Upload
others
View
5
Download
1
Embed Size (px)
Citation preview
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Opportunities and Challenges for Fan-out Panel Level Packaging
(FOPLP)
T. Braun (1), M. Töpper (1), S. Raatz (1), S. Voges (2), R. Kahle (2), V. Bader (1), J. Bauer (1), K.-F. Becker (1), T. Thomas (2), R. Aschenbrenner (1), K.-D. Lang (2)
(1) Fraunhofer Institute for Reliability and MicrointegrationGustav-Meyer-Allee 25, 13355 Berlin, Germany
e-mail: [email protected] phone: +49-30/464 03 244 fax.: +49-30/464 03 254
(2) Technical University Berlin, Microperipheric Center
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Outline
Motivation for Panel Level Packaging
PLP Results
Assembly on 24”x18” Panel Level
Compress ion Molding
Die Shift
Redistribution Outlook
Summary: Advantages & Challenges for FOPLP
Outlook
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
PLP MOTIVATION
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
FOWLP/FOPLP Process Flow Options
Die assembly on carrier
Wafer/panel overmolding
Carrier release
RDL (e.g. thin film, PCB based, …), balling, singulation
Apply thermal release tape on carrier Apply release layer on carrier
RDL (e.g. thin film, PCB based, …)
Die assembly on carrier
Wafer/panel overmolding
Carrier release, balling, singulation
Mold first RDL first
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Roadmap Fan-Out Panel Level Packaging
Source: Yole
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Challenges for Panel Packaging
assemblycompress ion
moldingcarrier
preparationdebonding
redistri-bution
handling, thinning & s ingulation
Eq
uip
me
nt
Ma
teri
al • Carrier
steel, glass,..?• Thermo
release tape Alternatives?
• EMC liquid,
granular, sheet?
• Dielectric polymers
liquid or film? photosensitive
or not?• Sputter targets• Plating
• Handling carrier
Tape or other material
Temporary adhesives
• Tape laminator
Available automatic equipment?
• Pick and Place Accuracy on
panel size?
• Material application
Dispensing, sprinkle, …
• Molding Uniformity,
thickness control, …
• Debonder Available
automatic equipment?
• Lithography Stepper, laser
ablation, LDI• Sputtering,
plating Thickness
variation, lines & spaces
• Thinning & Dicing
Available automatic equipment?
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
From Wafer to Panel Size for Fan-out Packaging
24“ x 18“610 x 457 mm²
12“300 mm8“6“
Wafer Technologies PCB Technologies
Panel Technologies
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
IZM Wafer Level Packaging Line (RDL)
for Wafer Sizes 100 mm / 150 mm / 200mm / 300 mm
Sputter Spin Coater Mask Aligner Wafer Plating Wet Etching
Spin CoaterSpin Coater N2 Oven RIEMask Aligner
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
IZM Panel Level Embedding Line
from Wafer Scale to Panel Scale 610 x 456 mm²/24”x18”
Datacon evo/
ASM Siplace CA3
Mahr OMS 600/
IMPEX proX3
WL: Towa up to 8”
PL: APIC up to 18”x24”
incl. 12” WL
Lauffer/
Bürkle
Siemens Microbeam/
Schmoll Picodrill with
HYPER RAPID 50
Ramgraber automatic
plating line
Schmoll MX1 Orbotech
Paragon Ultra 200
SchmidCREAMET 600
CI 2 S3
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
PLP RESULTS
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
FOWLP/FOPLP Process Flow Steps
Die assembly on carrier
Wafer/panel overmolding
Carrier release
RDL (e.g. thin film, PCB based, …), balling, singulation
Apply thermal release tape on carrier Apply release layer on carrier
RDL (e.g. thin film, PCB based, …)
Die assembly on carrier
Wafer/panel overmolding
Carrier release, balling, singulation
Mold first RDL first
24”x18”
24”x18”
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
High Speed Assembly on 24”x18”
Assembly of dies and fiducials
5.680 chips (2 x 3 x 0.25 mm³) have
been placed on the panel
Assembly speed of
~ 6.500 chips/h using one collect and
place 20-nozzle revolver head
using four assembly heads maximum
assembly speed could be accelerated
up to 32.000 chips/h
Assembled reconfigured 18”x24” panel
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Assembly Strategies on 18”x 24”
G1 G2
G3
B A
B AB A
B A C
CC
C
B
initial fiducial dies
A
-300 -200 -100 0 100 200 300
-0,10
-0,08
-0,06
-0,04
-0,02
0,00
0,02
0,04
0,06
0,08
0,10
x [
mm
]
x-position [mm]
-200 -100 0 100 200
-0,10
-0,08
-0,06
-0,04
-0,02
0,00
0,02
0,04
0,06
0,08
0,10
y [
mm
]
y-position [mm]
-300 -200 -100 0 100 200 300
-0,10
-0,08
-0,06
-0,04
-0,02
0,00
0,02
0,04
0,06
0,08
0,10
x [
mm
]
x-position [mm]
-200 -100 0 100 200
-0,10
-0,08
-0,06
-0,04
-0,02
0,00
0,02
0,04
0,06
0,08
0,10
y [
mm
]
y-position [mm]
Assembly Option A:three fiducial dies have been placed first and in a second step all other dies have been place in reference to
the initial fiducial dies
Assembly Option B:Global fiducials (G1, G2 and G3) have been assembled first. Local fiducial dies for the four segments (A, B,
C) have been placed in a second step in reference to the global fiducials. Finally all other dies are
assembled in reference to the local fiducials.
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Compression Molding - Principle
2 – 15 min
Short cycle time Constant temperature
-> no heating or cooling ramps No full compression pressure over
longer time PMC and mold release extra process
steps
Vacuum
Mold Tool
Mold Tool
Wafer
Cavity
Release Film
EMC
process profileprocess principle
panel mold machine
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Molding Compounds for Large Area Encapsulation
Liquid Compression Molding Compounds
Granular Compression Molding Compounds
Sheet LaminationMolding Compounds
Standard material for wafer level embedding
Paste-like material is dispensed in the cavity and flows during tool closing and compression of the tooling
Limited potential for large area due to complex dispense patterns needed and longer flow length?
€€
Standard material for MAP compression molding
Granular material is distributed nearly homo-geneously all over the cavity and melts and the droplets have to fuse during closing and compression of the tooling
No limitations for large area application
€
Standard material for wafer level embedding
Material sheets are melting and only flow around dies for encapsulation
Sheets in defined thicknesses/volume
No limitations for large area application
€€€
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Material Evaluation for Compression Molding
properties A B
liquid granular
filler content 89 wt.-% 90 wt.-%
filler cut size 75 µm 55 µm
CTE1 7,5 ppm/K 7,2 ppm/K
CTE1 33 ppm/K 30 ppm/K
Tg 165 C 175 C
flexural modulus @ RT 22 GPa 27 GPa
mold temperature 125 C 125 C
inmold cure time 600 s 420 s
PMC temperature 125 C 125 h
PMC time 1 h 2 h40 60 80 100 120 140 160 180
-0.04
-0.02
0.00
material B
material A
heat
flow
[W
/g]
temperature [°C]
20 40 60 80 100 12010
2
103
104
105
106
107
material B
vis
cosity
[Pa
s]
temperature [°C]
material A
DSC Rheology
Comparable cured material properties
Comparable low mold and cure temperature but different cure times
Significant different flow properties with much lower viscosity of the liquid compound
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Mold Compound Application
Liquid EMC Granular EMCs
Dispensing of dot patterns
Volume control by insitu weighing
Homogeneous spreading
Volume control by weighing
Manually by sieve technology, automatically by vibrating unit
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Compression Molding on 12”/300 mm Wafer Size
Liquid EMC Granular EMCs
Dispensing of one dot in the center
Homogeneous filling without flow marks or knit lines
Homogeneous spreading
Homogeneous filling without flow marks or knit lines
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Compression Molding on 24”x18” Panel SizeLiquid EMC – Evaluation of dot size pattern
Evaluation of different dot patterns – target panel thickness of 450 µm (~ 250 g)
Dispense time with state of the art material and equipment 20 – 30 min
1 2
3 4
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Compression Molding on 24”x18” Panel SizeLiquid EMC – Evaluation of dot size pattern
Complete filling of the 24”x18” panel feasible
Strong flow marks and knit lines for all patterns, dispense time too long
Process and material optimization needed
1 2
3 4
Strong flow marks and knit lines
Strong flow marks and knit lines
Strong flow marks and knit lines
Panel broken along knit line
Strong flow marks and knit lines
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Compression Molding on 24”x18” Panel SizeGranular EMC – Evaluation of spreading
Evaluation of two different spreading patterns – target panel thickness of 450 µm (~ 250 g)
o Dot pattern
o Homogeneous spreading
Application time with state of the art material and manual equipment 5 – 10 min
1 2
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Compression Molding on 24”x18” Panel SizeGranular EMC – Evaluation of spreading
Complete filling of the 24”x18” panel feasible
Granular compound distribution has also an influence on flow marks
Homogeneous distribution of the compound required
1 2
Flow marks in the shape of the granular dot pattern
No flow marks
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Compression Molding on 24”x18” Panel Size
Liquid EMC Granular EMCs
Molded panels with liquid EMC show less flow marks as blank panels
Significant marks only visible at the panel edges where no dies are assembled
Molding of panels with assembled dies (die thickness: 250 µm, mold thickness: 450 m)
Molded panels with granular EMC show nearly no flow marks
Encapsulation of assembled panels with liquid and granular compound feasible
Granular EMC show slightly better mold results and shorter process time
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Die Shift on 18”x 24”
initial fiducial dies
A
Assembly Option A:three fiducial dies have been placed first and in a second step all other dies have been place
in reference to the initial fiducial dies
-300 -200 -100 0 100 200 300
-0,6
-0,5
-0,4
-0,3
-0,2
-0,1
0,0
0,1
0,2
0,3
0,4
0,5
0,6
x [
mm
]
x-position [mm]
-200 -100 0 100 200
-0,6
-0,5
-0,4
-0,3
-0,2
-0,1
0,0
0,1
0,2
0,3
0,4
0,5
0,6
y [
mm
]
y-position [mm]
Linear die shift in x- and y-direction => compensation possible
Same slope in in x- and y-direction
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Die Shift on 18”x 24”
G1 G2
G3
B A
B AB A
B A C
CC
C
B
Assembly Option B:Global fiducials (G1, G2 and G3) have been assembled first. Local fiducial dies for the four
segments (A, B, C) have been placed in a second step in reference to the global fiducials.
Finally all other dies are assembled in reference to the local fiducials.
-300 -200 -100 0 100 200 300
-0,6
-0,5
-0,4
-0,3
-0,2
-0,1
0,0
0,1
0,2
0,3
0,4
0,5
0,6
x [
mm
]
x-position [mm]
-200 -100 0 100 200
-0,6
-0,5
-0,4
-0,3
-0,2
-0,1
0,0
0,1
0,2
0,3
0,4
0,5
0,6
y [
mm
]
y-position [mm]
Reference to global fiducials
Comparable results to assembly option A
Linear die shift in x- and y-direction => compensation possible
Same slope in in x- and y-direction
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Die Shift on 18”x 24”
G1 G2
G3
B A
B AB A
B A C
CC
C
B
Assembly Option B:Global fiducials (G1, G2 and G3) have been assembled first. Local fiducial dies for the four
segments (A, B, C) have been placed in a second step in reference to the global fiducials.
Finally all other dies are assembled in reference to the local fiducials.
Reference to local fiducials
Linear die shift in x- and y-direction in each quarter => compensation possible
Same slopes in all quarters
Lower die shift
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
RDL on Panel Size – Quo Vadis?
24“ x 18“610 x 457 mm²
12“300 mm8“6“
PCB based technologies Already available on panel level – proof of concept has
been demonstrated Currently limited to 10 µm lines and spaces Maskless adaptable processes possible No die surface opening possible for e.g. sensors or LEDs Low cost potential
Thin film technologies Proven and established process for FOWLP Fine line structuring down to 2 µm lines and spaces Die surface opening possible for e.g. sensors or LEDs Quite expensive equipment
No simple upscaling of technologies from WL to PL
Not one solution for everything
Application defined – “best of both worlds”
New materials in combination with new processes must be developed
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
PLP SUMMARY & OUTLOOK
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
• Electrical Performance: Proof of concept for very RF-Modules beyond 30 GHz.
• Improved wiring and I/O: There is several decades of experience in fine line wiring and interconnection technology in the IC industry that can be leveraged for packaging technology.
• Standardization:Standardization is key for embedding die package to multi-sourcing
• Thermo-mechanical reliability : Improved reliability compared to FIWLP due to additional plastic packaging
• Cost:Cost advantages are perceived with the ultra-miniaturized approach proposed when coupled with large area, high throughput and high volume production.
Advantages for FOWLP and PLP
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Challenges for FOPLP
• Warpage ( Assembly, Manufacturability)• Heterogeneous materials and non-symmetric structure cause bow• Polymer materials with adapted CTE& modulus and low shrinkage are
required• Optimized layer sequence and design required
• Accuracy/Resolution ( Miniaturization)• Improved optical recognition systems for placement equipment• Die shift compensation• Imaging with high depth of focus and high resolution• Local alignment LDI or scanner or stepper
• Yield ( Cost)• Suited materials and components• Optimized processes• Production experience learning curve
• Low k Polymers for RDL ( Performance)• Standard epoxy polymers are not sufficient for high performance RDL• Low k with low loss are essential for RF performance• Dry-film polymers offer the possibility for thick polymer layer
beneficial for RF
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
FOPLP – Current Status
cost
performancef(L/S, pitch, no. dies, ….)
PL
WL
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Fraunhofer IZM FOPLP Industrial ConsortiumPhase I
cost
performancef(L/S, pitch, no. dies, ….)
PL
WL
Validation of current FOPLP concerning equipment, material, performance and cost Differentiation against FOWLP
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Fraunhofer IZM FOPLP Industrial Consortium Phase II
cost
performancef(L/S, pitch, no. dies, ….)
PL
WL
FOPLP enhancement with adapted/optimized equipment and materials Developments in direction of higher performance and lower cost
© Fraunhofer IZM
September 2015 Tanja Braun
ForschungsschwerpunktTechnologien der Mikroperipherik
Thanks for your attention!