Product Presentation

Updated: 30th May 2004

Outline

• Product overview• Fabry-Pérot (FP) laser products• Distributed Feedback (DFB) laser products• Future products• Conclusion

Laser Product overview

• Wavelengths• 808 nm• 920 nm• 1310 nm• 1490 nm• 1550 nm• Custom

• Types• Fabry-Pérot (FP)• DFB

• Packages• Bare die• Chip-on-submount• TO-CAN• TOSA• Coaxial

• Modulation• CW / Pulsed• 1.25 Gb/s• 2.5 Gb/s• 10 Gb/s

Modulight 1310 nm FP laser diode products for digital applications

Modulight 1310 nm FP laser products

• Laser product family for different needs and applications:• ML-C-1310-FP-10G laser chip

• 10 Gb/s FP laser chip for 10G transponder and transceviver manufacturers

• SONET OC-192 VSR (< 600 m)

• SDH STM VSR-64.1r, STM I-64.1r (< 600 m)

• OIF VSR-4, (< 600m)

• 10 Gb/s over FDDI-grade MM fiber (220-300 m)

Modulight 1310 nm FP laser products

• ML-C-1310-FP-2G5• Bare 2.5 Gb/s FP die for full packaging and

assembly lines• SONET OC-48 SR / SDH STM I-16

• 1.25 Gb/s Gigabit Ethernet

• 1.06 Gb/s / 2.125 Gb/s Fibre Channel

• ML-T-1310-FP-2G5-F/B-X• ML-C-1310-FP-2G5 laser chip in a TO-56

can for 2.5 Gb/s and 1.25 Gb/s TOSA and transceiver manufacturers

• Available with flat window and ball lens caps

• Please inquire custom caps

Modulight 1310 nm FP laser products

• ML-COAX-1310-FP-2G5-2• Reliable coaxial fiber pigtail module

with ML-C-1310-FP-2G5 chip• 2 mW output power• Selectable connector

• ML-W-1310-FP-2G5 1310 nm FP epiwafers

• 1310 nm FP epiwafers with Modulight’s high-performance design or with customer’s own design

Competitive advantages

• Narrow spectral linewidth enables longer transmission distances with high-speed operation

• Strong core material design with superior temperature behavior for uncooled applications

• Controlled beam characteristics for optimal coupling efficiency

• Controlled design and manufacturing process from epiwafer to TO-can level

• Reliable long-term chip supply• Custom features available with short lead time to

production

ML-C-1310-FP-10G –10 Gb/s FP

• Proven robust manufacturing process inherited from 2.5G product

• 10 mW kink-free output power up to 85°C

• Narrow linewidth (typ. RMS 1 nm, -20 dB noise floor) reduces chromatic dispersion

• High-speed operation also at elevated temperatures

• Alignment features for automated pattern recognition

• Superior characteristic temperature of >91K 25-85°C, >88K 15-95°C (cw)

ML-C-1310-FP-10G – high-temperature operation

10 mW kink-free single transverse mode cw power

5 serial resistance

Stable slope efficiency

Example data: 10 devices from different laser bars

ML-C-1310-FP-10G – good fiber coupling

Good beam shape for optimal coupling efficiency

Typical beam ellipticity ~1.4

Horizontal FWHM 24.33°

Vertical FWHM 34.42°

ML-C-1310-FP-10G – reliability

ML-C-1310-FP-10G – S21

ML-C-1310-FP-10G –narrow spectrum

Excellent linewidth in broad temperature range

ML-C-1310-FP-10G – eye pattern

Rise time 39.6 ps (20-80)

Fall time 46.7 ps (80-20)

Jitter pk-pk 19.11 ps

Jitter rms 3.31 ps

S/N 10.21

ER > 5 dB

(Modulight 10Gb/s die in customer 10 Gb/s TO-can, Ib = 40 mA, room temperature, filtered)

ML-C-1310-FP-10G – eye pattern

10.312 Gb/s Eye-Pattern [N=231-1], 10GBASE-R mask, 20% margin

(example data from customer sub-assembly, Iljin Corp.)

ML-C-1310-FP-2G5

• 1310 nm bare FP laser die for up to 2.5 Gb/s digital applications• For customers with own packaging and assembly lines

• Reliable AlGaInAs/InP epi structure with Modulight’s high-performance design

• 7 mW rated output power (to be upgraded)

• >2.5 Gb/s operation -40-85°C

• Low <5 serial resistance

• Automated testing in Modulight’s verification process at 25°C and 85°C• I-L curve (Ith, Iop, slope, kink power)• I-V curve (Vop, Rs)• Spectral measurement (Central wavelength,

RMS spectral width)• Beam shape (ThetaV, ThetaH)

ML-C-1310-FP-2G5

• Narrower (<1 nm) spectral width than for competing 1310 nm FP laser products Reduced

chromatic dispersion

Longer transmission distances than with conventional MLM lasers

Developed for mass production

• Modulight’s chip products developed to match customers’ automated process lines• Die-shear force typ. 390 g• Ball shear force typ. 48 g• Wire pull strength >6 g

• Metal reflection and dicing quality suitable for pattern recognition methods

• Good beam shape for optimal coupling efficiency• Typical beam ellipticity ~1.4

(32:23)

Unbeaten temperature performance

• Best 2.5 Gb/s 1310 nm high-temperature FP laser chip in the market

• Suitable for uncooled transmitters, transceivers and transponders

• Best high-temperature performance• Slope efficiency typ. 0.28

W/A@85 °C• Key to low cost through simple

packaging• Higher manufacturing and design

tolerances for customers

ML-T-1310-FP-2G5-F/B-X• Modulight’s high-performance 2.5 Gb/s nm

1310 nm FP chip in a TO-56 can• Available with flat window and ball lens caps• Ask for custom caps• Ball lens cap can with low beam divergence

(<10°)• Stable focal distance• 100% gross leak test for hermeticity• 300-700 µA monitor PD current• 0.30 W/A slope efficiency 25°C (cw, with ball

lens cap)• 0.22 W/A slope efficiency 85°C (cw, with ball

lens cap)

Customer interface – quality of service

• Fast customer response• Modulight’s committed technical and sales personnel in your

service for after-sales support

• Product-specific quality plans available for customer review• Describing QC/QA activities in Modulight’s production in

detail• Exact description of all verification and validation criteria

• Easy access to production and verification data through Modulight’s manufacturing database• Delivery of all verification data to customer in electrical

format• Full process traceability

ML-C-1310-FP-2G5 – reliability

ML-C-1310-FP-2G5 – threshold current

2nd derivative method

ML-C-1310-FP-2G5 – frequency response

ML-C-1310-FP-2G5 – 2.5 Gb/s eye pattern

2.488 Gb/s, Iop = 30 mA, ext ratio 9.24 dB. OC-48/STM-16 mask, 20% margin

(Modulight 2.5 Gb/s die in customer sub-assembly, Iljin Corp.)

ML-C-1310-FP-2G5 – for 1.25 Gb/s and 2.5 Gb/s

2.488 Gb/s, OC-48/STM-16 filter

(Modulight 2.5 Gb/s die in Customer’s SFP transceiver)

ML-C-1310-FP-2G5 –2.5 Gb/s eye pattern

ML-T-1310-FP-2G5-F-3

• 55 km Gigabit Ethernet transmission, 13.5 dB extinction ratio, Pout = -0.2 dBm

• 25 °C ambient temperature (Tc = 41°C)• λ=1310.08, λ = 0.88 nm• Modulight TO-can in Allied Telesyn (US) GigE transceiver sub-assembly

Modulated spectrumEye pattern after 55 km transmission

ML-T-1310-FP-2G5-F-3

• 40 km Gigabit Ethernet transmission, 9.9 dB extinction ratio, Pout = -0.8 dBm

• 70°C deg ambient temperature (Tc = 87.5°C)

• λ=1325.10, λ = 0.79 nm• Modulight TO-can in Allied Telesyn (US) GigE transceiver sub-assembly

Eye pattern after 40 km transmission Modulated spectrum

1310 nm FP epiwafers

• Use Modulight’s standard production design in your own device process

or• Base your own FP or DFB design on

Modulight’s proprietary active area design• Exploit Modulight’s processing services for

broad-area characterisation or device-level epiwafer qualification

Modulight 1310 nm DFB products

1310 nm DFB laser products

• Products for SONET OC-48, 1x/2x Fibre Channel and long-reach Gigabit Ethernet• ML-C-1310-DFB-2G5

• 300x300 µm bare die

• ML-T-1310-DFB-2G5• TO-56 can with flat window cap or aspherical lens cap

1310 nm DFB laser products

• Active area design platform inherited from Modulight’s mature 1310 nm FP products• Focus on full operating temperature range (0-

85°C), not just RT operation• Small slope saturation at elevated temperatures• Small beam ellipticity

• Cost-effective grating process• Typ 43 dB SMSR• Typ 0.07 nm FWHM (-20 dB noise floor)• Temperature shift 0.09 nm/K

ML-C-1310-DFB-2G5 – frequency response

ML-C-1310-DFB-2G5 – 4 Gb/s modulation test

• Data Rate 4 Gb/s.• PRBS: 231-1• Eye Diagrams @

temperatures of 0, 25, 50, 75, 85, 100°C andlink distances of 0km, 2km and 10km

• Temperature compensation not optimized.• RF filter between LDD and LD not optimized.

⇨ Some ringing occurs in eyes, can be eliminated by optimized filter circuit

• LD maintains SM operation with 40 dB SMSR at all evaluated operation conditions.

• Clear open eyes @ all evaluated operation conditions• 10 km transmission with 4 Gb/s @ 0 - 100°C

Link: 0 m; Temp.: 0°C

Link: 0 m; Temp.: 25°C

Link: 0 m; Temp.: 50°C

Link: 0 m; Temp.: 75°C

Link: 0 m; Temp.: 85°C

Link: 0 m; Temp.: 100°C

Link: 2 km; Temp.: 0°C

Link: 2 km; Temp.: 100°C

Link: 10 km; Temp.: 0°C

Link: 10 km; Temp.: 100°C

Future DFB products from Modulight

• 2.5 Gb/s 1550 nm DFB die & TO-can• Long reach applications

• 1490 nm DFB die & TO-can • PON

• 10 Gb/s directly modulated 1310 nm DFB die• Based on Modulight’s 10G 1310 nm FP design• For uncooled transceivers/transponders

Conclusion

• Robust and manufacturable laser products• Strong customer focused technical pre and

after sales• Key success factors

• Agility, Reliability, Customer Focus and Profitability

• Quality, environment and cost-effectiveness in mind

• Volume manufacturing capacity in own building