Panasonic model TG6511FX

Panasonic System Networks Co., Ltd. 2010 Unauthorized copying and distribution is a violation of law.

ORDER NO. KM41004077CE

Telephone EquipmentModel No. KX-TG6511FXB

KX-TG6511FXFKX-TG6511FXMKX-TG6512FXBKX-TG6512FXFKX-TG6512FXMKX-TGA651FXBKX-TGA651FXFKX-TGA651FXM

Digital Cordless PhoneB: Black VersionF: Light Blue VersionM: Metallic Grey Version(for Central Europe)

2KX-TG6511FX/KX-TG6512FX/KX-TGA651FX


TABLE OF CONTENTSPAGE PAGE

1 Safety Precautions----------------------------------------------- 41.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 42.1. Battery Caution--------------------------------------------- 42.2. About Lead Free Solder (Pbf: Pb free)--------------- 42.3. Discarding of P.C. Board--------------------------------- 5

3 Specifications ----------------------------------------------------- 64 Technical Descriptions ----------------------------------------- 7

4.1. Block Diagram (Base Unit) ------------------------------ 74.2. Circuit Operation (Base Unit) --------------------------- 84.3. Block Diagram (Handset)-------------------------------114.4. Circuit Operation (Handset)----------------------------124.5. Circuit Operation (Charger Unit) ----------------------134.6. Signal Route -----------------------------------------------14

5 Location of Controls and Components ------------------156 Installation Instructions ---------------------------------------157 Operating Instructions-----------------------------------------15

7.1. For Service Hint-------------------------------------------158 Service Mode -----------------------------------------------------16

8.1. Engineering Mode----------------------------------------168.2. Copying Phonebook Items when Repairing -------208.3. How to Clear User Setting------------------------------22

9 Troubleshooting Guide ----------------------------------------239.1. Troubleshooting Flowchart -----------------------------239.2. Troubleshooting by Symptom (Base Unit and

Charger Unit) ----------------------------------------------359.3. Troubleshooting by Symptom (Handset) -----------39

10 Disassembly and Assembly Instructions ---------------4310.1. Disassembly Instructions -------------------------------4310.2. How to Replace the Handset LCD -------------------46

11 Measurements and Adjustments---------------------------4711.1. Equipment Required-------------------------------------4711.2. The Setting Method of JIG (Base Unit) -------------4711.3. Adjustment Standard (Base Unit)---------------------4911.4. Adjustment Standard (Charger Unit)-----------------5011.5. The Setting Method of JIG (Handset) ---------------5111.6. Adjustment Standard (Handset) ----------------------5311.7. Things to Do after Replacing IC or X'tal ------------5411.8. RF Specification-------------------------------------------5611.9. How to Check the Handset Speaker or

Receiver ----------------------------------------------------5711.10. Frequency Table (MHz) ---------------------------------57

12 Miscellaneous ----------------------------------------------------5812.1. How to Replace the Flat Package IC----------------5812.2. How to Replace the Shield Case ---------------------6012.3. Terminal Guide of the ICs, Transistors, Diodes

and Electrolytic Capacitors-----------------------------6213 Schematic Diagram ---------------------------------------------63

13.1. For Schematic Diagram---------------------------------6313.2. Schematic Diagram (Base Unit) ----------------------6413.3. Schematic Diagram (Handset) ------------------------6613.4. Schematic Diagram (Charger Unit) ------------------68

14 Printed Circuit Board-------------------------------------------6914.1. Circuit Board (Base Unit_Main)-----------------------6914.2. Circuit Board (Handset) ---------------------------------7114.3. Circuit Board (Charger Unit) ---------------------------73

15 Exploded View and Replacement Parts List -----------7415.1. Cabinet and Electrical Parts (Base Unit) -----------74

15.2. Cabinet and Electrical Parts (Handset)------------- 7515.3. Cabinet and Electrical Parts (Charger Unit) ------- 7615.4. Accessories------------------------------------------------ 7715.5. Replacement Part List ---------------------------------- 78


1 Safety Precautions1.1. For Service Technicians

Repair service shall be provided in accordance with repair technology information such as service manual so as toprevent fires, injury or electric shock, which can be caused by improper repair work.1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.3. FASTON terminals shall be plugged straight in and unplugged straight out.

ICs and LSIs are vulnerable to static electricity.When repairing, the following precautions will help prevent recurring malfunctions.1. Cover plastic parts boxes with aluminum foil.2. Ground the soldering irons.3. Use a conductive mat on worktable.4. Do not grasp IC or LSI pins with bare fingers.

2 Warning2.1. Battery Caution

1. Danger of explosion if battery is incorrectly replaced.2. Replace only with the same or equivalent type recommended by the manufacturer.3. Dispose of used batteries according to the manufactures Instructions.

2.2. About Lead Free Solder (Pbf: Pb free)Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatcontains lead.We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),Silver (Ag), and Copper (Cu).This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairwork we suggest using the same type of solder.

Caution PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 F 20 F (370 C 10 C). Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB. PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C). When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).


2.2.1. Suggested PbF SolderThere are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturersspecific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3. Discarding of P.C. BoardWhen discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.


3 Specifications

Note: Design and specifications are subject to change without notice.

Note for Service: Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition. Analog telephone connection: Telephone Line


4 Technical Descriptions4.1. Block Diagram (Base Unit)

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4.2. Circuit Operation (Base Unit)4.2.1. Outline

Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7). DECT BBIC (Base Band IC): IC7

- Handling all the audio, signal and data processing needed in a DECT base unit- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)- ADPCM code filter for speech encoding and speech decoding (DSP section)- Echo-cancellation and Echo-suppression (DSP section)- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)- DTMF receiver (DSP section)- Clock Generation for RF Module- ADC, DAC, timer, and power control circuitry- PLL Oscillator- Detector - Compress/Expander- First Mixer- All interfaces (ex: RF Power Amp, EEPROM, LED, Analog Front End, etc.)

RF Power Amp.: IC801- Amplifier for transmission and reception

EEPROM: IC401- Temporary operating parameters (for RF, etc.)

Additionally,- Power Supply Circuit (+3.0 V, +2.4 V, +1.8 V output)- Crystal Circuit (10.368 MHz)- Charge Circuit- Telephone Line Interface Circuit


4.2.2. Power Supply CircuitThe power is supplied to the DECT BBIC, RF Module, EEPROM and Charge Contact from AC Adaptor (+6.5 V) as shown inFig.101. The power supply is as follows;

DECT BBIC (IC7): DC Jack (+6.5 V) IC2 IC7DC Jack (+6.5 V) IC2 Q9 IC7DC Jack (+6.5 V) IC2 Q8 IC7

RF Power Amp. (IC801): DC Jack (+6.5 V) IC2 IC801 (Power AMP)

EEPROM (IC401): DC Jack (+6.5 V) IC2 IC7 IC401

Charge Contact (TP16): DC Jack (+6.5 V) R56 R55 D22 TP16

10

KX-TG6511FX/KX-TG6512FX/KX-TGA651FX

4.2.3. Telephone Line Interface

Bell signal detection Clip signal detection ON/OFF hook circuit

Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:In the standby mode, Q3 is open to cut the DC loop current and decrease the ring load.When ring voltage appears at the L1T (A) and L1R (B) leads (when the telephone rings), the AC ring voltage is transferred asfollows;

B L2 C4 R6 R33 IC7 Pin 21 (CID INp) A L1 C3 R4 R35 IC7 Pin 20 (CID INn)

ON/OFF hook circuit:In the standby mode, Q3 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit isconsequently in an on-hook condition. When IC7 detects a ring signal or press the TALK Key onto the handset, Q4 turns on and then Q3 turns on, thus providing anoff-hook condition (DC current flows through the circuit) and the following signal flow makes the loop current.

B L2 D3 Q3 Q5 R21 R22 D3 L1 A [OFF HOOK]4.2.4. Transmitter/Receiver

Audio Circuits and DTMF tone signal circuits.Base Unit and Handset mainly consist of RF Module and DECT BBIC. Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.

Signal Path:*Refer to Signal Route (P.14).

4.2.4.1. Transmitter BlockThe voice signal input from the TEL LINE interface goes to RF Power Amp. (IC801) through DECT BBIC (IC7) as shown inBlock Diagram (Base Unit) (P.7)The voice signal passes through the analog part of IC7 where it is amplified and converted to a digital audio stream signal. Theburst switch controller processes this stream performing encryption and scrambling, adding the various other fields to producethe GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.In IC7, the carrier frequency is changing, and frequency modulated RF signal is generated.In IC801,RF signal is amplified, andradiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation ofReceiver Block.

4.2.4.2. Receiver BlockThe signal of 1900 MHz band (1881.792 MHz ~ 1897.344 MHz) which is input from antenna is input to IC7 as shown in BlockDiagram (Base Unit) (P.7).In IC7, the signal of 1900 MHz band is downconverted to 864 kHz signal and demodulated, as GAP (Generic Access Profile)standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frameinformation and performs de-encryption and de-scrambling as required. It then goes to the DSP section where it is turned backinto analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.

4.2.5. Pulse DiallingDuring pulse dialling the hookswitch (Q3, Q4) is used to generate the pulses using the HOOK control signal, which is set highduring pulses. To force the line impedance low during the pause intervals between dial pulses, the PULSE_DIAL signal turnson Q2.

11


4.3. Block Diagram (Handset)

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IC80

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12


4.4. Circuit Operation (Handset)4.4.1. Outline

Handset consists of the following ICs as shown in Block Diagram (Handset) (P.11). DECT BBIC (Base Band IC): IC1

- All data signals (forming/analyzing ACK or CMD signal)- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)- PLL Oscillator- Detector- Compress/Expander- Reception

RF Power Amp: IC801- Amplifier for transmission

EEPROM: IC3- Temporary operating parameters (for RF, etc.)

4.4.2. Power Supply Circuit/Reset CircuitCircuit Operation:

When power on the Handset, the voltage is as follows;BATTERY(2.2 V ~ 2.6 V: BATT+) F1 Q2 (1.8 V), IC1-43pin (2.5V)The Reset signal generates IC1 (61 pin) and 1.8 V.

4.4.3. Charge CircuitCircuit Operation:

When charging the handset on the Base Unit, the charge current is as follows;DC+(6.5 V) R56 R55 D22 CHARGE+(Base) CHARGE+(Handset) Q4 D7 F1 BATTERY+... Battery... BATTERY- R45 GND CHARGE-(Handset) CHARGE-(Base) GND DC-(GND)In this way, the BBIC on Handset detects the fact that the battery is charged.The charge current is controlled by switching Q9 of Handset.Refer to Fig.101 in Power Supply Circuit (P.9).

4.4.4. Battery Low/Power Down DetectorCircuit Operation:

Battery Low and Power Down are detected by BBIC which check the voltage from battery.The detected voltage is as follows;

Battery LowBattery voltage: V(Batt) 2.25 V 50 mV

The BBIC detects this level and " " starts flashing. Power Down

Battery voltage: V(Batt) 2.0 V 50 mVThe BBIC detects this level and power down.

4.4.5. SpeakerphoneThe hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

13


4.5. Circuit Operation (Charger Unit)4.5.1. Power Supply CircuitThe power supply is as shown.

14


4.6. Signal Route

15


5 Location of Controls and ComponentsRefer to the Operating Instructions.

Note:You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation InstructionsRefer to the Operating Instructions.


7 Operating InstructionsRefer to the Operating Instructions.


7.1. For Service Hint

16


8 Service Mode8.1. Engineering Mode8.1.1. Base Unit

17


Frequently Used Items (Base Unit)ex.)

Note:(*1) Refer to Registering a Handset to a Base Unit in the Operating Instructions.(*2) When you enter the address or New Data, please refer to the table below.

(*3)

Items Address Default Data New Data RemarksC-ID (FSK) sensitivity 04 8B 00 01 (6 dB up) 02 (12 dB up) When hex changes from 00 to 01 or 02,

gain increases by 6 dB or 12 dB.C-ID (DTMF) sensitivity 00 0A 30 60 (6 dB up) 70 (12 dB up) When hex changes from 50 to 60 or 70,

gain increases by 6 dB or 12 dB.SMS (FSK) receiving sensitiv-ity

04 8B 00 01 (6 dB up) 02 (12 dB up) When hex changes from 00 to 01 or 02, gain increases by 6 dB or 12 dB.

SMS (FSK) sending level 04 9B/04 9A 00/04 19/20 (6 dB up)

32/40 (12 dB up)

When hex changes from 00 0B to 00 16 or 00 2C, gain increases by 6 dB or 12 dB.

Frequency 00 08/00 07 02/70 - - Use these items in a READ-ONLY mode toconfirm the contents. Careless rewriting maycause serious damage to the computer system.

ID 00 02~00 06 Given value - -

Bell length 02 1D 32 (5sec) (*3) 1E (3 sec) 14 (2 sec) This is time until bell stops ringing.(Unit: 100 ms)

PULSE Dial speed (10PPS -> 20PPS)

01 F8 2C (33msec) (*3)

19(20msec) - This is pulse make time. (Unit:1ms)

01 F9 38 (67msec) (*3)

19(30msec) - This is pulse break time. (Unit:1ms)

02 0C 57 (870msec) (*3)

2C (440msec) - This is inter-digit time in pulse mode. (Unit: 10ms)

Desired Number (hex) Input Keys Desired Number (hex) Input Keys0 0 A [R] + 01 1 B [R] + 1. . C [R] + 2. . D [R] + 3. . E [R] + 49 9 F [R] + 5

Bell length 32(hex) = 50(dec) 50 100 msec = 5000 msec (5 sec)PULSE Dial speed(10PPS -> 20PPS)

2C(hex) = 44(dec) (44 - 4) x 1msec = 40msec38(hex) = 56(dec) (56 + 4) x 1msec = 60msec57 (hex) = 87(dec) 87 10msec = 870msec

18


8.1.2. Handset

19


Frequently Used Items (Handset)ex.)

Note:(*1) When you enter the address or New Data, please refer to the table below.

(*2) When adding 01 (hex) to default value, sending level increases by 0.25 dB.ex.)

(*3) When reducing 01 (hex) from default value, receiving level increases by 0.25 dB.ex.)

(*4) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to thehandset.

Items Address Default Data New Data Possible AdjustedValue MAX (hex)

Possible AdjustedValue MIN (hex)

Remarks

Sending level 03 17 Adjusted value Given value 6F 00 (*2)Receiving level 03 18 Adjusted value Given value 00 3F (*3)

Battery Low 00 09 70 - - -(*4)Frequency 00 08/00 07 02/70 - - -

ID 00 10~00 14 Given value - - -

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys0 0 A [R] + 01 1 B [R] + 1. . C [R] + 2. . D [R] + 3. . E [R] + 49 9 F [R] + 5

Item Default Data New DataE7 E3 EB

Sending level -8dBm -7dBm -9dBm

Item Default Data New DataE7 E3 EB

Receiving level -22dBm -23dBm -21dBm

20


8.2. Copying Phonebook Items when RepairingYou can copy the handset phonebook to another (compatible Panasonic) handset. This will help to save the original phonebookdata which the customer has registered.Available models: KX-TG6511/KX-TG6512Refer to the following procedures.

Note: BS=Base Unit, HS=Handset If the max number of handsets are already registered to the base unit, a new handset cannot be registered. To register the handset, refer to Registering a Handset to a Base Unit in the Operating Instructions. To cancel the handset, refer to Deregistering a Handset in the Operating Instructions. To copy the handset phonebook, refer to Copying Phonebook Entries in the Operating Instructions.

21


Note: BS=Base Unit, HS=Handset If the max number of handsets are already registered to the base unit, a new handset cannot be registered. To register the handset, refer to Registering a Handset to a Base Unit in the Operating Instructions. To cancel the handset, refer to Deregistering a Handset in the Operating Instructions. To copy the handset phonebook, refer to Copying Phonebook Entries in the Operating Instructions.

22


8.3. How to Clear User SettingUnits are reset to the Factory settings by this operation (Erase recorded Voice messages*, stored Phone numbers, Caller listand etc.)

Note: Some menus are not reset. Refer to Operating Instructions (P.15). The reset menus differ depending on the following operations. This operation should not be performed for a usual repair.

* KX-TG6521 only

8.3.1. Resetting both base unit and handsetBoth the base unit and the registered handset which you did the following steps to are reset. Other registered handsetswill not be reset.

Note:(*1) Refer to Registering a Handset to a Base Unit in the Operating Instructions.

8.3.2. Resetting only handsetThe only handset is reset by doing the following steps to .

Note: (*2) The handset registration to the base unit is cancelled. If the handset needs to be registered to the base unit, refer to Registering a Handset to a Base Unit in the Operating

Instructions. If users do not bring the base unit with them, the registration procedure has to be done by users themselves.

23


9 Troubleshooting Guide9.1. Troubleshooting FlowchartFlow Chart

Cross Reference:Check Power (P.24)Bell Reception (P.34)Check Battery Charge (P.25)Check Link (P.26)Check the RF part (P.30)Check Handset Transmission (P.33)Check Handset Reception (P.33)Signal Route (P.14)Check Caller ID (P.33)

24


9.1.1. Check Power9.1.1.1. Base Unit

Is the AC Adaptor inserted into AC outlet? (*1)

Cross Reference:Power Supply Circuit (P.9)

Note:(*1) Refer to Specifications (P.6) for part number and supply voltage of AC Adaptor.

9.1.1.2. Handset

Cross Reference:Power Supply Circuit/Reset Circuit (P.12)

25


9.1.2. Check Battery Charge9.1.2.1. Base Unit

Cross Reference:Charge Circuit (P.12)

9.1.2.2. Handset

Cross Reference:Check Power (P.24)Charge Circuit (P.12)

9.1.2.3. Charger Unit

Cross Reference:Charge Circuit (P.12)

26


9.1.3. Check Link9.1.3.1. Base Unit

Note:(*1) Refer to Troubleshooting by Symptom (Base Unit and Charger Unit) (P.35)

Cross Reference:Check Point (Base Unit) (P.35)Power Supply Circuit (P.9)

27


Cross Reference:Check Point (Base Unit) (P.35)

28


9.1.3.2. Handset

Note:(*1) Refer to Troubleshooting by Symptom (Handset) (P.39)

Cross Reference:Check Point (Handset) (P.39)Power Supply Circuit/Reset Circuit (P.12)

29


Cross Reference:Check Point (Handset) (P.39)

30


9.1.4. Check the RF part9.1.4.1. Finding out the Defective part

After All the Checkings or Repairing1. Re-register the checked Handset to the checked Base Unit, and Regular HS to Regular BU.

Note:If you need to register a handset, refer to Registering a Handset to a Base Unit in the Operating Instructions.

31


9.1.4.2. RF Check FlowchartEach item (1 ~ 3) of RF Check Flowchart corresponds to Check Table for RF part (P.32).Please refer to the each item.

Note:(*1) Base unit - refer to (G) of Check Point (Base Unit) (P.35) Handset - refer to (H) of Check Point (Handset) (P.39)

32


9.1.4.3. Check Table for RF part

Note:(*1) Refer to Adjustment Standard (Base Unit) (P.49)(*2) Refer to Adjustment Standard (Handset) (P.53)

No. Item BU (Base Unit) Check HS (Handset) Check1 Link Confirmation Normal

HS, BU Mode: [Normal mode]

1. Register Regular HS to BU (to be checked).

2. Press [Talk] key of the Regular HS to establish link.

1. Register HS (to be checked) to Regular BU.

2. Press [Talk] key of the HS to establish link.

2 Xtal Frequency confirmation 1. Check Xtal Frequency. (*1)(10.368 MHz 100 Hz)

1. Check Xtal Frequency. (*2)(10.368 MHz 100Hz)

3 Range Confirmation Normal

HS, BU Mode: [Normal mode]

1. Register Regular HS to BU (to be checked).

2. Press [Talk] key of the Regular HS to establish link.

3. Compare the range of the BU (being checked) with that of the Regular BU.

1. Register HS (to be checked) to Regular BU.

2. Press [Talk] key of the HS to establish link.3. Compare the range of the HS (being

checked) with that of the Regular HS.

33


9.1.5. Check Handset Transmission

Cross Reference:Signal Route (P.14)

9.1.6. Check Handset Reception

Cross Reference:How to Check the Handset Speaker or Receiver (P.57).Signal Route (P.14)

9.1.7. Check Caller ID

Cross Reference:Signal Route (P.14)

34


9.1.8. Bell Reception9.1.8.1. Base Unit

9.1.8.2. Handset

Cross Reference:Telephone Line Interface (P.10)Check Link (P.26)How to Check the Handset Speaker or Receiver (P.57)

35


9.2. Troubleshooting by Symptom (Base Unit and Charger Unit)If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester(*1) or not.

Note:(*1) A general repair is possible even if you dont have the DECT tester because it is for confirming the levels, such as Acousticlevel in detail.(*2) Refer to Check Point (Base Unit) (P.35)

9.2.1. Check Point (Base Unit)Please follow the items below when BBIC or EEPROM or FLASH is replaced.

Note:After the measuring, suck up the solder of TP.*: The Setting Method of JIG (Base Unit) (P.47) is required beforehand.The connections of simulator equipment are as shown in Adjustment Standard (Base Unit) (P.49).

Items Check Point

Procedure Check or Replace Parts

(A) 3.0 V Supply Confirma-tion

VDD3 1. Confirm that the voltage between test point VDD3 and GND is 3.0 V 0.2 V. IC2, IC3, C32, C36, C86, C87, C88, R91, R92, R93, R95, D10,

Q10, L3(B) 1.8 V Supply Confirma-

tionVDD1 1. Confirm that the voltage between test point VDD1 and GND is 1.8 V 0.02 V.

2. Execute the command VDD, then check the current value.3. Adjust the 1.8V voltage of VDD1 executing command VDD XX(XX is the

value).

Q8, C75, C614, C61, IC7

(C) Charge Pump2.5V Supply Confirma-tion

VDD5 1. Confirm that the voltage between test point VDD5 and GND is 2.5 V -0.1/+0.3V.

IC7,C625,C631

(D) Charge Pump3.0V Supply Confirma-tion

VDD4 1. Confirm that the voltage between test point VDD4 and GND is 3.0 V 0.2 V. IC7,C616,C630

(E)* BBIC Confirmation - 1. BBIC Confirmation (Execute the command getchk).2. Confirm the returned checksum value.

Connection of checksum value and program number is shown below.

IC7, X1, R77, RA80

(F)* EEPROM Confirmation - 1. EEP-ROM Confirmation (Execute the command "sendchar EPV").2. Confirm the returned Value(Value for reference is written at "EEPROM C/

SUM in Software_Version_Table.xls).

IC7, RA402, C51, R657,

IC401(G)* BBIC Clock Adjustment CLK 1. Input Command sendchar WWD ff 48 IC 8006

2. Confirm that the voltage between testpoint VDD4 and GND is less than 1.0 V.3. Input Command sendchar sfr, then you can confirm the current value.4. Check Xtal Frequency. (10.368 MHz 100 Hz).5. If the frequency is not 10.368MHz 100Hz, adjust the frequency of CLK exe-

cuting the command sendchar sfr xx xx (where xx is the value) so that thereading of the frequency counter is 10.368000 MHz 5 Hz.

X1, IC7, R430, C305

36


(H)* Hookswitch Check with DC Characteristics

- 1. Connect Telephone Socket to Tel-simulator which is connected with 600 .2. Set line voltage to 48 V and line current to 40mA at off-hook condition of nor-

mal telephone.3. Execute the command hookoff4. Confirm that the line current is 40 mA 5 mA.5. Execute the command hookon.6. Confirm that the line current is less than + 0.8 mA.

L1, L2, Q3, R14, R15, Q4, R16,

R17, D3, R18~R24,

C15~C17, D21, Q5, R27, IC7

(I) DTMF Generator Check - 1. Connect Telephone Socket to DTMF tester. (Load=600 )2. Link Handset and push dial key.3. Confirm DTMF character.4. Confirm that the high Group is -6.0 dBm ~ -10.0 dBm.5. Confirm that the low Group is -8.5 dBm ~ -12.5 dBm.

IC7, R116, C141, R29, C22,

C23, Q5, D21

(J)* Transmitted Power Con-firmation

-ANTI_TP

Remove the Antenna before starting step from 1 to 7.1. Configure the DECT tester (CMD60) as follows;

Test mode: FP Traffic Carrier: 5 Traffic Slot: 4 Mode: Loopback PMID: 00000 RF LEVEL = -70 dBm.

2. Execute the command sendchar TST.3. Execute the command sendchar dmv 2 2.4. Check that Signalling Status has been set to Locked, then press ACCEPT

RFPI.5. Initiate connection from Dect tester (set up connect)6. Execute the command ANT1.7. Confirm that the NTP value at ANT is 19.0 dBm ~ 25.0 dBm.

IC7, C802~C806, C808~C814, C820, C819, C822, C823, C825, C827, C826, C834, C851, C853, C859~C861,

DA801, DA802, IC801,

L801~L803, C855~C858, R801~R807, R106, R109,

Q9, C617 (K)* Modulation Check and

Adjustment-

ANTI_TPFollow steps 1 to 6 of (J).

7.Confirm that the B-Field Modulation is -370 30/ +370 30 kHz/div & Modu-lated width 690 kHz using data type Fig31.8.Adjust the B-Field Modulation if required. (Execute the command readmodand wrtmod xx, where xx is the value.)


DA801, DA802, IC801,

L801~L803, C855~C858, R801~R807, R106, R109,

Q9, C617 (L)* Frequency Offset Check -


7.Confirm that the frequency offset is < 50 kHz.IC7,

C802~C806, C808~C814, C820, C819, C822, C823, C825, C827, C826, C834, C851, C853, C859~C861,

DA801, DA802, IC801,

L801~L803, C855~C858, R801~R807, R106, R109,

Q9, C617

Items Check Point


37


(M)* Frequency Drift Confir-mation

-ANTI_TP

Follow steps 1 to 6 of (J).7.Confirm that the frequency drift is < 35 kHz/ms.


DA801, DA802, IC801,

L801~L803, C855~C858, R801~R807, R106, R109,

Q9, C617 (N)* Sensitivity Receiver

Confirmation-


7.Set DECT tester power to -90 dBm.8.Confirm that the BER is < 1000 ppm.


DA801, DA802, IC801,

L801~L803, C855~C858, R801~R807, R106, R109,

Q9, C617 (O)* Timing Confirmation -


7.Confirm that the Timing accuracy is 5.0 ppm (When adjust the frequency of CLK in item (G)). 15 ppm (When do not adjust the frequency of CLK in item (A)).


DA801, DA802, IC801,

L801~L803, C855~C858, R801~R807, R106, R109,

Q9, C617 (P)* Power RAMP Confirma-

tion- Follow steps 1 to 6 of (J).

7.Confirm that Power RAMP is matching.IC7,

C802~C806, C808~C814, C820, C819, C822, C823, C825, C827, C826, C834, C851, C853, C859~C861,

DA801, DA802, IC801,

L801~L803, C855~C858, R801~R807, R106, R109,

Q9, C617

Items Check Point


38


9.2.2. Check Point (Charger Unit)

Note:After the measuring, suck up the solder of TP.The connection of adjustment equipment is as shown in Adjustment Standard (Charger Unit) (P.50).

(Q) Audio Check - 1. Link with Handset.2. Input -45dBm/1kHz to MIC of Handset.

Measure the Level at Line I/F and distortion level.3. Confirm that the level is -8 dBm 2 dBm and that the distortion level is < 5%

at TEL Line (600 Load).4. Input -20 dBm/1 kHz to Line I/F.

Measure the level at Receiver of Handset and distortion level(*Receive volume set to second position from minimum).

5. Confirm that the level is -22 dBm 2 dBm and that the distortion level is < 5%at Receiver (Volume Middle, 150 Load).

IC7, SA1, L1, L2, D3, Q3, Q4, R14, R15, R16, R17, D21, Q5, R19, R20, C14,

C56, R117, R116, C141, R9,

C22, C23

(R) Charging Check - 1. Connect Charge Contact 12 /2 W resistor between charge+ and charge-.2. Measure and confirm voltage across the resistor is 3.10 V 0.3 V.

R55, R56, D22, D23, D24, C623,

C624(S) 2.4V Supply Confirma-

tion VDD2 VDD2 1. Confirm that the voltage between test point VDD2 and GND is 2.5V 0.2V. IC7, Q9, C617

Items Check Point


(A) Charging Check - 1. Connect Charge Contact 12/2 W resistor between charge+ and charge-.2. Measure and confirm voltage across the resistor is 3.1 V 0.3 V.

R1, F1

Items Check Point


39


9.3. Troubleshooting by Symptom (Handset)If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester(*1) or not.

Note:(*1) A general repair is possible even if you dont have the DECT tester because it is for confirming the levels, such as Acousticlevel in detail.(*2) Refer to Check Point (Handset) (P.39)

9.3.1. Check Point (Handset)Please follow the items below when BBIC or EEPROM is replaced.

Note:After the measuring, suck up the solder of TP.*: Connections (P.51) is required beforehand.The connections of adjustment equipment are as shown in Adjustment Standard (Handset) (P.53).

Items Check Point


(A)* 1.8 V Supply Adjustment VDD1 1. Confirm that the voltage between test point VDD1 and GND is 1.8 V 0.02 V.2. Execute the command VDD, then check the current value.3. Adjust the 1.8V voltage of VDD1 executing command VDD XX(XX is the

value).

IC1, Q2, C48, D1, C1, C44,

R45, C40, C45, F1

(B)* BBIC Confirmation - 1. BBIC Confirmation (Execute the command getchk).2. Confirm the returned checksum value.

Connection of checksum value and program number is shown below.

IC1, X1, RA61, R64, R66

(C)* EEP-ROM Confirmation - 1. EEP-ROM Confirmation (Execute the command "sendchar EPV").2. Confirm the returned Value (Value for reference is written at "EEPROM C/

SUM in Software_Version_Table.xls).

IC1, IC3, RA40, C172

(D) Charge Control Check & Charge Current Monitor

Check

- 1. Apply 3.5 V between CHG(+) and CHG(-) with DC power supply and set cur-rent limit to 250 mA.Confirm the indication of charging on LCD.

2. Confirm that the current limit LED of DC power supply is ON/OFF.Confirm it after waiting over 1 minute at least.

3. Decrease current limit of DC power supply to 100 mA.4. Confirm that the current limit LED of DC power supply is stable. (Current limiter

is ON.)(If charge control cannot be confirmed by this procedure, please use battery to hand-set power supply and try again.)

IC1, Q4 Q9, D7, R6, R7, F1, C1, R2,

R30, R31, R8, R45

(E)* Charge Detection (OFF) Check

- 1. Stop supplying 3.5 V to CHG (+) and CHG (-).2. Confirm the indication of charging has been cleared.

IC1, Q4 Q9, D7, R6, R7, F1, C1, R2,

R30, R31, R8, R45

40


(F)* Battery Monitor Check - 1. Apply 2.25 V between BATT+ and BATT-.2. Execute the command

sendchar PADsendchar LED 0sendchar CRX 0 1sendchar AD1It assumes that the return value is XX.a) 6c XX 71: No need to adjustb) XX: 6A ~ 6B: Need to adjustXX: 72 ~ 74: Need to adjustWrite AD value of 2.25 V to EEPROM.ex) read data: XX = 6A, write data: YY = 6Aread data: XX = 73, write data: YY = 73EEPROM = 0004(Low Voltage) write YYExecute the command wreeprom 00 04 01 YY.EEPROM = 0005(No Voltage) write YY - 1DExecute the command wreeprom 00 05 01 ZZ.EEPROM = 000A(Low Voltage BL) write YY - 16Execute the command wreeprom 00 0A 01 WW.Note:

ZZ = YY - CNo Voltage writing data limit is 00.c) XX: 00 ~ 69: RejectXX: 75 ~ FF: Reject

IC1, F1, C1, R45

(G) Battery Low Confirma-tion

- 1. Apply 2.40 V between BATT+ and BATT-.2. Confirm that there is no flashing of Battery Icon.3. Apply 2.25 V 0.08 V between BATT+ and BATT-.4. Confirm that there is flashing of Battery Icon.

IC1, F1, C1, R45

(H)* BBIC Clock Adjustment CLK 1. Apply 2.6 V between BATT+ and BATT- with DC power.2. Input Command sendchar sfr, then you can confirm the current value.3. Check Xtal Frequency. (10.368 MHz 100 Hz).4. If the frequency is not 10.368 MHz 100 Hz, adjust the frequency of CLK exe-

cuting the command sendchar sfr xx xx (where xx is the value) so that thereading of the frequency counter is 10.368000 MHz 5 Hz.

Note:Clear the registered information for Base Unit before measurement, because theFrequency will not possibly get stable due to the registered information.Pressing the button of 3 7 9 # clears the registration.Register to it on Base Unit after measurement.

IC1, X1, C47

(I)* Transmitted Power Con-firmation

- Remove the Antenna before starting step from 1 to 4.1. Configure the DECT tester (CMD60) as follows;

Test mode: PP RFPI: 0102030405 Traffic Carrier: 5 Traffic Slot: 4 Mode: Loopback RF LEVEL = -70 dBm PACKET: PP32Z

2. Execute the command sendchar TST 01 02 03 04 05".3. Initiate connection from DECT tester.4. Confirm that the NTP value at ANT is 19 dBm ~ 25 dBm.

IC1, C802~C806, C808~C814, C819~C820,

C822, C825~C827,

C834, C860~C864, L801~L804,

DA801, R801~R808

(J)* Modulation Check and Adjustment

- Follow steps 1 to 3 of (K).4.Confirm that the B-Field Modulation is -37030/ +37030 kHz/div & Modulatedwidth 690 kHz using data type Fig 31.

IC1, C802~C806, C808~C814, C819~C820,

C822, C825~C827,

C834, C860~C864, L801~L804,

DA801, R801~R808

Items Check Point


41


(K)* Frequency Offset Confir-mation

- Follow steps 1 to 3 of (I).4.Confirm that the frequency Offset is < 50 kHz.

IC1, C802~C806, C808~C814, C819~C820,

C822, C825~C827,

C834, C860~C864, L801~L804,

DA801, R801~R808

(L)* Frequency Drift Confir-mation

- Follow steps 1 to 3 of (I).4.Confirm that the frequency Drift is < 35 kHz/ms.

IC1, C802~C806, C808~C814, C819~C820,

C822, C825~C827,

C834, C860~C864, L801~L804,

DA801, R801~R808

(M)* Sensitivity Receiver Confirmation

- Follow steps 1 to 3 of (I).4.Set DECT tester power to -88 dBm.5.Confirm that the BER is < 1000 ppm.

IC1, C802~C806, C808~C814, C819~C820,

C822, C825~C827,

C834, C860~C864, L801~L804,

DA801, R801~R808

(N)* Power RAMP Confirma-tion

- Follow steps 1 to 3 of (I).4.Confirm that Power RAMP is matching.

IC1, C802~C806, C808~C814, C819~C820,

C822, C825~C827,

C834, C860~C864, L801~L804,

DA801, R801~R808

(O) Audio Check and Confir-mation

- 1. Link to BASE which is connected to Line Simulator.2. Set line voltage to 48 V and line current to 40 mA.3. Input -45 dBm/1KHz to MIC and measure Line output level.4. Confirm that the level is -8 dBm 2 dBm and that the distortion level is < 5% at

TEL Line (600 Load).5. Input -20 dBm/1KHz to Line I/F and measure Receiving level at REV+ and

REV-.6. Confirm that the level is -22 dBm 2 dBm and that the distortion level is < 5%

at Receiver. (vol = 2)

IC1, C12, C96, C97, R215, R27, RA4, C11, C13,

R28, D3, D4, MIC, R73, R74

(P) SP phone Audio Check and Confirmation

- 1. Link to Base which is connected to Line Simulator.2. Set line voltage to 48 V and line current to 40 mA.3. Set the handset off-hook using SP-Phone key.4. Input -25 dBm/1KHz to Line I/F and measure Receiving level at SP+ and SP-.5. Confirm that the level is -15 dBm 2 dBm and that the distortion level is < 5%.

(vol = 3)

IC1, C12, C73, D13, D14, R73, R74, MIC, C11, C13, RA4, R27, R28, C96, C97, R215, C72

(Q) Charge Pump 3.0V Sup-ply Confirmation

CP3.0V 1. Confirm that the voltage between testpoint CP3.0V and GND is 3.0V -0.1/+0.3V.

C49, C52~C54

(R) Charge Pump 4.0V Sup-ply Confirmation

CP4.0V 1. Confirm that the voltage between testpoint CP4.0V and GND is 4.0V -0.2V. C50, C51, C55

Items Check Point


42


9.3.2. Troubleshooting for SpeakerphoneWhen the customers telephone line corresponds to the following conditions, and the transmission signal of SP-Phone isinterrupted, performing the next set up to a cordless handset will improve it to some extent.Conditions1. When customers line has less line loss.

ex.) The customer is using optical fiber, ISDN terminal adaptor, or PBX.In this case, receiving signal is strong and it may affect transmission signal.

2. When the other party is talking from noisy place.ex.) The other party is using cellular phone. The background noise is very loud.In this case, the noise from the other party (i.e. surrounding noise) may affect transmission signal.

Setting Method Change the handset address of EEPROM (0129) from 00 to 01 by Engineering Mode.

43


10 Disassembly and Assembly Instructions10.1. Disassembly Instructions10.1.1. Base Unit

44


10.1.2. Handset

45


10.1.3. Charger Unit

46


10.2. How to Replace the Handset LCDNote:

The illustrations are simplified in this page.They may differ from the actual product.

47


11 Measurements and AdjustmentsThis chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in Troubleshooting Guide (P.23)

11.1. Equipment Required Digital multi-meter (DMM): it must be able to measure voltage and current. Oscilloscope. Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; 4 ppm)

Hewlett Packard, 53131A is recommended. DECT tester: Rohde & Schwarz, CMD 60 is recommended.

This equipment may be useful in order to precisely adjust like a mass production.

11.2. The Setting Method of JIG (Base Unit)This section explains the PC setting to use command required in Check Point (Base Unit)(P.35).

Serial JIG cable: PQZZ1CD300E* PC which runs in DOS mode Batch file CD-ROM for setting: PNZZTG6511FX

Note:*: If you have the JIG Cable for TCD500 series

(PQZZ1CD505E), change the following values ofresistance. Then you can use it as a JIG Cable for bothTCD300 and TCD500 series. (It is an upper compatible JIGCable.)

11.2.1. Connections Connect the AC adaptor to DC-JACK (base unit).

Connect the JIG Cable GND (black) to GND.

Connect the JIG Cable RX (red) to URX and TX (yellow) to UTX.

Note:*: COM port names may vary depending on what your PC calls it.

Resistor Old value (k) New value (k)R2 22 3.3R3 22 3.3R4 22 4.7R7 4.7 10

48


11.2.2. How to install Batch file into P.C.

Note: ***** varies depending on the country or models.

11.2.3. CommandsSee the table below for frequently used commands.

Command name Function Examplerdeeprom Read the data of EEPROM Type rdeeprom 00 00 FF, and the data from address

00 00 to FF is read out.readid Read ID (RFPI) Type readid, and the registered ID is read out.writeid Write ID (RFPI) Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E

98 is written.hookoff Off-hook mode on Base Type hookoff.hookon On-hook mode on Base Type hookon.getchk Read checksum Type getchk.wreeprom Write the data of EEPROM Type wreeprom 01 23 45. 01 23 is address and 45

is data to be written.

49


11.3. Adjustment Standard (Base Unit)When connecting the simulator equipment for checking, please refer to below.

11.3.1. Bottom View

Note:(A) - (S) is referred to Check Point (Base Unit) (P.35)

PNLB

1732

ZPb

F

A

C23

C24

C57

C141

C305

C614

C61

C168

C820

C826

C65

C814

C90

C72

C422

C625

C631

C617

C421

C84

C55

C53

C137

C423

C54

R615

R2

R57

R117

R29

TP9

R12

R77

R78

DC_IN

R36R34

R37

R33

R81

IC7

D10

Q9

Q421

DCP

SPp

SPm

DCM

C624

C637

C19

C22

C56

C14

C18C1

55

CL2

C857

C855

C167

C623

C626

C856

C858

C837 C

169

C170

C136

C171

C52

CL1

C146 C

150

C149

C145

C615

C75

C74

CLK

(G)

(A),(

B),(C

),(D)

,(T)

C616

C630

C60

ANT2

_TP

ANT1

_TP

R24

R23

R20

R19R1

8R

116

R87

R86

R42

9

R42

5R42

4R

430

R42

6

R76

R40

R13

R35

R32

R75

R42

8 R42

7

LIN

E_D

C

CHG

RED

BLK

RED

RED

WH

TR

EDBLK

BLK

GRN

YLWCHG

SPDC

L2R

L1R

L1T

L2T

IC42

1

TP10

TP15

TP15

-sub

TP16

TP16

-sub

RA8

0

JTAG

RA1

D21

D27

D15

D16

D26

D24

D23

Q5

Q2

Q8

Q10

E

E

14

GND

_C

GND

2UT

X2UR

X2

GND

J101

VDD

5

VDD

3

VDD

1

VDD

2

VDD

4URX

UTX

GND

GN

D

CHARGE+

CHARGE-

GNDRXTX

GND

ANT

CP+2.5V+3.0V+2.4V+1.8V

VDD5CP+3.0VVDD4

VDD3VDD2VDD1

Dig

ital

Volt

Met

er

Dig

ital

Volt

Met

erD

C Po

wer

6.5V

DEC

T Te

ster

CTS6

0PC

U-AR

T

Dig

ital

Volt

Met

er

GND

Freq

uenc

yCo

unte

r

50 Term

inal

12 2W

(J),(K

),(L),

(M),

(N),(

O),(P

)(E

),(F)

,(G),(

H),

(I),(J

),(K)

,(S)

(R)

50


11.4. Adjustment Standard (Charger Unit)When connecting the simulator equipment for checking, please refer to below.

11.4.1. Bottom View

Note:(A) is referred to Check Point (Charger Unit) (P.38)

TP4

TP3

1

2

J1

AF1PbF

PNLP1029YA

PQUP11532Y

Charge-

Charge+

12 /2 W

DigitalVolt Meter (A)

DC POWERDC 6.5 V

TP3

TP4 (GND)

51


11.5. The Setting Method of JIG (Handset)This section explains the PC setting to use command required in Check Point (Handset)(P.39).

Serial JIG cable: PQZZ1CD300E* PC which runs in DOS mode Batch file CD-ROM for setting: PNZZTG6511FX

Note:*: If you have the JIG Cable for TCD500 series

(PQZZ1CD505E), change the following values ofresistance. Then you can use it as a JIG Cable for bothTCD300 and TCD500 series. (It is an upper compatible JIGCable.)

11.5.1. ConnectionsConnect the DC Power or Battery to BATT+ and BATT-.

Connect the JIG cable GND (black) to GND.

Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.

Note:*: COM port names may vary depending on what your PC calls it.

Resistor Old value (k) New value (k)R2 22 3.3R3 22 3.3R4 22 4.7R7 4.7 10

52


11.5.2. How to install Batch file into P.C.

Note: ***** varies depending on the country or models.

11.5.3. CommandsSee the table below for frequently used commands.

Command name Function Examplerdeeprom Read the data of EEPROM Type rdeeprom 00 00 FF, and the data from address

00 00 to FF is read out.readid Read ID (RFPI) Type readid, and the registered ID is read out.writeid Write ID (RFPI) Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E

98 is written.getchk Read checksum Type getchk.wreeprom Write the data of EEPROM Type wreeprom 01 23 45. 01 23 is address and 45

is data to be written.

53


11.6. Adjustment Standard (Handset)When connecting the simulator equipment for checking, please refer to below.

11.6.1. Component View

Note:(A) - (R) is referred to Check Point (Handset) (P.39)

A

PbF

C44

C880

C811C813

C72

C203

C105C206

C201

C175 C70C152

C71

C200C107

C106

C103C104

C73C864C863C814

C834

C802

C804

C43

C837

C48 C40C54C52C53

C51C55

C39 C30

C10

C400

C340

C341

C342

C332

C331

C147

C113C5

JTAGSTM

URXUTX

CHG(+)

MIC+ MIC-

CHG(-)

BATT-BATT+

BAT

MIC-

RCV-

E

1 4

8 5

MIC+

RCV+

R578

R50R53R236

R54

R231

R801R802

R805 R880R808

R66R63

R225R405

R203R807

R27R400R402 R248

R24921

1

R23R37R36

R20CLK

1.8V

R7R30

F1

R2

R332R331

R330

R3R8

R4

L802

IC3

TP_ANT1

RA800

RA4

RA40CP3.0V

CP4.0V

D22D21

D13RED

BLK

RED

BLK

D14

D400

D7

D3 D4

Q401

POWER

Q400

Q11

Q12

GND

C580

C187C186

C204

C827

C881

C819

C45C46

C825C809

C810 C861C808

C812

C806

C138

C139

C803

C805

C47C822

C826

C820

C860

C182

C49C50

C188

C12

C13C11

C96C18

C17 C97

C38

C35

C121

C150

C1C2

C172

C75C74

C3X1

MIC

R232

R55

SPEAKER

R233

R806

R64

R28

R403R

404

R406

R407

R401

R215

R45

R74

R31R6

R73

L801

L803

L46L47

IC801

IC1

RA32

RA1

RA61

RA31

RA30

DA801

D1

Q880

Q2

Q10Q7

Q4

Q9

RECE

IVER

PNLB1734YKX-TGA650XXKX-TGA651XXKX-TGA250XXKX-TGA251XXKX-TGA403XX

TGA250XXTGA251XXTGA403XX

TGA650XXTGA651XX

AFG

ener

ator

DC

6.5V

DC

Powe

r2.

30~2

.60V

DC

POW

ER2.

00~2

.25V

GND

GND

Dig

ital

Volt

Met

er

CLK

Freq

uenc

yCo

unte

r

2.7

VZe

ner

+

+

PC URXTX

RX

GND

100

GND

GND

ANTD

ECT

Test

erCM

D60

(at ba

ttery

low)

Pow

er K

ey

56

1

56

8 1 F

22pF

Curre

ntPr

obe

Osc

illosc

ope

1.8V

CP 3.0V

CP 4.0V

AF V

olt M

eter

Osc

illosc

ope15

0(I),(J

),(K)

,(L),(

M),(N

)

(H)

(A),(

Q),(R

)(A

),(B)

,(C),(

F),

(G),(

H),(I)

(O)

(D),(

E),(F

),(G)

(O),(

P)

54


11.7. Things to Do after Replacing IC or X'talIf repairing or replacing BBIC (FLASH type), EEPROM and X'tal, it is necessary to download the required data such asProgramming data or adjustment data, etc in memory.The set doesn't operate if it is not executed.

11.7.1. How to download the data11.7.1.1. Base UnitFirst, operate the PC setting according to The Setting Method of JIG (Base Unit)(P.47).Then download the appropriate data according to the following procedures.

Note:(*1) XX: country code, YY: revision number, ZZ: Voice PromptXX, YY and ZZ vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (Base Unit) (P.47).(*2) Refer to Check Point (Base Unit) (P.35)

Items How to download/Required adjustmentBBIC (FLASH type)(IC7)

Programming data is stored in memory. 1) Make sure to connect the JIG cable, then disconnect the DCPower in order to download the data.2) Execute the command flw480 *********.hex.3) Connect the DC Power.4) Press the PC Enter key once.5) After a few minutes, Successful upgrade is displayed on thePC indicating downloading has finished.6) Detach the JIG cable, then disconnect the DC Power.7) Connect the DC Power.8) Connect the JIG cable again, and execute the commandgetchk, then confirm the checksum value is correct.

If the downloading fails, start again from step 1).9) Default batch file: Execute the command default.bat.10) Country version batch file: Execute the commandTG6511EUXXrevYY.bat. (*1)11) Clock adjustment: Refer to Check Point (G). (*2)

EEPROM (IC401) Adjusted parameter data is stored in memory.(country version batch file, default batch file,etc.)

1) Change the address 0001 of EEPROM to AA to downloadthe data.2) Default batch file: Execute the command default.bat.3) Country version batch file: Execute the commandTG6511EUXXrevYY.bat. (*1)4) Clock adjustment: Refer to Check Point (G). (*2)

X'tal (X1) System clock Clock adjustment data is in EEPROM, adjust the data againafter replacing it.1) Refer to Check Point (F). (*2)

55


11.7.1.2. HandsetFirst, operate the PC setting according to The Setting Method of JIG (Handset)(P.51).Then download the appropriate data according to the following procedures.

Note:(*3) XX: country code, YY: revision numberXX and YY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (Handset) (P.51).(*4) Refer to Check Point (Handset) (P.39)

Items How to download/Required adjustmentBBIC (FLASH type)(IC1)

Programming data is stored in memory. 1) Make sure to connect the JIG cable, then disconnect the DCPower in order to download the data.2) Execute the command flw480 *********.hex.3) Connect the DC Power.4) Press and hold the handset Power key.5) While holding down the handset Power key, press the PCEnter key once.6) After a few minutes, Successful upgrade is displayed onthe PC indicating downloading has finished.7) Detach the JIG cable, then press the handset Power key toturn it on.8) Connect the JIG cable again, and execute the command"getchk, then confirm the checksum value is correct.

If the downloading fails, start again from step 1).10) Default batch file: Execute the command default.bat.11) Default batch file (remaining): Execute the commandTGA651FXDEFrevYY.bat. (*3).12) Country version batch file: Execute the commandTGA651FXXXrevYY.bat. (*3).13) Clock adjustment: Refer to Check Point (H). (*4).14) 1.8 V setting and battery low detection: Refer to CheckPoint (A), (F) and (G). (*4).

EEPROM (IC3) Adjusted parameter data is stored in memory.(country version batch file, default batch file,etc.)

1) Default batch file: Execute the command default.bat.2) Default batch file (remaining): Execute the command TGA651FXDEFrevYY.bat. (*3)3) Country version batch file: Execute the command TGA651FXXXrevYY.bat. (*3)4) Clock adjustment: Refer to Check Point (H). (*4)5) 1.8 V setting and battery low detection: Refer to Check Point (A), (F) and (G). (*4)

X'tal (X1) System clock Clock adjustment data is in EEPROM, adjust the data againafter replacing it.1) Refer to Check Point (C). (*4)

56


11.8. RF Specification11.8.1. Base Unit

*: Refer to Check Point (Base Unit) (P.35)

11.8.2. Handset

**: Refer to Check Point (Handset) (P.39)

Item Value Refer to -. *TX Power 19 dBm ~ 25 dBm Check Point (Base Unit) (J)Modulation -37030/+37030 kHz/div & Modulated

width 690 kHzCheck Point (Base Unit) (K)

Frequency Offset -50 kHz ~ +50 kHz Check Point (Base Unit) (L)Frequency Drift < 35 kHz / ms Check Point (Base Unit) (M)RX Sensitivity < 1000 ppm Check Point (Base Unit) (N)Timing Accuracy < 5.0 ppm/

57


11.9. How to Check the Handset Speaker or Receiver1. Prepare the digital voltmeter, and set the selector knob to ohm meter.2. Put the probes at the speaker terminals as shown below.

11.10. Frequency Table (MHz)

Note:Channel No. 10: In the Test Mode on Base Unit and Handset.

BASE UNIT HANDSETChannel No Transmit Frequency Receive Frequency Transmit Frequency Receive Frequency1 1897.344 1897.344 1897.344 1897.344 2 1895.616 1895.616 1895.616 1895.616 3 1893.888 1893.888 1893.888 1893.888 4 1892.160 1892.160 1892.160 1892.160 5 1890.432 1890.432 1890.432 1890.432 6 1888.704 1888.704 1888.704 1888.704 7 1886.976 1886.976 1886.976 1886.976 8 1885.248 1885.248 1885.248 1885.2489 1883.520 1883.520 1883.520 1883.520 10 1881.792 1881.792 1881.792 1881.792

58


12 Miscellaneous12.1. How to Replace the Flat Package IC

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), asoldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

12.1.1. Preparation PbF (: Pb free) Solder Soldering Iron

Tip Temperature of 700 F 20 F (370 C 10 C)Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone withless experience could overheat and damage the PCB foil.

FluxRecommended Flux: Specific Gravity 0.82.Type RMA (lower residue, non-cleaning type)Note: See About Lead Free Solder (Pbf: Pb free) (P.4)

12.1.2. How to Remove the IC1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder isleft at the joint on the board, the new IC will not be attached properly.

59


12.1.3. How to Install the IC1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

12.1.4. How to Remove a Solder Bridge1. Lightly resolder the bridged portion.2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

60


12.2. How to Replace the Shield Case12.2.1. Preparation

PbF (: Pb free) Solder Soldering Iron

Tip Temperature of 700F 20F (370C 10C)Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

Hot Air Desoldering ToolTemperature: 608F 68F (320C 20C)

12.2.2. Caution To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

12.2.3. How to Remove the Shield CaseNote:

If you dont have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.

61


12.2.4. How to Install the Shield CaseNote:

If you dont have special tools (ex. Hot air disordering tool), conduct the following operations. Shield cases No. : PNMC1013Z

1. Put the shield case.

2. Solder the surroundings.

62


12.3. Terminal Guide of the ICs, Transistors, Diodes and ElectrolyticCapacitors

12.3.1. Base Unit

12.3.2. Handset

63


13 Schematic Diagram13.1. For Schematic Diagram13.1.1. Base Unit (Schematic Diagram (Base Unit))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

13.1.2. Handset (Schematic Diagram (Handset))Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.2. The schematic diagram may be modified at any time with the development of new technology.

13.1.3. Charger Unit (Schematic Diagram (Charger Unit))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagram may be modified at any time with the development of new technology.

64


13.2. Schematic Diagram (Base Unit)

IC801

*IC421

(1)(2)

(3)(4)

(5)

(7)

(6)

(8)

(9)

NC: No Components

3.0V

2.5V

BeepBell Signal

TX _RF

TX _RF

RX _RF

GND

SPm

SPp

GND

GND

GND

GND

+3.0V

100R75

*R425NC

UTX

URX

GND

ANT_1

ANT2

NC

C854

ANT1

GNDGND

ANT_2

GND

NC

C850

GND GND

1kR76

ANT1_TP ANT2_TP

GNDGND

GND

1uC616

GND

+3.0V

GND

AP1

*CN5

PARALLEL WIRE

.

GND

GND

+2.5_CP

1uC625

CL1CL2

GND

GND

100n

C808

GND

GND

GND

PON1k

R804

RF_RXp

RF_RXn

GND

GND

GND

TXp

GND

220

R806

GND

TXn

GND

PSEL

3.3n

C814

VDD_PADRV

TXON

1kR803

GND

1PSET 2VCCS 3PI 4PIX7 PSEL8 POX9 PO

10 VCC11

GND

5PRAMP6 PAON

GND

GND

GND

RXON220

R807

GND

47R805

GND

*C4

21

NC

GND

*R424

NC

NC

GND

*Q421

VDD5

GND

*C422

NC

NC

*R

426

NC

*R

427

NC

*R

428

NC

*R

429

NC

GND

R13

5

10k

GND

10R43

0

GND

GND

100p

C856

100p

C858

GND

GND

10100n

C60

CKM

GND

_C

Q24

GND

+1.8V

NC

C837

CN5-10

CN5-9

CN5-8

CN5-7

CN5-6

CN5-5

CN5-4

CN5-3

CN5-2

CN5-1

1.5p

C803

27n

L801

DA8021 2

3

DA8011

23

1.8p

C804

1.8p

C802

Shie

ld

12

3

45

6

3nL8023nL803

3.3p

C805

3.3p

C806

VDD4

C163

NC

GND

GND

JTAG

3pC860

GND

GND

*R86 NC

*R87 NC

220RA80123

4*C1

49N

C

*C1

50

NC

100p

C823

GND

*C501

1n

*SW112

R80

8N

C

URX2

UTX2

GND2GND

1*CE

2 SO3

*WP4 VSS

5SI

6SCK

7*HOLD

8VDD

GND NC

C423

NC

*RA501

1234 5

678

NC

*R516

0

*R511

C851

7p

C853

7p

GND

Q25

R80

122

k

1.5k

R13

3

10p

C811

10p

C855

10p

C809

10p

C819

10p

C812

10p

C827

10p

C825

10p

C857

*C5

16N

C

*C5

15N

C

*C5

13N

C

*C5

14N

C

*C5

11N

C

*C5

12N

C

C517

NC

C519

NC

C518

NC

NC

C520

10p

C631

*C1

46N

C

C85910p

NC

C521

NC

C861

NC

C522

10p

C630

*C1

45N

C

2.2p

C810

2.2p

C813

*R

132

560

120

*R

802

1p*C8

34

0.9p

*C826

NC

L804

GND

NC

C862

0.5p

C820

3pC822

SDA2SCL2TAM_CSnSPI_CLK

TAM_WP

KEY0KEY1

ROW1ROW2

KEY2

CHARGE

TAM_WP

SPI_DISPI_DO

SPI_DO

TAM_CSn

SPI_DI

SPI_CLK

Low_Rad

ROW0

RO

W0

ROW0

TAM_WP

ROW2

KEY0

KEY1

ROW1

KEY2

LED1

LED2

eco_mode

for TG6511/2511/2521 TG7511/8511/5511

CP_OUT1=3.0V

Pow_Adj

Pre-matching

Balun

BPF

W 0.15mmL 22+/-4mm1st or 4th layer



W 0.15mmL 5.0mm1st layer


W 0.15mmL 20+/-2mm3rd layer



W 0.125mmL 7.6mmGap 0.125mm1st layer

W 0.15mmL 4.0mm x21st layer

65


*IC401

GND

GND

Q8

1uC614

GND

+1.8V

GND

GND

GND

GND

56k FR615

GNDGND

GND

SA1

33u

L1

33u

L2

GND

J101

GND

GND

+6.5V

GND

GND

GND

10k

R16 GND

GND

GND

GND

NC

(3216

)R

123

100k

R14

D3

4

1

3

2

GND GND

GND

*C1

6

NC

27k

R18

GND

NC

C17

GND

NC

*C2

8

100k

R27

NC

C15

GND

TP10

0

R116

8.2k

R19

100k

R23

+1.8V

GND

GND

GND

GND

GND

NC

C24

C57

NC

GND

GND

12R21

GND

TP9

NC

C23

470k

R28

K0.1

u

C56

NC

C141

GND

GND

1u

C22

NC

C155

1kR33

1kR35

GND

GND10p

C136

GND

100k

R10

GND

+1.8V

GND

GND

100kR8

100n

C72

100nC61

GND

3.3k

R81

3.3k

R11

7

+1.8V

1nC1

57

TP16

TP15

*C4

8

NC

*C1

56

1n

GND

GND

GND

GND

GND

100n

C51

GND

GND

GND100n

C75

Q4

*D

23 NC

+3.0V2.2u

C84

NCC3061u

C305

GND

GND

1k

R130

10k

R12

9

3AF1

10kRA402

123

4

*D

5

NC

AK

D6

NC

AK

D9

NC

AK

1u

C615

Q9

+2.4V

+2.4V

GND

220R106

220R109

10k

R77

NC

R78

GND

NC

C167

VDD2

100nC7

100nC8

10pC65

+2.5_CP

L2TL1TL1R

DCM

DCP

L2R

10p

C137

GND 100u

16

C32

5010

u

C27

GND

10.368MX11 3

2

0

R29

ANT1

RF_RXn

RXON

TXON

TXn

TXp

VDD_PADRV

PSEL

PON

ANT2

RF_RXp

GND

1033

0uC3

6

10k

R65

7

GND

GND

GND

GND

Q5

680pC9 500

680p

C10

500

1kRA1

1 2 3 45678

C622

NC

*D

22

LINE_DC

*R1263.3k

HAK_CL1

STM

VDD1

NC

C1

C617 1u 10

NC

C29

NC

C30

C37

NC

1MR4

1MR6

180k

R3

180k

R5

GND

*Q22

*R7

5.6M

*R9

5.6M

27R

22*C25

0.01

u

1uC8

6

22uH

L3

GND

47R91

DC_IN

0.1u

C87

0.01

u

C881

20R92

VDD3

NC

*D

24

*Q23

Q10D10

NC

C90

D27

NC

680

R95

4.7kR93

1 ON/*OFF

2 VSS4

EXT

5VIN

3 VOUT

*C6

26N

CN

C*C6

37

3.9kR37

1u*C6

240.

1u*C6

23

270R40 10p

C16910pC170

*C147 NC

*C148 NC

10pC168

10pC74

NC

C70

10pC171

*C4

9

470p

2.7k

0.25

W

R15

*D

15

NC

AK

*D

16

NCA

K

*R

2

NC

NC

*C2

*Q3

*Q2

*R

124

10

*R

12 10k

*R13 680

*C1

22.

2u

3.9k*R17

1u*C1

66

27k

*R

24

*D

26N

C

1VSS_LNA12RF_RXp

21CI

DINp

/VRE

Fp

3RF_RXn4VSS_LNA25RFP16RFP07REF_RES8AVS_XTAL

22R

ING

p/P3

_723

RIN

Gn/

P3_6

24R

ING

OUT

/RIN

GIN

G/P

3_5

25PA

RAD

ET/P

3_4

26AD

C0/P

3_3

27AD

C1/IN

T0/P

1_0

28N

TC/A

DC2

41 CP_C2y42 CP_VOUT1/LED143 CP_VOUT2/LED244 PON/P1_645 VDD146 P2_7/BXTAL

81

GND 9XTAL2

10XTAL111AVD_XTAL12RF_SUPPLY113LDO_CTRL14AVD15LSRn16LSRp17VREFm18MICh19CIDOUT/MICn

20CIDINn/MICp

29SO

Cp30

SOCn

31CH

ARG

E_CT

RL32

P1_7

/CHA

RGE

33PA

OUT

p/P3

_134

VDD

PA35

PAO

UTn/

P3_0

36VB

AT1

37CP

_C1x

38CP

_C2x

39CP

_C1y

40VB

AT2

47 P1_5/INT5/RDI/VDDE48 P1_4/INT4/TDOD49 P1_3/INT3/SIO50 P1_2/INT2/SK51 P1_1/INT1/LE52 P2_6/WTF_IN53 P0_7/SPI_DI54 P0_6/SPI_DO55 P0_5/SPI_CLK56 P0_4/SPI_EN57 P0_3/SCL258 P0_2/SDA259 P0_1/URX60 P0_0/UTX

61R

STn

62JT

AG63

P2_5

/PCM

_FSC

/SF

64P2

_4/S

CL1/

PCM

_DO

/DP3

65P2

_3/S

DA1/

PCM

_DI/D

P266

P2_2

/PCM

_CLK

/CLK

100

67P2

_1/E

CZ2/

PWM

1/LE

D468

P2_0

/ECZ

1/PW

M0/

LED3

69VD

D2

70LD

ORF

_CTR

L71

RF_

SUPP

LY2

72R

FP0n

73R

FP4

76VS

S_PA

DR

1

79VS

S_PA

DR

2

77R

F_TX

p

80R

FP2

75VD

D_P

ADR

78R

F_TX

n

74R

FP3

4.7M

*R43

3.9

(6332

)

*R

55

3.9

(6332

)

*R

56N

C*R

57

*R30

910

*R

31 0

*R202.7k

1000

p*C1

933n*C54*C

55 82n

120k*R36

820p*C5282

0p*C5

3

82k

*R32

82k

*R

34

680p*C3

680p*C4

*C5

10n

10n

*C6

4.7M

*R42

*C1

4

0.02

2u

*D

21

10n

*C42

10n

*C43

NC

C18

1 A02 A13 A24 GND 5SDA

6SCL

7WP

8VCC

EEP_

WP

Low

_R

adLE

D2

LED

1

EEP_

WP

CHAR

GE

eco

_m

ode

SCL2

SDA2

DC_IN

Charge -

Charge +

TO RF BLOCK

TG65/85xx only

3V DCDC convertor

Charge -

Charge +

1.8V 3.0V

TX _RF

RX _RF

TX _AF

Bell signalCaller ID

0.75V0V

250mVp-p

Loop Current

ChargeCurrent

RX_AF

Bell signal

*IC401

IC2

IC3*IC7

KX-TG6511/6512FX SCHEMATIC DIAGRAM (Base Unit)NC: No Components

(1)(2)

(3)(4)

(5)

(7)

(6)

(8)

(9)

66


13.3. Schematic Diagram (Handset)

BATT+

BATT-

0.1R45

BATTERY

+1.8V

GND

1kR66

C45K0.1u

C121NC

+1.8V

GND

1uC4

7

GND

GND GNDGND

GND

GND

GND

GNDGND

GND

GND

C44K0.1u

GND

1.2kR7

100

R8

CP+4.0V

+1.8V

k0.1

uC4

0RF_RXp

PONPSEL

VDD_PADRV

TXpTXn

TXON

RXONRF_RXn

CP+3.0V

0R215

Q7

Q2

Q4

BATTERY

1uC50

1uC49

CP+4.0V

SOFT

_C1

2

SOFT

_B1

2

SOFT

_A1

2

SHAR

P1

2

AST

12

GND

8

12

TALK

12

4

12

7

12

3

12

9

12

1

12

61

2

2

12

01

2

5

12

S11 2

100R63

F56k

R20

3

10k

R64

BATTERY

GND

NCR2

C43

10p

C46

10p

NC

C39

GND

CP+3.0V

Q9

10R20

NCR6

*LE

D3

*LE

D2

*LE

D1

*LED12

D11MR330

1uC332

Q11

Q12

GND

GND

27kR332

BATTERY

27kR331

GND

GND

1kRA1

1 2 3 45678

GND

K10uC53K10uC52D10pC54

GNDD10pC55

K1uC51

820R27

K10u

C12

C17D10p

K0.1

uC1

1K0

.1u

C13

3.3kRA4

VREFmC18D10p

D10

pC9

6

820R28D

10p

C97

VREFm

NCC4

8

GND

0R225

K2.2uC106.3V

330u

CP2C2

GND

RE2RF-SHIELD

12

3

45

6

GND

UTXURXGND

JTAG

BAT

CP4.0VCP3.0V

POWER

CKM

1.8V

CHG(+)

CHG(-)

STM

NCC3

NC

C150

220RA611

2 3

4

6.3V330u

C1CP1

1uC331

C182 3p

*R2480

GND

NCR4

GND

NCR400

GNDGND

NCC400

NC

D400

NC

R40

5

Q400NC

GND

Q401NC

+1.8V

NCR401

NCR404

NC

R40

2

NCR403

NCR406

NC

R407

LEFT

12

DO

WN

12

RIG

HT

12

UP12

R

12S

P1

2

L47L46

330*RA30

12345 6 7 8

1.5k

R30

1k

R3

*LE

D22

NC

*LE

D23

NC

1kR23

100R31C1

47

NC

120*RA32

12345 6 7 8

Power_adj

330*RA31

1 234

K1u

C5

D7

NCC340

J39pC341

NCC342

GND GND GND

NC

C38

NC

*C1

38

NC

*C1

39

*LE

D5

*LE

D7

*LE

D4

*LE

D6

*LE

D8

*LE

D9

*X1

10.368M13

2

*LE

D21

NC

NC*R249

1VS

S_LN

A12

RF_

RXp

21CIDINp/VREFp

3R

F_R

Xn4

VSS_

LNA2

5R

FP1

6R

FP0

7R

EF_R

ES8

AVS_

XTAL

22RINGp/P3_723RINGn/P3_624RINGOUT/RINGING/P3_525PARADET/P3_426ADC0/P3_327ADC1/INT0/P1_028NTC/ADC2

41CP

_C2y

42CP

_VO

UT1/

LED1

43CP

_VO

UT2/

LED2

44PO

N/P1

_645

VDD

146

P2_7

/BXT

AL

81

GND

9XT

AL2

10XT

AL1

11AV

D_X

TAL

12R

F_SU

PPLY

113

LDO

_CTR

L14

AVD

15LS

Rn16

LSRp

17VR

EFm

18M

ICh

19CI

DOUT

/MIC

n20

CIDI

Nn/M

ICp

29SOCp30SOCn31CHARGE_CTRL32P1_7/CHARGE33PAOUTp/P3_134VDDPA35PAOUTn/P3_036VBAT137CP_C1x38CP_C2x39CP_C1y40VBAT2

47P1

_5/IN

T5/R

DI/V

DDE

48P1

_4/IN

T4/T

DOD

49P1

_3/IN

T3/S

IO50

P1_2

/INT2

/SK

51P1

_1/IN

T1/L

E52

P2_6

/WTF

_IN

53P0

_7/S

PI_D

I54

P0_6

/SPI

_DO

55P0

_5/S

PI_C

LK56

P0_4

/SPI

_EN

57P0

_3/S

CL2

58P0

_2/S

DA2

59P0

_1/U

RX60

P0_0

/UTX

61 RSTn62 JTAG63 P2_5/PCM_FSC/SF64 P2_4/SCL1/PCM_DO/DP365 P2_3/SDA1/PCM_DI/DP266 P2_2/PCM_CLK/CLK10067 P2_1/ECZ2/PWM1/LED468 P2_0/ECZ1/PWM0/LED369 VDD270 LDORF_CTRL71 RF_SUPPLY272 RFP0n73 RFP4

76 VSS_PADR1

79 VSS_PADR2

77 RF_TXp

80 RFP2

75 VDD_PADR

78 RF_TXn

74 RFP3

F1

5.6n

J56pC35

LDO

_CTR

L

COL0

CHARGE_CTRLCHARGE

UTX

COL0COL1COL2COL3COL4

RO

W3

RO

W2

RO

W1

CHAR

GE

CHAR

GE_

CTRL

COL4

KEY_

LED

BELL_LED_AURX

LDO

_CTR

L

LCD_RESET

LCD_

CDLC

D_SC

LLC

D_SD

A

JTAG

SOCp

LCD_CSB

RO

W0

SOCn

BELL

_LED

_A

COL5

COL1

COL2

COL5

RO

W0

COL3

RO

W1

RO

W3

RO

W2

SOCpSOCn

KEY_

LED

CHARGETerminal

BATTERY

BELL LED(Amber)

TO RF BLOCK

[RU][EX /FX]

To PA

(MAX500mA)

KEY B/L LCD B/L

NC: No Components

*IC1

(1)(2)(3)

(4)(6)(5)

(8)

(9)(10)

(11)(12)(13)(14)(15)

(7)

Charge Current

3.0V 4.0V

1.8V

0.75V0V

250mVp-p

TX _RF

RX _RF

67


BATTERY

GND

GND

GND

CP+3.0V

CP+3.0V

K1uC188

NC

C70

GND

D21

D22

NC

C71

GNDD10pC113

D3NC

GND

D4NC

GND

GND

NC

C72

GND

NC

C73

GND

3.3n

C814

220

R806

GND TXp

47R805GND

GND

VDD_PADRV

TXON

GND GND

100n

C808

GND

PONGND

BATTERY

GND

1PSET 2VCCS 3PI 4PIX7 PSEL8 POX9 PO

10 VCC

11

GND

5PRAMP6 PAON

GNDTXn

PSELGND

GND

GNDGNDGND

RF_RXp

RXON

GND

GNDGND

RF_RXn

220

R807

NC

C837GND

VSS

CN5

10

GND

CN5

1

RES

ETB

CN5

4

V0CN

511

VDD

CN5

8

SCLK

CN5

6

LCD_

CSB

CN5

3

A0

CN5

5

OPT

_PW

RCN

52

VDD

ACN

59

SID

CN5

7

GND

CN5

12

k1000pC152

DA8011

23

27n

L801

AP1MIC1

2

TP_ANT1

3pC861

C820

NC

100p

*C1

033.

3k*R

53

NC

*C1

06

10k

*R

54

GND

100p

*C1

05

GND

GND470

*R

51

GND GNDGND GND

2.0p

*C187

2.0p*C186

1kR55

10k

*R

50

1u*C1

75

NC

*R

578

GND

GND

GND

3.6n

L802

3.6n

L803

3.3p

C806

1.6p

C810

1.6p

C813

3.3p

C805

GND

NC

R80

8

VREFm

C74D10pC75D10pVREFm

82R73

82R74

D13

D14

10kRA40

1 2 3 45678

K0.1uC172

RCV+

RCV-

MIC-

MIC+

NC*C2

00NC

*C2

01N

C*C2

03

NC

*R

231

NC

*R

232

NC*C204

NC*R233

1kRA800

12 3

4

NC

*R

236

NC*C2

06

CN51

13CA

P1+

CN51

14VS

SCN

5115

/RES

CN51

7V0

CN51

9VO

UT

CN51

4SI

CN51

5SC

L

CN51

10CA

P2-

CN51

8VR

CN51

3/C

S

CN51

11CA

P2+

CN51

1G

ND

CN51

16G

ND

CN51

12CA

P1-

CN51

2R

S

CN51

6VD

D

Q880NC

GND

GND GND

Power_adj

NC

C881

NC

R88

0

2pC804 2pC802

1.5p

C803

GNDGND

GNDGND

RECEIVER1

+

2 -

SP-PHONE_SPEAKER

1+

2-

J33p

*C1

07

10p

C809

10p

C811

10p

C812

10p

C819

10p

C822

10p

C825

10p

C827

10p

C860

NC

C863

NC

C864

NC

C880

10p

*C1

04

10p

*C5

80

1k*R

52

Q10NC

NCR36

NCC30 NC

R37

BATTERY

GND

680

*R

801

100

*R

802

1p*C834

1A02A13A24GND5 SDA

6 SCL

7WP

8VCC

3p

*C826

LCD_SDALCD_SCLLCD_CDLCD_RESETLCD_CSB

LSRp

LSRn

MICp

MICn

to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)

LSRp

LSRn

LSRp

Pre-matching

W 0.15mmL 3.0mm x21st layer



Balun

BPF W 0.15mmL 5.0mm1st layer



W 0.125mmL 7.6mmGap 0.125mm1st layer

to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250)

R801:220kR808:NC

*IC3

IC801

(1)(2)(3)

(4)(6)(5)

(8)

(9)(10)

(11)(12)(13)(14)(15)

(7)

KX-TGA651 SCHEMATIC DIAGRAM (Handset_Main)NC: No Components

RX_RF

TX_RF

TX _AF

RX-AF (Handset)

Sp-phone RX/Beep

68


13.4. Schematic Diagram (Charger Unit)

J1

2

1

TP3

G

TP2

TP1

TP4

R1

12 (2W)NCA K

F1

SCHEMATIC DIAGRAM (Charger Unit)

69


14 Printed Circuit Board14.1. Circuit Board (Base Unit_Main)14.1.1. Component View

C32

C37C88

C30

C25

C517C518

C512

C70C861

C511

C514C515

C513

C516C49 C48 C86

C36

C157

C520

C519

C521

C522 C827

C850C803C812

C811C825

C822

C823

C806C808

C805C810

C854

C860

C27

C17C16C15

C28

C42

C3C8

C2C43

C4

C622C1

R802

R91

R92 R95

R804

R801R808

R132R133

R135

R657

R516

R126

R130R129

R56

R803R805R28

R27

R21

R22

R9R10

R30R124

R123

R511

R42R14

L3

L801

L803

L1

IC801

SA1

D5

Documents

Panasonic model TG6511FX