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Printed Electronics (PE): Tools for the Trade
Vince Cahill, VCE Solutions
Printing United, October 25, 10:00 AM
Agenda: PE Tools of the Trade
• Comparison of Conventional & Printed Electronics printing methods
• PE Applications & Examples : Force Sensing Resistor (FSR), Chipless& Chipped RFID Tags, Heaters, OPV
• Conductive Ink & Print Materials
• Key Players, Market & Technology Trends & Conclusions
Photolithographic vs Printed Electronics
Source: http://www.dic-global.com/en/csr/special/archive/2014/special05.html
Source: wikimedia.org/wikipedia/commons; citing:
Heiko Kempa - Institute of Print and Media Technology, Chemnitz University of Technology
PE: Printing Methods
Analog:
• Screen Printing
• Flexography
• Gravure
• Pad Printing
• Lithography
• Hot Stamping
• Hot Foil with Printed Adhesive
• Etching
• Nanoimprint lithography (NIL)
• Evaporation printing
• Embossing
Digital:
• Ink Jet
• Thermal Transfer
• Aerosol Jet
Comparison of Print Electronics Methods
Print Method Deposit Thickness
µm
Conductive
Material
Throughput Range
m/min
Finest Resolution
µm
Screen Print 3-30 Ag, Au, Cu, Ni, Pt 0.6-100 ~30 µm
Flexography 0.17-8 Ag, Cu, Ni, Pt 5-180 20 µm
Gravure 0.02-12 Ag, Cu, Ni, Pt 200 ~10 µm
Hot Stamp Al: 0.26, Cu: 0.35 Cu, Al, Ag 1-20 ~20 µm
Inkjet 0.01-0.5 Low visc. Ag, Au, Cu 0.02-5 ~15 µm
Thermal Transfer Al: 0.26, Cu: 0.35 Cu, Al, Ag 0.7-10 ~21 µm
Aerosol Jet >10 µm Ag, Pt, Pd, and Cu
& Polymerics
~50 m/sec (head
speed)
~10 µm
Screen Print Electronics
• Screen printing can produce a range of thin to thick layers precisely
• It prints paste-like materials including conductive, resistive, di-electric & organic layers.
• It can apply paste materials to create conductors dielectrics, capacitors, resistors, coils, antennas, diodes, transistors, electroluminescence devices, and bio sensors as embedded components in the multilayer circuits.
Image source: https://chromaline.com/printed-electronics/
Inkjet for Printed Electronics
• Inkjet printhead systems range from very fine low viscosity drop generators to large drop producers with viscosity up to 1000 cp, ranging from fine 1-3 pl from PIJ Fujifilm Samba heads to MicroFab’s Solder Jet® heads.
• Inkjet systems, such as the Kateeva YIELDjet® are beginning to print OLEDs successful, opening the door to growth for production inkjet of OLED. See also DuPont’s soluble system.
Fujifilm Dimatix DMP 2850
Kateeva YIELDjet® FLEX
MicroFab Solder Jet® on jetlab®
platform
Aerosol Jet
• Aerosol Jet Flex – Fine Feature Interconnects
• Aerosol Jet 5X – 3D Printed Electronics
• Aerosol Jet HD – High Density Printed Electronics
• Aerosol Jet Print Engine – High Volume Production
Applications: Printed Antennas, Semiconductor Packaging, IoT, Displays, Silicon Solar Cells
• + 1-500+ cp viscosity possible
• Inks in addition to Ag, Pt, Pd, and Cu, include diluted thick film pastes, thermosetting polymers, eg. UV-curable epoxies, & solvent-based polymers, eg. polyimide & polyurethane.
• Optomec also makes LENS systems using a high power laser (400W to 3kW) to fuse powdered metals into fully dense three-dimensional structures.
Aerosol Jet 5X
See also: https://www.optomec.com/wp-content/uploads/2018/05/Webinar_AJ-Printing-Flexible-Circuits_Redacted_3APRIL2014.pdf
Ink Jet vs.
Optomec’sAerosol Jet
Source: https://www.researchgate.net/
Digital: Thermal Transfer
• Raster-based (not vector)• Ribbon construction• Back coat, Carrier, Top Coat(s)• Receiver • Paper, film, fabric, etc.• Thermal printhead
• Line of individually addressable heating elements
• Mechanism• Ink softens / melts• Ink sticks to receiver• Ink separates from carrier• Laser process can sharpen edge
Source: Dene H. Taylor, PhD, President, SPF-Inc & Dan Harrison, PhD,
Exec. VP, IIMAK
• Volume Resistivity............................ 3.00 μΩ∙cm
• Power Capacity................................ 2.50W
• Maximum Current Density............... 410 A/mm2
• Bend Test (ASTM F2750-09) \ % increase in resistivity
• after 100 Bends – Compression...... 0.65%
• after 100 Bends – Extension........... 0.50%
• Cross – Hatch Adhesion Test (ASTM F1842-09)....... 5
• Environmental Aging Test (ASTM F1996-06)
38ºC, 95%RH, 10 Days............. Pass
• Drying Time................ Immediate
• Sintering.................... Not Required
• Thickness.................... Al: 0.26 μm, Cu: 0.35 μmSource: SPF Inc. & IIMAK
Printed Metal Properties (based on OEM data)
Lines & gaps = 0.02”; 3-layer
• Printed Circuit Boards (PCB), Integrated Circuits (IC), Multilayered
• RFID & RAIN RFID Chipped & Chip-less & NFC Near Field Communication & RFID pressure & proximity sensors
• Anti-theft protection
• Force Sensing Resistors
• Electronic Logic & Memory
• Flexible Displays, & Touchscreens
• Electrophoretic, Electrochromic, Electroluminescent Displays
• Membrane Switch & Keypads
• E-Textiles
• Coils & Sensors
• In Mold Electronics (IME)
• Thin Film Transistors (active)
• Capacitors & Resistors (passive)
• Glucose Test Strips
• Batteries & Electronic Skin Patches
• OLED for Screens & Lighting
• Low Voltage Heaters
• Smart Labels
• PV/OPV Solar Cells: Perovskite,Thin Film
• Cellphone, toy & smart appliance parts
Applications for Printed Electronics
PragmatIC’s Planar Nano Transistor
• PragmatIC of Cambridge, UK developed a
very low cost flexible integrated circuits
(FlexICs) that are thinner than a human
hair & embeddable into everyday
objects.
• Its FlexLogIC® fab-in-a-box system is a
fraction of the cost of silicon based ICs
• It supports functionality including RFID
and NFC.
• It enables smart packaging, smart labels
and smart objects that can engage with
consumers and their environments.
• FlexLogIC greatly reduces capital & production costs & cycle time. It provides a highly scalable distribution model.
Image Source: www.electronicsweekly.com/news/research-news/materials-rd/greetings-card-gets-plastic-electronics-2011-07/Source: https://www.pragmatic.tech/technology
PE App: Force Sensing Resistor (FSR)
• A Force Sensing Resistor FSR is a variable resistor, constructed of several thin flexible layers, that varies in resistance as pressure is applied and released.
• An FSR’s measures the force then relays that information via output electronics. All FSRs use high-resistance, carbon-based inks which, along with other design factors, can be re-formulated to alter the functionality.
Image source: https://www.elprocus.com/force-sensing-resistor-technology/
Grenoble INP – Valence LCIS: Chip-less RFID
• Etienne Perret, Arnaud Vena, Small Tedjini & team
• Using Inkjet & Thermal Transfer to create RFID antennas
• “Chipless RFID based on RF Encoding Particle”
• Significant cost advantage over UHF RFID with IC chip
• Chipless RFID use RF energy to communicate data, but don't store a serial number in a silicon microchip in the transponder.
For latest chipless developments see:
https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6695767/
Image source: www.researchgate.net
Comparison of Classical RFID, Chipless RFID, & Barcode
RFID UHF Chipless RFID Barcode
Reliability Very Good Good Very Good
Multiread Possible Difficult Impossible
Read Range 10 m 50 cm 50 cm
Discretion Sight Non-line-of-sight Non-line-of-sight Line-of-sight
Cost $0.4 $0.004 <$0.0001
Rewritable Possible Possible Impossible
Sensor Possible Possible Impossible
Gesture Recognition Impossible Possible Impossible
Source: https://doi.org/10.1155/2018/7484265
The world
market CAGR for
Chipless RFID
through 2023 is
projected at
>27%, reaching
over $2 billion in
value by 2023
ILO - Cremieu, France
• Kohler distributed PE heating film demister-heater for bathroom mirrors
• PE heater for rear view auto mirrors
• Heated exam table covers
• PE heater films for buildings, trains, autos, ships,medical, agriculture, & industry
• Uses primarily screen, also thermal transfer
Images Source: ILO
Printable Conductive Inks
• Silver (Ag) nano-particles & precursors inks offer highest conductivity, oxidation resistance but high cost
• Copper (Cu) offers conductivity but requires photonic annealing and is subject without a topcoat to oxidation
• Conductive polymers offer modest conductivity for a low cost, but are limited for chemical and thermal stability
• Graphene & carbon nanotube ink for inkjet and gravure electronic printing offer stability & conductivity with thermal annealing
• Other metal-based inks include Indium Tin Oxide (ITO), nickel (Ni), gold (Au) and platinum (Pt)-based
Source: www.sigmaaldrich.com/technical-documents/articles/technology-spotlights/graphene-inks-for-printed-electronics.html
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The Market for Conductive Inks
• The current market for electronic and conductive inks is estimated at about $2 billion (US) in annual sales.
• Printed Electronics Now estimates that by 2022, the market will reach more than $2.5 billion.
• Grand View Research predicts the market to reach $4.37 billion by 2024.
Source: http://www.printedelectronicink.com/
PE Substrates
• Paper
• Fabrics
• Glass
• Metal
• Polycarbonate (PC)
• Polyethylene Terephthalate (PET)
• Polyethylene Naphthalene (PEN)
• Polyarylethersulfone (PES)
• Polyethylene (PE)
• Polyamideimide (PAI)
• Polyimide (PI)
Key PE Supplier Players
• Samsung
• LG
• Palo Alto Research Center (PARC)
• Agfa-Gevaert
• Molex
• Nissha USA
• Dupont
• BASF
• Novacentrix,
• E Ink Holdings
• Soligie Inc.
• Thinfilm Electronics
• Sharp (FOXXCON)
• PragmatIC
• Heliatek
• Blue Spark
• PolyIC
• Kovio
• IIMAK
• Creative Materials Inc.
• Genesink
Source: IDTechEx
Other Market Projections for PE
• MarketersMedia projects that the global Printed Electronics Market will grow from $6.24 billion in 2018 to $11.50 billion by 2023, at a CAGR of 13.0%.
• According to a MarketsandMarkets’ report* the printed electronics market is estimated to reach $13.6 billion by 2023 from $6.8 billion in 2018 in 2018, at a CAGR of 14.92% during 2018–2023.
• Consumer electronics, healthcare, automotive, aerospace and defense, retail and consumer goods
• Automotive industry is the largest contributor in the printed electronics market with use cases, such as sensors, lighting panels, and displays. Autonomous vehicles
* Printed Electronics Market by Material (Inks and Substrates), Technology (Inkjet, Screen, Gravure, and Flexographic), Device (Sensors, Displays, Batteries,
RFID tags, Lighting solutions/panels, and PV Cells), Industry, and Geography-Global Forecast to 2023
The Path for Cost Effective PE
Quantity
IC cost
Millions
$100+
Computers Smart objects
Trillions
~1¢
Billions
$1–10
Smart devices
>>$10Bn opportunityfor PragmatIC
Source: PragmatIC
Where is PE Going?
• OPV: Windows become electric generators
• Pressure sensors control hand held tools
• Low voltage & thin form heaters for apparel etc.
• Robots with Electro Active Polymers for finger tip sensing
• Flexible & stretchable electronics point to products that fit users
• Printed Electronics built into In-mold cast & 3D built functional products
• Smart Packaging: RFID & NFC connects objects to inventory scanning, shopping cart scanning rapid check out, & theft prevention. ~ $0.01 tags
• PE smart textile for personal & medical health monitoring & diagnosis
• Lower cost solutions
• Hybrids for the best of both or more