SST1171 Sonora CourtSunnyvale, CA 94086-5308Tel: (408) 735-9110 Fax: (408) 735-9036

www.superflash.comwww.sst.com

© 2007 Silicon Storage Technology, Inc. All rights reserved. Emosyn, the Emosyn Swirl design, Flashbank, Flashflex, G-Plus, NANDrive,Rania, Sciron, SST, the SST logo, SuperFlash, Swiftsim, Theseus, and UCM are registered trademarks and ATA-Disk chip, ComboMemory,CSF, FlashFlex, MPF, MTP, Pseudo NOR, PNOR, and SSF are trademarks of Silicon Storage Technology, Inc.

This product is patent protected by one or more U.S and/or foreign SST patents. A complete list of patents is located athttp://www.sst.com/technology/patents.xhtml. Other patents pending.

Specifications are subject to change without notice. Refer to http://www.sst.com for the most recent data sheet versions.

Memory sizes denote raw storage capacity; actual usable capacity may be less.

SST makes no warranty for the use of its products other than those expressly contained in the Standard Terms and Conditions of Salewhich are available from http://www.sst.com/products/terms.pdf.

404 04/07 Litho in U.S.A.

Headquartered in Sunnyvale, California, SST designs, manufactures and markets a diversified range of

memory and non-memory products for high volume applications in the digital consumer, networking, wire-

less communications and Internet computing markets. Leveraging its proprietary, patented SuperFlash

technology, SST is a leading provider of nonvolatile memory solutions with product families that include

various densities of high functionality flash memory components and flash mass storage products. The

Company also offers its SuperFlash technology for embedded applications through its broad network of

World-class manufacturing partners and technology licensees, including TSMC, which offers it under its

trademark Emb-FLASH. SST’s non-memory products include NAND Controllers, smart card ICs, flash

microcontrollers and radio frequency ICs and modules. Further information on SST can be found on the

company’s Web site atwww.sst.com.

D I G I T A L C O N S U M E R

W I R E L E S S C O MM U N I C A T I O N S

N E T W O R K I N G

I N T E R N E T C O M P U T I N G

2 0 0 7P R O D U C T S E L E C T I O N G U I D E

W W W . S U P E R F L A S H . C O M

T H I N K B E Y O N D F L A S H . . .

®

PARALLELFLASH MEMORIES

2

MPF ™ (Multi-Purpose Flash)39 Series

MPF+ (Multi-Purpose Flash Plus)39 Series

MTP products combine the electricalerasability of flash with the cost effec-tiveness of EPROM/OTPs. These devicestarget EPROM/OTP and the low-end flashmarket not requiring in-system programming. The MTPfamily includes two product series:

27 Series- 5.0V Read, 12.0V Program and Erase- Same packages and pin assignments as EPROM/OTP*

37 Series- 2.7-3.6V Read, 12.0V Program and Erase- Same packages and pin assignments as standard flash

*Note: SST27SF512 MTP follows flash memory pin assignments for 32-leadTSOP packages

MPF is a cost-effective flash memory addressingmainstream flash applications requiring in-systemprogramming. These products are offered in x8 orx16 organization with single 5.0V, 2.7-3.6V or 1.65-1.95Vpower-supply voltages. In addition to the standard Read accesstime of 70 ns, SST also offers high-speed, low-voltage MPF productswith Read access times of 45 and 55 ns. All 39 Series products useJEDEC standard packages, pin assignments, and command sets forease of use.

- 4 KByte Sector-Erase- Sector-by-sector Erase operations- Byte-by-byte Program operations

MPF+ includes all the features of MPF products,plus four additional features: Erase-Suspend/Erase-Resume, Boot Block, Security ID, andHardware Reset. Top Boot Block devices endin "2" (e.g. SST39VF3202). Bottom Boot Blockdevices end in "1" (e.g. SST39VF3201). x8 organization productscontain an "8" in the second to last digit (e.g. SST39VF1681).

PARALLELFLASH MEMORIES

1

27 and 37 Series MTP are used for applications such ascordless phones, VCD players, printers and fax machines,where code is frozen and in-system programming is notrequired. 39 Series MPF is used for all applicationsrequiring high performance features such as set-topboxes, PDAs, digital cameras and networking equipment.

MTP (Many-Time Programmable) Flash

MPF (Multi-Purpose Flash), x8

Device Product Density Voltage Access Packages(Program & Erase) Speed (ns)

SST27SF512 512 Kb (64Kx8) 5.0V Read/12V 70 PDIP-28, PLCC-32, TSOP-32 (8mmx14mm)

SST27SF010 1 Mb (128Kx8) 5.0V Read/12V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST27SF020 2 Mb (256Kx8) 5.0V Read/12V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST37VF512 512 Kb (64Kx8) 2.7V Read/12V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST37VF010 1 Mb (128Kx8) 2.7V Read/12V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST37VF020 2 Mb (256Kx8) 2.7V Read/12V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST37VF040 4 Mb (512Kx8) 2.7V Read/12V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

MPF (Multi-Purpose Flash), x16

MTP ™ (Many-Time Programmable)27 and 37 Series

Only SSTMicro-Packages offer you all these benefits:— 50% smaller than competition’s 6mm x 8mm BGA packages— Industry’s smallest 1.8V packages for 8 Mbit products— Thinnest standard flash package in the industry— Best total-cost solution for price-sensitive, fast-to-market

applications— JEDEC-approved packages

Device Product Density Voltage Access PackagesSpeed (ns)

SST39SF512 512 Kb (64Kx8) 4.5-5.5V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST39SF010A 1 Mb (128Kx8) 4.5-5.5V 45, 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST39SF020A 2 Mb (256Kx8) 4.5-5.5V 45, 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST39SF040 4 Mb (512Kx8) 4.5-5.5V 45, 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm)

SST39VF512 512 Kb (64Kx8) 2.7-3.6V 70 PLCC-32, TSOP-32 (8mmx14mm)

SST39VF010 1 Mb (128Kx8) 2.7-3.6V 70 PLCC-32, TSOP-32 (8mmx14mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF020 2 Mb (256Kx8) 2.7-3.6V 70 PLCC-32, TSOP-32 (8mmx14mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF040 4 Mb (512Kx8) 2.7-3.6V 70 PLCC-32, TSOP-32 (8mmx14mm)

SST39VF080 8 Mb (1Mx8) 2.7-3.6V 70 TSOP-40 (10mm x 20mm)

SST39LF512 512 Kb (64Kx8) 3.0-3.6V 45 PLCC-32, TSOP-32 (8mmx14mm)

SST39LF010 1 Mb (128Kx8) 3.0-3.6V 45 PLCC-32, TSOP-32 (8mmx14mm), TFBGA-48 (0.8mm pitch, 6mmx8mm),

WFBGA-34 (0.5mm pitch, 6mmx8mm)

SST39LF020 2 Mb (256Kx8) 3.0-3.6V 45 PLCC-32, TSOP-32 (8mmx14mm), TFBGA-48 (0.8mm pitch, 6mmx8mm),

WFBGA-34 (0.5mm pitch, 6mmx8mm)

SST39LF040 4 Mb (512Kx8) 3.0-3.6V 45 PLCC-32, TSOP-32 (8mmx14mm), TFBGA (0.8mm pitch, 6mmx8mm),

SST39LF080 8 Mb (1Mx8) 3.0-3.6V 55 TSOP-40 (10mm x 20mm)

MPF+ (Multi-Purpose Flash Plus), x16Device Product Density Voltage Access Packages

Speed (ns)

SST39VF1601 16 Mb (1Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF1602 16 Mb (1Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF1681 16 Mb (2Mx8) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF1682 16 Mb (2Mx8) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF3201 32 Mb (2Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF3202 32 Mb (2Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF6401B 64 Mb (4Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 8mmx10mm)

SST39VF6402B 64 Mb (4Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 8mmx10mm)

Device Product Density Voltage Access PackagesSpeed (ns)

SST39LF200A 2 Mb (128Kx16) 3.0-3.6V 45 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39LF400A 4 Mb (256Kx16) 3.0-3.6V 55 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mx8mm)

SST39LF800A 8 Mb (512Kx16) 3.0-3.6V 55 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

SST39VF200A 2 Mb (128Kx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

WFBGA (0.5mm pitch, 4mmx6mm),XFLGA (0.5mm pitch, 4mmx6mm)

SST39VF400A 4 Mb (256Kx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

WFBGA (0.5mm pitch, 4mmx6mm),XFLGA (0.5mm pitch, 4mmx6mm)

SST39VF800A 8 Mb (512Kx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (0.8mm pitch, 6mmx8mm)

WFBGA (0.5mm pitch, 4mmx6mm), XFLGA (0.5mm pitch, 4mmx6mm)

SST39WF400A 4 Mb (256Kx16) 1.65-1.95V 90 TFBGA-48 (0.8mm pitch, 6mmx8mm), WFBGA (0.5mm pitch, 4mmx6mm),XFLGA (0.5mm pitch, 4mmx6mm)

SST39WF800A 8 Mb (512Kx16) 1.65-1.95V 90 TFBGA-48 (0.8mm pitch, 6mmx8mm), WFBGA (0.5mm pitch, 5mmx6mm)

www.superflash.comSilicon Storage Technology, Inc.

Key Fea t u res

28 SERIESSST28VF040A products:- 256 Byte Sector-Erase- Sector-by-sector Erase operations- Byte-by-byte Program operations

29 SERIESSST29xF products:- 128 Byte Sector-Erase- Sector-by-sector Erase operations- Byte-by-byte Program operations

SST29xE products:- 128 Byte page size- Page-by-page Write operations- Page-Write operation includes an internal Erase transparentto the external system

SSF is a highly functionalmemory providing the flexibilityof programming single bytesand erasing small 128-Byte/256-Byte sectors. These products areoffered in x8 organization, at single 5.0Vor 2.7-3.6V power-supply voltages.

Concurrent SuperFlash (CSF) familyis a dual-bank flash memory devicedesigned for wireless communi-cation and consumer applications.The dual-bank architecture supportsthe Concurrent Read-While-Write operation where the user may read fromone bank while programming or erasing in the other bank.

Key Fea t u res

- Dual-Bank architecture for Concurrent Read-While-Write operations- Operating voltage:

2.7-3.6V for Read and Write operations- Hardware top or bottom sector protection- Flexible Erase capability:

2 KWord uniform Sector-Erase, 32 KWord Block-Erase orChip-Erase capability

- Factory and User Programmable Security ID- Erase-Suspend/Erase-Resume- User selectable x8/x16 Data Bus through a BYTE# pin- Hardware Write protection through WP# pin

Silicon Storage Technology, Inc. www.superflash.comPARALLELFLASH MEMORIES

PARALLELFLASH MEMORIES

43

SSF (Small-Sector Flash), Byte ProgrammableDevice Product Density Voltage Access Packages

(Program & Erase) Speed (ns)

SST28VF040A 4 Mb (512Kx8) 2.7-3.6V 200 PLCC-32, TSOP-32 (8mmx20mm)

SST29SF020 2 Mb (256Kx8) 4.5-5.5V 55 PLCC-32, TSOP-32 (8mmx14mm)

SST29SF040 4 Mb (512Kx8) 4.5-5.5V 55 PLCC-32, TSOP-32 (8mmx14mm)

SST29VF020 2 Mb (256Kx8) 2.7-3.6V 70 PLCC-32, TSOP-32 (8mmx14mm)

SST29VF040 4 Mb (512Kx8) 2.7-3.6V 70 PLCC-32, TSOP-32 (8mmx14mm)

SSF (Small-Sector Flash), Page ProgrammableDevice Product Density Voltage Access Packages

Speed (ns)

SST29EE512 512 Kb (64Kx8) 4.5-5.5V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx20mm)

SST29EE010 1 Mb (128Kx8) 4.5-5.5V 70 PDIP-32, PLCC-32, TSOP-32 (8mmx14mm, 8mmx20mm)

SST29VE010 1 Mb (128Kx8) 2.7-3.6V 200 PLCC-32, TSOP-32 (8mmx14mm, 8mmx20mm)

CSF (Concurrent SuperFlash), Byte ProgrammableDevice Product Density Voltage Access Packages

Speed (ns)SST36VF1601E 16 Mb (2Mx8 or 1Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (6mmx8mm)SST36VF1602E 16 Mb (2Mx8 or 1Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (6mmx8mm)SST36VF3203 32 Mb (4Mx8 or 2Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (6mmx8mm)SST36VF3204 32 Mb (4Mx8 or 2Mx16) 2.7-3.6V 70 TSOP-48 (12mmx20mm), TFBGA-48 (6mmx8mm)

CSF™ (Concurrent SuperFlash™)36 Series

Superior reliability of thick oxide-based SuperFlash cell technologyvs. thin oxide-based ordinary flash cell technology

SuperFlash = Superior Reliability Advancement of SuperFlash CellReduces Cell size by 40%

SuperFlash Ordinary Flash Self-Alignedfor < 0.25µ technologies

Non-Self-Alignedfor > 0.25µ technologies

28 and 29 Series SSF address applications requiring finedata granularity such as POS machines, DAB receivers,conditional access modules and power meters.

Among the many applications for 36 Series CSFare PDAs and cell phones.

SSF™ (Small-Sector Flash)28 and 29 Series

6

Serial Flash25 SeriesSerial Flash is a small, low-power flash memory that usesserial interface for sequentialdata access. Serial Flash usesfewer wires than parallel flashmemories to transfer data to andfrom a system. A reduction in board space, power consumptionand system cost are some of the benefits of the lower pin countinterface for Serial Flash. The 25 Series features a SerialPeripheral Interface (SPI) and pin-for-pin compatibility withindustry-standard SPI Serial EEPROM devices in densities from512 Kbit to 128 Mbit.

Silicon Storage Technology, Inc.

Key Features

- 6-signal synchronous LPC bus interface- Memory organization

- 4 KByte sectors- 16 KByte or 64 KByte overlay blocks

- Low Pin Count mode for in-system operationFirmware Hub (FWH) protocol, orLow Pin Count (LPC) protocol

- Two programmer modesParallel Programming (PP) mode for higher manufacturingthroughput, orAuto Address Increment (AAI) programming mode

- Security features- Hardware Write protection through WP# for entire chipand/or TBL# pins Top Boot Block

- Block locking registers to individually protect each overlay block- Enhanced 256 bit Security ID space (49LF0xxC only)- 12 KByte Protected Data Area (PDA) for EEPROM-likefunctionality (49LF004C/8C only)

- System expansion- 4 IDSEL pins allow for multi-chip selection- 5 GPI pins to extend system functions

LPC Serial Flash49 SeriesLPC Serial Flash is a high speed serialinterface product designed for systemcode and data storage in embeddedprocessor applications. The device’sLPC (Low Pin Count) interfaceoperates with 6 signal pins versus the28 pins of a parallel flash memory. Thisfrees up pins on the ASIC host controller resulting in lower ASIC costsand a reduction in overall system costs due to simplified signal routing.The SST49LFxxx devices are compliant with the Intel LPC InterfaceSpecification. The latest SST49LF0xxC devices are capable of a BurstRead (up to 128 bytes in a single operation) which enables a 15.6MB/sec data transfer.

www.superflash.comSERIALFLASH MEMORIES

SERIALFLASH MEMORIES

5

Key Features

- Serial Peripheral Interface (SPI)

- Up to 50 MHz maximum operating clock frequency

- Operating voltage:

- 2.7-3.6V or 3.0-3.6V for Read and Write operations

- Continuous Byte-wide Read operation with wrap-around feature

- Low power consumption:

- 7 mA (typical), Standby: 8 µA (typical)

- Flexible Erase capability:

- 4 KByte uniform Sector-Erase, 32 KByte and/or 64 KByte

Block-Erase or Chip-Erase capability

- Fast Erase time: Sector-Erase or Block-Erase: 18 ms (typical)

- Byte-Program: 14 µs (typical)

- Auto Address Increment (AAI) programming for fast production

manufacturing

- Hardware Write protection through WP# pin

LPC Serial Flash

Device Product Density Voltage Clock PackagesSpeed(MHz)

SST49LF004B 4 Mb (512Kx8) 3.0-3.6V 33 PLCC-32, TSOP-32 (8mmx14mm)

SST49LF040B 4 Mb (512Kx8) 3.0-3.6V 33 PLCC-32, TSOP-32 (8mmx14mm)

SST49LF004C 4 Mb (512Kx8) 3.0-3.6V 33 PLCC-32, TSOP-32 (8mmx14mm)

SST49LF008A 8 Mb (1024Kx8) 3.0-3.6V 33 PLCC-32, TSOP-40 (10mmx20mm)

SST49LF080A 8 Mb (1024Kx8) 3.0-3.6V 33 PLCC-32, TSOP-32 (8mmx14mm)

SST49LF008C 8 Mb (1024Kx8) 3.0-3.6V 33 PLCC-32, TSOP-32 (8mmx14mm)

SST49LF016C 16 Mb (2048Kx8) 3.0-3.6V 33 PLCC-32, TSOP-32 (8mmx14mm)

25 Series Serial Flash can be embedded in digitalcamcorders, LCD TVs, MP3 players and other smallconsumer portables.

49 Series LPC Serial Flash embeds BIOS and systemcode in several applications including LCD TV, DVD-RWdrives, PCs, set-top boxes, and printers; wherever lowpin count and high bandwidth are required.

Device Density Voltage Clock Speed Packages(MHz)

SST25VF512 512 Kb (64Kx8) 2.7-3.6V 20 SOIC-8 (150mil), WSON-8SST25VF512A 512 Kb (64Kx8) 2.7-3.6V 33 SOIC-8 (150mil), WSON-8SST25VF010 1 Mb (128Kx8) 2.7-3.6V 20 SOIC-8 (150mil), WSON-8SST25VF010A 1 Mb (128Kx8) 2.7-3.6V 33 SOIC-8 (150mil), WSON-8SST25VF020 2 Mb (256Kx8) 2.7-3.6V 20 SOIC-8 (150mil), WSON-8SST25LF020A 2 Mb (256Kx8) 3.0-3.6V 33 SOIC-8 (150mil), WSON-8SST25VF040 4 Mb (512Kx8) 2.7-3.6V 20 SOIC-8 (200mil), WSON-8SST25LF040A 4 Mb (512Kx8) 3.0-3.6V 33 SOIC-8 (200mil), WSON-8SST25VF040B 4 Mb (512Kx8) 2.7-3.6V 50 SOIC-8 (200mil), WSON-8SST25VF080B 8 Mb (1Mx8) 2.7-3.6V 50 SOIC-8 (200mil), WSON-8SST25VF016B 16 Mb (2Mx8) 2.7-3.6V 50 SOIC-8 (200mil), WSON-8SST25VF032B 32 Mb (4Mx8) 2.7-3.6V 50 SOIC-8 (200mil), SOIC-16 (300mil)SST25VF064C 64 Mb (8Mx8) 2.7-3.6V 50 SOIC-16 (300mil)SST25VF128C 128 Mb (16Mx8) 2.7-3.6V 50 SOIC-16 (300mil)

Serial Flash

ComboMemory products are highlyintegrated solutions, combiningSST SuperFlash® technology and StaticRandom Access Memory (SRAM) in single andmulti-chip packages. These devices are ideal forspace-constrained applications that require both flash andSRAM, such as cell phones, pagers, portable consumer electronicdevices, mobile communications, and handheld GPS units. TheComboMemory family includes two product series:

32 Series: Flash and SRAM or PSRAM combined in asingle Multi-Chip Package (MCP)

34 Series: Dual-Bank flash and SRAM or PSRAMcombined in a Multi-Chip Package (MCP)

COMBINATIONMEMORIES

Silicon Storage Technology, Inc. COMBINATIONMEMORIESwww.superflash.com

K e y F e a t u r e s

- Integrated flash and SRAM or PSRAM for small form factordesign

- Small footprint - replaces two parts with one- Read from or Write to SRAM or PSRAM while erasing orprogramming flash- Dual-Bank flash architecture for concurrent Read-while-Writeoperations (34 Series)- 64 KByte uniform Block-Erase capability- Low power consumption- Easy density upgrade with ComboMemory-ready pinassignments- Small Sector Erase capability:

- 32 Series : 2 KWord uniform Sector-Erase- 34 Series : 2 KWord uniform Sector-Erase

- High-density 32 Series:- 64 Mbit flash available in industry standard packages- MPF+ available with new features of Erase-Suspend/Erase-Resume, Boot Block, Security ID, and Hardware Reset

- 34 Series:- With new features of Erase-Suspend/Erase-Resume,Boot Block, Security ID, and Hardware Reset- Available in industry standard packages- x8/x16 flash

7 8

ComboMemory

Device Product Density Product Density Voltage Access PackagesFlash SRAM Speed (ns)

SST32HF802 8 Mb MPF (512Kx16) 2 Mb (128Kx16) 2.7-3.3V 70 LBGA-48 (10mmx12mm),

LFBGA-48 (6mmx8mm)

SST32HF64A1/2 64 Mb MPF+ (4Mx16) 16 Mb PSRAM (1Mx16) 2.7-3.3V 70 LFBGA-63 (8mmx10mm),

LFBGA-64 (8mmx10mm)

SST32HF64B1/2 64 Mb MPF+ (4Mx16) 32 Mb PSRAM (2Mx16) 2.7-3.3V 70 LFBGA-63 (8mmx10mm),

LFBGA-64 (8mmx10mm)

SST34HF162G 16 Mb CSF (1Mx16) 2 Mb (128Kx16) 2.7-3.3V 70 LFBGA-48 (6mmx8mm)

SST34HF164G 16 Mb CSF (1Mx16) 4 Mb (256Kx16) 2.7-3.3V 70 LFBGA-48 (6mmx8mm)

SST34HF324G 32 Mb CSF (2Mx16) 4 Mb (256Kx16) 2.7-3.3V 70 LFBGA-48 (6mmx8mm)

SST34HF1621C/2C 16 Mb CSF (1Mx16 or 2Mx8) 2 Mb (128Kx16) 2.7-3.3V 70 TFBGA-56 (8mmx10mm),

LFBGA-62 (8mmx10mm)

SST34HF1641J* 16 Mb CSF (1Mx16 or 2Mx8) 4 Mb PSRAM (256Kx16) 2.7-3.3V 70 TFBGA-56 (8mmx10mm),

LFBGA-62 (8mmx10mm)

SST34HF1681J* 16 Mb CSF (1Mx16 or 2Mx8) 8 Mb PSRAM (512Kx16) 2.7-3.3V 70 TFBGA-56 (8mmx10mm),

LFBGA-62 (8mmx10mm)

SST34HF3244* 32 Mb CSF (2Mx16 or 4Mx8) 4 Mb PSRAM (256Kx16) 2.7-3.3V 70 TFBGA-56 (8mmx10mm),

LFBGA-62 (8mmx10mm)

SST34HF3284* 32 Mb CSF (2Mx16 or 4Mx8) 8 Mb PSRAM (512Kx16) 2.7-3.3V 70 TFBGA-56 (8mmx10mm),

LFBGA-62 (8mmx10mm)

SST34HF32A4* 32 Mb CSF (2Mx16 or 4Mx8) 16 Mb PSRAM (1Mx16) 2.7-3.3V 70 TFBGA-56 (8mmx10mm),

LFBGA-62 (8mmx10mm)

32 and 34 Series ComboMemory provide lots of memory forspace-constrained applications like MP3 players. Combodevices are excellent for small, low-power devices such ascell phones and GPS systems.

ComboMemory ™

32 and 34 Series

* Please contact your local SST sales office for alternative configurations

FlashFlex family of 8-bit microcontroller productsincludes SST’s patented and proprietarySuperFlash® CMOS semiconductorprocess technology. The productsuse the 8051 instruction setand are pin-for-pin compatiblewith standard 8051 microcontrollerdevices. They are designed to be programmed in-system andin-application on the PCB for maximum flexibility.

FlashFlex® Microcontrollers89 Series

FlashFlexDevelopment KitsBoth the Starter Kit andDongle Kit are availablefrom SST distributors.To locate a distributornearest you or for moreinformation on the kits,see the SST web sitewww.sst.com.The web site is also yourresource for third-partyprogrammers and hard-ware emulators.

MICROCONTROLLERS Silicon Storage Technology, Inc. MICROCONTROLLERSwww.superflash.com

Product

ProductDescription

Features

Communication

Ordering Part No.

FlashFlex Starter Kit(supports RD series)

Starter board, target emulator board andMCU programmer

� Demo/target board with MCU control, 128 KBon-board flash, LED display port, any frequencyoperation, MCU signal access and 3.3V or 5Vsupply voltage

� Breadboard area for product development� Remote Reset and EA pin control� Security lock and re-map setting� External flash memory upgrade� File download and upload from internal or

external memory� BSL and SoftICE software provided with

software updates via Web

RS-232 serial to PC COM port

SST89CK78STR

FlashFlex Dongle Kit(supports RD series)

Field application codedownloader

� RS-232 interface board with LEDs� Easy-to-use switch block for

configuring the Dongle board� Small, compact size allows for easy

transport and effortless re-programmingof remote systems and devices

� BSL and SoftICE software providedwith software updates via Web

RS-232 serial to PC COM port

SST89CK79DGL

9 10

89 Series FlashFlex microcontrollers are important components in HDMI™ (High Definition Multimedia Interface) applications.

Key Features

- 8-bit 8051-compatible microcontrollers withembedded SuperFlash memory- 512 Byte/1024 Byte RAM- 9/16/17/24/40/72 KByte embedded SuperFlash- Individual block/page security lock- In-System Programming (ISP)- In-Application Programming (IAP )- Dual-block SuperFlash for RD Series- Single-block SuperFlash for RC Series- Small sector architecture: 128-byte sector size- Low power modes:

- Idle mode- Power-down mode with external wake-up

- Eight to ten interrupt sources with four levels of priority- Clock doubling option- Three high-current drive pins for LEDs- Serial interfaces: enhanced UART and SPI- 36 I/O pins*- Three 16-bit timer/counters- Watchdog Timer (WDT)- Programmable Counter Array (PCA)- Temperature ranges: 0ºC to +70ºCand -40ºC to +85ºC- Reduced EMI modes- Brown-out detection (BOD)**- 3V or 5V operation- PDIP-40, WQFN-40, PLCC-44 and TQFP-44 packages- Provided example Bootstrap Loader (BSL)***

* For RD Series, PDIP and WQFN packages have 32 I/O pins** For RD Series only*** For RD Series, an example BSL is pre-programmed in the memoryfor demonstrating initial user program code loading or subsequent usercode updating via the IAP operation. For RC Series, the example BSL isonly available on the SST website for users to download.

Operating Clock Flash Serial Interface ISP/ Interrupt Security I/ODevice Voltage Speed Memory1 RAM UART2 WDT BOD IAP DPTR Sources Chip Page Pins3 Packages

(MHz) (Levels) Lock Lock

RC Series: Single-Block SuperFlash MCU

SST89E52RC 4.5-5.5V 33 8KB(+1KB) 512B 1ch+ √ - √ 2 8(4) √ √ 32 PDIP-40, PLCC-44SST89E54RC 4.5-5.5V 33 16KB(+1KB) 512B 1ch+ √ - √ 2 8(4) √ √ 32 PDIP-40, PLCC-44

Operating Clock FlashMemory Serial Interface ISP/ Interrupt Security I/ODevice Voltage Speed Main 2nd RAM UART2 SPI PCA WDT BOD IAP DPTR Sources Hard Soft Pins3 Packages*

(MHz) Flash Flash (Levels) Lock Lock

SST89E52RD 4.5-5.5V 40 8KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 10(4) √ √ 32+4 PDIP-40, PLCC-44, TQFP-44SST89E54RD 4.5-5.5V 40 16KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 10(4) √ √ 32+4 PDIP-40, PLCC-44, TQFP-44SST89E58RD 4.5-5.5V 40 32KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 10(4) √ √ 32+4 PDIP-40, PLCC-44, TQFP-44SST89E516RD 4.5-5.5V 40 64KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 10(4) √ √ 32+4 PDIP-40, PLCC-44, TQFP-44, WQFN-40SST89V52RD 2.7-3.6V 33 8KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 10(4) √ √ 32+4 PDIP-40, PLCC-44, TQFP-44SST89V54RD 2.7-3.6V 33 16KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 10(4) √ √ 32+4 PDIP-40, PLCC-44, TQFP-44SST89V58RD 2.7-3.6V 33 32KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 10(4) √ √ 32+4 PDIP-40, PLCC-44, TQFP-44SST89V564RD 2.7-3.6V 33 64KB 8KB 1KB 1ch+ √ 5ch √ √ √ 2 8(4) √ √ 32 PDIP-40, PLCC-44, TQFP-44, WQFN-40

RD Series: Dual-Block SuperFlash MCU

* For PLCC-44 and TQFP-44 packages the part numbersuffix is RD2, it has Port 4 function and provides a totalof ten interrupt sources

Note 1: 16KB(+1KB) stands for single-block flashmemory composed of 16 KByte primary partitionplus 1 KByte secondary partition, allowing 17KByte total usable flash space for RC Series ifboot code is not necessary.Note 2: Enhanced UART with Automatic AddressRecognition (AAR) and framing error detectionfeaturesNote 3: Besides four 8-bit I/O ports, an additional4-bit port is provided in PLCC-44 and TQFP-44 pack-ages only.

2.4 GHz ~ 2.5 GHz High Efficiency Linear Power Amplifier – 802.11b/g SeriesWith a 3x3 mm 16-pin QFN package, SST12LP14A can be easily configured for U.S., European and Japanese markets (2.4~2.5 GHz)

Key Features:� Excellent Linear Output Power and Low Operating Current� Pout=23 dBm @ 1 MBPS 11b signal, 230 mA @ 3.3V (26% PAE)� EVM<3% at Pout = 20 dBm for 11g @ 54 Mbps operation, ~165 mA @ 3.3V� EVM<4% at Pout = 21.5 dBm for 11g @ 54 Mbps operation, ~200 mA @ 3.3V� IM3<-35dB� Stable gain across the frequency band and over temperature

- Gain~29 dB (°”0.5 dB across 2.4 GHz~2.5 GHz, °”0.5 dB over -10~85∞C)� Low Reference (Iref) and Quiescent (Icq) Currents

- Iref ~ 2 mA – allows direct Output Power Control by the MAC chip- Icq = 70 mA

� Wide-Dynamic Range, Temperature Stable and VSWR mismatch compensated Power Detector:Variations Test conditions<±0.3dB 0~85ºC single channel 1-14, 50W matched load<±0.4dB <2:1 output VSWR all angle, single channel 1-14, room temperature<±0.3dB across channels 1- 14, 50W matched load, room temperature<±0.3dB (goal) Sample-to-sample, to be confirmed with production tests

� Very low external component count

2.4 GHz ~ 2.5 GHz High Power Linear Power Amplifier – 802.11b/g SeriesWith a 3x3 mm 16-pin QFN package, SST12LP15A can be easily configured for U.S., European and Japanese markets (2.4~2.5 GHz)

Key Features:� High 33 dB Power Gain� High linear output power: meet 802.11g OFDM up to 25 dBm� High efficiency for 802.11g/b applications: ~25%/280 mA @ Pout = 23 dBm for 11g, ~27%/350 mA @ Pout = 25 dBm for 11b� On-Chip power detection� +3.0V ~ 4.2V single supply power

Dual Band Linear Power Amplifier – 802.11a/b/g SeriesWith 4x4 mm 24-pin WQFN package, SST13LP02 can be easily configured for high power/high efficiency applications for U.S.,European and Japanese markets (2.4~2.5 GHz and 4.9~5.8 GHz).

Key Features:� High 26 dB Power Gain across 2.4GHz ~ 2.5GHz� High 30 dB Power Gain across 4.9GHz ~ 5.8GHz� High linear output power: meet 802.11g OFDM up to 21 dBm� High linear output power: meet 802.11a OFDM up to 20 dBm� High efficiency for 802.11g applications: ~22%/150 mA @ Pout = 20 dBm for 11g, ~10 %/230 mA @ Pout = 19 dBm for 11a� On-Chip power detection� +3.0V ~ 3.6V single supply power

4.9 GHz ~ 5.8 GHz High Power Linear Power Amplifier – 802.11a SeriesWith 3x3 mm 16-pin QFN package, SST11LP12 can be easily configured for U.S., European and Japanese markets (4.9~5.8GHz).

Key Features:� 4.9GHz ~ 5.8GHz operating range� High 35 dB Power Gain� High linear output power: meet 802.11g OFDM up to 23+ dBm� High efficiency for 802.11a applications: ~12%/280 mA @ Pout = 21 dBm for 11a� On-Chip power detection� +2.7V ~ 3.6V single supply power

2.4 GHz ~ 2.5 GHz Linear Power Amplifier – Bluetooth SeriesWith a compact 6-lead LPCC package, SST12LP00 can be easily configured for high power/high efficiency applications with Bluetoothtransmitter applications.

Key Features:� 2.4 GHz ~ 2.5 GHz operating range� High 29 dB Power Gain� Low Icq = 15 mA� High PAE: 50% at P1 dB� On-Chip power detection� +2.7V ~ 3.6V single supply power

POWERAMPLIFIERS

Power Amplifier (PA) productsare based on the highly reli-able advanced InGaP/GaAsHBT technology. Our poweramplifier products cover thefollowing four application areas:(1) WLAN IEEE 802.11g/b band at 2.4 GHz, (2) WLAN 802.11aband at 4.9 – 5.8 GHz, (3) WLAN IEEE 802.11 a/b/g dual-band and(4) Bluetooth at 2.4 GHz. The WLAN power amplifiers are targeted atequipment including PCMCIA, MiniPCI and USB cards, as well aswireless access points. Two groups of power amplifiers are offeredfor this application: High Power and High Efficiency, both withsuperb power added efficiency.

High Power PA products offer the industry’s highest linear outputpower, up to 3 dB higher than competing products in a wide operatingtemperature range of -40ºC to +85ºC, to enable WLAN systems withwider transmission range and higher sustained data rates. Thedevices’ ultra-wide dynamic range and on-chip temperature-stablepower detector allow system designers to optimize the transmitteroutput power for each individual user, thereby minimizing the adjacentchannel interference and achieving maximum capacity. Testing hasshown that our new power amplifiers enable up to a 40 percentincrease in range when compared to alternative offerings. The per-formance breakthroughs offered by our new power amplifier productsare an ideal way for our WLAN customers to gain acompetitive advantage in the marketplace.

High Power PAs

11 12

CommunicationsICs

POWERAMPLIFIERS

Dual-Band Linear Power Amplifier – 802.11a/b/g seriesDevice Application Gain Gain Power Power Package

(a/b/g & FEM) 11g (dB) 11a (dB) 11g (dBm) 11a (dBm)SST13LP02 11a/b/g 26 30 21 20 WQFN-24

Single-Band Linear Power Amplifiers – 11a,11b/g and BluetoothDevice Application Gain Maximum Linear Package

(a/b/g) (dB) Output Power (dBm)SST11LP11-QVC 11a 24 18 QFN-16SST11LP12-QVC* 11a 35 21 QFN-16SST12LP14-QVC 11b/g 30 20 QFN-16SST12LP14A-QVC 11b/g 29 21.5 QFN-16SST12LP15A-QVC* 11b/g 33 23 QFN-16SST12LP00-QV6 Bluetooth 29 21 LPCC-6

* High Power PA Group

SST’s communications ICs are used in WLAN andBluetooth applications

Silicon Storage Technology, Inc. www.superflash.com

EMBEDDED CONTROLLERS

Key Fea t u res

- Host Interface supports ATA/ATAPI-5 and CFA 2.0 Commands- Interface and support standard NAND flash media up to 16 Gbit- Supports 512 Byte and 2 KByte page size Media Flash- Flash Media Interface: 8-bit and 16-bit access- Supports up to PIO Mode-4 and Multiword DMA Mode-2- Fast Read performance: up to 10.0 MB/sec (max)- Fast Sustained Write performance: up to 10.0 MB/sec (max)- Low power, 5V/3.3V interface- Low standby current- Pre-programmed embedded firmware- Internal or external system clock option- 20-Byte unique ID for expanded security- Write-Protect or Power-Down pin for preventing data overwrites- Advanced security features- Support for both commercial and industrial temperature ranges- 100-pin TQFP, 84-ball BGA and 85-ball VFBGA packages

Functions SST55LD019A SST55LD019B SST55LD019C

Supported 16 MB to 4 GB 16 MB to 8 GB 4 GB to 32 GBCapacity

Performance - Up to 6 MB/sec Up to 10 MB/sec Up to 10 MB/secSustained (max) (max) (max)Write Speed

Performance - Up to 10 MB/sec Up to 10 MB/sec Up to 10 MB/secSustained (max) (max) (max)Read Speed

Security Yes Yes YesFeatures

13

ATA Flash Disk ControllerDevice Voltage Clock Packages

Speed (MHz)

SST55LD019A 3.0-3.6V, 4.5-5.5V 45 TQFP-100 (16mmx16mm),

TFBGA-84 (9mmx9mm),

VFBGA-85 (6mmx6mm)

SST55LD019B 3.0-3.6V, 4.5-5.5V 45 TQFP-100 (16mmx16mm),

TFBGA-84 (9mmx9mm),

VFBGA-85 (6mmx6mm)

SST55LD019C 3.0-3.6V, 4.5-5.5V 45 TQFP-100 (16mmx16mm),

TFBGA-84 (9mmx9mm)

ATA Flash Disk Controller55 SeriesATA Flash Disk Controller is well suited for solid-state mass storageapplications in high-performance, flash media-based data storagesystems. They are ideal for smaller, lighter designs and lowerpower consumption in applications such asportable computers, digital cameras, musicplayers, PDAs, hand-held terminals,monitoring devices andset-top boxes.

14

NON-Pb (LEAD-FREE) PRODUCTSAND RoHS COMPLIANCE

SST’s Commitmentand Track Record

SST is a leader in offering non-Pb (lead-free) products. In Marchof 2002, we announced and began shipping volume production ofsuch products. By 2003, almost every SST product was offered inproduction with a lead-free option. As of December 2004, SSThas shipped well over 25 million non-Pb units worldwide.

Today, all members of SST's Parallel Flash, Serial Flash,Combination Memory, Embedded Controllers and Mass Storageproduct lines are offered with a non-Pb (lead-free) environmentaloption. All of SST's lead-free products are RoHS compliant. In thefuture, SST plans to offer non-Pb products in its Emosyn andcommunications product lines.

For more information, see the Environmental Resourcessection of SST’s website (www.sst.com) or contact yourlocal SST sales office.

Silicon Storage Technology, Inc.

55 Series ATA Flash Disk Controllers are ideal solutionsfor portable applications such as MP3 players.

SST maintains a strong commitment to preserving theenvironment.

www.superflash.com

RoHS Compliance

All SST products are non-Pb (lead-free) and are RoHS compliant.

RoHS (Restriction on Hazardous Substances) is a European Union(EU) directive that bans lead (Pb) and other certain materials inelectrical and electronic equipment. This directive takes effecton July 1, 2006.

The RoHS directive bans the following substances:� Lead and its compounds� Mercury and its compounds� Cadmium or cadmium compounds� Hexavalent Chromium and its compounds� PBB (polybromobiphenyl)� PBDE (polybrominated diphenyl ethers)

In addition to these substances, SST's non-Pb (lead-free) partsdo not contain the following substances:

� Chlorinated paraffins (chlorine flame retarding materials/plasticizers)

� Polychlorinated biphenyl (PCB) category� Polychlorinated naphthalene category� Organic tin compounds (Tributhyl tin category/Triphenyl

tin category)� Asbestos� Azo compounds� CFCs or other Class 1 Ozone Depleting Substances

This list is only an abbreviated one. If you need more informationconcerning SST products and a specific substance or RoHSCompliance, please see see the Environmental Resourcessection of our website, www.sst.com or contact your localSST sales office.