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Released in April 2016
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No.QTC2003EJ-02C1604
(Specifications are subject to change without notice.)
MC Y K MC Y K
(1) Quartz Crystal Division of Seiko Instruments Inc. and affiliates, which is responsible for manufacturing the products described in this catalogue, holds ISO 9001 and ISO 14001 certification.
(2) SII Crystal Technology Inc. Tochigi site holds ISO/TS 16949 certification.
Shenzhen OfficeRoom 2212-15, Office Tower, Shun Hing Square,Di Wang Commercial Centre, 5002 Shen Nan Dong Rd.,Shenzhen 518008, ChinaTEL:+86-755-8246-2680FAX:+86-755-8246-5140
4-5/F, Wyler Centre 2, 200 Tai Lin Pai Rd.,Kwai Chung, N.T., Kowloon, Hong KongTEL:+852-2421-8611FAX:+852-2480-5479E-mail:[email protected]://www.sih.com.hk
Room 2701-2703, 27th Floor, Shanghai Plaza, 138 Mid Huaihai Rd.,Shanghai 200021, ChinaTEL: +86-21-6375-6611 FAX: +86-21-6375-6727
12F, No.101, Sec.2, Nanking E.Rd., Taipei 104, Taiwan,R.O.C.TEL:+886-2-2563-5001FAX:+886-2-2563-5580E-mail:[email protected]://www.sii.com.tw
Siemensstrasse 9, D-63263 Neu Isenburg, GermanyTEL:+49-6102-297-0FAX:+49-6102-297-50100E-mail:[email protected]://www.seiko-instruments.de
21221 S. Western Ave., Suite 250, Torrance, CA 90505, U.S.A.TEL:+1-310-517-7771FAX:+1-310-517-7792E-mail:[email protected]://www.sii-crystal.com
Europe North/Central/South America
Asia
1-8, Nakase, Mihamaku, Chiba-shi, Chiba 261-8507, JapanTelephone:+81-43-211-1214 Facsimile:+81-43-211-8030E-mail:[email protected]
<Manufacturer> SII Crystal Technology Inc.1110, Hirai-cho, Tochigi-shi, Tochigi 328-0054, Japan
Quartz Crystal Sales Department
Printed with soy ink.
Printed on recycled paper
Quartz CrystalProduct Catalogue
SC-12S (Under development) …………………4SC-16S ……………………………………………5SC-20S ……………………………………………6SC-20T ……………………………………………7SC-32S ……………………………………………8SC-32A (For automotive use) …………………9SC-32P (R1=50kΩ max.) Low ESR Series ……………………………… 10
SSP-T7-F ……………………………………… 11SSP-T7-FL (SMD type low CL resonator for low-power microcontrollers) ……………………………… 12
VT-200-F ……………………………………… 13VT-200-FL (Cylinder-type low CL resonator for low-power microcontrollers) ……………………………… 14
Contents
Ceramic package
Plastic mold
Cylinder
Quartz Crystal Unit Handling Precautions …… 15
Oscillation Circuit Design Precautions ……… 17
Packing …………………………………………… 19
4
Ceramic packageSC-12S (Under development)
FEATURES• Ultra small size type (1.2×1.0mm×0.5mm max.).• SMD type suitable for high density surface mounting.• Excellent shock and heat resistance.• Complete Pb-free.• Complies with EU RoHS directive.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSMobile Phone, Wearable, Module, Sub-clock function for a variety of Microcomputer, etc.
UNIT: mm
#2#1
Remark Please make sure there is no pattern under SC-12S on the circuit board. Please note this product is under development and the specifications and dimensions are subject to change.
UNIT: mm
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.035±10%)×10-6/℃2
Load Capacitance CL 6pF to 12.5pF Please specifyMotional Resistance (ESR) R1 90kΩ max.Absolute Maximum Drive Level DLmax. 0.5μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 1.5pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
#2#1
5
Ceramic packageSC-16S
FEATURES• SMD type suitable for high density surface mounting. • Thin type with height 0.5mm max.• Excellent shock and heat resistance.• Complete Pb-free.• Complies with EU RoHS directive.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSMobile Phone, Wearable, Module, Sub-clock function for a variety of Microcomputer, etc.
UNIT: mm
#2#1
Remark Please make sure there is no pattern under SC-16S on the circuit board.
UNIT: mm
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.035±10%)×10-6/℃2
Load Capacitance CL 6pF to 12.5pF Please specifyMotional Resistance (ESR) R1 90kΩ max.Absolute Maximum Drive Level DLmax. 0.5μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 1.2pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
#1 #2
6
Ceramic packageSC-20S
FEATURES• Thin type with height 0.6mm max.• SMD type suitable for high density surface mounting.• Excellent shock and heat resistance.• Complete Pb-free.• Complies with EU RoHS directive.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSMobile Phone, Wearable, Module, Sub-clock function for a variety of Microcomputer, etc.
UNIT: mm
#2#1
Remark Please make sure there is no pattern under SC-20S on the circuit board.
UNIT: mm
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.030±10%)×10-6/℃2
Load Capacitance CL 6pF to 12.5pF Please specifyMotional Resistance (ESR) R1 70kΩ max.Absolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 1.3pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
#1 #2
7
Ceramic packageSC-20T
FEATURES• Ultra thin type with height 0.35mm max.• SMD type suitable for high density surface mounting.• Excellent shock and heat resistance.• Complete Pb-free.• Complies with EU RoHS directive.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSSmart card, Wearable, Module, Sub-clock function for a variety of Microcomputer, etc.
UNIT: mm
#2#1
Remark Please make sure there is no pattern under SC-20T on the circuit board.
UNIT: mm
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.033±10%)×10-6/℃2
Load Capacitance CL 6pF to 12.5pF Please specifyMotional Resistance (ESR) R1 75kΩ max.Absolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 1.0pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
#1 #2
8
Ceramic packageSC-32S
FEATURES• Thin type with height 0.85mm max.• SMD type suitable for high density surface mounting.• Excellent shock and heat resistance.• Complete Pb-free.• Complies with EU RoHS directive.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSMobile Phone, Wearable, Module, Sub-clock function for a variety of Microcomputer, etc.
UNIT: mm
#2#1
Remark Please make sure there is no pattern under SC-32S on the circuit board.
UNIT: mm
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.030±10%)×10-6/℃2
Load Capacitance CL 6pF to 12.5pF Please specifyMotional Resistance (ESR) R1 70kΩ max.Absolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 1.0pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
#1 #2
9
Ceramic packageSC-32A (For automotive use)
FEATURES・Conforms to "AEC-Q200".• SMD type suitable for high density surface mounting.• Excellent shock and heat resistance.• Complete Pb-free.• Complies with EU RoHS directive.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSCar Audio, Car Navigation, ECU sub-clock, In-vehicle clock etc.
UNIT: mm
#2#1
Remark Please make sure there is no pattern under SC-32A on the circuit board.
UNIT: mm
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.030±10%)×10-6/℃2
Load Capacitance CL 6pF to 12.5pF Please specifyMotional Resistance (ESR) R1 70kΩ max.Absolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 1.0pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -55℃ to +125℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
#1 #2
10
Ceramic packageSC-32P (R1=50kΩ max.) Low ESR Series
FEATURES• Suitable for microcomputer with Low ESR (R1=50kΩ max.).• SMD type suitable for high density surface mounting.• Excellent shock and heat resistance.• Complete Pb-free.• Complies with EU RoHS directive.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSPC, Tablet, BLE Module, Wearable
UNIT: mm
#2#1
Remark Please make sure there is no pattern under SC-32P on the circuit board.
UNIT: mm
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.030±10%)×10-6/℃2
Load Capacitance CL 6pF to 12.5pF Please specifyMotional Resistance (ESR) R1 50kΩ max.Absolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 1.0pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
#1 #2
11
Plastic mold
UNIT: mm
#1
#4
#2
#3
UNIT: mm
6.70.10.1
0.3
0.15
0.55
0.3
7.0 max.
1.5
max
.
1.4
max
.
#4 #3
#1 #2
1.05
0.55 0.6
#4 #3
#1 #2
SSP-T7-F
FEATURES• Thin type with height 1.4mm max.• SMD type suitable for high density surface mounting.• Excellent shock and heat resistance.• Complies with EU RoHS directive.• Complete Halogen-free.• A crystal resonator processed by high reliable photo-
lithographic technology inside.
APPLICATIONSMobile Phone, Wearable, Module, Sub-clock function for a variety of Micro-computer, etc.
Remark Please make sure there is no pattern under SSP-T7-F on the circuit board.
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.033±10%)×10-6/℃2
Load Capacitance CL 7pF to 12.5pF Please specifyMotional Resistance (ESR) R1 50kΩ max./65kΩ max. Please specifyAbsolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 0.9pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
12
Plastic mold
UNIT: mm
#1
#4
#2
#3
UNIT: mm
6.70.10.1
0.3
0.15
0.55
0.3
7.0 max.
1.5
max
.
1.4
max
.
#4 #3
#1 #2
1.05
0.55 0.6
#4 #3
#1 #2
SSP-T7-FL (SMD type low CL resonator for low-power microcontrollers)
FEATURES• Consumes one tenth the standby power of general
crystal resonators (with a load capacitance of 12.5 pF).• Excellent low drive level characteristics.• Complies with EU RoHS directive.• Complete Halogen-free.
APPLICATIONS• Consumer electronics products for saving standby
energy consumption.• Battery operated devices requiring a long battery life.
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.033±10%)×10-6/℃2
Load Capacitance CL 3.7pF, 4.4pF, 6.0pF Please specifyMotional Resistance (ESR) R1 50kΩ max./65kΩ max. Please specifyAbsolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.01μW typ.Shunt Capacitance C0 0.9pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -55℃ to +125℃ Piece part basis
DIMENSIONS INTERNAL LEAD CONNECTION
RECOMMENDED SOLDERING PATTERN
CAUTIONThe SSP-T7-FL is designed for use in ultra-low-power microcontrollers. Do not use this resonator in regular microcontrollers as it might cause problems with oscillation.
Remark Please make sure there is no pattern under SSP-T7-FL on the circuit board.
13
Cylinder
UNIT: mm
VT-200-F
FEATURES• Compact tubular package.• Photolithographic process.• Excellent shock resistance and environmental
characteristics.• Complete Pb-free.• Complies with EU RoHS directive.
APPLICATIONSClocks, Timers, Water/Electricity Meters, Remote controllers, Sub-clock function for a variety of Microcomputer, etc.
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.035±10%)×10-6/℃2
Load Capacitance CL 7pF to 12.5pF Please specifyMotional Resistance (ESR) R1 50kΩ max.Absolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.1μW typ.Shunt Capacitance C0 0.9pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -40℃ to +85℃ Piece part basis
DIMENSIONS
( 0.26)
6.0+0.10−0.15 5.0 min.
(0.6
5)
2.0
ma
x. φ
φ
Remark Please make sure there is no pattern under VT-200-F on the circuit board.
14
Cylinder
CAUTIONThe VT-200-FL is designed for use in ultra-low-power microcontrollers. Do not use this resonator in regular microcontrollers as it might cause problems with oscillation.
VT-200-FL (Cylinder-type low CL resonator for low-power microcontrollers)
FEATURES• Consumes one tenth the standby power of general
crystal resonators (with a load capacitance of 12.5 pF).• Photolithographic process.• Excellent low drive level characteristics.• Complete Pb-free.• Complies with EU RoHS directive.
APPLICATIONS• Consumer-electronics products for saving standby
energy consumption.• Battery operated devices requiring a long battery life.
STANDARD SPECIFICATIONSConditions where not specified (Temperature: 25±2°C, DL: 0.1μW)
Item Symbol Specifications Conditions / NotesNominal Frequency f_nom 32.768kHzFrequency Tolerance f_tol ±20×10-6 Please specifyTurnover Temperature Ti +25±5℃Parabolic Coefficient B (-0.035±10%)×10-6/℃2
Load Capacitance CL 3.7pF, 4.4pF, 6.0pF Please specifyMotional Resistance (ESR) R1 50kΩ max.Absolute Maximum Drive Level DLmax. 1.0μW max.Level of Drive DL 0.01μW typ.Shunt Capacitance C0 0.9pF typ.Frequency Ageing f_age ±3×10-6 +25±3℃, First YearOperating Temperature T_use -40℃ to +85℃Storage Temperature T_stg -40℃ to +85℃ Piece part basis
DIMENSIONS
( 0.26)
6.0+0.10−0.15 5.0 min.
(0.6
5)
2.0
ma
x. φ
φ
UNIT: mm
Remark Please make sure there is no pattern under VT-200-FL on the circuit board.
Quartz Crystal Unit Handling Precautions
15
Hermetic
Glass
Lead
Case
Hermetic
GlassLead
Case
Breakage Tweezers orneedle-nose pliers
Case
Lead
Solder
Printed circuit
board
0.5mm 0.5mm
Solder
D2.0mm
LSolder
L>D
MOUNTING PRECAUTIONSLead Type Crystal Units• StructureTubular crystal units (VT) are hermetically sealed using glass (see Figures 1 and 2).
• Unbending the lead(1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force may
crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of the charac-teristics and may also break the crystal chip (see Figure 3).
(2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of lead tightly (see Figure 4).
• Bending the lead(1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a
crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6).(2) Always leave a length greater than 2.0mm when bending a lead after soldering (see Figure 7).
Make the length from the case to the printed cir-cuit board (L) longer than the case diameter (D) so that the lead wire will not be pulled in case the crystal unit falls over.
Soldering directly to the case will reduce the degree of vacuum and may result in deterioration of the characteristics and may break the crystal chip.
Figure 1 Figure 2
Figure 3 Figure 4
Figure 5 Figure 6 Figure 7
16
Quartz Crystal Unit Handling Precautions
Time(sec.)
Tem
pera
ture
(°C
)
Note: the temperature is the PCB surface temperature.
100 150 200 25050
50
100
150
200
25010±1sec
260°C peak.
250±10°C
220°C
170±10°C
50±10sec
120±20sec
• Soldering(1) Cylinder The soldering position has to be at the lead wire more than 1.0mm away from the glass seal. A long period of time of heating at high temperature may result in deterioration of the characteristics and
may break the crystal unit. If crystal unit is unavoidably heated, heat the lead part at 300℃ or lower for 5 seconds or less and please
make sure to keep the case below 150℃.
(2) Ceramic package, Plastic mold An example of the reflow temperature profile is shown as follows (see Figure 8).
CLEANINGSince a small, thin crystal chip is used for tuning fork crystal units and the frequency approximates that of an ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning.
MECHANICAL SHOCK(1) Quartz crystal units are designed to withstand a drop from 75cm onto a hard wooden board at least 3 times.
However, their crystal chips may break depending on the conditions when they are dropped. Ensure that the crystal unit functions normally before use if the crystal units have been dropped or subjected to an excessive mechanical shock.
(2) Unlike chip parts such as resistors, and capacitors, the SMD crystal unit has a crystal chip which is hermetical-ly sealed inside. Therefore, check the influence of shock during automatic mounting or influence of deposition of case to the board by ultrasonic vibration before use.
(3) Avoid mounting crystal unit to the board with mechanical vibration source including ultrasonic vibration source. If the crystal unit is unavoidably mounted to the same board with mechanical vibration source, ensure that the crystal unit functions normally.
Example of SMD product soldering conditions(260°C peak: Lead-free products)
Figure 8
Oscillation Circuit Design Precautions
17
OSCILLATION FREQUENCY AND LOAD CAPACITANCE (CL)The load capacitance (CL) is a parameter for determining the frequency of the oscillation circuit. The CL is represented by an effective equivalent capacitance that is loaded from the oscillation circuit to both ends of the crystal unit (see Figure 12).The oscillation frequency varies depending upon the load capacitance of the oscillation circuit. In order to obtain the desirable frequency accuracy, matching between the load capacitances of the oscillation circuit and the crystal unit is required. For the use of the crystal unit, match the load capacitances of the oscillation circuit with the load capacitances of the crystal unit.
(×10−6)
120
100
80
60
40
20
0
−20
−40
5 6 8 10 12 14 16 18 20 22 24 26 28Load Capacitance CL
Frequency Load Capacitance Characteristics
CL=12.5PF
Typ.△f/f0
(pF)
Freq
uenc
y D
evia
tion
X'talCg Cd Cds
Rd
Rf
Cgs
Cos
Load capacitance : CL
Cs=Stray capacitance ofthe circuit
CL= +CsCg CdCg+Cd
Figure 12
DRIVE LEVEL (DL)The drive level of a crystal unit is shown by the level of the operating power or the current consumption (see Figures 9, 10, and 11).Operating the crystal unit at an excessive power level will result in the degradation of its characteristics, which may cause frequency instability or physical failure of the crystal chip. Design your circuit within absolute maximum drive level.
L1 C1 R1
C0
Rf
IX
Cg Cd
Rd
Crystal unit Oscillationcircuit
IX
CLLe
Re −R
Drive Level: DL2
IX • ReR1(1+C0/CL)CurrentEffective resistance
2DL:Re:IX:
Re:
Figure 9 Figure 10 Figure 11
Figure 13
18
Oscillation Circuit Design Precautions
Oscillation Allowance Evaluation MethodAdd resistor “Rx” to the crystal unit in series and ensure that the oscillation starts or stops. The approximate nega-tive resistance of the circuit is the value obtained by adding the effective resistance “Re” to the maximum resistance “Rx” when the oscillation starts or stops after gradually making Rx value larger.
Negative resistance |-R| = Rx + Re
|-R| is a value at least five times as large as the maximum equivalent series resistance (R1 max.) of the crystal unit. *Re is the effective resistance value during oscillation.
Re = R1 (1+ ) 2
OSCILLATION ALLOWANCE
To ensure stable oscillation, the negative resistance of the circuit should be significantly larger than the equivalent series resistance (the oscillation allowance is large). Ensure that the oscillation allowance is at least five times as large as the equivalent series resistance.
Rd
RxCd
Rf
Cg
C0
CL
Frequency temperature characteristics of tuning fork crystals is shown by negative quadratic curve which has a peak at 25°C as per left graph.Please make sure to consider the temperature range and frequency accuracy you need since magnitude of frequency variation becomes larger and larger as the temperature range becomes wider.
[Approx imat ion fo rmula o f f requency tempera ture characteristics]
f_tem=B (T-Ti)2
B : Parabolic coefficientT : Given temperatureTi : Turnover temperature
Typ.Ti=25℃ =−3.5×10 /℃B 2
−20 −10 0 10 20 30 40 50 60 70(℃)
0
−10
−20
−30
−40
−50
−60
(×10 )
Temperature
△f/f0
FrequencyDeviation
−8
−6
Figure 14
Frequency Temperature Characteristics
FREQUENCY-TEMPERATURE CURVE
Packing
19
The following is the standard packing.
LEAD TYPE PRODUCTSAfter products are inserted in polyethylene bags, the bags are placed in boxes for shipping.
Product name Quantity per lot Quantity per bag Quantity per boxVT-200-FL / VT-200-F 10,000 pcs. 500 pcs. 20 bags
SMD PRODUCTSProduct name Quantity per reel
SSP-T7-F /SSP-T7-FL3,000 pcs.
SC-32S/SC-32A/SC-32P/SC-20S/SC-20TSC-16S/SC-12S 5,000 pcs.
Notes : If a smaller quantity is provided, (less than the standard packing quantity listed above) then the quantity per reel may differ.
TAPE AND REEL CONFIGURATION• Reel configuration
Product name Reel inner width Reel outer width Product name Reel inner width Reel outer widthSSP-T7-F /SSP-T7-FL 17.0mm 19.4mm SC-32S/SC-32A/SC-32P 15.4mm 13.0mm
φ180
19.4 ±1.0
120゚120゚
3-2.2
17+1.0 0φ13φ21
φ50
φ 180 φ60
15.4
13
120゚120゚
3-2
φ13φ21
Product name Reel inner width Reel outer widthSC-20S/SC-20T/SC-16S/SC-12S 11.4mm 9.0mm
φ180 φ 60
120゚120゚
3-2
φ13φ21
9
11.4
20
Packing
SC-20T 0.23±0.05
5゚
0.40±0.05
2.25±0
.05B-B
• Emboss tape configuration UNIT : mmProduct name SSP-T7-F /SSP-T7-FL Product name SC-32S/SC-32A/SC-32P
B-B
0.3 ±0.05
1.4±0.1
7.2±0
.1(4.
8)
A A
A-A
1.55 ±0.05
5゚
5゚
B
B
P4±0.10 2±0.10 P4±0.01φ1.5 +0.10
φ1.0 +0.1016
.0±0.37.5
±0.1
1.75±
0.1
Product name SC-32T Product name SC-20S/SC-20T
P4±0.10
1.75±
0.10φ1.5 +0.1
0
φ1.0 +0.2 0
2±0.05P4±0.10
A-A
B-B
A A
B
B
5.5±0.
0512±
0.20
3゚
3゚
0.8 ±0.05
0.25 ±0.05
3.4±0.
05
1.7±0.05
P4±0.10
1.75±
0.10φ1.5 +0.10
0
φ1.0±0.10
0.23 ±0.05
5゚
3.5±0.
05
0.75 ±0.05
8±0.20
2±0.05P4±0.10
A-A
B-B
A A
B
B
2.25±0.
05
1.4±0.05 5゚
Product name SC-16S Product name SC-12S
P4.0±0.10φ1.5 +0.10-0
φ0.5±0.10
0.23±0.05
A-A
B-B
A A
B
B 0.6±0.05
8.0±0.
2
1.75±0
.103.5
±0.05
4.0±0.10 2.0±0.05
5゚MAX
5゚MAX
1.8±0.
05
1.2±0.05
P4.0±0.10φ1.5 +0.10-0
φ0.5±0.10
0.20±0.05
A-A
B-B
A A
B
B 0.63±0.05
8.0±0.
2
1.75±0
.103.5
±0.05
4.0±0.10 2.0±0.05
5゚MAX
5゚MAX
1.38±0
.05
1.18±0.05
Remarks Precautions for handling reels (1) Store at normal temperature and normal humidity (refer to standard conditions of JIS Z-8703 labora-
tory). Avoid storing for a long time and mount the crystal units immediately after unpacked.[Normal temperature: +15 to 35°C Normal humidity: 25 to 85%RH]
(2) Handle outside boxes and reels with care.Tapes and reels may be deformed by external pressure.
21
MEMO
IMPORTANT1. The information herein is subject to change without notice.2. Neither reproduction, duplication nor unauthorized use of this catalog
in whole or part is allowed without the prior written approval of Seiko Instruments Inc.
3. The colors of the products reproduced herein (“Products”) may be dif-ferent from the actual colors. Check colors on actual products before using the Products.
4. Circuits and respective application methods described herein are for ref-erence only. Seiko Instruments Inc. shall not be liable for any damages or losses resulting from any claim by third parties that any Products or application methods described herein infringe any right intellectual
property right. All intellectual property rights with respect to the Products belong exclusively to Seiko Instruments Inc.
Seiko Instruments Inc. does not grant users of the Products any right or license to the Products hereunder.
5. When Products include Strategic Products (or Services) stipulated in the Foreign Exchange and Trade Control Law, they shall not be exported without permission of governmental authorities.
6. In the case that the Products described herein are used in a specific applicationwhere high reliability is required, such as transport vehicle, control equipment for such vehicles, aircraft, railway vehicles, water transport vessel, or medical equipment with the purpose for maintaining life indefinitely, prior consultation with our sales office is required.
Released in April 2016
Contact us
No.QTC2003EJ-02C1604
(Specifications are subject to change without notice.)
MC Y K MC Y K
(1) Quartz Crystal Division of Seiko Instruments Inc. and affiliates, which is responsible for manufacturing the products described in this catalogue, holds ISO 9001 and ISO 14001 certification.
(2) SII Crystal Technology Inc. Tochigi site holds ISO/TS 16949 certification.
Shenzhen OfficeRoom 2212-15, Office Tower, Shun Hing Square,Di Wang Commercial Centre, 5002 Shen Nan Dong Rd.,Shenzhen 518008, ChinaTEL:+86-755-8246-2680FAX:+86-755-8246-5140
4-5/F, Wyler Centre 2, 200 Tai Lin Pai Rd.,Kwai Chung, N.T., Kowloon, Hong KongTEL:+852-2421-8611FAX:+852-2480-5479E-mail:[email protected]://www.sih.com.hk
Room 2701-2703, 27th Floor, Shanghai Plaza, 138 Mid Huaihai Rd.,Shanghai 200021, ChinaTEL: +86-21-6375-6611 FAX: +86-21-6375-6727
12F, No.101, Sec.2, Nanking E.Rd., Taipei 104, Taiwan,R.O.C.TEL:+886-2-2563-5001FAX:+886-2-2563-5580E-mail:[email protected]://www.sii.com.tw
Siemensstrasse 9, D-63263 Neu Isenburg, GermanyTEL:+49-6102-297-0FAX:+49-6102-297-50100E-mail:[email protected]://www.seiko-instruments.de
21221 S. Western Ave., Suite 250, Torrance, CA 90505, U.S.A.TEL:+1-310-517-7771FAX:+1-310-517-7792E-mail:[email protected]://www.sii-crystal.com
Europe North/Central/South America
Asia
1-8, Nakase, Mihamaku, Chiba-shi, Chiba 261-8507, JapanTelephone:+81-43-211-1214 Facsimile:+81-43-211-8030E-mail:[email protected]
<Manufacturer> SII Crystal Technology Inc.1110, Hirai-cho, Tochigi-shi, Tochigi 328-0054, Japan
Quartz Crystal Sales Department
Printed with soy ink.
Printed on recycled paper
Quartz CrystalProduct Catalogue