Electroforming Mold U.S. Patent 5,632,878. May 27, 1997 M. Kitano, assignor to FET Engineering Inc., Bardstown, Ky.

A method of manufacturing a porous electroformed tool in which a metal de- posited layer is formed by deposit ing metal on a base by electroforming, char- acterized by using electroforming solu- tion comprising nickel sulfamate, in the range of 300 to 400 g/L, nickel chloride in the range of 5 to l0 g/L, and boric acid in the range of 30 to 40 g/L, to which is added a nonleveling agent consisting of benzene sulfonic acid or a carboxylic acid or nicotinic acid or methyl-pentynol in the range of 0.05 to 0.8 g/L in the process of deposit ing metal on the base to form a porous electroformed tool having about 70 holes of 10 to 20 lum per dm 2.

Chromium Plating Process U.S. Patent 5,632,880. May 27, 1997 M. Santini, Villingen-Schwenningen, Germany

A process for galvanic deposition of chro- mium coatings on a metallic base material

comprising cleaning the base material, ex- posing the cleaned base material to a chro- mium plating bath to form a hard chromium coating having a hardness of at least 600 HV with beaded surface structure, and galvani- cally applying a black chromium coating on the hard chromium coating to fill and smooth the beaded surface structure.

Electroplating a Nonconduct ive Substrate U.S. Patent 5,632,92,: May 27, 1997 D. Ferrier et aL, ass~nors to MacOermid Inc., Waterbu04, Conn.

A liquid disper:don for use in enhancing the electroplating of a nonconductive sur- face comprising carbon particles, which have been surface modified by being con- tacted with a dye, said carbon particles having an average diameter of less than 3.0 microns in the dispersion; a dispersant; and an aqueous liquid dispersion medium; wherein the concentration of the carbon particles in the liquid di:¢persion is less than 5% by weight.

Process for Producing a Circuit Board u.s. Patent 5,633,121. May 27, 1997 £ Namiki et al., assignors to Fujitsu Ltd., Kawasaki, Japan

A process for preparing a circuit board comprising coating a resist on a copper layer; patterning the resist; selectively etch- ing or plating the copper layer using the patterned resist as a mask to thereby form a copper circuit to be used as a part of a circuit board; measuring a degree of oxida- tion of the copper layer, said measuring being accomplished prior to coating the resist on the copper layer by irradiating a surface of the copper layer with an irradi- ation beam so that at least a portion of the irradiation beam is reflected from the sur- face as a reflected beam and evaluating a characteristic of the reflected beam as a measure of the degree of oxidation; and after an excessive degree of oxidation has been determined, either removing at least a portion of the oxidized copper or covering the oxidized copper with a copper cladding prior to the coating of the copper layer with the resist.

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112 METAL F IN ISHING • F E B R U A R Y 1998