Peter Arrowsmith 2-26-2004thor.inemi.org/webdownload/newsroom/Presentations/Opto_TIG_AP… · –Optical module to PCB solder attach (level-2): completed cost model ... –Learn the

OE TIG Project Planning MeetingOE TIG Project Planning MeetingAPEX 2004APEX 2004

Peter Arrowsmith2-26-2004

2Connect with and Strengthen your Supply ChainConnect with and Strengthen your Supply Chain

OE TIG UpdateOE TIG Update

• Starting to see OE equipment revenue growth

• Strong growth at edge: Access & FTTP, PONs

• Traffic continues to grow 50-100% pa, triple play(data, VoIP, video), retail, file swapping...

• Fiber interconnect technologies will be continue tobe used

• Emerging technologies: high speed interconnects,organic waveguides, optical emission & modulationin Si (Intel), optical band gaps, holey fibers...

• Cost of packaging, assembly & test, remainsignificant

• Looking for Member input to OE roadmap, gapanalysis & project selection


OE TIG Update – Agenda

• Project updates:

– Fiber optic signal performance

– Optoelectronics substrates (Cu vs optical backplane cost-performancemodel)

– Fiber optic splice improvement

– OE module carrier standardization (level-1): completed

– Optical module to PCB solder attach (level-2): completed cost model

• Standards organization collaboration

• OE technology gap analysis

• Future OE TIG project plans

Optical Connector ContaminationOptical Connector Contaminationand its Influence on Optical Signaland its Influence on Optical Signal

PerformancePerformance

Project Updates,

Feb, 2004

Chair: Tatiana Berdinskikh, Celestica Inc

Co-chair: Heather Tkalec, Alcatel Canada


Fiber Optic Signal Performance ProjectFiber Optic Signal Performance Project

• Object:

– Learn the effects that many anomalies have on the performanceof a fiber optic signal

– Identify the severity of optical signal loss due to the mostcommon, potential, hazards found in the supplier and internalmanufacturing processes

• Scope:

– Develop connector end-face inspection criteria, which wouldprovide feedback to OEM Incoming Quality, ComponentEngineering and cable suppliers on specific cleanlinessrequirements with supporting data

– Provide quantitative evidence to production and test departmentsto validate their expensive inspection and cleaning strategies,which have been historically endorsed by the industry


Fiber Optic Signal PerformanceFiber Optic Signal PerformanceProjectProject


Benefits:• Develop the Industry Standard for cleanliness of fiber optics

connectors. Methods and guidelines was submitted forincorporation into OE standards, e.g. IPC-STD-040

• Improve the cleaning process and and prevent of fiber end facecontamination

Project Status:• First face-to face meeting held June 2002 (Celestica, Toronto)• Confirmed participants:

Aerotech World Trade Ltd, Alcatel Canada, Celestica, CiscoSystems, Nortel Networks, Solectron

• Contributors:Avanex, Sagitta, Westover Scientific



Fiber Optic Signal PerformanceFiber Optic Signal Performance Tatiana Berdinskikh, CelesticaTatiana Berdinskikh, Celestica Inc./ Heather Inc./ Heather TkalecTkalec, , AlcatelAlcatel Canada Canada

Project Status cont.• The results of the the project has been presented at OMI

conference (Ottawa, Apr, 03) and has been published atthe Journal of SMT (2003, v.16, issue 3)

• The results of the project has been presented at the IECmeeting, Montreal, Oct 7-8 ‘03. The results have been wellreceived

• The paper has been published by the Connector Specifiermagazine (Jan ‘04)

• The paper will be presented at APEX2004 (Feb, 04)• Collaborate with the IPC on the standard development

(Cleaning processes for Level 1 and Level 2 OpticalSubassembly)

• Looking for additional members, particularly cablesuppliers


• The influence of scratches, particles and oil contaminationon optical performance of SC connectors was investigated

• Scratches (2 mm or less), within fiber MFD, has no impacton IL can degrade the RL

• The level of RL degradation depends on the size (widthand depth) and, the number of the scratches crossingMFD

• Polishing scratches outside the MFD have no impact on IL& RL

Results




Results cont.• Carbon/dust particles located at the distance <25 mm

from the core can resulted in a significant increase ofIL ( 0.5-1 dB ) and decrease in RL (20-30 dB change)

• Based on our results, carbon/dust particles located at≥25 mm from the core have minimum impact on IL (< 0.02dB) and RL (< 4dB)

• Removable contamination can be redistributed during themating/demating operation. Hence, removablecontamination is not acceptable.

• Application of oil contamination resulted in significantdegradation of RL (10-12 dB) and didn’t result in anysignificant changes of IL


• Future studies will investigate more on the effects of theparticles when they are locate at the cladding layer as wellas focusing on particle size, quantity and different particletypes

• The development of the mathematical modeling forscratches/particles/oil contamination is the subject of thefurther research

• Prevention of the electrostatic effect during the cleaningprocess of the fiber optics connectors

Possible Technical Development



• Work together with IEC (TIA) on the development of a newstandard. The data can be incorporated into the existing drafts86B/1876/CD, 86B/1822/CD, possibly 86B/1677/PAS (draft orexisting standard?). IEC test method 61300-3-34

• Complete main project 1Q-2Q ’04.

• Form follow-on standards project “ Fiber Endface CleanlinessSpecification”

Industry Benefits• Cost reduction: supplier/user acceptance spec differences drive

rejection of non-conforming material• Cleaning process improvement and prevention of contamination

also result in the cost reduction and assembly yield improvement• Participants (supplier & users) develop common standard

Future Plans



OE TIG ProjectsOE TIG Projects

Optoelectronics Substrates Project

Leader: Jack Fisher

Sub-groups

PCB cost model: Adam Singer, Cookson

Optical: Peter Arrowsmith, Celestica


The optoelectronics industry is moving at a rapidpace and new ideas and processes occur almostevery week. The printed wiring board is one ofthe components that may impact or be impactedby the optoelectronic momentum. To enable theoptoelectronic industry to meet it’s cost andperformance targets the PWB must be able tocarry both electrons and photons in the samesubstrate. The NEMI Optoelectronic Substrateteam will investigate the use of opticalwaveguides in or on PWB’s.

Optoelectronics Substrates ProjectOptoelectronics Substrates Project


Original Purpose Statements:

• This purpose of this group is to addresses the implementation ofoptical and optoelectronic technologies in printed wiring boards(PWB’s) used for packaging, for final product or for other applications.The areas to be addressed include:

• An understanding of the drivers and the constraints of producingoptoelectronic PWB’s including cost analysis and tradeoffs.

• Design considerations for materials used for PWB fabrication andassembly, including material properties

• Manufacturability of waveguides and the integration of waveguides inPWB’s

• Performance and testing of waveguides and connector attachment towaveguides

• Component mounting and interconnecting structures.



Current Statement:

Initial investigation by the committee determined that the OEM’swere not planning to use optoelectronics in their next generationmachines.

The OEM’s felt that optoelectronics was at least two generationsaway from implementation in product that effect the revenue stream

The OEM’s were all working on internal analysis's of optoelectronicsolutions and were all interested in participating in a NEMItechnology analysis activity.

There are numerous estimates of how far copper can be pushed toincrease data rates. The estimates range from 2.5 Gb/s to 40 Gb/s.



Activities:In light of the OEM’s not booking optoelectronics as partof their next generation equipment it was decided to do abusiness analysis of copper vs optoelectronics

The product to be analyzed will be a communicationsindustry backplane.



Optical Optical BackplaneBackplane Cost Cost

Cost-performance is the key driver; we need an industry metricto compare optical vs. Cu-based, e.g. $/(Gb/s/channel/m)

Crossover zone:changeover will not be

immediate, but will rangedepending on issues includingcost sensitivity, reliability, and

design limitations

Bandwidth x Distance

Rel

ativ

e C

ost Copper

PCB

Optical PCB

20042000


Status:•Bi-weekly telecons•Very good participation

•Several OEM’s, fabricators, CMs, material suppliers•First pass output of copper backplane model run andvalidated by 3 fabricators•Draft electrical technology road map,1-10(40) Gbps,includes connectors, signal conditioning, chip-sets andhigh performance substrates•Starting to develop connector input to the model•Discussing the optoelectronic technology alternatives

•Fiber•Waveguide•Polymer applique•Etc



Next steps:

Run multiple copper sensitivities.Materials, via qty. and types,Layers counts, etc.

Develop connector data baseCost, type, use

Add signal conditioning, bus chip-sets, ASICsMay need resource assistance

Determine the copper / opto architectures to be modeledfor high performance

Difficult because it is often proprietary information



Splice Improvement Project

Leader: Peter Arrowsmith

Sub-groups

Measurement: Rob Suurmann, Celestica

Standards: Eric Mies, Vytran

Larry Wesson, Aurora


Splice Improvement Project

• Started mid-2002, initially 9 companies approved PPA

• Active participants: Aurora, Celestica, Nortel Networks, Sanmina-SCI, Sumitomo Electric, Vytran

• Weekly conference calls

• Physical mtgs: NFOEC/Sanmina 10/02, iPhotonics 1/03, OFC 2004

• Technical papers at OMI 4/03, APEX 2004

• Presentations: NEMI Council, IEC Montreal mtg 10/03

• Deliverables are low loss measurement standards for identical &dissimilar fiber splicing

• Project is basis for assessing accuracy of splicer loss estimators,improving splice yield, relative to loss budget target...


Improved Fiber Splicing Project

• Project Objective (from Statement of Work):– To develop and promote industry-wide test methods and

splice quality criteria that will allow for systematicinvestigation of variability, comparison of equipment,improved yield and lower costs

• Project Benefits:– Promote the use of common metrics and measurement

methods– Identify the sources of loss measurement variation for

future improvement– Submit methods and guidelines for incorporation into OE

standards, e.g. IPC-STD-0040


• Measured vs Estimated Loss

• Low loss splicing for module assembly requires more accurate loss estimation

• Active splicing is used to ensure accuracy, but requires optical I/O access

• What are the failure modes for the outliers?

• Can the estimation be improved (software/hardware)?

Figure showsMeasured vsEstimated insertionloss for SMF-SMFsplices on different‘PAS’ style splicers

False rejects: impact yield, False rejects: impact yield, unnecessary reworkunnecessary rework

False accepts:False accepts:system test failsystem test fail

Drivers: Why Loss Test Measurement?


Current Status of Project and Synopsis

1. Standards review. Request to IEC to 80% completedistribute IEC 61073-3/1073-3 to group

2. SMF-SMF gage R&R comparison of member’s Completesplice loss test methods

3. Correlation of estimated vs. measured loss 80% complete4. Loss estimator accuracy metrics, confidence limits 50% complete

5. Statistical comparison of actual loss distributions 50% completebased on 1000 splice data sets,

6. SMF-EDF splice loss repeatability, BFA method Complete

7. SMF-EDF splice round robin (directionality) Complete

8. Standards organization collaboration In-progress

9. Verify loss test methods for dissimilar fiber splices In-progress

10. Draft splice loss standard Planned


SMF-EDF Splice Round Robin Results

Directionality: (EDF>SMF) - (SMF>EDF)

-0.20

-0.15

-0.10

-0.05

0.00

0.05

A1

A3

A5

B1

B3

B5

C1

C3

C5

D1

D3

D5

Splice Sample

Dir

ecti

on

al D

elta

(d

B)

B-1

B-2

B-3 NS

B-4 NS

Round-robin directional datafor SMF-EDF splices at 1310nm (using BFA site-to-sitemethod). A to D are fibercombinations and B-1 to B-4are user test setups.The largest in directionality isfound for user set-ups B-3 &B-4, both without anintegrating sphere.


SMF-EDF Splice Loss -- Key Findings

• Light emitted from the EDF has a larger cone (NA) cf. SMF-28

• The integrating sphere collects a fraction of all the emitted light,independent of angle

• In the absence of the IS some of the light emitted at higher angles maynot be coupled onto the detector, or be detected as efficiently

• Hence highest loss occurs when EDF is coupled to the detector

• Directionality is an artifact of the measurement set-up

• Users need to be aware of the issue and take corrective action

• For example, measure the EDFÆSMF direction, measure both

directions and average, and/or use an IS

• Even with a directional system, the sum (average) of the two directionsgives the same/“correct” value for the splice loss (verified w/site-to-site)


Planned & Possible Follow-on Activities

• Verify test methods for dissimilar fiber splices, SMF28-X (X = EDF,LEAF, high NA)… currently in-progress

– BFA/single cut-back, add-on, inserted section methods

• Write project report

• Project completion 1Q ‘04

• Form follow-on project (with IPC/TIA/IEC) to develop lossmeasurement standards

– low loss SMF-SMF splicing and dissimilar fiber splices

• Splicer estimator accuracy metric, based on confidence limits

– Splice SMF at limits of MFD, core concentricity, eccentricity andbatch-to-batch variation, depending on interest

• Low loss standard “splice” for accuracy assessment, with NIST



OE Standards OrganizationLiaison


NEMI & StandardsNEMI & Standards

• NEMI is not a formal standards body.

• However, many NEMI deployment projects canbenefit from adoption of open industrystandards.

• Our strategy then is to collaborate with otherindustry groups as required to develop theappropriate standards that will accelerateadoption of technology and business practices.

• This collaboration is driven by specific needsof NEMI projects and Technology IntegrationGroups (TIGs).


Existing Cooperation on StandardsExisting Cooperation on Standards

• NEMI has worked with the following groups todevelop and deploy standards:

– EIA/JEDEC (typically on Semiconductor Packaging)

– IEEE (machine interface software)

– IPC (Printed Wiring Board fabrication & assembly,data exchange)

– RosettaNet (data exchange)

• Typically we enter into a written agreement withorganizations that spells out:

– Roles & Responsibilities

– Recognition for standards developed

– Ongoing support/updating


8. Standards Organization Liaison

IEC SC 84A fibers, SC 86B (Bruce LeFevre) fiber optic interconnectingdevices and passive components– WG1 (Al Cherin): fibers and and associated measuring methods

– WG4 (Ton Bolhaar): stnd. test and measurement methods for f-ointerconnecting devices & passive components

– WG6 (Philip Longhurst): stnds and specs for f-o interconnecting devices

– WG7 (Andre Girard): fiber optic passive components

TIA SC FO-4 (Chair, Steve Swanson) fiber optic components/sub-systems– FO 4.2/4.4 test and measurement methods

– FO 4.3 (Tom Ball, Matt Brown): interconnecting devices and relatedcomponents

– FO 4.8 (Andre Girard): passive f-o devices

– TIA has proposed NEMI representation on U.S. TAG

IPC STD 0040 “OE Assembly & Packaging Technology”, relevantsections


Standards Identified in IPC 0040Standards Identified in IPC 0040

• Highest priority, based on participant feedback

• Each has 2-3 sub-standards to address the differentOE levels– 303: Handling of photonic components and fiber optic cable

– 318: Methods for OE component attachment and alignment

– 315: Attachment materials for OE assembly

– 309: Quality assurance of OE components and assemblies

– 313: Material requirements for optical interconnecting substrates

– 311: Moisture absorption precautions for OE packages

– 312: OE thermo-mechanical engineering requirements

• In progress at NEMI– 310: Cleaning and cleanliness/contamination testing

– 302: Fiber splicing and test



OE Technology Roadmap GapAnalysis


TIG PlanTIG Plan

The NEMI 2002 OE Roadmap identified four key areas

that need to be addressed:

Proposed priority for next 2 years: member inputNEMI member interest predominantly in ITC sectors(other photonics orgs deal with displays, lighting, etc)

Pkg Level Device Tech Integration Automation Standards0: Device1: Component X X X2: Module/PCA X X X3: System X X4: Network

X = most relevant to NEMI members


Device TechnologyDevice Technology

Roadmap Gaps– Passive alignment and self-aligning devices/components to

support pick & place module assembly

– Continued development in areas that promise lower cost opticalcomponents such as tunable lasers, VCSELs, SOAs andsemiconductor switch products

– A system wide view of thermal management to reduce powerconsumption and the cost of keeping optical components withinoperating ranges. Development of more stable optical materialsand designs, use of heat pipes and other methods to removeheat, more efficient cooler technology

– More advanced development of photonic crystal or othertechnologies that promise to put photonics on a size reductionroadmap comparable to electronics.


Device TechnologyDevice Technology

Discussion– May be of limited ability for current NEMI industry members to

impact/leverage. Intel, Sumitomo/Excelight

– Work through other orgs & Universities, e.g. OIDA

– OIDA PTAP program supports getting leading-edge devices intoUniversities for evaluation & testing

– Nanotech/MEMS, photonic bandgap crystals, and other emergingtechnologies need to be watched


IntegrationIntegration

Definition– Combine several functions in a single optical component to

reduce costs and improve performance

– Reducing number of optical interfaces improves reliability

– Passive alignment assembly, use of stops, standoffs, V-grooves

Examples– Lensed fiber end

– CD/DVD read-write head (combines source, lens, mirror,polarizer, detector)

– Planar lightwave circuit (PLC), eliminate first level packagestructure

– Si optical bench, waferboard

– Wafer level VCSEL lens fabrication

– Multichannel VCSEL & detector arrays



Gaps– Technologies must be developed that support effective hybrid

integration of components into lower cost, smaller, higherfunctioning subsystems

– Development in ‘optical solders’ and board level wave-guides toenable more complex and higher density

– Common platform for both optical, OE & electronic devices

– Pick & place compatible, passive alignment hybrid devices

– Low loss, small radii 90° bends & waveguide-device coupling

– Platform for fiber-free assembly, e.g. waveguide based, withpassive fiber coupling, e.g. V-groove

– More intelligent network management to take advantage oftransport capability and services and to improve networkutilization (system/network level)



Discussion– Hybrid OE integration is realistic, monolithic has even more

challenges

– Some interesting passive alignment approaches coming out ofstart-ups, e.g.

• Avanti, “lego” building block assembly, ball & V-groove

• Xponent, surface mount photonics, transverse mode coupling

– Propose program to get innovative modules & packages intoindustry for evaluation & qualification (like a PTAP)

– Need for lifetime/reliability prediction

– Need for COO modeling

– NEMI member preference for evolutionary vs. revolutionary


AutomationAutomation

Gaps– Improved subcomponents and materials that lead toward

automation will be key to supporting the higher volumes expectedat the edge of the network. This includes self aligning structuresand structures that can be assembled without concern regardingchanging alignment. Also certified materials that are recognizedand expected to meet specific reliability and performancerequirements for various market segments/applications so thatrisk and costs are reduced.

– Assembly processes and equipment that support integratingelectronics and optics into single packages

– Improved fiber management or elimination of fiber to allow forconventional electronic processes for modules/board level

– Design tools that support specific manufacturing processes andalso support integration of analysis to speed products to marketand reduce development costs.


AutomationAutomation

Discussion– Current OE volumes too low to justify development of new/ high

capex equipment

– Lasky argues world-wide OE component capacity can be met byapprox. 20 machines, based on SMT-like throughput

– Lack of standardized processes & packages major challenge,drives complexity/cost

– Move to LCGs further inhibits demand for automation

– First need to address DFM (e.g. passive alignment), yields andstandardization

– Emphasis on using existing equipment/platforms, SMT, dieattach, wirebonders, encap...


StandardsStandards

Gaps– Packaging represents one of the highest costs of current O/E

components and also represents a major cost to using thesecomponents in higher assemblies. New packaging standards must bedeveloped to address changes in reliability, scope and usability

– Reliability standards are well established for the telecommunicationsbackbone networks. New standards should be established for otherapplications including datacom and premise applications

– Interoperability standards need to be established to allow for the mixingand matching of hardware to achieve more competition and betterproduction scales. Engineered links that guarantee optical performanceend to end to interoperable standards would also significantly reduce theCAPEX and OPEX costs to service providers

– Testing needs to be standardized so lower cost test equipment can bedeveloped for use in both manufacturing and in the field

– Improved transport standards to support data protocols.

– List prioritized standards identified in IPC Std 0040


StandardsStandards

Discussion– Need for assembly & test standards across all levels, impacts all

NEMI members

– Distinguish between de-facto industry standards, like MSAs,which can be achieved quickly (lead technology development),vs. Standard Organizations that can take years (lag)

– NEMI has strong liaison with IPC, and recent links to TIA and IEC

– Telcordia (Bellcore) reliability stnds well entrenched for telecom.

– IPC has identified 23 areas for standardization in Std 0040

– We would be doing well if we developed & verified some keydraft standards and submitted them to IPC/TIA/IEC

– Need for lifetime/reliability requirements, particularly for datacomand last mile applications



Future OE TIG Projects


Future OE TIG ProjectsFuture OE TIG Projects

The NEMI Optoelectronics TIG plans to start 2-3 new projects in 2004.

Proposed projects are drawn from:

• Follow-on projects from the current OE TIG activities

• Prioritized gap analysis of the OE section of the 2002 Roadmap

• Priority areas for standardization, identified in IPC OE packaging andassembly document STD 0400

Project list is preliminary and we seek member input on prioritizing

the list, input on scope/content, and suggestions for other projects.

Timetable for discussion of the OE projects is:

• NEMI member conference calls, early Dec 2003 and/or Jan 2004

• Open workshops at APEX 2004 (Anaheim, CA) and OFC (Los Angeles),February 21-27

• Final project selection, by 1Q04

• Project forming 2Q04



Continuing & follow-on projects:• Optical backplane emulator cost-performance model.

(continuing) Leader: Jack Fisher

• Optical connector cleaning standard (with IPC) (in-progress)

• Optical connector contamination acceptance standard. (Inpartnership with IEC/TIA & IPC) Leader: Tatiana Berdinskikh

• Possible project on optical receptacle inspection & cleaning,and/or parallel optical connectors (MTP..)

• Low loss measurement standard for product fiber splicing. (Inpartnership with TIA & IPC) Leader: TBD

• Splicer loss estimator comparison and accuracy metric.Leader TBD


Splicer Loss Estimator vs. Measured Loss

• Measured vs Estimated Loss• Low loss splicing for module assembly requires more accurate loss estimation

• Active splicing is used to ensure accuracy, but requires optical I/O access

• What are the failure modes for the outliers?

• Can the estimation be improved (software/hardware)?

Figure showsMeasured vsEstimated insertionloss for SMF-SMFsplices on different‘PAS’ style splicers

False rejects: impact yield, False rejects: impact yield, unnecessary reworkunnecessary rework

False accepts:False accepts:system test failsystem test fail



NEMI OE Roadmap gap analysis projects:• Reliability requirements for datacom/last mile/FTTH, lifetime

prediction

• OE packaging standards for reduced cost, e.g. hermeticity“sufficient”

• Pb-free compatibility for level-2 OE module, attach & rework,e.g. selective solder

IPC STD 0040 projects:• Handling of photonics components and fiber (separate

activities for Levels 1 & 2)

• OE component attachment and alignment (Levels 1, 2 & 3)

• Attachment materials of OE assembly (Levels 1 & 2)

• Test and reliability requirements for OE Components andAssembly (Levels 0, 1 & 2)


Future OE Roadmap Gap ProjectFuture OE Roadmap Gap Project

Reliability datacom requirements for access/lastmile/FTTC• Datacom reliability standards less developed than telecom,

cf. Telcordia GRs

• Need to understand applications & environments, e.g. insidevs. down conduit/outside cabinet (Telcordia)

• Perform reliability testing of test vehicles/products

• Identify critical failure modes, failure mechanisms

• Develop predictive models

• Verify models

• Draft improved/new industry standards, “Telcordia-lite”



OE packaging standards for reduced cost• Compliment to reliability requirements project

• Identify high cost components/processes

• Develop cost model to perform sensitivity analyses

• Potl cost savings, e.g. hermetic packaging may be over-killfor some environments

• Package reliability sufficient for application

• Evaluate alternative packaging, e.g. LCP boxes, thermalsealing, polymer adhesive bonding



Pb-free compatibility for level-2 OE module, attach &

rework• OE module and fiber pig-tails, max temperature <85 °C

• Previous project on second level solder attach of opticalmodules (lack of industry interest)

• Developed cost model, showed cost savings of automatedselective solder vs. manual soldering.

Strong dependency on volume & labor rate

• SFP transceiver modules are plugable, metal housing is nottemp sensitive (mass reflow)

• Interest in extending to Pb-free (SAC) wave/reflow >217 °C

• Qualify equipment/processes

• Look at impact on module attach yield, defects, reliability...


OE TIG Update: SummaryOE TIG Update: Summary

• Optoelectronic assembly will continue to be a keyskill for OEM & EMS members

• Connector & fiber interconnect technologies will becontinue to be used

• “New” technologies will be adopted, e.g. optical-electrical integration, embedded organic waveguides

• Lack of standardization is key inhibitor

• 2004 OE Roadmap in-progress, additional supportwelcome!

• Looking for input on OE project selection

• Identify interested participants

• Group defines the project... detailed statement ofwork, project participation agreement


www.nemi.orgwww.nemi.orgEmail contacts:Email contacts:

David David GodlewskiGodlewski

daviddavid..godlewskigodlewski@@neminemi.org.org

Jim McElroyJim [email protected]@nemi.org

Bob PfahlBob Pfahl

[email protected]@nemi.org

Documents

Peter Arrowsmith 2-26-2004thor.inemi.org/webdownload/newsroom/Presentations/Opto_TIG_AP… · –Optical module to PCB solder attach (level-2): completed cost model ... –Learn the