PlasmaPro NGP80 Brochure

8/7/2019 PlasmaPro NGP80 Brochure

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Next Generation Plasma SystemsCompact open-loading tool or plasma etch and deposition

Plasma Pro TM NGP 80 Range


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Plasma Pro NGP 80 range

Plasma Pro NGP 80

Plasma Pro NGP 80 o ers versatile plasma etchand deposition solutions on one plat orm withconvenient open loading. This compact, small-

ootprint system is easy to site and easy to use,

with no compromise on process quality.The Plasma Pro NGP 80 is ideally suited to R&D or small-scale production, and can process

rom the smallest wa er pieces to 200mm wa ers. The open load design allows ast wa er

loading and unloading, ideal or research, prototyping and low-volume production.

Wide range o applications

III-V etch processes Silicon Bosch and cryo-etch processes

Diamond Like Carbon (DLC) deposition

SiO2 and quartz etch Failure analysis dry etch de-processing using the specially-con gured

Plasma Pro NGP FA tools, with RIE, dual-mode RIE/PE and ICP processes

ranging rom packaged chip and die etch through to ull 200mm

wa er etch

High quality PECVD o silicon nitride and silicon dioxide orphotonics, dielectric layers, passivation and many other uses

Hard mask deposition and etch or high brightness LED production

Deep Si eature etch by ICP-RIE cryo process

Failure analysis - ast metal layer exposure in the Plasma ProNGP FA ICP

Multiple process technologies

RIE o InP waveguide

7 m polyimide eature RIE

Sub m Si mesa etch


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The electrostatic shield design in the Plasma Pro NGP 80 ICP con guration avoids

energetic ion bombardment and capacitive coupling, providing low

substrate damage, with long li e or the ICP tube and reduced maintenance.

Optimised showerhead design delivers high per ormance PECVD

processes with excellent deposition uni ormity.

Plasma Pro NGP 80Process technology con iguration options

Plasma Pro NGP 80

Plasma Pro NGP 80 RIEProven dry etch technology used

success ully throughout the industry

on a wide range o applications.

Plasma Pro NGP 80 ICPHigh density plasma or high rate

etching. Independent control o ion

energy allows low damage, highly

selective processing to be achieved.

Plasma Pro NGP 80 PECVDDesigned to produce high quality

uni orm dielectric lms. Stress control is

provided by selectable or mixed high/

low requency plasma power, enabling

deposited lms to be tuned or tensile,

compressive or low stress.

Plasma Pro NGP 80 RIE/PECombines anisotropy o RIE with

selectivity o PE mode etching

in a single system.The 240mm electrode

accommodates wa ers up to200mm in size or all system

confgurations


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Easy open access

The pneumatic hoist mechanism is designed to allow clear access to the lower electrodeand smooth chamber opening with minimal particle generation.

Bene its o Plasma Pro NGP 80 range

High per ormance processes

Plasma Pro NGP 80 optimised electrode cooling results in excellent process control,

wa er temperature uni ormity and great fexibility, covering a wide range o processes.

Enhanced process uni ormity and rates are guaranteed by using ahigh-conductance radial (axially symmetric) pumping con guration

The addition o 50ms datalogging o the capacitor values o ers traceability andhistory o chamber and process conditions

A close-coupled turbo pump provides high pumping speed and excellent base pressure

The Plasma Pro NGP 80 is the tool o choice or open load, plasmaetch and deposition, with high per ormance processes using optimisedelectrode cooling, excellent substrate temperature control, andadvanced Auto Matching Unit (AMU) allowing easy set up.

Plasma Pro NGP 80


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System control and diagnostics

Process Control Etchend point detection

Excellent etch control and rate determination

can be provided by optional end-point detection,

integrated with PC4000 TM process tool so tware.

Laser end-point detection usinginter erometry to measure etch depth in

transparent materials on refective sur aces

( or example, oxides on Si), or refectometry

or non-transparent materials (such as

metals) to determine layer boundaries

Optical emission spectrometry (OES) orlarge sample or batch process end-pointing

by detecting changes in etch by-products

or depletion o reactive gas species, and or

chamber clean end-pointing

Reliability and diagnostics

Fault and tool status diagnostics is

achieved through the ront end so tware.

The system provides in ormation about the

status o key components, leading to rapid

and detailed ault identi cation.

Easy access to the main componentsor maintenance through quickly

removable panels

Extended uptime via rapid componentchange and ease o chamber cleaning

Gas Control System

A modular upgrade path or gas lines enables users to maximise

the fexibility o the Plasma Pro NGP80 system. The remote gas

line by-pass acility allows broad unctionality & ease o use.

The gas pod o ers maximum process fexibility. The designenables the easy addition o urther gas lines, up to 12

The gas pod may be sited remotely in a service area, and isvented and ready or ducting into an extraction system or

ull sa ety compliance

Optional purge acility

Plasma Pro NGP 80


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Process tool so tware

Plasma Pro NGP 80 includes a new and improved user inter ace

based on tried and tested so tware. Ox ord Instruments so tware

is renowned or its clarity and ease o use, making it quick to

train process operators while retaining ull unctionality or ab

managers and service sta .

The ront end visual inter ace, which controls and monitors theprocess tool, is con gured exactly or the customers system

Process recipes are written, stored and recalled through thesame so tware, building a library

Password controlled user login allows di erent levels o useraccess and tasks, rom one-button run operation to ull

system unctions

Continuous system data logging (50ms) ensures e ectivetraceability o each wa er and process run Fully GEM/SECS compatible

Cost o ownership and customer support

We work with our customers to create the right system,

process, and support package to meet your speci c

requirements, so our range o Service Level Agreements (SLA)

will be tailored to your needs. This can include:

Guaranteed response times or support engineer visits andtechnical hotline calls

Choice o support coverage up to 24/7 Scheduled preventative maintenance calls Managed spares inventory options, including customer

dedicated stock, via our parts locations worldwide

Pre erential spare part pricing

Process training Certi ed maintenance training courses or customersown engineers in preventative maintenance

and rst level troubleshooting

So tware control and system support

Superiorenvironmentale fciency

Plasma Pro NGP 80 hasa low heat load and high

energy e ciency. The tools

e cient ergonomics and

compliance to Semi S2 make

this a tool o choice or both

research and small-scale

production users.

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Worldwide Service and Support

Ox ord Instruments is committed to supporting our customers success. We recognise that

this requires world class products complemented by world class support. Our global service

orce is backed by regional o ces, o ering rapid support wherever you are in the world.

We can provide:

Tailored service agreements to meet your needs Comprehensive range o structured training courses Immediate access to genuine spare parts and accessories

System upgrades and re urbishments

visit www.ox ord-instruments.com or more in ormation

This publication is the copyright o Ox ord Instruments plc and provides outline in ormation only, which (unless agreed by the company inwriting) may not be used, applied or reproduced or any purpose or orm part o any order or contract or regarded as the representationrelating to the products or services concerned. Ox ord Instruments policy is one o continued improvement. The company reserves theright to alter, without notice the speci cation, design or conditions o supply o any product or service. Ox ord Instruments acknowledgesall trademarks and registrations. Ox ord Instruments plc, 2010. All rights reserved. Re :OIPT/NGP80/2010/01

n Plasma Etch & Deposition n Atomic Layer Deposition n Ion Beam Etch & Deposition n Nanoscale Growth Systems n HVPE

Technical speci ications

Ox ord InstrumentsPlasma Technology

For more in ormation please email:[email protected]

UKYattonTel: +44 (0) 1934 837000

GermanyWiesbadenTel: +49 (0) 6122 937 161

JapanTokyoTel: +81 3 5245 3261

PR ChinaBeijingTel: +86 10 6518 8160/1/2

ShanghaiTel: +86 21 6132 9688

SingaporeTel: +65 6337 6848

US, Canada & Latin AmericaConcord, MA

TOLLFREE: +1 800 447 4717

www.ox ord-instruments.com

Overall dimensions o the Plasma Pro NGP 80

Wheels are removable and or transportation purposes only. Dimensions in mm.

Documents

PlasmaPro NGP80 Brochure