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OpenROAD: Foundations and Realization of Open, Accessible
Design
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Webpage: theopenroadproject.org
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OpenROAD = Digital Layout Generation
• Demo of capability:DRC-clean RTL-to-GDSpush-button in foundryenablement
• Key first step in a 4-yearjourney
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https://github.com/The-OpenROAD-Project/alpha-release/blob/master/flow/docs/flow.png
Flow Demo
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Other OpenROAD Highlights
• Task 2: Cloud Infrastructure
• Task 4: Parasitic Extraction (PEX)
• Task 6: Power/Signal Integrity
• Tasks 8,9,11 (PCB): PCB Placement and Routing
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Cloud Infrastructure (Task 2 – Brown U.)Run OpenROAD Flow in a Single-Click
https://flow.theopenroadproject.org
- Public Cloudon AWS
- Browser Interface- Scalable
Infrastructure- Integration with
GitHub- Can be deployed
on-prem
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Parasitic Extraction (Task 4)
PEX model Regression Model
Parasitic resistance/capacitance
SPEF formatdesign.spef
(or RSPF file)
Design information
DEF formatdesign.def
PDKTech dataCorners
PEX is a callable functionCalling functionSTA, FP, PL, CTS, PSI
Golden PEX
Proprietary
INPUT
OUTPUT
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PEX ResultsValidation of the regression model parasitics for CMP28 PDK using a timer, experiments include comparison between:
• Arc delays of a cell• Path slacks• Pin transitions
Our Model
Num
ber o
f pat
hs
Path slack
Innovus
Num
ber o
f pat
hs
Path slack
Path slack distribution
Num
ber o
f arc
s
Error (%)
Num
ber o
f pin
s
Error (%)
Norm
alize
d re
sista
nce
Norm
alize
d ca
pacit
ance Length (um)
Length (um)
Max Rise Time Delay Error Distribution
Max Arc Delay Error Distribution
Regression fit (per-unit RC) GF14FF
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Power Integrity (T6): ML-based PDN Synthesis
Power integrity module
Placed DEFCell LEF
Package informationParasitics, C4 locations
Template-based PDN
N stitchable templatesT1, T2, …, TN
ML engineCurrent map
TN
…
T3
T1
CNN
T2
Current distribution:OpenSTA power report
IR drop map
Template definition
C4 bump
4 regions R1 – R4 with different PDN densities
R1R2
R3R4
FlowCongestion estimates
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Power Integrity Results
Width (μm)
Leng
th (μ
m)
• Evaluation of the flow:• Synthesized template-based PDN meets an 8mV static IR drop spec
Width (μm)
Leng
th (μ
m)
Testcase Technology Max IR Congestion improvement
Average number of tracks saved
Rocket Chip TSMC 16FF 6.72mV 2.39% 1,360Black Parrot TSMC 65LP 11.75mV 3.22% 2,148Vanilla Bean TSMC 65LP 8.47mV 3.02% 1,224
Ariane TSMC 65LP 11.58mV 3.31% 2,574
IR d
rop
(V)
Current map of Rocket chip Static IR map of Rocket chip
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PCB Placement & Routing Overall Flow
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• Comparative study of several placement methods and existing packages• Identified simulated annealing as a winner in terms of flexibility and performance
• Cost function: wirelength, overlap, placement & pin/net-aware routability• Routability-based placement minimizes net wire-density term• Weighting routability term yields placements with nets whose components
spread to increase net-area and reduce net wire-density• UCSD Routing (in development)
• Goal: push-button 100% routing completion• Interactions between placement and route engine• Hierarchical fine-grid rip-up and reroute router
• FreeRouting (GPLv3, https://freerouting.org/)• Routing angles: 45-degree, 90-degree and any-angle
PCB Placement & Routing Development
SA-Based placement (BM1):Cumulative airwire distance: 2784 mm
Manual placement (BM1): Cumulative airwire distance: 3640mm
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AAA: Completed work AAA: Work in progress AAA: Stretch goals• 1 Month:
• Additional validation on more PCB cases• Add 45 degree rotation support for placement• Add informative error messages• Explore global and detailed routing algorithms• Integrate UCSD placer and FreeRouting router flow in KiCad format
• 3 Months:• Implement routing algorithms in UCSD router• Identify correlations between SA-placement results and unrouted nets• Implement design rule checker in UCSD router
• 6 Months:• Thorough validation of pipeline and package development• Routability and timing-driven placement• Prototype PCB routing package for manufacturability (layout rules)• Automate tuning of P&R parameters
PCB Layout Future Plans
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WRAP-UP
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Looking Forward (Year 2 = Phase 1B)• V1.0 July 2020 must advance 20 years on EDA industry learning curve
within next 2-3 quarters• 1980’s file-based integration July 2019• 2000’s tight integration on shared incremental substrate July 2020
• Next: architecture, database, build/CI/devops, CAE/PE,• + teaching EDA SW to the OpenROAD/FOSS community
• Professionals on the team: mandatory• Industry veterans who have “done this before”
• Outreach is gaining traction – please help us accelerate it!• (e.g., “Power Users”, “Spec”, design enablement assumptions still needed
+ testcases, calibrations, contributed C++ modules, verification engines …)
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OpenROAD People to Meet This Week
Tutu and Mehdi (Michigan) Design
Advisors, Flow, Release
Abdelrahman (Brown) Cloud Infrastructure
Lukas (UCSD) Architecture and
OptimizationVidya and Jeff (Minnesota) PEX and Power Integrity
Mingyu and Lutong(UCSD) FP/Place and
Detailed Routing
Connie, James, Chester, Devon (UCSD) PCB Place and Route
The views, opinions and/or findings expressed are those of the author and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government 20
Thank You!