SEMICONDUCTOR EQUIPMENT

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OKAMOTO Semiconductor Equipment TechnologyThe OKAMOTO Line-up products have been developed to filluser's needs arising in the throughout process of the brittlematerial from ingot to chip by use of fixed and free abrasivegrain.They pursue the world of further PLANARIZATIONtoward thetwenty-first century.

Grinding

Internal SlicingSlicing Dicing

PolishingIn order to meet with multifunction of semi-conductor devices such as LSI, VLSI and ULSI, it is required to grind,with high accuracy ,highly integrated circuit on which multiple layers of wires are printed. The CMP has beendeveloped to respond to such planarization. CMP of OKAMOTO, being equipped with the special structure in thehead and clamping machanism, can stably process wafer with high througghput and high accuracy.

CMP-Chemical • Mechanical' Polishing

SPP600SBest seller manual type CMP machine with varioustype of software

Specifications Unit SPPSOOSFootprint (WXDxH) mm 1380x 1228x 1873No,01 \'IalermanagementinSinMtarewsly 2Work Siwaler,Electronicsparts,Brittlematerials

Work size mm cp200

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CMP-Chemical • Mechanical· Polishing

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SPP600ATUltra Precision Full auto Polisher received TechnologyPrize from the Japan Society of Abrasive GrainProcess in 1997

Specifications ' Unit SPP600ATFootprint (WXDXH) mm 1706x2329x2113

No,ofwafermanagementinSim~taneoos~ 4

Work Si wafer

Work size mm cp200

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Final Polisher

PNX332Fulf auto Pofisher for the next generation largediameter wafer which made an extremely improved forthe edge profile and uniformity of remove

Specifications Unit I PNX332Footprint (WXDxH) mm 2300x4820x2500

No,ojwafermanagementinSil1lJltaneoos~ 8

Work Si wafer

Work size mm cp300

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Grinding

Grinding

The machine can grind such semiconductor material as silicon, gallium arsenide, etc. And electronic material asferrits and ceramic. Adopting the OKAMOTO original process method, the machine can achieve stable production athigh efficiency without influencing machining accuracy.

Back grinder for 200mm

GNX200Technology Prize from the Japan Society

of Mechanical Engineers in 1996

Own developed Downfeed Grinding + Index wafer transfermechanism targeting wafer breakage ZERO, high accuracy,high efficiency come true on 200mm wafer. New Type

Sgepifications Unit GNXaODFootprint (WXOXH) mm 1350x2770x 1845No.ofwafermanagementinSimu~aneoosly- 3Work - Si waferWork size mm cp200

~Technology Prize from the Japan Society

of Mechanical Engineers in 1996

Grinder + Etcher in-line system in order to remove depth ofdamage by chemical etching system and Full automated massproduction machine for Ultra Thin Wafer.

Back grinder for the Ultra Thin Wafer (501Jffi wafer thickness)

GNX200E/P

SpetificatitJns Unit GNX200E/PFootprint (WXOXH) mm 2605x2515x 1980No.ofwafermanagementinSimultaneously- 5Work - Si waferWork size mm cp200

•~Technology Prize from the Japan Societyof Mechanical Engineers in 1996

Own developed Downfeed Grinding + Index wafer transfermechanism targeting wafer breakage ZERO, high accuracy,high efficiency come true on 300mm wafer. New Type

Back grinder for 300mm

GNX300

Specifications Unit GNX:lPOFootprint (WxOXH) mm 1400x31 OOx 1875No.ofwafermanagementinSimultaneoosly- 3Work - Si waferWork size mm cp300

Back grinder + Polisher in·line system for 300mm

GNX300P/ETechnology Prize from the Japan Society

of Mechanical Engineers in 1996

In order to improve wafer strength by Grinder and Polisher in-line system, achieved high accuracy and high efficiency

Specifications Unit GNX300P/EFootprint (WXOXH) mm 2400X3140X 1900No.ofwafermanagementinSimultaneously- 4

Work - Si waferWork size mm cp300

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Precision Grinder

VGS02MKI18BOwn developed Downfeed Grinding + Index wafer transfermechanism targeting wafer breakage ZERO, highaccuracy, high efficiency come true on 200mm wafer.Basic Type

Specifications Unit VGqO?MKIIS@Footprint (WxOxH) mm 2700 x 1555 x 1775No.ofwafermanagementinSimultaneously- 4Work - Si waferWork size mm tP200

Ultra Precision Grinder

VG202MKIITop model which achieved 0.14/.1m/8" (TTV)

Specifications Unit VG20~MKIIFootprint (WXOXH) mm 2160x1295x1740Work - Ultra precision SOl waferWork size mm tP200

Back grinder for chemicalcompound wafer, 200mm

VG201Developed for chemical compoundwafer grinder, ex. GaAs etc.

Speqifications Unit VG201'Footprint(WxOxH) mm 1800 x 1250 x 1850Work - GaAsWork size mm tP200

Grinder for Row bar

SDG60Grind ABS-surface (Perpendicularplane) of MR-head in precisely

Speoifications Unit SDG60Footprint (WxOXH) mm 1 130 x 1340 x 1700Work - Brittle materialsWork size mm e so

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----.Wafer Grinder for 200/300mm

VG201 D200/300Double side wafer grinder inwaxless for 200/300mm

Specifications Unit V@20 10200/300Footprint(WxOxH) mm 2580x 1765x 1784/3610x2227x2119Work - Si waferWork size mm rp2001 tP300

Grinder for brittle materials

VG401/101High rigidity machine suit forhard & brittle materials, to adaptshuttle table for the production

Specifications Unit VG4011l01Footprint (WXOXH) mm 91Ox1456x2007/1300x 1230x 1733Work - Brittle materialsWork size mm tP4001 rp250

Specifications Unit ALG12Footprint (WxOxH) mm 1932x 1783x 1843Work - 200/300mm SDI WaferWork size mm rp300

Wafer edge chamfering grinder

ALG12Own developed chamferingsystem for less edge chippingand no peel off on SDI wafer, upto 300mm capability. NEW type

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,apping

LappingA lapping machine which can adapt to various conditions is necessary to obtain high accurate flatness androughness in the process of wafer and electronic material. OKAMOTO various lapping machines is lineup ofmultiaplication, and can be selected to meet the customer's requirement. Any model of the machine is easy tooperate and suitable for mass productivity.

Supersize Pitch Polisher

SPP4000Supersize Pitch Polisher for Submicron Flatness in 1m x1m work size

Speeifications Unit SPP4000Footprint (WxDxH) mm 5B02 x 4962 x 3662Work - Brittle materials/Optical partsTable dia. mm 1/l4000

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. ---- -. ---Desk Top type lapping machine

-:J•Precision Lapping Machine

SPL15 SPL15TBest seller machinefor various type of precision process withplentiful option (ex. Facingdevice, Electronic LappingGuide,

etc) 1Less space, a compact Desk Top type Lapping Machine

•SlJecifications Unit SPL15Footprint (WxDXH) mm 1000x1510x1300Work - Electronicsparts/BrittlematerialsTable dia. mm 1/l375

Specifications Unit SPL15TFootprint (Wx Dx H) mm 560 x 750 x 5BOWork - Electronicsparts/BrittlematerialsTable dia. mm 1/l375

Supersize Lapping Machine

SPL120Lapping forl/l3000mm workpiece in precisely

Specifications Unit SPL120Footprint (WXDXH) mm 36BOX4710x26BO

Electronicsparts/BrittlematerialsWork1/l3000Table dia. mm

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Slicing/Dicing~nt&m.1 Slicil)g

Since germanium brittle material was first cut in the world, we have developed several models of dicing machinesthat meet the user's requirements for cutting semi-conductor raw material and electronic parts. Under presentcircumstances that high accuracy is a normal requirement, we are offering a machine which is equipped with newcontrol, enabling easy operation and higher throughput.

200mm 1.0 type Slicer

ASM200BRSlice for 200mm Silicon ingot as high effeciency

Specifications Unit ASM200BAFootprint (WXDxH) mm 2285x 1305x2365Work Brittle materials/Si ingotWork size mm 41200

6"/8" Dicer

ADM6DMKII/8DMKII

~Advanced software foreasy operate and easyslice for hard materialby rigid spindle

Specifications Unit ADM6DMKII/8DMKIlFootprint (WXDXH) mm 850x 1185x 1584Work Brittle materialsWork size mm 41200/41 300

Supersize Dicer

ADM500Slice for Large sizebrittle material(500 x 500mm)

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Specifications Unit ADM500Footprint (WXDXH) mm 1600x2138x 1906Work Brittle materials

400 x 400/500nWork size mm

IMulti Slicer

ASM420MMulti Cut Slicer adopt high rigidity spindle with powerfulmotor to achieve high efficiency slicing process

Specifications Unit ASM420MFootprint (WXDXH) mm 21 50 x 1455 x 1430Work - Brittle materialsWork size mm 400x200

Ultra precision Slicer

FSM250WorldTopClassPrecisionSlicingMachineadoptNoncontact type ceramicair slide way for noheat expansion and nodeterioration. fi"'~fi::::il-2S0

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Specifications Unit FSM250Footprint (WXDXH) mm 1400 x 1387 x 1681Work - Brittle materialsWork size mm 350X240

GRIND-XOKAMOTO PRECISION SYSTEMS

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OKAMOTO MACHINE TOOL WORKS, LTO.3009 KAMIICHI,ATSUGI KANAGAWA.243-0801 JAPANTEL.81-46-286-9212 FAX:81-46-286-9114

URL : http://www.okamoto.co.jp

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·Specifications subject to change without notice.Printed in Japan in Feb.2001 2001022000AD·0