PC929 Series High Speed, Built-in Short SMD 14 pin OPIC ... Sheets/Sharp PDFs/PC929 Series.pdf · SMD 14 pin ∗OPIC Photocoulper ... devices shown in catalogs, data books, ... Date

PC929 Series

1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC929)

2. Approved by VDE (VDE0884) (as an option) file No. 94626 (as model No. PC929)

3. Package resin : UL flammability grade (94V-0)

Features

Agency approvals/Compliance

1. Inverter

Applications

High Speed, Built-in Short Protection Circuit, Gate Drive SMD 14 pin ∗OPIC Photocoulper

1. 14 pin Half pitch type (Lead pitch : 1.27 mm) 2. Double transfer mold package

(Ideal for Flow Soldering)3. Built-in IGBT shortcircuit protector circuit 4. Built-in direct drive circuit for IGBT drive

(Peak output current : IO1P, IO2P : MAX. 0.4 A)5. High speed responce (tPLH, tPHL : MAX. 0.5 µs)6. High isolation voltage (Viso(rms) : 4.0 kV)

DescriptionPC929 Series contains an IRED optically coupled to

an OPIC chip.It is packaged in a Mini-flat, Half pitch type (14 pin).Input-output isolation voltage(rms) is 4.0kV. High

speed responce (tPLH, tPHL : MAX. 0.5 µs).

1Sheet No.: D2-A06301EN

Date Nov. 28. 2003© SHARP Corporation

Notice The content of data sheet is subject to change without prior notice.In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

PC929 Series

∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip.

Internal Connection Diagram

Truth table

2Sheet No.: D2-A06301EN

Outline Dimensions (Unit : mm)

PC929 Series

Input

ON

OFF

C input-output

Low level

Low level

High level

High level

O2 output

High level

Low level

Low level

Low level

FS output

High level

Low level

High level

At operating protection function

High level

1

2

3

4

5

6

7

CathodeCathodeAnodeNC∗

NC∗

NC∗

NC∗

8

9

10

11

12

13

14

FSCGNDO2

GND ∗ No. to pin shall be shorted in the device.

O1

VCCAmp.

Voltage regulator

IGBT protectioncircuit

Interface

1 2 3 4 5 6 7

891011121314

4 7

1. SMT Gullwing Lead-Form [ex. PC929P] 2. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC929PY]

Product mass : approx. 0.47g

1.27±0.25

PC929

6.5±0

.5

Date code

9.22±0.5

0.6±0.1

3.5±0

.5

7.62±0.3

Epoxy resin

0.35

±0.2

5

0.26

±0.1

8

71

14

Primary side mark

1.0+0.4−0 1.0+0.4

−0

10.0+0 −0.5

1.27±0.25

PC9296.

5±0.5

SHARPmark "S"

Date code

9.22±0.5

0.6±0.1

3.5±0

.5

7.62±0.3

Epoxy resin

0.35

±0.2

5

0.26

±0.1

8

71

VDE

4

14

VDE0884 Identification mark

Primary side mark

1.0+0.4−0 1.0+0.4

−0

10.0+0 −0.5

Date code (2 digit)

A.D.

1990

1991

1992

1993

1994

1995

1996

1997

1998

1999

2000

2001

Mark

A

B

C

D

E

F

H

J

K

L

M

N

Mark

P

R

S

T

U

V

W

X

A

B

C

Mark

1

2

3

4

5

6

7

8

9

O

N

D

Month

January

February

March

April

May

June

July

August

September

October

November

December

A.D

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

2012···

···

2nd digit

Month of production

1st digit

Year of production

3

repeats in a 20 year cycle

Sheet No.: D2-A06301EN

PC929 Series

Country of originJapan


Electro-optical CharacteristicsParameter Symbol MIN. TYP. MAX. Unit

Inpu

t Forward voltageTa=25˚C, IF=0.2mA

Reverse current

Terminal capacitance Ta=25˚C, V=0, f=1kHz

Out

put

Supply voltageTa=−10 to +60˚C

−

O1 Low level output voltage

O2 High level output voltage

O2 Low level output voltage

O1 leak current

High level supply current

Low level supply currentTa=25˚C, VCC=VO1=24V, IF=0

VCC=VO1=24V, IF=0

V

V

µA

pF

V

V

V

V

µA

mA

mA

mA

mA

Ta=25˚C, IF=10mA

Ta=25˚C, VR=5V

Ta=25˚C, VCC=VO1=24V, IF=5mA

VCC=VO1=24V, IF=5mA

−

−

−

15

15−

20

−

−

−

−

−

−

1.2 −

10

250

30

24

0.4

2.0

500

17

19

18

20

1.75

Conditions

VF1

VF2

IR

Ct

VCC

VO1L

VO2H

VO2L

IO1L

ICCH

ICCL

VCC1=12V, VCC2=−12V, IO1=0.1A, IF=5mA

VCC=VO1=24V, IO2=−0.1A, IF=5mA

VCC=24V, IO2=0.1A, IF=0

Ta=25˚C, VCC=VO1=35V, IF=0

*8

*9

*9

*9

*9

*9

*9

*9

*9

−

30

−

−

22

V

V−

0.2

1.2

−

10

−

11

−

1.6

1.5

(unless otherwise specified Ta=Topr)

*8 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 13 ) and GND (pin, 10 , 14) near the device, when it measures the transfer characteristics and the output side characteristics.

*9 FS=OPEN, VC=0

Absolute Maximum Ratings

Parameter Symbol Rating Unit

Inpu

t Forward current mA

Reverse voltage V

Out

put

Supply voltage V

O1 output current A

A

O2 output current A

A

O1 output voltage V

Power dissipation

Overcurrent detection voltage

Overcurrent detection current

Error signal output voltage

Error signal output current

mW

V

mA

V

mA

Total power dissipation mW

Operating temperature ˚C

Storage temperature ˚C

IF

VR

VCC

IO1

IO1P

IO2

IO2P

VO1

PO

VC

IC

VFS

IFS

Ptot

Viso (rms)

Topr

Tstg

Tsol ˚C

*2

*1

O1 peak output current*3

*3

*4

O2 peak output current

*5

*6Isolation voltage

Soldering temperature*1 The derating factors of a absolute maximum ratings due to ambient temperature

are shown in Fig.15*2 Ta =25˚C*3 Pulse width≤0.15µs, Duty ratio : 0.01*4.5 The derating factors of a absolute maximum ratings due to ambient temperature

are shown in Fig.16*6 AC for 1minute, 40 to 60 %RH, Ta =25˚C, f=60Hz*7 For 10s

20

6

35

0.1

0.4

0.1

0.4

35

500

VCC

30

VCC

20

550

4.0

−25 to +80

−55 to +125

260

kV

*7

(unless otherwise specified Ta=Topr)

4

PC929 Series


5

PC929 Series

Parameter Symbol MIN. TYP. MAX. Unit

Tra

nsfe

r ch

arac

teri

stic

sPr

otec

tion

outp

utE

rror

sig

nal o

utpu

tO

verc

urre

ntde

tect

ion

Ta=25˚C,VCC=VO1=24V, FS=OPEN, VC=0

VCC=VO1=24V, FS=OPEN, VC=0

Isolation resistance

Rise time

Fall time

Overcurrent detection voltage

Overcurrent detectionvoltage hysteresis width

O2 "High→Low" propagation delay time at overcurrent protection

O2 "High→Low" output voltageat overcurrent protection

Error signal output pulse width

O2 Fall time at overcurrent protection

Low level error signal voltage

High level error signal voltage

Instantaneous common mode rejection voltage (High level output)

Instantaneous common mode rejection voltage (Low level output)

mA

mA

Ω

µs

µs

µs

µs

kV/µs

kV/µs

V

V

µs

µs

V

V

µA

µs

µs

"Low→High" input threshold current

Ta=25˚C, VCC=VO1=24V, IF=5mA, RG=47Ω, CG=3 000pF

FS=OPEN, VC=0

Ta=25˚C, VCM=600V(p-p) IF=5mA, VCC=VO1=24V,

∆VO2H=2.0V, FS=OPEN, VC=0

Ta=25˚C, VCM=600V(p-p) IF=0, VCC=VO1=24V,

∆VO2L=2.0V, FS=OPEN, VC=0

Ta=25˚C VCC=VO1=24V

IF=5mA, RG=47Ω CG=3 000pF, FS=OPEN

Ta=25˚C, IF=5mA VCC=VO1=24V

IFS=10mA, RG=47Ω CG=3 000pF, C=OPEN

Ta=25˚C VCC=VO1=24V, IF=5mA

VFS=24V, RG=47Ω CG=3 000pF, VC=0

Ta=25˚C, VCC=VO1=24VIF=5mA, RFS=1.8kΩRG=47Ω, RC=1kΩ

CG=3 000pF, CP=1 000pF

Ta=25˚C VCC=VO1=24V

IF=5mA, RG=47Ω, CG=3 000pF, RC=1kΩ, CP=3 000pF

FS=OPEN

5×1010

−

−

−

−

−1.5

1.5

VCC−6.5

1

2

−

−

−

−

20

−

0.3

0.2

−

0.5

0.5

−

−

VCC−5.5

3

10

−

2

0.4

100

5

−

3.0

5.0

0.5

0.5

Conditions

"Low→High" propagation delay time

"High→Low" propagation delay time

Res

pons

e tim

e

IFLH

RISO

tPLH

tPHL

tr

tf

CML

VCTH

VCHIS

tPCOHL

tPCOtf

VOE

VFSL

IFSH

tPCFHL

∆tFS

CMH

Ta=25˚C, DC=500V, 40 to 60%RH

−

1011

0.2

0.2

1.5

0.3

0.3

−

−

VCC−6

2

4

5

−

0.2

−

1

35

*11

*12

(unless otherwise specified Ta=Topr)*10

Error signal "High→Low"propagation delay time

*10 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 13 ) and GND (pin 10 , 14) near the device, when it measures the device, when it measures the overcurrent characteristics, Protection output characteristics, and Error signal output characteristics.

*11 IFLH represents forward current when output goes from "Low" to "High"*12 VCTH is the of C(pin 9 ) voltage when output becomes from "High" to "Low"


Model Line-up

PC929 PC929Y−−−−−− Approved

Lead Form

Package

Model No.VDE0884

PC929P PC929PY−−−−−− Approved

Taping

SMT Gullwing

1 000pcs/reel

Sleeve

50pcs/sleeve

6

Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.

PC929 Series


Fig.6 Test Circuit for High Level / Low Level Supply Current

Fig.5 Test Circuit for "Low→High" Input Threshold Current

7

PC929 Series

Fig.1 Test Circuit for O1 Low Level Output Voltage

Fig.2 Test Circuit for O2 High Level Output Voltage

Fig.3 Test Circuit for O2 Low Level Output Voltage

Fig.4 Test Circuit for O1 Leak Current

3

21

13

12

11

10

9

8

14

V

PC929IF

VO1L

VCC1

VCC2

IO1

13

12

11

10

9

8

14VPC929

IF VO2L

VCC

IO2

3

21

13

12

11

10

9

8

14VPC929

IFvariable

VO2

VCC

3

21

13

12

11

10

9

8

14VPC929

IF V02H

VCC

IO23

21

13

12

11

10

9

8

14

PC929IF

VCC

IO1LA3

21

13

12

11

10

9

8

14

PC929IF

VCC

ICC

A

3

21


8

PC929 Series

Fig.7 Test Circuit for Instantaneous Common Mode Rejection Voltage

Fig.8 Test Circuit for Response Time

Fig.9 Test Circuit for Overcurrent Detection Voltage, Overcurrent Detection Voltage Hysteresis

Fig.10 Test Circuit for O2 Output Voltage at Overcurrent Protection

13

12

11

10

9

8

14VPC929 VO2

VCCSW

B

GND

GND

+ −

∆VO2L

VO2L

∆VO2H

VO2H

A

VCM

VCM waveform

VCM

(peak)

CMH, VO2 waveform SW at A, IF=5mA

CML, VO2 waveform SW at B, IF=0mA

3

21

13

12

11

10

9

8

14

PC929

RG

CG

VCC

VIN

tr=tf=0.01µsPulse width 5µsDuty ratio 50%

tPLH tPHL

tftr

10%

90%

VOUT waveform

50%

50%

VIN waveform

3

21

V VOUT

1 2

3

13

12

11

10

9

8

14

PC929

RG

CG

VCC

IF V VO2

V VCTH

13

12

11

10

9

8

14

PC929

RG

RC

CG

VCC

IF V VO2

VCCP1 2

3


Fig.12 Test Circuit for High Level Error Signal Current

Fig.11 Test Circuit for O1 Low Level Error Signal Voltage

9

PC929 Series

Fig.14 Error Signal "High→Low" propagation Delay Time, Error Signal Output Pulse Width

Fig.13 Test Circuit for O2 "High→Low" Propagation Delay Time at Overcurrent Protection, O2 Fall Time at Overcurrent Protection

13

12

11

10

9

8

14

PC929

RG

CG

VCC

IF

IFS

VVFSL

3

21

13

12

11

10

9

8

14

PC929

RG

CG

VCC

IF

A

VFS

IFSH

3

21

V

13

12

11

10

9

8

14

PC929 VOUT

RG

RC

CG

CP

VCC

VIN


3

21 V

13

12

11

10

9

8

14

PC929

RG

RFS

CG

VCC

VIN


RC3

21VOUT

IF(Input current)

90%50%10%

tpCOHL VO

E

tpCOTF

90% Error detection threshold voltage (VCTH)10%

∆tFS

50% 50%

C(Detecting terminal)

FS(Error signal output)

tpCFHL

VO2 (O2 output voltage)


10

PC929 Series

Fig.15 Forward Current vs. Ambient Temperature

Fig.17 Forward Current vs. Forward Voltage

Fig.16 Power Dissipation vs. Ambient Temperature

Fig.19 "Low→High" Relative Input Threshold Current vs. Ambient Temperature

Ambient temperature Ta (˚C)

Pow

er d

issi

patio

n Po

, Pto

t (m

W)

−25 0 25 50 75 100 1250

100

200

300

400

500

550

600

80

PtotPO

1.00.01

0.1

1

10

100

1.2 1.4 1.6 1.8 2.0 2.2

Forward voltage VF (V)

Forw

ard

curr

ent I

F (m

A)

50˚C

25˚C

70˚C

Ta=0˚C

0.4

0.0

0.2

0.6

0.8

1.6

1.0

1.2

1.4

−25 0 25 50 75 100

Rel

ativ

e in

put t

hres

hold

cur

rent

IFL

H

VCC=24V

Ambient temperature Ta (°C)

IFLH = 1 at Ta=25°C

60

50

40

30

20

10

00 25 50 75 80 100 125−25

Forw

ard

curr

ent I

F (m

A)


Fig.20 O1 Low Level Output Voltage vs. O1 Output Current

1

0.1

0.01

0.0010.01 0.1 1

Ta=25°CVCC1=12VVCC2=−12VIF=5mA

O1

low

leve

l out

put v

olta

ge V

O1L

(V

)

O1 output current IO1 (A)

Fig.18 "Low→High" Relative Input Threshold Current vs. Supply Voltage

1.6

1.4

1.2

1.0

0.615 18 21 24 27 30

0.8

Ta=25°CR

elat

ive

inpu

t thr

esho

ld c

urre

nt I

FLH

Supply voltage VCC (V)

Value of VCC=24V assumes 1.


11

PC929 Series

Fig.26 O2 Low Level Output Voltage vs.Ambient Temperature

Fig.24 O2 High Level Output Voltage vs. Ambient Temperature

Fig.23 O2 High Level Output Voltage vs. Supply Voltage

24

23

22

21

20

19−25 0 25 50 75 100


O2

high

leve

l out

put v

olta

ge V

O2H

(V

)

IO2=0A

VCC=24VIF=5mA

IO2=−0.1A

0.8

0.9

1

1.1

1.2

1.3

−25 0 25 50 75 100


O2

low

leve

l out

put v

olta

ge V

O2L

(V

)

VCC=24VIF=5mA

IO2=−0.1A

35

30

25

20

15

10

515 18 21 24 27 30

O2

high

leve

l out

put v

olta

ge V

O2H

(V

)


Ta=25°CIF=5mAIO2=−0.1A

Fig.22 O1 Leak Current vs. Ambient Temperature

−25

10−6

10−7

10−8

10−9

10−10

0 25 50 75 100


O1

leak

cur

rent

IO

1L (

A)

VCC=VO1=35VIF=0mA

Fig.21 O1 Low Level Output Voltage vs.Ambient Temperature

−25 0 25 50 75 100

0.20

0.15

0.10

0.05

0.00


O1

low

leve

l out

put v

olta

ge V

O1L

(V

)

VCC1=12VVCC2=−12VIF=5mA

IO1=0.1A

Fig.25 O2 Low Level Output Voltage vs. O2 Output Current

10

1

0.1

0.010.01 0.1 1

O2

low

leve

l out

put v

olta

ge V

O2L

(V

)

O2 output current IO2 (A)

VCC=24VTa=25°C


12

PC929 Series

Fig.30 Propagation Delay Time vs.Ambient Temperature

Fig.29 Propagation Delay Time vs. Forward Current

Fig.31 Overcurrent Detecting Voltage vs. Ambient Temperature

0.1

0.2

0.3

0.4

0.5

0

Prop

agat

ion

dela

y tim

e t P

HL, t

PLH (

µs)

t PLH

tPHL

VCC=24VRG=47ΩCG=3 000pFIF=5mA

−25 0 25 50 75 100


30

25

15

10

5

0

20

Ove

rcur

rent

det

ectin

g vo

ltage

VC

TH (

V)

VCC=24VRG=47ΩCG=3 000pFIF=5mA

−25 0 25 50 75 100


1.0

0.6

0.7

0.8

0.9

0.5

0.4

0.3

0.2

0.1

00 5 10 15 20 25

Forward current IF (mA)

Prop

agat

ion

dela

y tim

e t P

HL, t

PLH (

µs)

t PLH

tPHL

Ta=25°CIF=5mARG=47ΩCG=3 000pF

Fig.27 High Level Supply Current vs. Supply Voltage

Fig.28 Low Level Supply Current vs. Supply Voltage

18

16

14

12

10

8

6

Low

leve

l sup

ply

curr

ent I

CC

L (

mA

)

15 18 21 24 27 30


Ta=25˚C

Ta=80˚C

IF=0mATa=−25˚C

16

14

12

10

8

6

4

Ta=25˚C

Ta=80˚C

Hig

h le

vel s

uppl

y cu

rren

t IC

CH (

mA

)

15 18 21 24 27 30


IF=5mA

Ta=−25˚C

0

10

8

6

4

2

tPCOHL

tPCOtf

O 2 o

utpu

t fal

l tim

e at

pro

tect

ion

from

ove

rcur

rent

t PC

Otf

/O 2

"H-L

" del

ay ti

me

at p

rote

ctio

n fr

om o

verc

urre

nt t P

CO

HL

(µs) VCC=24V

IF=5mARG=47ΩCG=3 000pFRC=1kΩCP=1 000pF

−25 0 25 50 75 100


Fig.32 O2 Output Fall Time at Protection from Overcurrent/O2 "High-Low" Propagation Delay Time at Protection from Overcurrent vs. Ambient Temperature


13

PC929 Series

VCC=24VIF=5mARG=47ΩCG=3 000pFRC=1kΩCP=1 000pF

2.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

−25 0 25 50 75 100


O2

outp

ut v

olta

ge a

t pro

tect

ion

from

ov

ercu

rren

t pri

mar

y si

de m

ark

VO

E (

V)

0

0.1

0.2

0.3

0.4

0.5

Low

leve

l err

or s

igna

l vol

tage

VFS

L (

V)

VCC=24VIF=5mAIFS=10mARG=47ΩCG=3 000pFC=OPEN

−25 0 25 50 75 100


10−6

10−7

10−8

10−9

Hig

h le

vel e

rror

sig

nal c

urre

nt I

FSH (

A)

VCC=24VIF=5mARG=47ΩCG=3 000pFVC=0

−25 0 25 50 75 100


Fig.34 O2 Output Voltage at Protection from Overcurrent vs. Ambient Temperature

Fig.36 High Level Error Signal Current vs. Ambient Temperature

Fig.35 Low Level Error Signal Voltage vs. Ambient Temperature

0

1.5

1.2

0.9

0.6

0.3

Err

or s

igna

l "H

-L"

prop

agat

ion

dela

y tim

e t P

CFH

L (

µs)

VCC=24VIF=5mARFS=1.8kΩRG=47ΩCG=3 000pFRC=1kΩCP=1 000pF

−25 0 25 50 75 100


Fig.33 Error Signal "High-Low" Propagation Delay Time vs. Ambient Temperature

Fig.37 Error signal output pulse width vs. Ambient Temperature

0

50

40

30

20

10

Err

or s

igna

l out

put p

ulse

wid

th ∆

t FS

(µs)

VCC=24VIF=5mARFS=1.8kΩRG=47ΩCG=3 000pFRC=1kΩCP=1 000pF

−25 0 25 50 75 100


Fig.38 Overcurrent Detecting Voltage vs. Supply Voltage

0

5

10

15

20

25

Added resistance=0Ω

0.5kΩ

1kΩ

1.5kΩOve

rcur

rent

det

ectin

g vo

ltage

VC

TH (

V)

15 18 21 24 27 30


Ta=25˚CIF=5mAVCC=24VRG=47ΩCG=3 000pFRC=1kΩFS=OPENCP=1 000pF


14

PC929 Series

Fig.40 Example of The Application Circuit (IGBT Drive for Inverter)

Fig.39 Overcurrent Detecting Voltage - Supply Voltage Characteristics Test CircuitAnode

Cathode

PC

929

VCC

O1

O2

C

FS

GND

RG

RC

VO2

CP CG

VCC

VC

Add

ed r

esis

tanc

e

IF

V

V

• In order to stabilize the power supply line, we recommend to locate a bypass capacitor CB (0.01µF or more) between VCC and GND near photocoupler.

• In order to stabilize the detecting voltage of pin-C, we recommend to locate a capacitor CP (approximately 1 000pF) between pin-C and GND, and a resistor RC (approximately 1.0kΩ) between VCC and pin-C.However, the rise time of the detection voltage at Pin-C varies along with the time constants of CP and RC.So, please make sure the device works properly in actual conditions.

• For the diode D, which is located between pin-C and collector of IGBT, we recommend to use a diode that has the withstand voltage characteristic equivalent to IGBT and also has little leak current.

• In order to prevent the failure mode or breakdown of pin-C from VCE variation of IGBT, we recommend to locate a resistor R2 (approximately 10kΩ) and a diode D1 at near pin-C, and a resistor R3 (approximately 50kΩ) and a diode D2 at between pin-C and GND.

This application circuit shows the general example of a circuit, and is not a design guarantee for right operation.

PC

929

Anode

Cathode

TTL, microcomputer, etc.

VCC

O1

O2

C

CB

CpFS

GND

RG

RC

R2

D2

D1

R3

R1

RFS

PC817X etc.To microcomputer

+

CFS

(+)

(−)

Pow

er s

uppl

y

Cathode

+

VCC1=12V

VCC2=12V


15

PC929 Series

Fig.41 Operations of Shortcircuit Protector Circuit

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

1. Detection of increase in VCE(sat) of IGBT due to overcurrent by means of C terminal (pin )2. Reduction of the IGBT gate voltage, and suppression of the collector current3. Simultaneous output of signals to indicate the shortcircuit condition (FS signal) from FS (pin ) terminal to

the microcomputer4. Judgement and processing by the microcomputer In the case of instantaneous shortcircuit, run continues.

At fault, input to the photocoupler is cut off, and IGBT is turned OFF.

9

8

Anode

TTL, microcomputer, etc. Amp.

Constant voltage circuit

PC929

IGBT protector circuit

VCC

Tr. 1

Tr. 2

Typ. 150kΩ

O1

O2

C

VC

FS

GND

Feedback to primary side

Cathode

Cathode

VCC

RGRC

CP

VEE

IGBT

3

2

8

9

1014

11

12

13

1

Inte

rfac

e


16

PC929 Series

Design Considerations

Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-sign.When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics.

Notes about static electricity

In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device.

We recommed to use approximately 1 000pF of capacitor between C-pin and GND in order to prevent miss opration by noise.In the case that capacitor is used approximately 1kΩ of resistance shall be recommended to use between VCC and C-pin However, the rise time of C-pin shall be changed by time constant of added CR, so that please use this device after confirmation.

In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED.

The detector which is used in this device, has parasitic diode between each pins and GND.There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant.Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level.

This product is not designed against irradiation and incorporates non-coherent LED.

Design guide


For additional design assistance, please review our corresponding Optoelectronic Application Notes.

17

PC929 Series

DegradationIn general, the emission of the LED used in photocouplers will degrade over time.In the case of long term operation, please take the general LED degradation (50% degradation over 5years) into the design consideration.Please decide the input current which become 2times of MAX. IFLH.

Recommended Foot Print (reference)

1.8

1.27

1.27

1.27

1.27

1.27

1.27

0.8

9.0

(Unit : mm)


Manufacturing Guidelines

Reflow Soldering:Reflow soldering should follow the temperature profile shown below.Soldering should not exceed the curve of temperature profile and time.Please don't solder more than twice.

Soldering Method

Flow Soldering :Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines.

Flow soldering should be completed below 260˚C and within 10s.Preheating is within the bounds of 100 to 150˚C and 30 to 80s.Please don't solder more than twice.

Hand solderingHand soldering should be completed within 3s when the point of solder iron is below 400˚C.Please don't solder more than twice.

Other noticesPlease test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.

18

1 2 3 4

300

200

100

00

(˚C)

Terminal : 260˚C peak

( package surface : 250˚C peak)

Preheat

150 to 180˚C, 120s or less

Reflow

220˚C or more, 60s or less

(min)

PC929 Series


Solvent cleaning:Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less

Ultrasonic cleaning:The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device.Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.

Recommended solvent materials:Ethyl alcohol, Methyl alcohol and Isopropyl alcoholIn case the other type of solvent materials are intended to be used, please make sure they work fine in ac-tual using conditions since some materials may erode the packaging resin.

Cleaning instructions

This product shall not contain the following materials.And they are not used in the production process for this device.Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

Presence of ODC

19

PC929 Series


Package specification

20

12.0

6.7

5.8

10.8

520±2

Sleeve packagePackage materials

Sleeve : HIPS (with anti-static material)Stopper : Styrene-Elastomer

Package methodMAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers.The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.MAX. 20 sleeves in one case.

Sleeve outline dimensions

(Unit : mm)

PC929 Series


21

Tape and Reel packagePackage materials

Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system)Reel : PS

Carrier tape structure and DimensionsF

K

E I

D J

G

B

H H

A

C

Dimensions List (Unit : mm)A

16.0±0.3

B

7.5±0.1

C

1.75±0.1

D

12.0±0.1

E

2.0±0.1

H

10.4±0.1

I

0.4±0.05

J

4.2±0.1

K

9.7±0.1

F

4.0±0.1

G

φ1.5+0.1 −0

5˚M

AX

.

a

c

e

g

f

b

d

Dimensions List (Unit : mm)a

330

b

17.5±1.5

c

100±1.0

d

13±0.5

e

23±1.0

f

2.0±0.5

g

2.0±0.5

Pull-out direction

[Packing : 1 000pcs/reel]

Reel structure and Dimensions

Direction of product insertion

PC929 Series

· The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems rela-ted to any intellectual property right of a third party re-sulting from the use of SHARP's devices.

· Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the spec-ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufac-turing locations are also subject to change without no-tice.

· Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions:(i) The devices in this publication are designed for use in general electronic equipment designs such as:

--- Personal computers--- Office automation equipment--- Telecommunication equipment [terminal]--- Test and measurement equipment--- Industrial control--- Audio visual equipment--- Consumer electronics

(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection

with equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e.,

aircraft, trains, automobiles, etc.)--- Traffic signals--- Gas leakage sensor breakers--- Alarm equipment--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec-tion with equipment that requires an extremely high lev-el of reliability and safety such as:

--- Space applications--- Telecommunication equipment [trunk lines]--- Nuclear power control equipment--- Medical and other life support equipment (e.g.,

scuba).

· If the SHARP devices listed in this publication fall with-in the scope of strategic products described in the For-eign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP de-vices.

· This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro-duced or transmitted in any form or by any means, elec-tronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.

· Contact and consult with a SHARP representative if there are any questions about the contents of this pub-lication.

22


Important Notices

PC929 Series

Documents

PC929 Series High Speed, Built-in Short SMD 14 pin OPIC ... Sheets/Sharp PDFs/PC929 Series.pdf · SMD 14 pin ∗OPIC Photocoulper ... devices shown in catalogs, data books, ... Date