Based on IPC 1720A

Manufacturer Name Location (plant) Address Date

CEI Limited Batam, Indonesia

Product Types Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters

Construction Rigid Printed Board � Flex Printed Board � Rigid/Flex Board � Rigid Backplane � Molded Product �MCM - Ceramic

Printed Board� MCM - Laminated �

MCM - Deposited

Dielectric�

Assembly Type Single Sided PTH � Single Sided SMT �Single Sided

PTH/SMT�

Single Sided FTP/

BGA� Double Sided SMT �

Double Sided

PTH/SMT�

Double Sided PTH /

SMT / BGA, COB,

TAB

�

Board Size Diagonal - mm (in) <250 (<10") � 250 (10") � 350 (14") � 450 (17.5") � 550 (21.5") � 650 (25.5") � 750 (29.5") � 850 (33.5") �

Maximum PTH Work Area <300cm2

(46 in2 ) � 300cm

2 (46 in

2 ) � 600cm

2 (93 in

2 ) � 1000cm

2(155 in

2) � 1500cm

2(232 in

2) � 2100cm

2 (325 in

2) � 2800cm

2 (434 in

2) � 3600cm

2(434 in

2) � >3600cm

2(434 in

2) �

Maximum SMT Work Area <300cm2

(46 in2 ) � 300cm

2 (46 in

2 ) � 600cm

2 (93 in

2 ) � 1000cm

2(155 in

2) � 1500cm

2(232 in

2) � 2100cm

2 (325 in

2) � 2800cm

2 (434 in

2) � 3600cm

2(434 in

2) � >3600cm

2(434 in

2) �

Processes & Complexity Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters

Thru Hole Insertion Two Leaded Axial � Two leaded Radial �Multiple lead <6

radial�

Single in-line

packages�

Dual in-line packages

<24 PION�

Dual in-line packages

>24 PION� Pin Grid Arrays � Component Sockets �

Card Edge/ piece

connectors�

SMT PlacementChip resistors / Cap

(reel)�

Bulk chip

resistors/Cap� Tantalum capacitor �

Metal faced

components� Sm. Outline diodes �

Sm. Outline

transistors� Sm. Outline IC's �

Variable resistor trim

pots�

SMT sockets /Test

pts. Connect�

Lead Free Process Capability

(RoHS)Not available � RoHS compliant �

lead processing

available�

High Pin countChip on tape (molded

Ring) >0.4 mm pitch�

Chip on tape (Molded

Ring) <0.3mmpitch�

Quad Flat Pack

(QFP) >0.4 mm pitch�

Quad Flat Pack

(QFP) <0.3mmpitch�

Shrink Quad Flat

Pack (SQFP)�

Thin Small Oputline

Package (TSOP)�

Ball/Post Grid Array

>1mm pitch�

Ball/Post Grid Array

<1mm pitch� Land Grid Array �

Component Placement Ability

(Case Size)01005 � 0201 � 0402 � 0603 � 0805 � 1206 � >1206 � <3mm � >3mm �

Attachment Techniques Hand Soldering � Hot Bar soldering �Focused Hot Air

soldering� Wave Soldering � IR Reflow Soldering �

Vapor Phase

Soldering�

Hot Air Convestion

Soldering� Laser Soldering �

Conductive adhesive

attachment�

Attachment TechniquesBall Solder for High

voltage� � � � � � � � �

Cleaning No Clean/Never

Clean system�

Aqueous cleaning in-

line system�

Aqueous Cleaning

Static Soak�

Modified Solvent

Clean - In-line�

Ultrasonic Agitation

cleaning�

Semi Aqueous

cleaning�

Cleaning and Cleanlilness testing None �Ionic Salt Residue

Test�

Organic contaminant

HPLC Test (High

Pressure Liquid

Chromatography

�Surface Insulation

Resistance (SIR)

Test

� Other � Other: �

Cleaning Chemistry None � Saponifier � Trepene � Alcohol � Other Solvent �

Water Quality PCA Cleaning None � Tap Water � D.I. Water � Reverse Osmosis � Carbon � Filter �Resistivity :

Megohms//Normal�

Resistivity:

Megohms/Minimum�

Coating and Encapsulation Bare Die - Glob top �Bare De - Total

assembly�

Assembly (1 or 2

sides) Epoxy coating�

Assembly (1 or 2

sides) Polyurethane

coating

�Assembly (1 or 2

sides) Acrylic coating�

Assembly (1 or 2

sides) Vacuum Dep.

coating

�Encapsulation

erxterior access

(Test)

�Encapsulation

erxterior access

(Tuning)

�Encapsulation Entire

Assembly (Thin Coat)�

Inspection In-coming � In-process � Final inspection � 100% inspection � Audit inspoection � Manual � Semi-automatic � Automatic � Other: �

AOI Post Paste � Pre-placement � Post placement � Post Reflow �

Testing and RepairTest Equipment

Design�

Test Equipment

Fabrication� Test Development � Failure analysis � Repair Depot � Rework Depot � Other

Factory Type Batch Production � Cell Based � Kanban � Dedicated Lines �

Electrical Test Equipment Parameters Parameters Parameters � Parameters Parameters Parameters Parameters Parameters Parameters

Test TypeAutomatic Test

Generation�

X-Ray Joint

evaluation� Cleanliness Testing �

Auto In-Circuit

Electronic Assembly�

Electo-magnetic

Interference (EMI)�

Auto Function

Electronic Assembly�

System Level Test

Electrical�

System Level Test -

Functional�

System Level Test -

Environmental�

Test Fixture Type No Fixture �One sided Probe

Generic Electrical�

Clam Shell Test -

Generic Electrical�

Custom Fixture

Electrical�

Dedicated Test Bed

Electrical� Humidity Test � Temperature Test � Vibration Tes � Shock Test �

Probe Point Pitch - mm (in) >1.0mm (0.40) � 1.0 (0.040) � 0.8 (0.032) � 0.65 (0.025) � 0.50 (0.020) � 0.40 (0.016) � 0.30 (0.012) � 0.20 (0.008) � <0.2 (0.008) �

No. of Probe Points <200 � 200 � 500 � 1000 � 1500 � 2000 � 2500 � 3000 � >3000 �

No. of Test Vectors <500 � 500 � 1000 � 2000 � 3000 � 4000 � 5000 � 6000 � >6000 �

Special Equipment X-Ray � AOI �Ionic Extraction

Tester�

Surface Insultaion

Resistance (SIR)

Tester

�Resistivity/

Conductivity Meter� Other: �

Environmental Stress Screening Burn-in Temperature �Burn-in with

Temperature Cycling�

Burn-in - High

Temperature Cycles�

Burn-in ,

Temperature Cycles -

Hi Humidity

� Power Cycling on-off � Vibrations Testing � Shock Test � Salt Spray Testing � Other: ESS �

Product Volume Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters

Volume of Assemblies per month Prototype � Low (Under 100) �Low -Medium (100-

1000)�

Medium (1000-

10000)�

Medium High (10,000

- 20,000)� High (20,000-50,000) � Very High (50,000+) �

Capacity Analysis <50% � 50% � 60% � 70% � 80% � 90% � 100% �

Inventory Turns (Sales/Inventory) <1 � 2-4 � 5-8 � 9-12 12+

Percentage of capacitySingle Sided

_70____%

Double Sided

_30____%

Size of a production lot in boards Minimum _20____ Normal _250____

Number of Boards per Month Low ____50K___ Medium ___80K__ � High ___100K__

Average Lead time (days) Low Vol _60_daysMedium Vol

60_days � High Vol ___days

Quick Turn _10 to

20__days�

Changeover Tine <5 Minutes � 5-10 Minutes � 10-30 Minutes � 30 minutes - 1 hour � 1 hour - 2 hour � >2 hours �

Quality Development Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters Parameters

SPC Implementation Plan exists � Training Started �

Process Data

Collected analyzed,

CAR process in

place

� All employees trained �Several Major

processes stable�

Continued

improvement of

Stable processes

�All processes under

control�

Inspection Method - Incoming Lot rejection � MIL STD 105D � 100% Inspection �

Supplier programs/controlsSupplier rating

program�

Monthly analysis

program�

Key problems

identified�

Supplier performance

reviews�

Approvals & Certifications ISO - 9003 � ISO - 9002 � ISO-9001 � ISO-9001:2000 � ISO 14001 � AS9100 � J-STD-001 � MIL-PRF-31032 � MIL-STD-275 �

Approvals & Certifications (Cont) ISO 13485/8 � TS 16949 � � EEC � CSA � QS9000 � Customer Eval � UL Products � �

Approvals & Certifications (Cont) IPC-A-610, Class I � IPC-A-610, Class II � IPC-A-610, Class III � ISO - 13485/8 � TUV � CE � VDA � TS-16949 � UL508A �

Full FA report will be provided to customer after each FA.

Printed Circuit Board Assembly Capabilities

2, Ang Mo Kio Ave 12, S'pore 569707

We also provide DFM, DFT and DFS, (design for Manufacturing, test and sourceability) for all new products when customer engage us to review the their PCB layout and advice Bill of Material. Input will be given to attain highest manufacturability, Testability and optimum Bill of

Material cost.

The DFM, DFT and DFS are also done during FA for any mature products transfer.

hengty@cei.com.sgHeng Teck Yow 64811882 Ext 305

Contact Name Contact Phone Contact email