Collaboration meeting CERN - CSEM 1

Pressure Tests Results

13/03/2013

Collaboration meeting CERN - CSEM 2

Summary of Wafers….

13/03/2013

Micro-fabrication process at CSEM. 5 wafers produced from a 380 µm Si wafer etched with 190 µm deep channels and closed by Si-Si bonding with a cover wafer.

- Wafer # 3 -> (through holes)- Wafer # 5- Wafer # 7- Wafer # 8- Wafer # 9

186 µm

194 µm

th

- dicing and grinding of the cover wafer to the wanted thickness (th)- testing at CERN

Bonding details see CSEM

Collaboration meeting CERN - CSEM 3

Structures on Each Wafer:

13/03/2013

B (µm)

50

100

200

500

PRESSURE TEST STRUCTURESATLAS

FRAME 4 - NA62

D = 210 µm

5.4 mm

50 µm

2.85 mm

B

21 mm

13 m

m

45 m

m

19 mm

CSEM

83.8 mm

10 m

m

CSEM

In each wafer there are:- 2 samples ATLAS- 2 samples FRAME 4 – NA62- 8 structures «pressure test» (4 different channel dimensions)

Done for CO2 circulation, with restrictions and pillars

Collaboration meeting CERN - CSEM 4

Testing Procedure:

13/03/2013

ATLASCSEM

FRAME 4 - NA62CSEM

- Gluing a piece of silicon for the ATLAS and FRAME4 samples on the inlet hole to test the outlet manifold (weakest point)

- Manual water pump used to apply the pressure- Clamp connector to hold the samples- DAQ system in Labview to save data- Eye alignment of the hole and the connector

Collaboration meeting CERN - CSEM 5

Tested Samples:

13/03/2013

th th th th th th

Wafer # 3 25 19 bar (broken) 25 78 bar 25 90 bar 25 155 bar (broken) 145 102 bar 100 87 bar

15 9 bar 25 78 bar 25 145 bar (broken) 25 145 95 bar 100 123 bar

Wafer # 5 25 23 bar 25 75 bar (broken) 25 180 bar (broken) 25 145 92 bar 100 (broken)

25 18 bar 25 (broken) 25 185 bar (broken) 25 186 > 250 bar 100 145 bar (broken)

Wafer # 7 25 31 bar 25 175 bar 25 240 bar 25 > 320 bar 100 (broken) 100 94 bar (broken)

25 26 bar 25 190 bar 25 (broken) 25 > 310 bar 190 fluidic test 190 fluidic test

Wafer # 8 25 31 bar 25 122 bar 25 280 bar (broken) 25 200 bar (broken) 100 66 bar 100 (broken)

25 34 bar 25 190 bar 25 300 bar 25 > 300 bar 190 fluidic test 190 fluidic test

Wafer # 9 25 10.5 bar 25 40 bar 25 71 bar 25 65 bar

25 (broken) 25 38 bar 25 86 bar 25 120 bar

FRAME 4Pressure test Channel 500 Pressure test Channel 200 Pressure test Channel 100 Pressure test Channel 50 ATLAS

- ‘## bar’ = good explosion of the channel

- ‘## bar (broken)’ = sample broken in many pieces once reached the ## pressure

- ‘(broken)’ = sample broken before testing

- ‘ > ## bar ‘ = reached a pressure of ## bar without failure samples still available

- ‘fluidic test’ = samples avalaible for testing on going...

Collaboration meeting CERN - CSEM 6

Pictures:

13/03/2013

Wafer # 9: debonding area (channel of 50, 65 bar) Wafer # 3: explosion of outlet manifold (FRAME4, 100 µm, 123 bar)

Wafer # 8: explosion of outlet manifold (ATLAS, 100 µm, 66 bar)Wafer # 7: explosion of channel (channel of 200, 175 bar)

Collaboration meeting CERN - CSEM 7

Test with 2mm Pyrex

13/03/2013

2 mm

70 µm

th

A (µm) B (µm)

20 50

50 100

50 200

50 500

Pressure test structures with 70 µm channels etched in a Silicon wafer anodically bonded to a 2 mm Pyrex. The silicon has been then grinded to different thickness (th).

D = 200 µm

5 mm

A

5 mm

B

20 mm

10 m

m

Samples produced by CERN at CMi

Collaboration meeting CERN - CSEM 8

Test with Pyrex 2 mm, Results

13/03/2013

thickness Channel 500 thickness Channel 200 thickness Channel 100 thickness Channel 50200 30 - 20 < 20 < 20

4347 / 1 208 > 250 4347 / 2 207 > 250 4347 / 3 202 > 250 4347 / 4 241 > 250 4347 / 5 198.1 205 > 250 4347 / 6 194.1 205 > 250 > 250 4347 / 7 197.7 202

avg 210rms 12.82853961

thickness Channel 500 thickness Channel 200 thickness Channel 100 thickness Channel 50100 30 - 20 < 20 < 20

4345 / 1 1854345 / 2 1804345 / 3 172 > 250 > 250 4345 / 4 98.1 165 > 250 4345 / 5 101 1624345 / 6 162 > 250 4345 / 7 134 > 250 > 250

avg 165.7142857rms 15.35033072

thickness Channel 500 thickness Channel 200 thickness Channel 100 thickness Channel 5050 30 - 20 < 20 < 20

4334 / 1 1324334 / 2 160 > 250 > 250 4334 / 3 150 > 250 4334 / 4 2004334 / 5 158 > 250 4334 / 6 157 > 250 > 250 4334 / 7 160

avg 159.5714286rms 18.88201822

Collaboration meeting CERN - CSEM 9

Test with Si-Si Samples with Channels

13/03/2013

Very big outlet manifold (large unbonded area)

Narrow manifold No manifold, just channels

Long restrictions at the inlet

200 µm wide channels

P1 P2 P3 P4

165 µm

70 µm

165 µm

Samples production outsourced

Collaboration meeting CERN - CSEM 10

Test with Si-Si Samples, Results

13/03/2013

116 78 bar 115 114 113

126 76 bar 125 124 123

136 135 134 133 bar (broken) 133 HOLD 258

146 Ti-Au 145 144 221 bar 143 175 bar (broken)

128 138 121 131

216 77 bar 215 214 222 bar 213

226 225 224 240 bar 223

236 Ti_au 235 234 233

246 245 72 bar 244 243

228 238 221 231

316 77 bar 315 314 313 74 bar (broken)

326 325 324 323 84 bar (broken)

336 335 334 333 HOLD 303

346 345 344 182 bar 343 HOLD 250

328 338 321 208 bar 331

416 (broken) 415 77 bar 414 231 bar 413

426 425 424 241 bar 423

436 435 434 433

446 445 444 443

428 438 421 431 153 bar (broken)

516 250 bar 515 228 bar 514 HOLD 270 513

526 281 bar 525 278 bar 524 HOLD 270 523

536 535 534 Ti_au 533

546 545 544 Ti_au 543 Ti_au

528 538 521 531 Ti_au

P1 P2 P3 P4

P1_516

P1_116

P3_144P3_144

Hydrophobic bonding!!

P3_214

P2_515

Hydrophilic bonding unbonded areas!

Collaboration meeting CERN - CSEM 11

Future tests

13/03/2013

- More pressure test with 2 mm Pyrex

- Fluidic test on-going

- SEM images and measures of the real thickness of samples

- Numerical simulations with COMSOL on-going

- …