Upload
vonhan
View
215
Download
0
Embed Size (px)
Citation preview
AACD2019 Organizers
Cultural Association
With the support from
Scientific Committee Andrea Baschirotto - Univ. Milan-Bicocca (Italy)
Pieter Harpe - Univ. Eindhoven (The Netherlands) Kofi Makinwa - Delft Univ. of Tech. (The Netherlands)
Organizing Committee Andrea Baschirotto - Univ. Milan-Bicocca (Italy)
Piero Malcovati – Univ. Pavia (Italy)
Contact information Andrea Baschirotto
E-mail: [email protected] Phone: (+39)-338-4153105
AACD Series web-site: www.aacd.ws
AACD2019 web-site: www.innotechevents.com/aacd2019
AACD2019 Sponsors
Platinum
Gold
Silver
Bronze
Preliminary Program
Announcement
AACD 2019
XXVIII Workshop on Advances in Analogue Circuit and Design
www.aacd.ws www.innotechevents.com/aacd2019
- High Tech for Space -RedCat Devices
AACD 2019
Milan (Italy), April 1st-3rd , 2019
About AACD2019 The AACD workshops are a highly rated series of events
established in 1992 and, since then, held yearly. In the past, the AACD workshop has been held in Scheveningen, Leuven, Eindhoven, Villach, Lausanne, Como, Copenhagen, Nice,
Tegernsee, Noordwijk, Spa, Graz, Montreux, Limerick, Maastricht, Oostende, Pavia, Lund, Graz, Valkenburg, Grenoble,
Lisbon, Neuchatel, Villach, Eindhoven, Edinburgh. The aim of the AACD workshop is to bring together a group of
analog/RF circuit design experts, who are committed to advancing the frontiers of analog circuit design, and to brainstorm about new possibilities and future developments. The workshop is held in places where many such experts are locally available. The proceedings are available at the workshop. Afterwards, a
book containing the revised proceedings is edited and published by Springer.
AACD2019 Venue
The AACD 2019 workshop will take place on 1st–3rd, April, 2019 at University of Milano-Bicocca in Milan (Italy).
How to reach Milan
By plane Milan Linate Airport (12 km from AACD venue), Milan Malpensa
Airport (54 km from AACD venue), Milan Bergamo Airport (46 km from AACD venue).
By train Milan is a railway gateway within Italy, so trains are available
from virtually everywhere.
Accommodation information Information on accommodation in Milan can be found on the
workshop website.
Social Events (fully included in the registration)
April, 1st, 2019 Museum Social Event
Museo Nazionale Scienza e Tecnologia "Leonardo da Vinci"
April, 2nd, 2019 Gala Dinner
Pavarotti Milano Restaurant Museum
About Milan
Milan is the 2nd-largest city in Italy. Located in the Lombardia region, in Northern Italy, Milan is considered the economical capital of the country.
Milan is considered a leading alpha global city, with strengths in the field of the art, commerce, design, education, entertainment, fashion, finance,
healthcare, media, services, research, and tourism. Its business district hosts Italy's Stock Exchange and the headquarters of national and international
banks and companies
Milan has the third-largest economy among European cities after Paris and London, but the fastest in growth among the
three, and is the wealthiest among European non-capital cities. The city has been recognized as the world’s fashion capital and
the world’s design capital. Milan has also been able to establish itself as a center for microelectronics
and electronics and as a high-tech hub.
All of the most important multinational companies in the areas of microelectronics and microsystems, telecommunications, and information
technology have design centers or offices in the Milan area.
AACD 2019 Preliminary Program
April, 1st, 2019 Next-Generation ADCs
Chairman: Kofi Makinwa G. Manganaro, (ADI), “Emerging ADCs” N. Sun, (Univ. of Texas), “Noise-shaping SAR ADCs” M. Ortmanns (Univ. of Ulm), “Efficient High-Resolution Nyquist
ADCs” M. Bolatkale (NXP), “Continuous-Time ADCs for Automotive
Applications” S. Pavan (IIT Madras), “Continuous-Time ADCs with FIR
Feedback” B. Verbruggen (Xilinx), “High-Speed ADCs for Wireless
Applications”
April, 2nd, 2019
High-Performance Power Management Chairman: Pieter Harpe
N. Butzen (KU Leuven), “Advanced Multiphasing: Pushing the Limits of Fully Integrated Switched-Capacitor Converters”
J. Wittmann (Dialog), “High-Efficient Power Management in Wearables and IoT Devices”
M. Kashmir (Bosch, USA), “Current Sensing Techniques: Principles and Readouts”
C.-M. Zetterling (KTH), “Wide Bandgap Integrated Circuits for High Power Management in Extreme Environments”
J. Thoné (MindCet), “On the Limits of Driving Wide-Bandgap Transistors”
S. Morini, D. Respigo (Infineon), “Challenges in Driving New Generations of Power Switch for Motor Drive”
April, 3rd, 2019 Technology Considerations for Advanced IC
Chairman: Andrea Baschirotto B. Chandhoke (Globalfoundries), ”Silicon Technologies for the
Next Age of Wireless/Optical Connectivity" M. Pagani, P. Rossi, R. Lombardi (Huawei), "IC Technologies for
mm-Wave Applications" A. Onetti (STMicroelectronics), "IC Technologies for Advanced
MEMS-Based Smart Sensors" M. Poezart, A. Laville, M. Pardoen, G. Close, and D. Gerna,
(Melexis), “Robustness, Reliability and Diagnostic Aspects in Sensors for Automotive Applications: the Magnetic Sensors Case"
U. Gatti, C. Calligaro (Redcat Devices), “Rad-Hard Analog IC Design, Theory and Implementation”
M. De Matteis, C. Enz, S. Mattiazzo, A. Pipino, F. Resta, A. Baschirotto, (Univ. Milan-Bicocca, INFN), “1-GRad-TID Effects in 28nm Devices Study for Rad-Hard Analog Design”