Performance optimization (induction field; gas) end of Mar.Integration and services connectivity studies mockup end of Mar.Cooling system components production (360) and piping end of Mar.Cables (hybrid-horse shoe) production and testing end of Mar.HV board optimization (25) end of Mar.25 hors shoe cards production Jan.-Feb.11th card Feb.-Mar.50 VFATs both types end of Jan.TTP hybrid testing system end of Jan.338 pad type VFAT+104 strip type VFAT hybrids end of Feb.450 VFAT hybrids components and bonding end of Mar. !!Hybrids testing (1 detector/day)Detector with electronics testing (1/day) parallel with hybrids testTelescope assembly parallel with detectorsIntegration & services test (1 week)

28th of April !

T2 PlanningT2 Planning

T2 PlanningT2 Planning

 -T2 mechanical support improvement (Dmitri, Wolfgang, Miranda, Eric)

-definition of services (cables !) for T2 electronics (Walter)

-cooling power specification (Eric) CMS cooling meetings

-CMS gas meeting

-Kapton cables (connecting horse shoe and 11th cards) production and testing status and procedures (Nicola, Eraldo)

-11th card design and production status, including geometry definition in connection with limited available space for telescope installation (Guido, Nicola)

- preparations for VFAT hybrids assembly in Helsinki (Kari) Kari’s mail

Issues from 16.01.2008 T2 meetingIssues from 16.01.2008 T2 meeting

1) hybrids in panels (how many in one panel?)2) the proper smt components in a standard form of band suitable for those assembling machines3) both white and black connectors in similar form4) VFATs, if you want that they will be installed at the same time. The alignment precision should be 13 microns.5) proper drawings of stencils (or even better, if you have the actual stencils themselves)

VFAT Hybrids assembly in HelsinkiVFAT Hybrids assembly in Helsinki

-Work on TTP:1)understand how to control and use the TTP; 2)define the procedure to test the hybrids and test all the available ones; 3)test four hybrids plugged on the GEM with the TTP (this will require time, but We are really interested to see the results in terms of noise);

-Work on Timing:4)make a systematic analysis of the noise versus the number of clock cycles for the monostable pulse length; 5)define with you the measurements and the procedure to follow to finalize the timing study; 6)according to point 5, make the tests changing the induction field and/or the gas mixture.(I think that probably we will not have all the needed time to face off all this points. Regarding point 6, I think that we could make all the necessary in order to arrange the H8 system set-up (for example I think that we cannot sent the mixture with CF4 directly on the air as we are doing now withAr/CO2 etc. etc.) to be ready to make this measurements during the next period at cern (we have time until the end of March for the results of these tests and I'm sure that we will be at CERN for other weeks before the end March!). Moreover we don't have at the moment in Siena the possibility to change the mixture and for this reason this test should be done at CERN, but we could eventually do the tests concerning the induction field.

Detector optimization (Eraldo)Detector optimization (Eraldo)

Status of  mechanical support and mock-up (service cables),

Status of 11th card (production and testing - status of DAQ),

Hybrids production in Helsinki,

Ambient temperature, pressure and humidity sensors locations,

Reports from the CMS meetings (gas, cooling and grounding),https://edms.cern.ch/file/463581/2/Totem_Gas_System_2-1.doc

T2 planning overview 

Issues from 23.01.2008 T2 meetingIssues from 23.01.2008 T2 meeting

  Tous les composants sont places.

Je commence a regarder comment faire le routage de la carte le plus efficacement possible. Voir si je peux faire des parties répétitives que je puisse recopier après ( copy paste ).

J'ai vérifier tous le connecteurs pour les mettre dans le bon sens . Maintenant c'est OK. Une fois que tout est bien en place on vas essayer de travailler a 2 sur le même job pour aller plus vite .

Lundi Guido devrait venir au CERN  pour vérifier quelques points .

J'ai demander a Eric de me donner les dimension maximale du Circuit en longueur , car si je pouvais avoir quelques mm de plus cela m'arrangerais .        On va essayer de la terminer au plus vite .                          Manu

1111thth card status card status

Bonjour a tous,voici un premier rapport concernant le test d'insertion et la prise de mesures du détecteur TOTEM T2.Ces mesures ont été prises sur place dans CMS.les premières mesures montrent que la situation est moins catastrophique que l'on pensait.L'enveloppe extérieure du détecteur est simulée par un cylindre de diamètre 480 mm et de longueur 500mm.Aucuns problèmes pour l'insertion: le détecteur se monte facilement.Positionnement: des mesures entre le détecteur et la paroi interne du HF (Hadron forward) ont été relevées sur les deux parties.  - la cote minimum est de 7.80 mm et la cote maxi est de 14.3 au rayon  - le HF est décentre de 1.95 mm en position horizontale et de 2.15 en position verticale.  - le HF a un jeu de 4.5 a 5 mm entre chaque demi-coquille.  - le point le plus critique se situe au niveau de la 11 eme carte avec un jeu de 8.6 mm minimum Nous ne connaissons pas la position exacte du tube a vide par rapport au HF. Cependant les jeux relèves permettront un centrage du T2.La tolérance d'ajustement sera suffisante pour le centrage des trois éléments.les mesures ont été prises avec Miranda, Wolfgang, Dimitri et moi-même.Pour plus de détails,un dessin et un relevé de cotes est a disposition ainsi que quelques photos.Conclusion: l'insertion du détecteur TOTEM T2 ne posera aucuns problèmes si nous respectons notre enveloppe de d=480mm.Salutations Eric DAVID  le 31.01.2008 

Agenda for 13.02.2008 T2 meetingAgenda for 13.02.2008 T2 meeting

Detector performance optimization (detectors shielding)

Status of  mechanical support and mock-up, services routing

Cooling of the HV board (manifold status)

Status of the 11th card layout (incl. cooling)

Status of the hybrids and horse shoe card production

Hybrids assembly in Helsinki,

T2 planning overview 

T2 Planning T2 Planning modified 13.02.2008modified 13.02.2008

Agenda for 20.02.2008 T2 meetingAgenda for 20.02.2008 T2 meeting

Status of  mechanical support, mock-up and services routing

Electronics production schedule

Components for electronics assembly specs (hybrids)

Detectors shielding

T2 planning overview 

Item Loc. 4-Feb 11-Feb 18-Feb 25-Feb 3-Mar 10-Mar 17-Mar 24-Mar 31-Mar 7-Apr 14-Apr 21-Apr 28-Apr 5-May 12-May

HS Pre/Production (2) Production CIRE

HS Pre/Production (2) Assembly BICE

HS Pre/Production (2) Qualification CERN

HSTC Design PISA

HSTC Production PISA

HSTC Assembly PISA

HSTC Firmware Development PISA

HSTC Software Development SIENA

HSTC Test & Firmware Refinement PISA

HS Production (48) Production CIRE

HS Production (48) Assembly & Test BICE

11th Design CERN

11th Prototype (2) Production CERN

11th Prototype (2) Assembly CERN

11th Prototype (2) Test CERN

11th (1) + HS (2) Test CERN

11th Production (6) XXX

11th Assembly (6) XXX

11th Test XXX

Kapton Production (60) ECS

Kapton Assembly (60) ECS

Cabling and PS Checks CERN

Cable Specs Definition ORVEM

Cable Prototype Assembly (2 sets) ORVEM

Cable Prototype Test (2 sets) PISA

Cable Production Assembly (6 sets) ORVEM

Cable Production Test (6 sets) ORVEM

Detector Integration (1/4) CERN

T2 electronics planningT2 electronics planning

HS Components (50 pieces)Manufacturer Reference Pieces (1) Pieces (2) Pieces (3)

Connectors50-pin Header Connector (Hybrids) ERNI ERNI_TYPE_QVM 17 850 900 in BICE before th 24th of March (*)130-pin Header Connector (11TH) Panasonic AXK5SA3675 3 150 170 in BICE before th 24th of March (*)Active ComponentsDCU CERN 1 50 60 in BICE before th 24th of March (*)CRT902 CERN 11 550 600 in BICE before th 24th of March (*)

Kapton Components (3x60 pieces)Connectors130-pin Socket Connector Panasonic AXK5SA3275 2 360 400 in Pisa before th 24th of March

11TH Components (8 pieces)Connectors130-pin Header Connector (HSs - 10) Panasonic AXK5SA3675 30 240 260 to be acquired before the 14th of April (**)130-pin Socket Connector (CCMCs - 13) Panasonic AXK5SA3275 26 208 230 to be acquired before the 14th of April (**)50-pin Socket Connector (TMCs - 2) ERNI ERNI_TYPE_BVF 4 32 40 to be acquired before the 14th of April (**)26-pin Socket Connector (TMCs - 2) ERNI ERNI_TYPE_BVF 2 16 20 to be acquired before the 14th of April (**)

100-pin Header Connector (OBs) HIROSE FX2CA1-100P-1.27DSAL 7 56 60 to be acquired before the 14th of April (**)40-pin Header Connector (OBs) HIROSE FX2CA1-40P-1.27DSAL 2 16 20 to be acquired before the 14th of April (**)

40-pin Header Connector (CCUMs) SAMTEC QSE-020-01-L-D-A 15 120 130 to be acquired before the 14th of April (**)

20-pin Receptacle Connector (DOHMs) 3M 10220-R21CS 2 16 20 to be acquired before the 14th of April (**)

Active ComponentsLVDS_RX CERN 13 104 120 to be acquired before the 14th of April (**)LVDSMUX CERN 2 16 30 to be acquired before the 14th of April (**)CRT902 CERN 7 56 80 to be acquired before the 14th of April (**)PLL25 CERN 10 80 100 to be acquired before the 14th of April (**)

(1) => components required to mount 1 PCB(2) => components required to mount all the PCBs (spare PCBs included)(3) => required components (including spare components)(*) if all the components are not available, at least the components required to mount 2 HS prototypes must be sent to BICE before the 25th of February(**) if all the components are not available, at least the components required to mount 2 11TH prototypes must be available at CERN before the 24th of March

Components for T2 electronics assemblyComponents for T2 electronics assembly

Agenda for 27.02.2008 T2 meetingAgenda for 27.02.2008 T2 meeting

Mechanical support, mock-up and services routing

Cooling

DCS sensors

Components for electronics assembly

Electronics production schedule

Detectors shielding

T2 planning overview 

1) In each quarter the following sensors will be used: a) 1 RadMon (6 wires)b) 1 Humidity (4 wires)c) 1 Pressure (4 wires) d) 7 pt100 for temperatures  - e.g.: T(pipe_in), T(pipe_out), T(air), T(humidity_sensor), T(electronics_test_point_1, T(electronics_test_point_2), T(electronics_test_point_3), e) 2 pt100 for temperatures for DSS  - T(DSS_1) and T(DSS_2), location to be defined 2) In view of the detector integration the following allocation and readout are suggested for the sensors above mentioned: a) RadMon: the card will be inserted into an ERNI 12-pin connector housed on the 11th card (two connectors on the two sides of the power connectors will be placed since the card will have to stand on the opposite side with respect to directions of the cables) b) Pressure, Humidity and pt100 for T(humidity sensor): these three sensors will be housed on a smallcard (similar to the RadMon one) that will be inserted into an ERNI 12-pin connector housed on the 11th card  (two connectors on the two sides of the power connectors will be placed since the cards will have to stand on the opposite side with respect to directions of the cables) c) 8 pt100 for T(pipe_in), T(pipe_out), T(air), T(electronics_test_point_1, T(electronics_test_point_2), T(electronics_test_point_3), T(DSS_1) and T(DSS_2): located in the test points and connected through 4 wire  connections to eight 4-pin connectors (to be identified) housed on the 11th card d) one additional 100-pin HIROSE connector will bring out the 68 wires [2x6+2x(4+4+4)+8x4] through a cable similar to the ones used to connect the 11th card to the Opto-Board e) signals - if required - could be conditioned in the "patch panel" board in the rack to fan-out to the 4 36-wire cables pre-viewed for each quarter of the detector

DCS sensors integration in T2DCS sensors integration in T2

far+

No. Cable No. Cable No TYPE ORIGIN DESTINATION LON- ODINB (par TOT-CMS) CABLE function OUVRAG EQUIPEMENT POSV POSH CONNECT OUVRAG EQUIPEMENT ELEMENT POSV POSH CONNECT GUEUR mm

1 TR.2_CT 1 3M control loop T2+far 11th card J1 3M 20pin HF+ rack X3R73 DOHM (?) 3M 20pin 7 ~10

2 TR.2_CT 2 3M control loop T2+far 11th card J2 3M 20pin HF+ rack X3R73 DOHM (?) 3M 20pin 7 ~103 TR.2_DT 3 04.21.51.550.4 (2 x 50 for 100 wires)data out T2+far 11th card J3 100 pin P50E-100S-TG scem 09.55.21.103.3HF+ rack X3R73 rack w optoboards 100 pin P50E_100P1_S1 7 10

4 TR.2_DT 4 04.21.51.550.4 (2 x 50 for 100 wires)trigger out T2+far 11th card J4 100 pin P50E_100P1_S1 HF+ rack X3R73 rack w optoboards 100 pin P50E_100P1_S1 7 10

5 TR.2_DT 5 04.21.51.550.4 (2 x 50 for 100 wires)data out T2+far 11th card J5 100 pin P50E_100P1_S1 HF+ rack X3R73 rack w optoboards 100 pin P50E_100P1_S1 7 10

6 TR.2_DT 6 04.21.51.550.4 (2 x 50 for 100 wires)trigger out T2+far 11th card J6 100 pin P50E_100P1_S1 HF+ rack X3R73 rack w optoboards 100 pin P50E_100P1_S1 7 10

7 TR.2_DT 7 04.21.51.550.4 (2 x 50 for 100 wires)trigger out T2+far 11th card J7 100 pin P50E_100P1_S1 HF+ rack X3R73 rack w optoboards 100 pin P50E_100P1_S1 7 10

8 TR.2_DT 8 04.21.51.550.4 (2 x 50 for 100 wires)data out T2+far 11th card J8 100 pin P50E_100P1_S1 HF+ rack X3R73 rack w optoboards 100 pin P50E_100P1_S1 7 10

9 TR.2_DT 9 04.21.51.550.4 (2 x 50 for 100 wires)data out T2+far 11th card J9 100 pin P50E_100P1_S1 HF+ rack X3R73 rack w optoboards 100 pin P50E_100P1_S1 7 10

10 TR.2_DV 10 04.21.51.568.2 data control out T2+far 11th card J10 34 pin P50E_34P1_SR1 HF+ rack X3R73 rack w optoboards 34 pin P50E_34P1_SR1 7 11.2

11 TR.2_DV 11 04.21.51.568.2 trigger control out T2+far 11th card J11 34 pin P50E_34P1_SR1 HF+ rack X3R73 rack w optoboards 34 pin P50E_34P1_SR1 7 11.2

12 TR.2_LV 12 LV power AVDD HS0 T2+far 11th card B1-4 2x2 (pwr+sense) HF+ rack X3R73 Wiener maraton 2x2 (pwr+sense) 713 TR.2_LV 13 LV power AVDD HS1 T2+far 11th card B1-4 2x2 (pwr+sense) HF+ rack X3R73 Wiener maraton 2x2 (pwr+sense) 714 TR.2_LV 14 LV power DVDD HS0 T2+far 11th card B1-4 2x2 (pwr+sense) HF+ rack X3R73 Wiener maraton 2x2 (pwr+sense) 715 TR.2_LV 15 LV power DVDD HS1 T2+far 11th card B1-4 2x2 (pwr+sense) HF+ rack X3R73 Wiener maraton 2x2 (pwr+sense) 716 TR.2_LV 16 LV power DVDD Cntrl T2+far 11th card B1-4 2x2 (pwr+sense) HF+ rack X3R73 Wiener maraton 2x2 (pwr+sense) 717 TR.2_LV 17 EGNDA, EGNDD T2+far 11th card B1-4 ?? HF+ rack X3R73 ?

18 TR.2_HV 18 HV detector T2+far Detector 1 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 719 TR.2_HV 19 HV detector T2+far Detector 2 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 720 TR.2_HV 20 HV detector T2+far Detector 3 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 721 TR.2_HV 21 HV detector T2+far Detector 4 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 722 TR.2_HV 22 HV detector T2+far Detector 5 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 723 TR.2_HV 23 HV detector T2+far Detector 6 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 724 TR.2_HV 24 HV detector T2+far Detector 7 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 725 TR.2_HV 25 HV detector T2+far Detector 8 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 726 TR.2_HV 26 HV detector T2+far Detector 9 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 727 TR.2_HV 27 HV detector T2+far Detector 10 HV HV coax HF+ rack X3R73 HV Patch Panel HV coax 7

28 TR.2_PM 28 Position sensor T2+far Sensor 1 HV tbd HF+ rack X3R73 Patch panel tbd 729 TR.2_PM 29 Position sensor T2+far Sensor 2 HV tbd HF+ rack X3R73 Patch panel tbd 730 TR.2_PM 30 Position sensor T2+far Sensor 3 HV tbd HF+ rack X3R73 Patch panel tbd 731 TR.2_PM 31 Position sensor T2+far Sensor 4 HV tbd HF+ rack X3R73 Patch panel tbd 7

T2 cables (one quarter)T2 cables (one quarter)

Agenda for 5.03.2008 T2 meetingAgenda for 5.03.2008 T2 meeting

Mechanical support, mock-up and services routing Dmitri presentation

Cooling

Helsinki T2 status (VFAT hybrids (radhard capacitors specs, chips gluing), HV board (resistors), shielding)

Components for electronics assembly

Electronics production schedule

 

T2 integrationT2 integration

CoolingCooling