarvellNuvoton

OkiOmnivisionSilicon ImageSilicon Motion ST

AUDIO / VIDEO

DISK / INTERFACESAS/SCSIMarvellVitesse

SATA/ATAAtmel Exar MarvellSilicon ImageSMSCVitesse

FibreChannelLattice MarvellVitesse

Solid StateMicronSilicon MotionSMSC

31

Enhance Your Design...With Nu horizoNs EDucatioN aND DEvElopmENt solutioNs

LabCam delivers online training opportunities in a way that recognizes the value of engineers’ time. As easily as You Tube® videos, engineers can quickly load and watch videos from industry leaders consisting of insights on products, evaluation kit overviews, end-user applications and more. Each tutorial is up to ten minutes in length and features technology experts, CEOs and/or peers introducing new solutions or explaining integral aspects of an important product, solution or application. This free value-added program is packaged for short, informative and high quality distance learning.

Nu Horizons is proud to present our education and training program, which offers engineers the opportunity to participate in technical seminars conducted by experts focused on the latest technologies from our leading suppliers. This program provides higher velocity learning to help minimize start-up time to quickly begin your design process utilizing the latest development tools, software and products. Check online for the latest seminar schedule.

In order to simplify the design process, Nu Horizons has created a series of application notes designed to guide engineers through the process of interfacing different devices together. Using a detailed step-by-step approach, these design guides identify key elements in the design process. Topics in the application notes are organized by design task and each topic is a stand-alone section, with a short introduction or overview, followed by the step-by-step design guidelines. All steps include a sufficient level of detail to provide the designer with relevant information to proceed quickly and easily from start to finish.

Nu Horizons offers a wide range of development / evaluation boards, tools and kits featuring the latest technology from the most trusted suppliers in the industry. Visit the development tool section of our website for a variety of solutions all aimed at providing a low-cost solution for designers to accelerate a product’s time-to-market.

www.nuhorizons.com/labcam

www.nuhorizons.com/seminars

www.nuhorizons.com/appnotes

Application Notes

DevelopmentTools

www.nuhorizons.com/devtools

Portal is a monthly publication containing new products, technologies and development tools available from Nu Horizons leading suppliers. Portal is availabe both in print and on the web. Sign up online to receive your copy, be notified of upcoming issues or to request samples of the products found inside.

www.nuhorizons.com/portal