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Page 1 of 9
OX-228Oven Controlled Crystal Oscillator
• Surface Mount package• SC_CUT Crystal• Low Profile Compact Package• standard frequency: 5,10, 20 MHz (CMOS) 10 MHz (Sinewave)• ultra low aging rate
• Base stations• Test equipment• Synthesizers• Military communication equipment• Digital Switching
Features Applications
OX-228
Frequency Stabilities1 ( 5,10 & 20 MHz)
Parameter Min Typical Max Units Conditionvs. operating temperature range (referenced to +25°C)
1 ppb [pk-pk] --40 to +85°C
Initial tolerancevs. supply voltage changevs. load changvs. aging / dayvs. aging / year
-0.2-2-2
-0.15-30
+0.2+2+2
+0.15+30
ppmppbppb ppbppb
at time of shipment, nominal EFCVS ±5% static
Load ±5% static after 7 days of operation (CMOS) after 7days of operation (CMOS)
Holdover/Drift -1,5 +1,5 µsec over 4 hours, temp change during the holdover time: 2.8°C; after 7 days constant
operation
start up time 0.25 2 sec
Warm-up time 5 minutes to ±5ppb of final frequency (1 hour reading) @ +25°C
Performance Specifications
Supply Voltage (Vs)
Parameter Min Typical Max Units ConditionSupply voltage (standard) 3.135 3.3 3.465 VDC
Power consumption4.0 Watts during warm-up
1.35 Watts steady state @ +25°C
CMOS Version
Page 2 of 9
Performance SpecificationsRF OutputSignal [standard] LVHCMOS
Load 15 pF
Signal Level (Vol) 0.4 VDC with Vs=3.3V and 15pF Load
Signal Level (Voh) 2.4 VDC with Vs=3.3V and 15pF Load
rise time 5 ns
fall time 5 ns
Duty Cycle 45 55 % @ (Voh-Vol)/2
Sub Harmonics -40 dBc frequencies >= 10 MHz
Spurious -90 dBc
Frequency Tuning (EFC)Tuning Range Fixed OCXO; No adjust
Additional Parameters
Phase Noise3
-131-140-143-151-152
-125-135-140-150-150
dBc/HzdBc/HzdBc/HzdBc/Hz dBc/Hz
10 Hz100 Hz1 kHz
10 kHz100khz
@ 10MHz
ADEV 55
E-11E-11
10 s tau1000 s tau @ 10MHz
Weight 12 g
Processing & Packing Handling & Processing Note
Absolute Maximum Ratingssupply voltage (Vs) 5.5 V with Vs=3.3 & 5.0 VDC
Output Load 50 pF
Operable Temperature Range -40 +85 °C
Storage Temperature Range -40 +125 °C
Page 3 of 9
Supply Voltage (Vs)
Parameter Min Typical Max Units ConditionSupply voltage (standard) 3.135 3.3 3.465 VDC
Power consumption4.0 Watts during warm-up
1.35 Watts steady state @ +25°C
RF OutputSignal Sinewave
Load 45 50 55 Ohm
Output Power 0 3 6 dBm with Vs=3.3V
Harmonics -30 dBc
Spurious -90 dBc
Frequency Tuning (EFC)Tuning Range Fixed OCXO; No adjust
Additional Parameters
Phase Noise3 (
-100-130-145-152-155-155 -160
-90-125-140-147-150-150-155
dBc/HzdBc/HzdBc/HzdBc/HzdBc/Hz dBc/HzdBc/Hz
1Hz10 Hz
100 Hz1 kHz
10 kHz 100khz1 MHz
@ 10MHz
ADEV 55
E-11E-11
10 s tau1000 s tau @ 10MHz
Weight 12 g
Processing & Packing Handling & Processing Note
Absolute Maximum Ratingssupply voltage (Vs) 5.5 V with Vs=3.3 & 5.0 VDC
Output Load 50 pF
Operable Temperature Range -40 +85 °C
Storage Temperature Range -40 +125 °C
Frequency Stabilities1 ( 10 MHz)
Parameter Min Typical Max Units Conditionvs. operating temperature range (referenced to +25°C)
1 ppb [pk-pk] --40 to +85°C
Initial tolerancevs. supply voltage changevs. load change vs. aging / dayvs. aging / year
-0.2-2-2
-0.2-30
+0.2+2+2
+0.2+30
ppmppbppb ppbppb
at time of shipment, nominal EFCVS ±5% static
Load ±5% static after 7 days of operation (Sinewave) after 7days of operation (Sinewave)
Holdover/Drift -1,5 +1,5 µsec over 4 hours, temp change during the holdover time: 2.8°C; after 7 days constant
operation
start up time 0.25 2 sec
Warm-up time 5 minutes to ±5ppb of final frequency (1 hour reading) @ +25°C
Sinewave Version
Page 4 of 9
4 5 6 7
3 2 1
TopView
H±0,3
7,620,1
17,80,1
220,2
25,4
0,2
23,4
0,1
7,620,1
17,80,1
Padvorschlagland patternrecommendation
G3432,5
2,5
0,1
Dimensions in mm
Outline Drawing / Enclosure
Pin Connections1 I.C (Do not connect)
2 N.C
3 Supply Voltage Input (Vs)
4 RF Output
5 I.C (must remain un connected)
6 I.C (must remain un connected)
7 Ground (Case)
OX-228Height “H” cover material
12.1 metal
Page 5 of 9
Standard Shipping Method (OX-228)
Recommended Reflow Profile
Additional Environmental Conditions
Enclosure Type Tape Width W (mm) Quantity per meter Quantity per reel Dimension P
OX-228 (12.1mm) 44 37.5 100 28
Dimension in mm:
A, B and K are dependent uppon component dimensions
production tolerance complying DIN IEC 286-3
P
W
1.75±0.1
R 0.75
4.0
Position in tapePin1
A
B B
Unwinding direction
0.2
0 ±0.0
5
A
All dimensions in millimeters unless otherwise stated
XXXXX
XXXXX
if W < 32mm only upper hole line existent
A
cross-section B - B
B
K
cross-sectionA - A
Note: All temperatures refer to topside of the package, measured on the package body surface.
Parameter Description
Rapid temperature changes
MIL-883-1010 Cond B 1000 cycles -55/125C
Vibration MIL-STD-883 Meth 2007 Cond A 20G 20-2000Hz 4x in each 3axis 4 min
Shock Mech.Shock MIL-STD-202 Meth 213 Cond.C 100G 6ms 6 shocks in each direction
Solderability J_STD_002C Cond A, Through hole device/ Cond. B, SMD 255C (diving time50,5sec.) Dip+Look with 8h damp pre-treatment: solder wetting >95%
Solvent resistance MIL-STD-883 Meth 2015 Solv. 1,3,4
ESD HBM JESD22-A114-F Class 1C 10* 1000V
Moisture Sensit. Level 1 JESD22-A113-B
RoHS compliance 100% RoHS 6 compliant
Washable washable device
TP: max 260°C (@ solder joint, customer board level) Tp: max: 10…30 sec Additional Information: This SMD oscillator has been designed for pick and place reflow soldering SMD oscillators must be on the top side of the PCB during the reflow process.
Page 6 of 9Rev. 20 May 2020
For Additional Information, Please Contact
Contact Information
USA: 100 Watts Street
Mt Holly Springs, PA 17065Tel: 1.717.486.3411Fax: 1.717.486.5920
Europe:Landstrasse
74924 Neckarbischofsheim Germany
Tel: +49 (0) 7268.801.0Fax: +49 (0) 7268.801.281
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your reasonability to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATION OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATU-TORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING, BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFOR-MANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly, or otherwise, under any Microchip intellectual property rights unless otherwise stated.
TrademarksThe Microchip and Vectron names and logos are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
Ordering Information
OX - 228 1 - E A E - 500 0 - 10M0000000
Product FamilyOX: OCXO
PackageSMD version: 228
Height1: 12.1 mm
Supply VoltageE: 3.3V
Stability Code500 1 ppb [pk-pk]
Frequency
Frequency Control0: No Tuning
RF Output CodeA: HCMOSE: sinewave
Temperature RangeE: -40°C to +85°C
Notes:1. Contact factory for improved stabilities or additional product options. Not all options and codes are available at all frequencies.2. Unless other stated all values are valid after warm-up time and refer to typical conditions for supply voltage, frequency control voltage, load, temperature (25°C).3. Phase noise degrades with increasing output frequency.4. Subject to technical modification.5. Contact factory for availability.
Page 7 of 9
typical warm up@ OX-2281-EAE-5000-10M0000000
typical holdover over 4 hour lab condition@ OX-2281-EAE-5000-10M0000000
typical temp stability@ OX-2281-EAE-5000-10M0000000
typical holdover over 8 hour lab condition@ OX-2281-EAE-5000-10M0000000
typical perforamce data
-20
-15
-10
-5
0
5
10
15
20
0 100 200 300 400 500 600 700
Freq
uenc
y De
viat
ion
[ppb
]
Time [sec]-40°C -10°C 25°C 50°C 85°C
Holdover 4 hour (lab condition)
0%
5%
10%
15%
20%
25%
30%
35%
5,551E-17 0,2 0,4 0,6 0,8 1 1,2 1,4 1,5
µsec
Holdover 8hour (lab condition)
0%
5%
10%
15%
20%
25%
30%
35%
0,3 0,7 1,1 1,5 1,9 2,3 2,7 3,1 >3,1
µsec
Page 8 of 9
typical frequeny vs. load change@ OX-2281-EAE-5000-10M0000000
typical Phase Noise
@ OX-2281-EAE-5000-10M0000000
typical frequeny vs. supply voltage@ OX-2281-EAE-5000-10M0000000
typical ADEV@ OX-2281-EAE-5000-10M0000000
typical perforamce data
0,00
2,00
4,00
6,00
8,00
10,00
12,00
14,00
16,00
18,00
-0,6
-0,4
-0,2
0,0
0,2
0,4
0,6
0 100 200 300 400 500 600
Load
[pF]
Freq
uenc
y de
viat
ion
[ppb
]
Time [sec]
0,00
0,50
1,00
1,50
2,00
2,50
3,00
3,50
4,00
-0,6
-0,4
-0,2
0,0
0,2
0,4
0,6
0 100 200 300 400 500 600 700 800 900
Supp
ly v
olta
ge [V
]
Freq
uenc
y de
viat
ion
[ppb
]
Time [sec]
Page 9 of 9
typical aging data@ OX-2281-EAE-5000-10M0000000
typical power consumption vs. operating temperature@ OX-2281-EAE-5000-10M0000000
@ OX-2281-EAE-5000-10M0000000
typical perforamce data
-1,00
0,00
1,00
2,00
3,00
4,00
5,00
6,00
0 10 20 30 40 50 60 70 80
df/f
[ppb
]
Time [d]
0200400600800
10001200140016001800200022002400
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Leis
tung
[mW
]
Temperatur [°C]
1
10
100
1000
1 10 100 1000
pow
er o
n tim
e be
fore
fine
adj
ustm
ent [
hour
s ]
storage time [days]
recommended power on time after x days of power off@ OX-2281-EAE-5000-10M0000000
sdf