complexing agent, and an alkali metal hydroxide; and electroplat- ing the coated moldings, wherein the electroless copper plating solu- tion has pH of 10 to 14.

RADIATION-CURABLE COATlNGS US. Patent 6332,291. Dec. 25,200l C. Flosbach et al., assignors to Herberts GmbH & Co. KG, Wuppertal, Germany A coating composition, which is curable by means of high-energy radiation, comprising oligomeric or polymeric compounds having a number average molecular weight of 300 to 1,000; at least one compound selected from the group consisting of monomeric, oligomeric, and polymeric com- pounds having at least one func- tional group; one or more pho- toinitiators; and, optionally, at least one of solvent, water, pig-

ments, extenders, and conven- tional additives.

ELECTROLYTIC MEmOD FOR STRIPPING ELECTROLESS NICKEL US. Patent 6,332,970. Dec. 25,200l B. W Coffey, Lenoir, N. C. A method for stripping electroless nickel deposits from a substrate selected from the group consist- ing of iron, cast iron, steel alloy, stainless steel, aluminum, elec- troplated nickel, cast nickel, iron, nickel-cobalt alloy, sulfamate nickel, and titanium comprising immersing in an electrolytic bath a compound selected from the group consisting of oxoacids, oxoacid salts, and combination thereof, and hydrogen peroxide; and stripping the electroless nick- el deposits by electrolysis.

SOLDER ELECTROPLATlNG US. Patent 6,334,937. Jan. 1,2002 R. W Batz, Jr et al., assignors to Semitool Inc., Kalispell, Mont. An apparatus for plating solder on a microelectronic workpiece comprising a reactor chamber adapted to hold an electroplating solution; a chemical delivery sys- tem to provide the electroplating solution; a workpiece support including a contract assembly for providing electroplating power to a surface at a side of the work- piece that is to be plated; and a consumable anode.

PLURAL-LAYER ELECTRODEPOSITED COAllNG US. Patent 6334,940. Jan. 1,2002 H. Muramoto and l’! Yamamoto, assignors to Nippon Paint Co. Ltd., Osaka-fu, Japan

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