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PHOSPHATIZlN6 PROCESS U.S. Patent 6,168,674. Jan. 2, 2001 H. Gehmecker et al., assignors to Dynamit Nobel, Troisdorf, Germany
A process of phosphatizing metal surfaces comprising contact ing the iron or steel with an aqueous acid phosphatizing solution con- taining 0.4 to 2.0 g/L Zn; 7 to 25 g/L P205; 0.005 to 0.5 g/L peroxide as H202; 0.01 to 10 g/L formate; and added nitrite, and r insing with water, which has been ad- justed with mineral acid to a pH of 3.6 to 5.0.
IELEClrlIOCNIEMICAL II~EATMIENT OF ELONGATE Al i l lCLES U.S. Patent 6,168,691. Jan. 2, 2001 R. Kauper et al., assignors to Atotech Deutschland GmbH, Germany
A device for the electrochemical t r e a t m e n t of e longate ar t icles comprising a container for con- taining a t rea tment liquid, with at least one electrode having a hollow chamber with a longitudi- nal axis and a periphery parallel to the axis into which hollow chamber the article may be in- serted; and at least one screening mask, which is arranged axially displaceable within the hollow chamber.
PLATING APPARATUS U.S. Patent 6,168,693. Jan. 2, 2001 C.E. Uzoh and G.R. Landry, assignors to International Business Machines Corp., Armonk, N.Y.
An electroplating system compris- ing at least one plating tank con-
taining a plating solution, at least one anode arranged in the plating tank; at least one cathode includ- ing at least one workpiece portion in contact with the substrate in- cluding a thief portion; a power supply; and a controller.
SPbm w,.RIMG APPARATUS U.S. Patent 6,168,696. Jan. 2, 2001 R.D. Burton et al., assignors to Micron Technology Inc., Boise, Idaho
An inductively coupled ionized sputtering apparatus.
VACUUM COATIIN6 APPARATUS U.S. Patent 6,168,698. Jan. 2, 2001 J. Szczyrbowski et al., assignors to Balzers und Leybold Deutschland Holding AG, Hanau, Germany
An apparatus for coating a sub- s t r a t e compr i s ing a v a c u u m
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To address the many new and potential application developments, this Fourth Edition presents an entire- ly new collection of contributions on a wide range of cutting-edge topics from electrodeposition of semi- conductors to environmental considerations. Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to- date explanations of the principles and applications of highly relevant deposition techniques.
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September 2001 109