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8/10/2019 Part 1-Review (1)
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I. Nature of Materials
A. Atomic StructureB. Types of Bonding
C. Crystalline Structures
1. types
2. defectsD. Amorphous Materials
1. Implications on order
2. Solidification
II. Mechanical Properties
A. Types of Loads
B. Mechanical Testing
C. Effect of Temperature
D. Viscosity, Viscoelasticity
III. Physical Properties
A. DensityB. Thermal Expansion
C. Melting
D. Diffusion
IV. Dimensions & Surfaces
A. Dimensions vs. Tolerance
B. Types of Measurement
Instruments
C. Surface Texture (4 features)D. Surface Integrity
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Part 1 Review
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V. Metals
A. Definition
B. Types of Alloys
C. Phase diagram
1. Three types of
information
2. ID phase transformationsD. Fe-C Alloys
1. Classification
2. General Properties
VI. Ceramics
A. Definition
B. Classification
C. Mechanical Properties
VII. Polymers
A. Definition
B. Synthesis
C. Structure
D. Response to heat
E. Types
VIII. Composites
A. Definition
B. Components
C. Classification
D. Types of Mechanical
Reinforcement
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Test 1 Review
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Atomic Structure
Valence electrons determine all of thefollowing properties
1) Chemical
2) Electrical
3) Thermal
4) Optical
5) Mechanical
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Primary Bonding
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Ionic bond metal + nonmetal
donates acceptselectrons electrons
Dissimilar electronegativities
ex: MgO Mg 1s22s22p63s2 O 1s22s22p4
[Ne] 3s2
Mg2+ 1s22s22p6 O2- 1s22s22p6
[Ne] [Ne]
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Occurs between + and - ions.
Requires electron transfer. Large difference in electronegativity required.
Example: NaCl
Ionic Bonding
Na (metal)
unstable
Cl (nonmetal)
unstable
electron
+ -Coulombic
Attraction
Na (cation)
stable
Cl (anion)
stable
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C: has 4 valence e
-
,needs 4 more
H: has 1 valence e-,
needs 1 more
Electronegativitiesare comparable.
Covalent Bonding similar electronegativityshare electrons
bonds determined by valences&porbitals dominate bonding Example: CH4
shared electronsfrom carbon atom
shared electrons
from hydrogenatoms
H
H
H
H
C
CH 4
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Metallic Bonding Metallic Bond:
Delocalized as electron cloud
Results in good electrical and thermal conductivit
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Arises from interaction between dipoles
Permanent dipoles-molecule induced
Fluctuating dipoles (London forces)
-general case:
-ex: liquid HCl
-ex: polymer
Adapted from Fig. 2.14,
Callister & Rethwisch 3e.
SECONDARY BONDING
asymmetric electronclouds
+ - + -
secondarybonding
HH HH
H 2 H 2
secondarybonding
ex: liquid H2
H Cl H Clsecondarybonding
secondarybonding
+ - + -
secondary bonding
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Crystalline Structure
Manner in which atoms are located at regularand recurring positions in three dimensions
Unit cell - basic geometric grouping of atoms
that is repeated The pattern may be replicated millions of
times within a given crystal
Characteristic structure of virtually all metals,as well as many ceramics and some polymers
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Three Crystal Structures in Metals
Three types of crystal structure: (a) body-
centered cubic, (b) face-centered cubic, and
(c) hexagonal close-packed
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Crystal Structures for Common Metals
Room temperature crystal structures for some
of the common metals:
Body-centered cubic (BCC)
Chromium, Iron, Molybdenum, Tungsten
Face-centered cubic (FCC)
Aluminum, Copper, Gold, Lead, Silver, Nickel
Hexagonal close-packed (HCP) Magnesium, Titanium, Zinc
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Imperfections (Defects) in Crystals
Nearly all engineering materials possess defects
Defects are often introduced during
solidification
Imperfections can also be introduced purposely;
e.g., addition of alloying ingredient in metal
Types of defects: (1) point defects, (2) line
defects, (3) surface (interfacial) defects
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Point Defects
Imperfections in crystal structure involving either a
single atom or a small number of atoms
Point defects: (a) vacancy, (b) ion-pair vacancy (Schottky
Defect), (c) interstitial, (d) displaced ion (Frenkel Defect).
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Line Defects
Connected group of point defects that forms a
line in the lattice structure
Most important line defect is a dislocation,
which can take two forms:
Edge dislocation
Screw dislocation
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Edge Dislocation
Edge of an extra plane of atoms that exists in the lattice
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Screw Dislocation
Spiral within the lattice
structure wrapped
around an
imperfection line, like
a screw is wrapped
around its axis
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Interfacial or Surface Defects
Imperfections that extend in two directions
to form a boundary
Examples: External: the surface of a crystalline object is an
interruption in the lattice structure
Internal: grain boundaries are internal surface
interruptions
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Polycrystalline Nature of Metals
A block of metal may contain millions of
individual crystals, called grains
Such a structure is calledpolycrystalline
Each grain has its own unique lattice orientation
But collectively, the grains are randomly oriented in the
block
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G i d G i B d i i M t i l
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22
Mostengineering materials are polycrystal l ine.
Each "grain" is a single crystal.
If grains are randomly oriented, overall component properties
are not directional. Grain sizes typ. range from 1 nm to 2 cm
(i.e., from a few to millions of atomic layers).
Grains and Grain Boundaries in Materials
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Si l l l
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Single Crystals
-Properties vary withdirection: anisotropic.
-Example: the modulus
of elasticity (E) in BCC iron:
Data from Table 3.7,
Callister & Rethwisch 3e
Polycrystals
-Properties may/may not
vary with direction.
-If grains are randomly
oriented: i so t rop ic.(Epoly iron= 210 GPa)
-If grains are textured,
anisotropic.
200 mm Adapted from Fig.5.19(b), Callister &
Rethwisch 3e.
(Fig. 5.19).
Single vs. Polycrystals
E (diagonal) = 273 GPa
E (edge) = 125 GPa
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Crystalline vs. Amorphous materials
Difference in structure between: (a) crystallineand (b) noncrystalline materials
Crystal structure is regular, repeating;
amorphous materials are less tightly packedand randomly oriented
(a) (b)
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True Stress-Strain Curve
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True Stress-Strain Curve
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Strain Hardening in Stress-Strain Curve
Note that true stress increases continuously
in the plastic region until necking
In the engineering stress-strain curve, the
significance of this was lost because stress was
based on the original area value
It means that the metal is becoming stronger
as strain increases
This is the property called strain hardening
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T St St i i L L Pl t
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True Stress-Strain in Log-Log Plot
289/26/2014
K= strength coefficient;
and
n = strain hardening
exponent
Flow Curve
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Categories of Stress-Strain
Relationship: Perfectly Elastic
Behavior is defined
completely by modulus of
elasticity E Fractures rather than yielding
to plastic flow
Brittle materials: ceramics,
many cast irons, andthermosetting polymers
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Stress-Strain Relationships: Elastic
and Perfectly Plastic
Stiffness defined by E
Once Yreached, deforms
plastically at same stress level Flow curve: K= Y,n= 0
Metals behave like this when
heated to sufficiently high
temperatures (aboverecrystallization)
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Stress-Strain Relationships: Elastic
and Strain Hardening
Hooke's Law in elastic region,
yields at Y
Flow curve: K> Y, n> 0 Most ductile metals behave
this way when cold worked
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Testing of Brittle Materials
Hard brittle materials (e.g., ceramics) possess
elasticity but little or no plasticity
Conventional tensile test cannot be easily applied
Often tested by a bendingtest(also called
flexure test)
Specimen of rectangular cross-section is
positioned between two supports, and a load isapplied at its center
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Bending Test
Bending of a rectangular cross section results
in both tensile and compressive stresses in the
material: (left) initial loading; (right) highly
stressed and strained specimen
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Testing of Brittle Materials
Brittle materials do not flex
They deform elastically until fracture
Failure occurs because tensile strength of outer
fibers of specimen are exceeded
Failure type: cleavage- common with ceramics
and metals at low temperatures, in which
separation rather than slip occurs along certaincrystallographic planes
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Effect of Porosity
Despite various processing steps pores maystill exist in ceramic
Porosity (P) has a negative influence on elastic
properties and strength E = E0(1-1.9P+0.9P2)
sfs= s0exp(-nP)
10 vol% porosity will decrease flexuralstrength by 50% from measured value of
nonporous material.
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Hardness
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Hardness
Resistance to permanently indenting the surface.
Large hardness means:
-- resistance to plastic deformation or cracking in
compression.
-- better wear properties.
e.g.,10 mm sphere
apply known force measure size
of indent afterremoving load
dDSmaller indentsmean largerhardness.
increasing hardness
mostplastics
brassesAl alloys
easy to machinesteels file hard
cuttingtools
nitridedsteels diamond
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Effect of Temperature on Properties
General effect of
temperature onstrength and
ductility
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Hot Hardness
Hot HardnessAbility of a
material to retain
hardness at elevated
temperatures
Typical hardness as a
function of
temperature forseveral materials
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Eff t f H ti Aft H d i
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1 hour treatment at Tanneal...
decreases TSand increases %EL. Effects of cold work are reversed!
3 Annealing
stages to
discuss...
Adapted from Fig. 8.22, Callister & Rethwisch3e.
Effect of Heating After Hardening
ten
siles
treng
th(M
Pa
)
duc
tility(%EL
)tensile strength
ductility
600
300
400
500
60
50
40
30
20
annealing temperature (C)200100 300 400 500 600 700
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R
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Annihilation reduces dislocation density.
Recovery
Scenario 1
Results from
diffusion
Scenario 2
4. opposite dislocationsmeet and annihilate
Dislocationsannihilateand forma perfectatomic
plane.
extra half-planeof atoms
extra half-planeof atoms
atomsdiffuseto regions
of tension
2. grey atoms leave byvacancy diffusionallowing disl. to climb
tR
1. dislocation blocked;cant move to the right
Obstacle dislocation
3. Climbed disl. can now
move on new slip plane
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Recrystallization
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New grains are formed that:
-- have a small dislocation density
-- are small
-- consume cold-worked grains.
Adapted from
Fig. 8.21 (a),(b),
Callister &
Rethwisch 3e.
33% cold
worked
brass
New crystals
nucleate after
3 sec. at 580C.
0.6 mm 0.6 mm
Recrystallization
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F rther Recr stalli ation
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All cold-worked grains are consumed.
Adapted fromFig. 8.21 (c),(d),
Callister &
Rethwisch 3e.
After 4
seconds
After 8
seconds
0.6 mm0.6 mm
Further Recrystallization
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Grain Growth
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At longer times, larger grains consume smaller ones.
Why? Grain boundary area (and therefore energy)
is reduced.
After 8 s,
580C
After 15 min,
580C
0.6 mm 0.6 mm
Adapted from
Fig. 8.21 (d),(e),
Callister &
Rethwisch 3e.
Grain Growth
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TR
Adapted from Fig. 8.22,
Callister & Rethwisch 3e.
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R t lli ti T t T
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Recrystallization Temperature, TRTR= recrystallization temperature= point of highest rate of
property change
1. Tm => TR0.3-0.5 Tm(K)
2. Due to diffusionannealing timeTR= f(time) shorter
annealing time => higher TR
3. Higher %CW=> lower TR
strain hardening4. Pure metals lower TRdue to dislocation movements
Easier to move in pure metals => lower TR
Hot workabove TR
Cold workbelow TR
Smaller grains
stronger at low temperature
weaker at high temperature
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R t lli ti d M f t i
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Recrystallization and Manufacturing
Recrystallization can be exploited in
manufacturing
Heating a metal to its recrystallization
temperature prior to deformation allows a
greater amount of straining
Lower forces and power are required to perform
the process Forming a metal at temperatures above its
recrystallization temperature is called hot working
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Tensile deformation of a polymer
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elasticappliedstress
viscoelastic
viscous
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Fundamental Concepts
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Fundamental Concepts Component pure metals and/or compounds of which
an alloy is composed
System- 1) specific body of material under consideration,2) series of alloys consisting of same components.
Solubility limitmaximum conc. of solute atoms thatmay dissolve in solvent to form solid solution
Phasehomogeneous portion of a system with uniformphysical and chemical characteristics.
EquilibriumSystem is stable over time.
Metastable - state of equilibrium never completely
achieved, small changes may occur, may persistindefinitely.
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S lid S l i
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Solid Solutions
Crystal structure is maintained Impurity atoms are randomly distributed
throughout host
For interstitial solid solutions, impurity atomsfill the voids or interstices among host atoms
Atomic diameter of interstitial atom
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Impurities in Metals
Conditions for substitutional solid solution (S.S.) 1. r (atomic radius) < 15%
2. Proximity in periodic table
i.e., similar electronegativities
3. Same crystal structure for pure metals 4. Valency
All else being equal, a metal will have a greater tendency to
dissolve a metal of higher valency than one of lower valency
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Solute element or compound present in minor concentration
Solvent element or compound present in greatest amount (host atoms)
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Criteria for Solid Solubility
CrystalStructure
electroneg r(nm)
Ni FCC 1.9 0.1246Cu FCC 1.8 0.1278
Both have the same crystal structure (FCC) and have similar
electronegativities and atomic radii suggesting high mutual
solubility.
Simple system (e.g., Ni-Cu solution)
Ni and Cu are totally soluble in one another for all proportions.
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PHASE DIAGRAMS
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Phase Diagrams
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Phase Diagrams
Indicate phases as a function of T, C, and P.
For this course:
- binary systems: just 2 components.- independent variables: T and C (P = 1 atm is almost always used).
Phase
Diagram
for Cu-Ni
system
Adapted from Fig. 10.3(a), Callister &
Rethwisch 3e.
2 phases:
L (liquid)
a (FCC solid solution)
3 different phase fields:L
L +a
a
wt% Ni
20 40 60 80 10001000
1100
1200
1300
1400
1500
1600
T(C)
L (liquid)
a
(FCC solid
solution)
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Isomorphous Binary Phase Diagram
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Cu-Ni
phase
diagram
Isomorphous Binary Phase Diagram
Phase diagram:
Cu-Ni system. System is:
Adapted from Fig. 10.3(a), Callister &
Rethwisch 3e.
-- binaryi.e., 2 components:
Cu and Ni.
-- isomorphousi.e., complete
solubility of one
component in
another; aphase
field extends from0 to 100 wt% Ni.
wt% Ni
20
40
60
80
100
0
1000
1100
1200
1300
1400
1500
1600
T(C)
L (liquid)
a
(FCC solid
solution)
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Phase Diagrams
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wt% Ni20 40 60 80 1000
1000
1100
1200
1300
1400
1500
1600
T(C)
L (liquid)
a
(FCC solid
solution)
56
Phase Diagrams:Determination of phase(s) present
Rule 1: If we know T and Co, then we know:-- which phase(s) is (are) present.
Examples:
A(1100C, 60 wt% Ni):1 phase: a
B
(1250C, 35 wt% Ni):2 phases: L + a
B
(1250C,35)
A(1100C,60)Adapted from Fig. 10.3(a), Callister &
Rethwisch 3e.
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Phase Diagrams:
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wt% Ni
20
1200
1300
T(C)
L (liquid)
a
(solid)
30 40 50
Cu-Nisystem
Phase DiagramsDetermination of phase compositions
Rule 2: If we know T and C0, then we can determine:
-- the composition of each phase.
Examples:
TAA
35
C032
CL
At TA = 1320C:
Only Liquid (L) presentCL= C0 ( = 35 wt% Ni)
At TB
= 1250C:
Both aand L present
CL = Cliquidus ( = 32 wt% Ni)
Ca = Csolidus ( = 43 wt% Ni)
At TD = 1190C:
Only Solid (a) present
Ca= C0 ( = 35 wt% Ni)
Consider C0= 35 wt% Ni
D
TD
tie line
4
Ca3
Adapted from Fig. 10.3(a), Callister &
Rethwisch 3e.
B
TB
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Phase Diagrams
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Rule 3: If we know T and C0, then can determine:
-- the weight fraction of each phase. Examples:
At TA : Only Liquid (L) present
WL = 1.00, Wa= 0At TD : Only Solid (a) present
WL = 0, Wa = 1.00
Phase Diagrams:Determination of phase weight fractions
wt% Ni
20
1200
1300
T(C)
L (liquid)
a
(solid)
3
0
4
0
5
0
Cu-Ni
system
TAA
35C0
32CL
BTB
D
TD
tie line
4Ca3
R
S
At TB : Both a and L present
73.032433543
= 0.27
WL
SR + S
Wa R
R + S
Consider C0= 35 wt% Ni
Adapted from Fig. 10.3(a), Callister &
Rethwisch 3e.
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The Inverse Lever Rule
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Tie lineconnects the phases in equilibrium with each
otheralso sometimes called an isotherm
The Inverse Lever Rule
WL=
ML
ML+ M
=S
R + S=C
C0
C
CL
W
=R
R + S=C
0 C
L
C
CL
wt% Ni
20
1200
1300
T(C)
L (liquid)
a
(solid)
30 40 50
B
T
B
tie line
C0
CL Ca
SR
Adapted from Fig. 10.3(b),
Callister & Rethwisch 3e.
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E Cooling of a C Ni Allo
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60
wt% Ni20
120 0
130 0
3 0 4 0 5 0110 0
L (liquid)
a
(solid)
T(C)
A
35C0
L: 35wt%Ni
Cu-Nisystem
Phase diagram:
Cu-Ni system.
Adapted from Fig. 10.4,
Callister & Rethwisch 3e.
Consider
microstuctural
changes that
accompany the
cooling of aC0= 35 wt% Ni alloy
Ex: Cooling of a Cu-Ni Alloy
4635
4332
a: 43 wt% Ni
L: 32 wt% Ni
Ba: 46 wt% NiL: 35 wt% Ni
C
EL: 24 wt% Ni
a: 36 wt% Ni
24 36D
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Mechanical Properties: Cu-Ni System
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Mechanical Properties:Cu-Ni System
Effect of solid solution strengthening on:
-- Tensile strength (TS) -- Ductility (%EL)
Adapted from Fig. 10.6(a),
Callister & Rethwisch 3e.
Tens
ile
Streng
th(MPa
)
Composition, wt% NiCu Ni0 20 40 60 80 100
200
300
400
TS forpure Ni
TS for pure Cu
Elonga
tion
(%EL)
Composition, wt% NiCu Ni
0 20 40 60 80 10020
30
40
50
60
%ELforpure Ni
%ELfor pure Cu
Adapted from Fig. 10.6(b),
Callister & Rethwisch 3e.
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Binary Eutectic Systems
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2 componentshas a special composition
with a min. melting T.
Adapted from Fig. 10.7,
Callister & Rethwisch 3e.
Binary-Eutectic Systems
3 single phase regions
(L, a, b)
Limited solubility:a: mostly Cu
b: mostly Ag
TE : No liquid below TE
: Composition at
temperature TE
CE
Ex.: Cu-Ag system
Cu-Agsystem
L (liquid)
a L+ a
L+b
b
a + b
C , wt% Ag20 40 60 80 1000
200
1200
T(C)
400
600
800
1000
CE
TE 8.0 71.9 91.2779C
Ag)wt%1.29(Ag)wt%.08(Ag)wt%9.71( b+aLcooling
heating
Eutectic reaction
L(CE) a(CaE) + b(CbE)
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EX: Pb Sn Eutectic System
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L+a
L+b
a + b
200
T(C)
18.3
C, wt% Sn
20 60 80 1000
300
100
L (liquid)
a
183C
61.9 97.8b
For a 40 wt% Sn-60 wt% Pb alloy at 150C, determine:
-- the phases presentPb-Snsystem
EX: Pb-Sn Eutectic System
Answer:a+ b-- the phase compositions
-- the relative amountof each phase
150
40C0
11Ca
99Cb
SR
Answer:Ca= 11 wt% SnCb= 99 wt% Sn
Wa
=Cb- C0
Cb- Ca
= 99 - 4099 - 11
= 5988
= 0.67
SR+S
=
Wb=C0 - Ca
Cb - Ca=
R
R+S
=
29
88 = 0.33=
40 - 11
99 - 11
Answer:
Adapted from Fig. 10.8,
Callister & Rethwisch 3e.
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64
Lamellar Eutectic Structure
Adapted from Figs. 10.14 & 10.15,
Callister & Rethwisch 3e.
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Eutectic Eutectoid & Peritectic
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65
Eutectoidone solid phase transforms to two other solid phases
S2 S1+S3
a+ Fe3C (For Fe-C, 727C, 0.76 wt% C)
intermetallic compound - cementite
cool
heat
Eutectic, Eutectoid, & Peritectic
Eutectic- liquid transforms to two solid phases
L a+ b (For Pb-Sn, 183C, 61.9 wt% Sn)coolheat
cool
heat
Peritectic- liquid and one solid phase transform to a second solid
phase
S1 + L S2
+ L (For Fe-C, 1493C, 0.16 wt% C)
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Intermediate Compounds
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66
Intermediate Compounds
Mg2Pb
Note: intermetallic compound exists as a line on the diagram
stoichiometry is fixed.
Adapted fromFig. 10.20, Callister &
Rethwisch 3e.
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Classification of Metal Alloys
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Adapted from Fig. 10.28, Callister &
Rethwisch 3e
Classification of Metal AlloysMetal Alloys
Steels
Ferrous Nonferrous
Cast Irons
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Based on data provided in Tables 13.1(b), 13.2(b), 13.3, and 13.4, Callister & Rethwisch 3e.
Steels
Low Alloy High Alloy
low carbon
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Adapted from Fig. 10.28, Callister &
Rethwisch 3e
Adapted from Fig. 13.1,
Callister & Rethwisch 3e.
Classification of Metal AlloysMetal Alloys
Steels
Ferrous Nonferrous
Cast Irons
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Cast Irons
Ferrous alloyswith > 2.1 wt% C
more commonly 3 - 4.5 wt% C
Low meltingrelatively easy to cast
Generally brittle
Cementite decomposes to ferrite + graphite
Fe3C3 Fe (a) + C (graphite)
generally a slow process
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Fe C True Equilibrium Diagram
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Fe-C True Equilibrium Diagram
Graphite formation
promoted by
Si > 1 wt%
slow cooling
Adapted from Fig. 13.2,
Callister & Rethwisch 3e.
1600
1400
1200
1000
800
600
4000 1 2 3 4 90
L
+L
a+ Graphite
Liquid +
Graphite
(Fe) C, wt% C
0.6
5740C
T(C)
+ Graphite
100
1153C
Austenite4.2 wt% C
a +
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Nonferrous Alloys
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Based on discussion and data provided in Section 13.3, Callister & Rethwisch 3e & Fundamentals of Modern
Manufacturing 4thedition.
Nonferrous Alloys
NonFerrousAlloys
Al Alloys
-low r: 2.7 g/cm3Produced from bauxiteGood conductor, corrosion res.Wrought (1XXX), Cast (1XX.X)
Mg Alloys
-very low r: 1.7g/cm3
machinable-Produced from MgCl2
Refractory metals
-high melting Ts-Nb, Mo, W, TaNi Alloys
-Similar to steels-oxid./corr. resistant
Ti Alloys
-relativelylowr:4.5g/cm3
vs 7.9 for steel-reactiveathighTs-space applic.
Cu Alloys
Brass:Zn is subst. impurity
corrosion resistant)
Bronze: Sn, Al, Si, Ni aresubst. impurities
CXXXXX)
Cu-Be:precip. hardenedfor strength
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Noble metals
Au, Ag, Pt, Pd
Chemically inactive (in bulk)
Used for jewelry, decorative applications
Generally corrosion resistant and good
conductors
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Superalloys
Superior combinations of properties
Used in high temperature, corrosive
environments
Aircraft turbine components, nuclear reactors,
petrochemical equipment
Classified according to predominant metal in
alloy (Co, Ni, Fe)
Doped with refractory metals (Nb, Mo, W, Ta)
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Polymerization
As a chemical process, the synthesis ofpolymers can occur by either of two
methods:
1. Addition polymerization2. Step polymerization
Production of a given polymer is generallyassociated with one method or the other
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Addition Polymerization In this process, the double bonds between
carbon atoms in the ethylene monomers are
induced to open up so they can join with
other monomer molecules
The connections occur on both ends of the
expanding macromolecule, developing long
chains of repeating mers
It is initiated using a chemical catalyst to open
the carbon double bond in some of the
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Addition Polymerization
Model of addition (chain) polymerization: (1)initiation, (2) rapid addition of monomers, and
(3) resulting long chain polymer molecule with
nmers at termination of reaction
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Step Polymerization
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p y
In this form of polymerization, two reacting
monomers are brought together to form anew molecule of the desired compound
As reaction continues, more reactantmolecules combine with the molecules first
synthesized to form polymers of length n= 2,then length n= 3, and so on
In addition, polymers of length n1and n2also
combine to form molecules of length n= n1+n2, so that two types of reactions areproceeding simultaneously
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Step Polymerization
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Step Polymerization
Model of step polymerization showing the
two types of reactions occurring: (left) n-merattaching a single monomer to form a
(n+1)-mer; and (right) n1-mer combining with
n2-mer to form a (n1+n2)-mer.
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l
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Some Examples
Polymers produced by additionpolymerization:
Polyethylene, polypropylene, polyvinylchloride,
polyisoprene
Polymers produced by step polymerization:
Nylon, polycarbonate, phenol formaldehyde
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l l S f l
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81
Molecular Structures for Polymers
secondarybonding
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Physical characteristics of polymers depends on MW, shape and structure of
molecular chains.
Structure of the chains may be controlled during synthesis.
Polymers usually consist of 2 or more of the molecular structures.
low packing Covalently linked Distinct mech/thermal propflexible
linear branched crosslinked network
Molecular Configurations for Polymers
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82
Molecular Configurations for Polymers
The regularity and symmetry of the side atom or group can
influence the properties
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head to tail head to head
Stereoregularity
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83
g y
Refers to situation in which atoms are linked in same
order but differ in spatial arrangment
isotacticall Rgroups on same side of
chain
C C
H
H
H
R R
H
H
H
CC
R
H
H
H
CC
R
H
H
H
CC C C
H
H
H
R
C C
H
H
H
R
C C
H
H
H
R R
H
H
H
CC
syndiotacticRgroups alternate
sides
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Stereoregularity (cont.)
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84
Stereoregularity (cont.)
atacticRgroups randomly positioned
C C
H
H
H
R R
H
H
H
CC
R
H
H
H
CC
R
H
H
H
CC
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Conversion from one tactic structure to another is not possible by rotation of bonds.Bonds must be severed and reformed after rotation.
All configurations may be observed in a single polymer.
Copolymers
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85
Copolymers
two or more monomers
polymerized together randomA and B randomly
positioned along chain
alternatingA and B alternatein polymer chain
block large blocks of A unitsalternate with large blocks of Bunits
graftchains of B units grafted
onto A backbone
A B
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Crystallinity in Polymers
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86
y y y
Complex, molecules (vs. ions,
atoms)
Ordered atomic
arrangements involving
molecular chains
Crystal structures in terms ofunit cells
Example shown
polyethylene unit cell
Adapted from Fig.
4.10, Callister &
Rethwisch 3e.
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Polymer Crystallinity
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87
Polymer Crystallinity
Crystalline regions
thin platelets with chain folds at faces
Chain foldedstructure
10 nm
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Polymer Crystallinity (cont.)
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88
Polymer Crystallinity (cont.)
Polymers rarely 100% crystalline
Difficult for all regions of all chains tobecome aligned
Degree of crystallinity
expressed as % crystallinity.-- Some physical properties
depend on % crystallinity.
-- Heat treating causes
crystalline regions to grow
and % crystallinity to
increase.
Adapted from Fig. 14.11, Callister 6e.
crystallineregion
amorphous
region
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Th l B h i f P l
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Thermal Behavior of Polymers
The melting behavior of a polymer is determined
by its crystallinity
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Thermo (plastic,set) polymers
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Thermoplastic Soften & liquefy when heated
Harden when cooled
Soften/hardening is reversible
Secondary bonding diminishes astemperature increases
Normally soft
Most linear and some branched
structures
Synthesized by applying heat andpressure
Thermoset Permanently hardens during
formation
Network polymers
Bonds anchor chains to prohibit chainmovement during heat treatment
Extensive crosslinking exists (10
50%)
Polymer degradation only occurs at
excess temperatures
Generally harder and stronger.
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Response to mechanical forces at high temperature related to dominant
molecular structure
Strength vs. Temperature
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Amorphous TP is glass-like below Tg
100 % Crystalline polymer has no rubbery transition
Partially crystallized polymer has intermediate behavior
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Physical Properties of TP
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Physical Properties of TP
Lower densities than metals or ceramics Typical specific gravity for polymers are 1.2 (comparedto ceramics (~ 2.5) and metals (~ 7)
Much higher coefficient of thermal expansion
Roughly five times the value for metals and 10 timesthe value for ceramics
Much lower melting temperatures
Insulating electrical properties
Higher specific heats than metals andceramics
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Cross-Linking in TS Polymers
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Cross Linking in TS Polymers
Three categories:1. Temperature-activated systems
2. Catalyst-activated systems
3. Mixing-activated systems
Curing is accomplished at the fabrication
plants that make the parts rather than the
chemical plants that supply the startingmaterials to the fabricator
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Mechanical Properties of Polymers
Stress Strain Behavior
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94
Stress-Strain Behavior
Deformation strains for polymers > 1000%
brittle polymer
plastic
elastomerelastic moduli
less than for metals Adapted from Fig. 7.22,Callister & Rethwisch 3e.
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95
Composites
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Composite
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96
Composite
Combination of two or more individualmaterials
Design goal: obtain a more desirablecombination of properties (principle of
combined action)
e.g., low density and high strength
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Terminology/Classification
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97
Composite:
-- Multiphase material that is artificially
made.
Phase types:
-- Matrix - is continuous
-- Reinforcing/Dispersed - is discontinuous and
surrounded by matrix
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Interphase
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p
In some cases, a third ingredient must beadded to bond primary and secondary phases
Called an interphase, it is like an adhesive
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Interphases
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Interphases
Formation of an interphase consisting of asolution of primary and secondary phases attheir boundary
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Terminology/Classification
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100
Dispersed phase:
-- Purpose:MMC: increase sy, TS, fatigue and creep resist.
CMC: increase toughnessPMC: increase E, sy, TS, creep resist.
-- Types: particle/flakes, fiber, structural
Matrix phase:
-- Purposes are to:- transfer stress to dispersed phase- protect dispersed phase from
environment
-- Types: MMC, CMC, PMC
metal ceramic polymer
gy/
woven
fibers
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Classification of Composites
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101
Classification of Composites
Particulates
particle
Flakes
Particle-reinforced
Continuous
(aligned)
Aligned Randomly
oriented
Discontinuous
(short)
Fiber-reinforced
Laminates Sandwich
panels
Structural
Composites
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Fiber Orientation
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Fiber orientation in composite materials:
(a) one-dimensional, continuous fibers; (b)
planar, continuous fibers in the form of a
woven fabric; and (c) random, discontinuous
fibers
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Three Factors that Determine Properties
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1. Materials used as component phases in thecomposite
2. Geometric shapes of the constituents and
resulting structure of the composite system
3. How the phases interact with one another
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Example: Fiber Reinforced
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Polymer
Model of
fiber-reinforced
composite material
showing direction in
which elastic
modulus is being
estimated by therule of mixtures
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Variations in Strength and Stiffness
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Variations in Strength and Stiffness
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Classification: Fiber-Reinforced (iii)
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106
Critical fiber length for effective stiffening & strengthening:
Ex: For fiberglass, common fiber length > 15 mm needed
Particle-reinforced Fiber-reinforced Structural
c
fd
t
s2
lengthfiber
fiber diameter
shear strength of
fiber-matrix interface
fiber ultimate tensile strength
For longer fibers, stress transference from matrix is more efficientShort, thick fibers:
c
fd
t
s2
lengthfiber
Long, thin fibers:
Low fiber efficiency
c
fd
t
s2
lengthfiber
High fiber efficiency9/26/2014 ME/IE 380 - Abiade
Composite Benefits
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PMCs: Increased E/r
E(GPa)
Density, r[mg/m3]
0.1 0.3 1 3 10 300.010.1
1
10
102
103
metal/metal alloys
polymers
PMCs
ceramics
Adapted from T.G. Nieh, "Creep rupture of a
silicon-carbide reinforced aluminum
composite", Metall. Trans. AVol. 15(1), pp.
139-146, 1984.
MMCs:
Increasedcreep
resistance10
-8
10-6
10-4
6061 Al
6061 Alw/SiC
hi k
ess (s-1)
CMCs: Increased toughness
fiber-reinf
un-reinf
particle-reinf
Force
Bend displacement