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From Technologies to Market
Eric Mounier
Thibault Buisson
IRT Nanoelec, Grenoble, 21 mars 2016
© 2016
Photonics & 3D, Convergence Towards a New Market Segment
2
CONTENT
•Silicon Photonics value proposition
•Why 3D brings value for photonics
•An industry on the rise
3
DATA CENTER TRAFFIC WILL TRIPLE FROM 2014 TO 2019
25% CAGR 2014-2019
Most of the flow will beWITHIN data center:
73% in
2019.
©2016 | www.yole.fr | IRT Nanoelec
Source Cisco Index 2014
0
2
4
6
8
10
12
2014 2015 2016 2017 2018 2019
Zettabytes per Year(source Cisco Index)
4
INTERNET CONTENT AND APPLICATION PROVIDERS’ INVESTMENTS
$9.7B
Asian-Pacific
$2.0B
The Middle East
and Africa$4.6B
Latin America
$10.9B
North
America
$12.8B
Europe
• In 2014, around $143B was
invested worldwide in new data centerprojects (future technologies, R&D).
• Content and application providers alone
invest $40B annually to networks,
facilities, and equipment.
• 60 new large data centers are
expected in Western Europe by 2020.
2014 Investment for Facilities & Equipment
1/3 of the global investments made in this market.
©2016 | www.yole.fr | IRT Nanoelec
5
WHERE ARE THE TECHNICAL CHALLENGES?
• For the next generation of data centers three main technical aspects are targeted:
• Storage capacity
• Power consumption (always on)
• Data flow
• On the storage side, higher density capacity/less latency are sought.
• Related to power consumption, more efficient systems are needed.
• For the data flow, faster data transmission and higher bandwidth are required.
Equipment manufacturers are continuously working on technical breakthroughs
Data CenterStorage
Capacity
Power
Consumption Data Flow
Technical
Breakthroughs
IT equipmentPower
equipment
Cooling
systems
©2016 | www.yole.fr | IRT Nanoelec
6
WHERE ARE THE TECHNICAL CHALLENGES?
Equipment manufacturers are continuously working on technical breakthroughs
Data CenterStorage
Capacity
Power
Consumption Data Flow
Technical
Breakthroughs
IT equipmentPower
equipment
Cooling
systems
©2016 | www.yole.fr | IRT Nanoelec
• For the next generation of data centers three main technical aspects are targeted:
• Storage capacity
• Power consumption
• Data flow
• On the storage side, higher density capacity/less latency are sought.
• Related to power consumption, more efficient systems are needed.
• For the data flow, faster data transmission and higher bandwidth are required.
Optical links are a solution at
these challenges while
reducing costs!
7
SILICON PHOTONICS
Today’s status & roadmap
Yole forecasts Si Photonics to start being used in data centers by 2020+
• Back in 2006, VOA was the first Si photonics products on the market.
• Today still few Si photonics products are on the market.
• In the near term (~2020+), Si photonics chips will be deployed in high-speed signal transmission systems, which far exceed the capabilities of copper cabling: HPCs, Data Centres, Medical applications.
• As Si photonics evolves and chips become more sophisticated, we expect to see the technology used more in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses.
Silicon Photonics will start being used
in data centers
2020+
2014
AOC products available
2006
VOA: the first Si photonics on the
market
2025+
Si photonics used for core interconnections
within processors
RoadmapSilicon Photonics on data centers
©2016 | www.yole.fr | IRT Nanoelec
Photons will get closer to the chips!
8
MORE TO COME
2006 2009/2010 2015
©2016 | www.yole.fr | IRT Nanoelec
9
WE NEED INTEGRATION
©2016 | www.yole.fr | IRT Nanoelec
Divided by 2
Divided by 2
Small form factor pluggable
transceiver is essential part for
100G deployments different
flavors for 100G transceivers!
Front panel bandwidth is today the
most important metrics how many
ports can you aggregate?
Decreasing form factor Increasing
front panel density.
32x100 Gbps 3.2Tbps (1.28Tbps for 40G)
10
WE NEED INTEGRATION
©2016 | www.yole.fr | IRT Nanoelec
Divided by 2
Divided by 2
Small form factor pluggable
transceiver is essential part for
100G deployments the different
flavors for 100G transceivers!
Front panel bandwidth is today the
most important metrics how many
ports can you aggregate?
Decreasing form factor Increasing
front panel density.
80%
Compared to IC, fiber pig tailing makes
a big difference.
11
WE NEED INTEGRATION: 3D IS A SOLUTION
©2016 | www.yole.fr | IRT Nanoelec
Small form factor pluggable
transceiver is essential part for
100G deployments the different
flavors for 100G transceivers!
Decreasing form factor Increasing
front panel density.
• 3DICs drivers have not changed over the years:
• Increased performance & functionality
• Reduce power consumption
• Reduce form factor
• Reduce cost
12
WE NEED INTEGRATION: 3D IS A SOLUTION
©2016 | www.yole.fr | IRT Nanoelec
Divided by 2
Divided by 2
Small form factor pluggable
transceiver is essential part for
100G deployments the different
flavors for 100G transceivers!
Front panel bandwidth is today the
most important metrics how many
ports can you aggregate?
Decreasing form factor Increasing
front panel density.
• 3DICs drivers have not changed over the years:
• Increased performance & functionality
• Reduce power consumption
• Reduce form factor
• Reduce cost
• They correspond to what Si Photonics is looking for:
• more bandwidth for HPC & data centres interconnects
• less mW/Gbps power consumption
• denser integration with 3D stacks (µbumps, 2.5D, TSV)
• leverage of CMOS process ($1/Gbps target)
13©2016 | www.yole.fr | IRT Nanoelec
NOT YET THE IC SUPPLY CHAIN …
Suppliers
Chip firms Optical inter-
connects firms Servers
Social network
& eBusiness
providersWafers
Manufacturing
equipment
Materials &
supplies
De
sign
Wafe
r fa
b
Wafe
r p
rob
e (
optica
l &
ele
ctri
cal)
Ass
em
bly
v
End-users are driving the R&D for optical data centers.
Still few IP provider,
packaging services providers.
Like the IC in the 90s.
14
STILL FEW PRODUCTS BUT A COMPETITIVE LANDSCAPE
Si Photonics Activity
Business model
Pro
duct
Man
ufa
cturi
ng
R&
D/ D
eve
lopm
ent
Sta
ge
R&D/MPW Devices / modulesFoundriesFabless Systems End-usersDesign
Acquired by
OSATs
15
CONCLUSIONS
©2016 | www.yole.fr | IRT Nanoelec
• Silicon Photonics is the answer to interconnects bottlenecks in HPC, data centers but is also a promising platform for other applications such as medical, lidar.
• Packaging is still a major hurdle, 3D developments from the IC world can help.
• The photonics supply chain is still setting up, for ex. opportunities will arise for OSATs.
