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On-Chip Voltage and Timing Diagnostic Circuits
Frank O’Mahony
Advanced Design, Intel Hillsboro, Oregon
October 2014
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Why Measure Time/Voltage On-Chip?
1. Routing signals to equipment can filter and corrupt measurement
Loss, delay, discontinuities, loading, noise
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Scope
Pkg/Socket
PCB
Connectors
Cable
Circuit Die Pkg/Skt PCB Connector Cable
Scope
Why Measure Time/Voltage On-Chip?
2. Some measurements must be done w/o external equipment
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Wafer Sort
Ref: www.besi.com
In-Situ Test
Ref: www.intel.com
Presentation Flow
We’ll discuss key metrics and the limitations of off-chip measurements
Then we’ll see how to solve these with on-die measurement circuits
My objective is that you will leave today with a set of simple but very useful techniques that you can apply to your own designs
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Outline
Delay Measurement
Power Supply Characterization
I/O System Characterization
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Outline
Delay Measurement
Delay Metrics
Off-chip measurement limitations
On-Chip Phase Detector
Code Density Test (CDT)
Power Supply Characterization
I/O System Characterization
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Delay/Skew Measurements
Measuring the delay between two or more signals (often clocks) can be critical for circuit debug and characterization
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clk skew
refclk PLL clkout
Lock error
ckI
ckQ ckΦ
phase_sel
Phase Interp.
Phase linearity
Off-Chip Clock Skew Measurement
External measurement limitations
Delay matching to equipment delay error
Filtering for high-speed signals delay error
VCM and edge rate differences cause error
Delay stability poor repeatability
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Scope ckA
ckB
TA
TB
TA≠TB
Scope ckA ckB
ckref
trig
Basic off-chip setup Improved off-chip setup
Poor ck edge and repeatability
On-Chip Phase Detector
Mix phase difference down to DC on chip
Other types of phase detectors can also work
Measure DC component off- or on-chip
Shared Mixer reduces mismatch. Still has MUX mismatch.
Requires calibration for Voltage-to-Time constant (A)
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N:1
Mixer LPF
Vmeas
-π π 0
cos 𝜔𝑡 + 𝜃1 cos 𝜔𝑡 + 𝜃2
cos 𝜔𝑡 + 𝜃𝑁
cos 𝜔𝑡 + 𝜃𝑟𝑒𝑓
𝜃𝑛 − 𝜃𝑟𝑒𝑓
A ∙ cos 𝜃𝑛 − 𝜃𝑟𝑒𝑓
Example: 10GHz Clock Skew Measurements
Meas. resonant clock grid skew w/ sub-ps accuracy
Minimize/match routing to phase detectors
Measure externally with voltmeter
Calibrate externally using adjustable delay line
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Ref: F. O'Mahony, ISSCC 2003
Voltmeter 𝜃𝑟𝑒𝑓
CKref chip boundary T
Code Density Test (CDT) Method
Basic Idea: Count the # of Reference Edges that occur between two clock edges
Likelihood of “Hit” is ΔT/T
Asynchronous ring VCO provides uniform Edge PDF
Jitter and spread-spectrum improve the distribution
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ck
ck+ΔT
Async. Edge PDF
ΔT[°]
360 180 0
1
0
ΣHits ΣEdges
ΔT
T
Ref: J. Doernberg, JSSC 1984
Code Density Test (CDT) Method
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ck
ck+ΔT
ΔT
XOR
ΣEdges
ck ck+ΔT ΔT(periods)
Σ
Σ ΣHits
ΣHits ΣEdges
Async. Edge PDF
Async.
Oscillator
ΔT[°]
360 180 0
1
0
ΣHits ΣEdges
Spread
Spectrum
tune
T
Ref: M. Mansuri, VLSIC, 2012
Time-Domain Circuit Operation
Likelihood of “Hit” is ΔT/T
Async. clock period must be >2∙ΔTmax
A simple VCO frequency calibration ensures this
Jitter helps by randomizing edge location 13 of 63
ck
ck+ΔT ΔT
# Hits
# Edges
0 1 2
0 4 3 2 1
T
Async. Clock
Delay Measurement Accuracy
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Re[Φck]
Im[Φck]
Model w/ Binomial Distrib. (think “many coin flips”)
Accuracy improves as (1/ΣEdges)0.5
Higher Resolution Longer measurement time
ΔT/T
Synchronizer
Synchronizer aligns samples across full 360˚ range
Clocks for ΔT=N∙Tck+Δt are identical. Synchronizer
adds programmable # of cycles of delay.
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ck
ck+ΔT
Async.
Oscillator sel
0∙Tck
0.5∙Tck
1∙Tck edge
Delay Measurement Range
Measure ck[1..N] relative to ck,fixed
ck[1..N] are all later than ck,fixed
Removes circuit mismatch (e.g. FF’s) except Mux
Use cycdel to select which edges to compare
Synchronizer extends range to >360° 16 of 63
360 180 0
1
0
ck,fixed
ΣHits ΣEdges
ck[1..N]
cksel cycdel
Delay Analyzer
ck
ck+ΔT
ΔT[°]
Detailed Circuit Implementation
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Entirely digital implementation
Counter depth depends on required accuracy
DCO
ck,
fixed
ck+DT
XO
R LFSR 2M
Cntr
rst
fine[4:0]
ckDCO
Async. DCO + LFSR
Phase detector
24
16
cyccnt
edgecnt
2N
Cntr 24
FF D
FF D
SCK
Syn
c
SCK+DT
RZ
frz_sel[3:0]
cnt
frz
rst
cnt
frz
rst cycdel
ck[1..N]
cksel
Ref: M. Mansuri, VLSIC, 2012
Measured Phase Interpolator (PI) Linearity
Fully on-die measurement of quadrature PI w/ CDT
Phase transfer function provides INL/DNL
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0 33 66 99 1320
45
90
135
180
225
270
315
360
PI phase select code (132 steps)
Pha
se (
degre
es)
PI ckI
ckQ ckΦ
phase_sel
Delay Analyzer
phase_meas
Measured Phase Error – Repeatability
Measurement error reduces as (1/ΣEdges)0.5
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106
108
1010
10-5
10-4
10-3
Total DCO cycles count
Rep
eata
bili
ty (
rms)
no
rmaliz
ed
to c
lock p
eriod
Ref: M. Mansuri, VLSI 2012
ΣEdges
σ(ΔT/T)
Outline
Delay Measurement
Power Supply Characterization
Power Supply metrics
Off-chip measurement limitations
Real vs. Equivalent time measurement
Supply noise waveform
Supply impedance
Supply noise spectrum
I/O System Characterization
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Power Supply Metrics
Used to design, model and debug the chip
Examples: Quantify Vcc droop V(t)
Verify Grid model Z(f)
Find aggressors PSD(f)
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frequency
PSD
(f)
Noise spectrum
Power Delivery Impedance
Time
V(t
) Waveform Capture
|Z(f
)|
frequency
Power Supply Grid on Die
External Power Supply Measurements
Packages commonly have supply probes
Off-chip measurement limitations
External probing loads the power supply
Probe measurements are not local
Limited # of probe points due to pkg routing
Package filters the supply measurements
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Spectrum Analyzer
Oscilloscope
Time-Domain Reflectometer (TDR)
On-Die High-Speed ADC
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Ideally embed local ADCs to digitize these metrics
High resolution (10+ bits) and BW (>1GHz) presents a significant implementation challenge
ADC Vcc(t) meas
Power Supply Grid on Die
Real vs. Equivalent-Time Measurement
One-shot meas.
Most complete info
Time, spectral
Limited by ADC fsamp, resolution
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TS
T+TS
Eqiv. time
Voltage
Voltage
Real time
Equivalent time
time
Periodic waveforms
No spectral info.
Effective BW and resolution not limited by ADC
TS
T
Equivalent-Time Measurement
Time Base Generator (TBG) provides strobe
Sweeps strobe position in equivalent time
Sampler output is postprocessed (e.g. averaged)
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strobe
ckref
wave
Time Base Generator
Post- processor
Sampler out
Refs: E. Alon, Trans. Adv. Pkg. 2009. S. Nafzigger, JSSC 2006.
Tdelay Treset
Treset
Tdelay
Sampler Option #1: 1-bit Comparators
Programmable threshold Voltage CDF/PDF
Center of this PDF is the Average Voltage (μ)
CDF/PDF also captures Voltage Noise(e.g. σ)
…along with comparator noise and strobe jitter
Extract fit to distribution (normal, uniform, sinusoid)
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strobe
1-bit ADC
Vth
Vin Σ cnt
All 1’s
All 0’s
Vin Equal
Vin=Vth
cnt
Sampler Option #1: 1-bit Comparators
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strobe
1-bit ADC
Vth
Vin Σ cnt
Vth 0
1
0
CDF
PDF (CDF deriv.)
cnt
# strobes
0.5
Programmable threshold Voltage CDF/PDF
Center of this PDF is the Average Voltage (μ)
CDF/PDF also captures Voltage Noise(e.g. σ)
…along with comparator noise and strobe jitter
Extract fit to distribution (normal, uniform, sinusoid)
Vth=Vin
Waveform Capture w/ 1-bit Comp.
Combine 1-bit ADC with Equivalent-Time sampling to get full Waveform Capture
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strobe
1-bit ADC
Vth
Vin Σ cnt
T
Equiv. Time (T) Ref. K. Soumyanath, JSSC 1999.
Waveform Capture w/ 1-bit Comp.
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strobe
1-bit ADC
Vth
Vin Σ cnt
T
Equiv. Time (T)
Combine 1-bit ADC with Equivalent-Time sampling to get full Waveform Capture
Ref. K. Soumyanath, JSSC 1999.
Waveform Capture w/ 1-bit Comp.
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strobe
1-bit ADC
Vth
Vin Σ cnt
T
Equiv. Time (T)
Combine 1-bit ADC with Equivalent-Time sampling to get full Waveform Capture
Ref. K. Soumyanath, JSSC 1999.
Example: Simple Power Supply Measurement
Re-used RX sampler from to sample Vcc,noise
AC couple Vcc,noise sets correct common mode for sampler
Limits measurement to freq > RC
Simplest TBG – strobe is the delayed noise signal
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Ref: F. O'Mahony, VLSIC 2006
Measured Noise @ 400MHz 100
50
0
0 1 2 3
Vnois
e [
mV]
Vcc,avg
Vss,avg
Vcc,noise
LPF
Voltmeter
Noise injector
Vth
Pulse Gen.
T
Time [ns]
Rbig
Sampler Option #2: VCO-based ADC
Idea #1: Count Async. VCO edges during fixed ΔT
Pro: Directly attach VCO to power supply, real- or equivalent-time meas.
Con: Quant. error trades off with fint and fNyq
This is a variation of the Code Density Test!
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samp
Cntr (Σ) cnt
VCO
cnt
Vcc
VCO
samp Tint
Ts
0 1 2 3 0 1
en
Sampler Option #2: VCO-based ADC
Idea #2: Sample-and-Hold the supply voltage
Pro: Quantization error is independent of fint and fNyq*
Con: S/H leakage, Supply voltage buffer, Equivalent-Time measurement only (or else fNyq degrades)
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Ref: E. Alon, VLSIC 2004
Vcc
samp
Vbuf
0 1 2 3 4 5 6 7 cnt
vco
Tint
Ts (equiv. time)
Vbuf
vco
*Note: This is the Equivalent-Time Nyquist frequency
Sampler Option #2: VCO-based ADC
Idea #3: Very short aperture with averaging
Pro: Quantization error independent of fint and fNyq. Directly connect VCO to power supply. No sampling switch. Very short Tint, set by passive RC and calibrated.
Con: Not capable of real-time measurement, increased measurement time
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Ref: V. Abramzon, E. Alon, ESSCIRC 2005
cnt
Vcc
vco
samp Tint
1 0 2
samp’ XOR
samp’
cnt
samp
VCO RZ
Cntr
Tint
Sampler Calibration
Map Vcccnt with DC sweep of Vcc
Can be approximated as linear fit
Avoid operating close to VT - Variation/Linearity
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XOR
samp’
cnt
samp
VCO RZ
Cntr
cnt
Vcc [V]
VT Tint
Unknowns are removed w/ this
calibration
RC delay is not a function of Vcc,noise
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TBG Cntrs
Samp[0]
PSN inj. noiseinj
clk cnt
Samp[5] Ref: F. O’Mahony, ISSCC 2010
TBG, Cntrs and PSN inj.
I/O Lanes
I/O Lanes
Scan
Noise Samplers
Supply Noise Meas. on I/O Testchip
noiseinj
en[1:N]
Vcc
Periodic Noise Waveform Capture
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Probes local Vcc noise waveforms
1GHz Noise
0 0.2 0.4 0.6 0.8 1
0.78
0.8
0.82
0 0.2 0.4 0.6 0.8 1
0.78
0.8
0.82
0 0.2 0.4 0.6 0.8 1
0.78
0.8
0.82
Time [ps]
260μm
780μm
1300μm
Voltage
Time [ns]
Noise propagation
Power Supply Impedance Meas.
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0 1 2 3 4 5
x 10-8
-0.1
0
0.1
Time
Vo
lta
ge
Step Response
0 1 2 3 4 5
x 10-8
-2
0
2
x 108
Time
Vo
lta
ge
Impulse Response
107
108
109
0
0.2
0.4
0.6
Frequency [Hz]
Z(f
) [
]
Frequency Response
0 1 2 3 4 5
x 10-8
-0.1
0
0.1
Time
Vo
lta
ge
Step Response
0 1 2 3 4 5
x 10-8
-2
0
2
x 108
Time
Vo
lta
ge
Impulse Response
107
108
109
0
0.2
0.4
0.6
Frequency [Hz]
Z(f
) [
]
Frequency Response
0 1 2 3 4 5
x 10-8
-0.1
0
0.1
Time
Vo
lta
ge
Step Response
0 1 2 3 4 5
x 10-8
-2
0
2
x 108
Time
Vo
lta
ge
Impulse Response
107
108
109
0
0.2
0.4
0.6
Frequency [Hz]
Z(f
) [
]
Frequency Response
[V]
[10
8 V
] Z(f
)[Ω
]
Time [ns]
Time [ns]
Freq.[Hz]
Step Response (w/ current step)
Impulse Response
Freq. Response Z(f)
Impedance Measurement Example
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101
102
103
0
0.1
0.2
0.3
0.4
0.5
Frequency [MHz]
|Z(f
)| [
]Power Delivery Response from Step
Neg. step
Pos. step
Note that Q depends on the power grid loading
Measuring PSD w/ Autocorrelation
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V
time
s1 s2 s1 s2 s1 s2
R()
DFT Power Spectral
Density PSD(f)
Circuitry for PSD Meas.
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Measure R() with dual samplers
Digitally sweep = ts2-ts1
DFT of R() = PSD (post-process off-chip)
Cntr
TBG s1
s2
Samp2
Samp1
Vcc(t)
clk
ts1
ts2
Cntr
Cntr
s1
s2
s2_acc
s1_acc
r_acc
Ref: E. Alon, VLSIC 2004
PSD Measurement Example
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600 620 640 660 680 700 720 740 760-0.01
0
0.01
R(
) [V
2]
[ns]
102
103
-50
-40
-30
-20
Frequency [MHz]
PS
D [
dB
V]
R(
) [V
2]
PSD
[dBV]
[ns]
Freq. [MHz]
600 620 640 660 680 700 720 740 760-0.01
0
0.01
R(
) [V
2]
[ns]
102
103
-50
-40
-30
-20
Frequency [MHz]
PS
D [
dB
V] -22.7dBV (200mV-pp)
Outline
Delay Measurement
Power Supply Characterization
I/O System Characterization
Bit Error Rate (BER) Eye
Waveform capture
RX noise
Clk-data jitter
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Transceiver Metrics
Link measurements
BER eye / Eye Margins
Receiver noise
Clock/Data jitter
Waveform capture
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TX RX
PI ck,RX
ck,TX
Din Dout [1 0 1 1 0 0 1 0 1 1] [1 0 1 1 0 0 1 0 1 1]
V
t
1 0 1 1 0 0 1 0 1 1
BER Eye and Margins
Probability of error in Equivalent time
Sweeps Voltage and Equivalent Time
“Margin” represents how robust the link is
Voltage margin (vert.), Timing margin (horiz.)
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V
Time
1UI
Time [UI]V
olta
ge
[V
]
-0.5 0 0.5
-0.06
-0.04
-0.02
0
0.02
0.04
0.06 -10
-9
-8
-7
-6
-5
-4
-3
-2
-1
10X BER
Bit Error Ratio Eye
BER Eye and Margins
Probability of error in Equivalent time
Sweeps Voltage and Equivalent Time
“Margin” represents how robust the link is
Voltage margin (vert.), Timing margin (horiz.)
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V
Time
1UI
10X BER
0UI 1UI
Timing Margin
BER Eye Measurement
Phase Interpolator (PI) Time Sweep
Sampler Offset Voltage Sweep
Masking can be used optionally to target certain characteristics
e.g. Loop-unrolled eye, Even/Odd eyes
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Vth
Pattern Checker
Mask Error Cntr data
clk
delay
Optional
PI Cycle Cntr
BER Eye Measurement
Keep in mind Nerr/Nbits is just an estimation of BER
Rule of Thumb: 95% Confidence Level requires error-free transmission for Nbits = 3xBERmin
e.g. No errors for 3x1012 bits indicates BER≤10-12 with 95% certainty
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Pass
Fail
V
Time
Ref: http://cp.literature.agilent.com/litweb/pdf/5989-2933EN.pdf
BER Eye Measurement
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V
# errors
Keep in mind Nerr/Nbits is just an estimation of BER
Rule of Thumb: 95% Confidence Level requires error-free transmission for Nbits = 3xBERmin
e.g. No errors for 3x1012 bits indicates BER≤10-12 with 95% certainty
Time
Ref: http://cp.literature.agilent.com/litweb/pdf/5989-2933EN.pdf
Measured BER Eye Example
Often measure a subset of points to save time
Voltage or Time Margin “bathtub” plots
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Time [UI]
Vo
lta
ge
[V
]
-0.5 0 0.5
-0.06
-0.04
-0.02
0
0.02
0.04
0.06 -10
-9
-8
-7
-6
-5
-4
-3
-2
-1
10X BER
Voltage [V]
Time [UI]
RX Sampler Characterization
Voltage CDF (PDF) RX characterization
Reflects all RX noise as “input referred”
Fully in-situ if TX provides VDC
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Vth
Cntr VDC
clk All 1’s
All 0’s Vth
cnt
Input-Referred Voltage Noise
RX Sampler Characterization
Voltage CDF (PDF) RX characterization
Reflects all RX noise as “input referred”
Fully in-situ if TX provides VDC
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Vth [mV] -10 0 +10
10-2
10-4
10-6
10-8
σ=1.1mV-rms Bimodal=1mV-pp
Vth
Cntr VDC
clk
Input-Referred Voltage Noise
Clock-Data Jitter
Time CDF (PDF) RX clk-data jitter
Fully in-situ if TX provides “slow clock”
Applicable to any clock circuit
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PI
N
Cntr clk
delay
Slow clk
Sweep sampler delay
All 1’s All 0’s
cnt
Slow clk
Ref: B. Casper, ISSCC 2006
Clock-Data Jitter
Time CDF (PDF) RX clk-data jitter
Fully in-situ if TX provides “slow clock”
Applicable to any clock circuit
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Time [ps] -5 0 +5
10-2
10-4
10-6
10-8
σ=820fs-rms
PI
N
Cntr clk
delay
Slow clk
Ref: B. Casper, ISSCC 2006
On-die waveform capture
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Equiv. Time
Vth
PI
N
Cntr
data
clk
delay
Ref: B. Casper, JSSC 2003
Mask 1:N periodic N-bit waveform
CDF mean = V(t)
PI sweeps time
On-die waveform capture
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Equiv. Time
Mask 1:N periodic N-bit waveform
CDF mean = V(t)
PI sweeps time
Vth
PI
N
Cntr
data
clk
delay
Ref: B. Casper, JSSC 2003
On-die waveform capture
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Equiv. Time
Mask 1:N periodic N-bit waveform
CDF mean = V(t)
PI sweeps time
Vth
PI
N
Cntr
data
clk
delay
Ref: B. Casper, JSSC 2003
Waveform Capture Example
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0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
-0.25
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
0.25
Time (nsec)
Vo
ltag
e (
V)
Voltage [
V]
Time [ns]
1 0 1 1 1 0 0 0 1 0 0 0 1 1 0 1
Summary
On-die measurement is useful when:
No external equipment available
Accuracy lost by routing out to scopes
A simple set of digital-friendly techniques provide accurate time and voltage on-chip
Code Density Test
Equivalent time/Sub-sampling/Bit Masking
Time/Voltage sweep with 1-bit ADC
Use measurement circuits that are already on chip!
Offset comparators, phase shifters, digital counters, pattern checkers
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Key Refs: Delay Measurement
F. O'Mahony et al. "A 10-GHz global clock distribution using coupled standing-wave oscillators,“ ISSCC 2003, paper 24.4. Expanded version in JSSC, Nov. 2003, pp. 1813-1820.
J. Doernberg et al., "Full-speed testing of A/D converters," JSSC, pp. 820- 827, Dec 1984.
L.-M Lee et. al, "A sub-10-ps multiphase sampling system using redundancy," JSSC Jan. 2006, pp. 265-273.
L. Xia, et al., “Sub-2ps, static phase error calibration technique incorporating measurement uncertainty cancellation for multi-gigahertz time-interleaved T/H circuits,” TCAS-I, Jan. 2012, pp.1-9.
Mansuri, M. et al., "An on-die all-digital delay measurement circuit with 250fs accuracy," Symp. VLSI Circuits (VLSIC) 2012, pp.98-99.
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Key Refs: Power Supply Measurement
E. Alon et al., “Circuits and Techniques for High-Resolution Measurement of On-Chip Power Supply Noise,” Symp. VLSI Circuits (VLSIC) 2004, pp. 463-466.
V.A. Abramzon et al., "Scalable circuits for supply noise measurement," ESSCIRC 2005., pp. 463- 466.
S. Naffziger et al., "The implementation of a 2-core, multi-threaded itanium family processor," JSSC, pp. 197-209, Jan. 2006.
E. Alon, "On-Die Power Supply Noise Measurement Techniques," IEEE Transactions on Advanced Packaging, pp.248-259, May 2009.
F. O'Mahony et al., "A Low-Jitter PLL and Repeaterless Clock Distribution Network for a 20Gb/s Link," Symp. VLSI Circuits (VLSIC), 2006, pp.29
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Key References: I/O Characterization
Soumyanath, K. et al., "Accurate on-chip interconnect evaluation: a time-domain technique ," JSSC, pp.623-631, May 1999.
M. Takamiya, M. Mizuno, and K. Nakamura, “An on-chip 100GHz-sampling rate 8-channel sampling oscilloscope with Embedded sampling clock generator,” ISSCC 2002.
B. Casper et al., "An 8-Gb/s simultaneous bidirectional link with on-die waveform capture," JSSC, pp. 2111- 2120, Dec. 2003.
D. Oh et al., "In-situ characterization of 3D package systems with on-chip measurements," Electronic Components and Technology Conference (ECTC), 2010 pp.1485-1492.
M. Mueller et al., “Total Jitter Measurement at Low Probability Levels, Using Optimized BERT Scan Method”, Agilent White Paper. http://cp.literature.agilent.com/litweb/pdf/5989-2933EN.pdf
B. Casper et al., "A 20Gb/s Forwarded Clock Transceiver in 90nm CMOS," ISSCC 2006, pp.263-272.
F. O’Mahony et al., “A 47x10 Gb/s 1.4 mW/Gb/s Parallel Interface in 45nm CMOS,” JSSC, pp. 2828 - 2837, Dec. 2010.
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