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ProdigyElectronics
YourpartnerforQualitycomponents
www.prodigyelectronics.com
1
Topicsfortoday
ü AboutProdigyü ProdigyValue-addsupportü SupplyChainManagementü Technologiesü Manufacturinglocationsü QualitySystemCertificationsü Customersü Contact
www.prodigyelectronics.com 2
AboutProdigy
Founded2001Designandmanufacture
Ø customelectroniccomponent
LocationØ China-HongKong–India-USA
InhousedesigncenterØ HongKong-India
ManufacturinglocationsØ ChinaandTaiwan
www.prodigyelectronics.com 3
ProdigyValue-Addsupport
Concept
• Technologyidentification
• Designdirections
• Designplan
Design
• Designformanufacturingcheck
• Stack-upreview• Laminateselection
• Componentsselection
Production
• Prototype• QuickTurn
• Tooldevelopment
• Production• Planning• QualityManagement
• OntimeDelivery
www.prodigyelectronics.com 4
ü Workcloselywithyourinternaldesignandpurchaseteamsü Providesupportthroughyourentireproductdevelopmentcycle
Prodigy-SupplyChainManagement
PlanandForecasting
ProductionControl
DeliveryFCA/CIF/DDU
ManagedInventory(VMI)andWarehousing
www.prodigyelectronics.com 5
ProdigyPCBtechnologies
www.prodigyelectronics.com 6
RigidPCBItem Capability
LayerCount 1to40layers
BoardThickness 12milto315mil
Dimensions 36”x24”(max)
Material FR4Normal/Mid/High,ShengYi,ITEQ,Isola,Nelco
FinalCuThickness Outer12oz/Inner12oz(max)
LineWidth/Space 3mil/3mil
Drillingdiameter 0.15mmto6.35mm
AspectRatio 15:1
ControlledImpedance +/-10%(normal)+/-5%(advanced)
Surfacefinish OSP,HASL(Lead/lead-free)ENIG,ImmersionSilver,ImmersionTin,GoldFinger
www.prodigyelectronics.com
7
HDIPCBItem Capability
DrillingSize Laser0.075mm(min)
HDIAbility 4+N+4
DielectricThickness 0.05mmto0.15mm
Aspect 1.5:1
BottomPadsize(undermicro-via) [Holesize+0.15]mm
Topside–Padsize(onmicro-via) [Holesize+0.15]mm
Copperfilling Yes
ViainPaddesign Yes
Buriedholeresinplugged Yes
MinimumViasizecanbeCufilled 0.1mm
Maxstacktimes Anylayer
www.prodigyelectronics.com 8
HDIPCB-References
ProdigyPCB072015 www.prodigyelectronics.com 9
HighLayerCount
Blind/BuriedVia
BackDrill
FlexiblePCB-CapabilityItem Capability
LayerCount 8Layer(max)
BoardThickness 0.05(1L)0.12(2L)0.20(4L+)
Dimensions 1800mmX240mm
Material PI,PETincluding:Taiflex,DupontFR&AP,ShengYi,Doosan,Hanwha
LineWidth/Space 0.05mm(1/4Oz)0.055mm(1/3Oz)0.06mm(1/2Oz)
Drillingdiameter 0.15mm(min)
RigidFlexCapability Yes
AirGapCapability Yes
Surfacefinish OSP,ENIG,AUPlating(soft/hard)
ProdigyPCB072015 www.prodigyelectronics.com 10
FlexiblePCB-Reference
ProdigyPCB072015 www.prodigyelectronics.com 11
MetalCladPCB-CapabilityItem Capability
LayerCount 1to4layers
BoardThickness 0.6to3.0mm
Dimensions 18”x24”(max)
Material FR4(TG105-170)/EMCEM-MPCEM-MP/PolyTCB-2AL/NanyaNPRCA/HuaShan5052
Cuthickness-etched Outer2oz/Inner2oz(max)
LineWidth/Space 4mil/4mil
Drillingdiameter PCB0.15to6.35mm
AL0.50to6.35mm
DrillingTolerance PTH+/-3mil(min2mil)NPTH+/-2mil
Surfacefinish HASLOSPENIG
www.prodigyelectronics.com 12
MetalCladPCB-Applications
LEDLight
HighDensityPowerModule
AutomotiveHeadlight,Backlight,Brake,InCarLighting,TailGate
www.prodigyelectronics.com 13
QualityCertifications
• System– ISO9001:2015
• Product– UL– TUV
www.prodigyelectronics.com 14
Customers
• ThyssenKruppAG• MicrosoftInc• AT&T• FLEX• Sanmina• Octopus
www.prodigyelectronics.com 15
ContactusAmericast+19099737046 f+19146629637
Asia,EuropeandOceaniat+85223359916 f+85223351558
SouthEastAsiaandMiddleEastt+914443542102 f+914443542101Email [email protected] www.prodigyelectronics.com
082018 www.prodigyelectronics.com 16