2
Reliability testing starts with reliable sockets QFN BCC/MLF/MLP/LPCC www.plastronics.com Call us: 972-258-2580 | Email us: [email protected] Patent No: US7, 025, 602 H-Pin is a registered trademark of Plastronics LIDDED OPEN TOP PRODUCT DESCRIPTION Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version. SPECIFICATIONS (mm) Available in 0.40, 0.50, 0.65, 0.80 and 1.00mm pitches Custom pitches down to 0.30mm Lidded and Open T op Sockets for ≤10mm packages Lidded Sockets for 10 - 16mm packages Center ground pin standard for all sockets Optional copper heat slug available for high wattage devices Sockets for over 80 different JEDEC standard footprints MECHANICAL PROPERTIES • Mounting Thru hole • Socket Operation Clamshell lid; ZIF Open Top • Operating Temperature -55°C to +150°C • Contact Force 32g • Life Cycles 5,000 Mechanical Cycles PHYSICAL PROPERTIES • Plastic Body PPS • Contact Base Metal BeCu • Contact Plating Au over Ni; NiB optional • Center Pin Base Metal Brass; Cu optional • Center Pin Plating Au • Springs, Torsion/Coil Passivated S.S. ELECTRICAL PROPERTIES • Contact Resistance < 50 mOhms • Inductance 3 nH • Current Rating .5A w/ 30°C rise, 1.0A w/ 75°C rise Volume Resistivity 1 x 10 15 Ohm-cm • Insulation Resistance 560 V/mil MECHANICAL PROPERTIES PHYSICAL PROPERTIES ELECTRICAL PROPERTIES DEVICE TOP INSERT BOTTOM INSERT DEVICE TOP INSERT BOTTOM INSERT

QFN BCC/MLF/MLP/LPCC - PLASTRONICS · 2015. 9. 24. · Reliability testing starts with reliable sockets QFN BCC/MLF/MLP/LPCC 29.46 35.94 15.30 14.03 PART NO. 2.29 PC BOARD CONTACT

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Page 1: QFN BCC/MLF/MLP/LPCC - PLASTRONICS · 2015. 9. 24. · Reliability testing starts with reliable sockets QFN BCC/MLF/MLP/LPCC 29.46 35.94 15.30 14.03 PART NO. 2.29 PC BOARD CONTACT

Reliability testing starts with reliable sockets

QFN BCC/MLF/MLP/LPCC

www.plastronics.comCall us: 972-258-2580 | Email us: [email protected]

Patent No: US7, 025, 602H-Pin is a registered trademark of Plastronics

LIDDED

OPEN TOP

PRODUCT DESCRIPTIONPlastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.

SPECIFICATIONS (mm) Available in 0.40, 0.50, 0.65, 0.80 and 1.00mm pitches Custom pitches down to 0.30mm Lidded and Open Top Sockets for ≤10mm packages Lidded Sockets for 10 - 16mm packages Center ground pin standard for all sockets Optional copper heat slug available for high wattage devices Sockets for over 80 different JEDEC standard footprintsMECHANICAL PROPERTIES

• Mounting Thru hole

• Socket Operation Clamshell lid; ZIF Open Top

• Operating Temperature -55°C to +150°C

• Contact Force 32g

• Life Cycles 5,000 Mechanical Cycles

PHYSICAL PROPERTIES

• Plastic Body PPS

• Contact Base Metal BeCu

• Contact Plating Au over Ni; NiB optional

• Center Pin Base Metal Brass; Cu optional

• Center Pin Plating Au

• Springs, Torsion/Coil Passivated S.S.

ELECTRICAL PROPERTIES

• Contact Resistance < 50 mOhms

• Inductance 3 nH

• Current Rating .5A w/ 30°C rise, 1.0A w/ 75°C rise

• Volume Resistivity 1 x 1015 Ohm-cm

• Insulation Resistance 560 V/mil

MECHANICAL PROPERTIES

PHYSICAL PROPERTIES

ELECTRICAL PROPERTIES

DEVICE

TOP INSERT

BOTTOM INSERT

DEVICE

TOP INSERT

BOTTOM INSERT

Page 2: QFN BCC/MLF/MLP/LPCC - PLASTRONICS · 2015. 9. 24. · Reliability testing starts with reliable sockets QFN BCC/MLF/MLP/LPCC 29.46 35.94 15.30 14.03 PART NO. 2.29 PC BOARD CONTACT

Reliability testing starts with reliable sockets

QFN BCC/MLF/MLP/LPCC

29.4

6

35.94

15.3

0

14.0

3

2.29

PART NO.

PC BOARD

CONTACT TAIL .23 X .10

32.10

ORIENTATION

26.7

0

CLOSED OPEN

DEVICE SEATING PLANE

PART NUMBER

15.5

01.

10

3.40 2.

304.

10

11.5

0

CONTACT TAIL .23 X .10

27.43

20.3

2 2.29 13

.46

14.7

3PART NUMBER

CONTACT TAIL .23 X .10

QFN OFFERINGS

LIDDED BODY SIZE ≤10mm

LIDDED BODY SIZE 10 - 16mm

OPEN TOP BODY SIZE ≤10mm

All units in mm unless otherwise noted.

Plastronics offers over 140 QFN socket options.For a complete list, please visit our website at www.Plastronics.com.

www.plastronics.comCall us: 972-258-2580 | Email us: [email protected]

Patent No: US7, 025, 602H-Pin is a registered trademark of Plastronics