TEST CAPABILITIES MicrosecƟonal (Cross‐secƟon) Analysis PCB / PCBA Failure Analysis (F/A) Advanced AnalyƟcal Techniques: DiﬀerenƟal Scanning Calorimetry (DSC) Dynamic Mechanical Analysis (DMA) Fourier Transform Interferometry (FTIR) Scanning AcousƟc Microscopy (CSAM) Scanning Electron Microscopy (SEM) Thermal Gravinetric Analysis (TGA) Themal Mechanical Analysis (TMA) Environmental SimulaƟon ConduƟve Anodic Filament (CAF) Dielectric Withstanding Voltage (DWV) ElectroChemical MigraƟon (ECM) Moisture and InsulaƟon Resistance (MIR) Surface InsulaƟon Resistance (SIR) Humidity (Steady State & Cycling) Temperature (Thermal Aging/AcceleraƟon) Electrical TesƟng Visual and DimenƟon InspecƟon Mechanical ProperƟes Tensile Strength Peel Strength Bond Strength / Bond Pull Microtek Laboratories has the capabilities to perform physical, mechanical, electrical, visual & dimensional testing and verification at the PCB bare board level, raw materials as well as the assembled PCBA’s. Microtek can evaluate to both military and commercial standards including IPC specification and test methods, MIL-PRF- 55110; MIL-PRF-31032; MIL-P-50884, ASTM, IEC as well as customer procurement documents. Since 1986, our highly-qualified staff includes mechanical and chem- ical engineers, technicians and laboratory management in industry knowledge and experience. PCB/PWB & PCBA TESTING Global Headquarters: Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A. eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com Global Leader in Test Technology and Expertise Copyright 2013 - Microtek Laboratories Scan to Learn More IPC-A-600 IPC-A-610 IPC-6012 IPC-6013 IPC-6016 IPC-6018 IPC-TM-650 MIL-PRF-55110 MIL-PRF-31032 MIL-P-50884 ASTM IEC Bellcore (Telcordia) UL

PCB-PCBA Testing - 1-2013

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PAB

ILIT

IES

Microsec onal (Cross‐sec on) Analysis

PCB / PCBA Failure Analysis (F/A)

Advanced Analy cal Techniques:

Differen al Scanning Calorimetry (DSC)

Dynamic Mechanical Analysis (DMA)

Fourier Transform Interferometry (FTIR)

Scanning Acous c Microscopy (CSAM)

Scanning Electron Microscopy (SEM)

Thermal Gravinetric Analysis (TGA)

Themal Mechanical Analysis (TMA)

Environmental Simula on

Condu ve Anodic Filament (CAF)

Dielectric Withstanding Voltage (DWV)

ElectroChemical Migra on (ECM)

Moisture and Insula on Resistance (MIR)

Surface Insula on Resistance (SIR)

Humidity (Steady State & Cycling)

Temperature (Thermal Aging/Accelera on)

Electrical Tes ng

Visual and Dimen on Inspec on

Mechanical Proper es

Tensile Strength

Peel Strength

Bond Strength / Bond Pull

Microtek Laboratories has the capabilities to perform physical, mechanical, electrical, visual & dimensional testing and verification at the PCB bare board level, raw materials as well as the assembled PCBA’s. Microtek can evaluate to both military and commercial standards including IPC specification and test methods, MIL-PRF-55110; MIL-PRF-31032; MIL-P-50884, ASTM, IEC as well as customer procurement documents. Since 1986, our highly-qualified staff includes mechanical and chem-ical engineers, technicians and laboratory management in industry knowledge and experience.

PCB/PWB & PCBA TESTING

Global Headquarters:

Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.

eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com

Global Leader in Test Technology and Expertise

IPC-A-600 IPC-A-610 IPC-6012 IPC-6013 IPC-6016 IPC-6018 IPC-TM-650

MIL-PRF-55110 MIL-PRF-31032 MIL-P-50884 ASTM IEC Bellcore (Telcordia) UL