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Optimizing Smart Manufacturing - Reducing Cost and Time-to-Market with New Sensing and Communication Technologies Vipin Bothra Santa Clara, CA May 2019

Reducing Cost and Time-to-Market with New Sensing and

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Page 1: Reducing Cost and Time-to-Market with New Sensing and

Optimizing Smart Manufacturing -Reducing Cost and Time-to-Market with New Sensing and Communication Technologies

Vipin Bothra

Santa Clara, CA

May 2019

Page 2: Reducing Cost and Time-to-Market with New Sensing and

Optimizing Smart ManufacturingOptimizing Smart Manufacturing -- Reducing Cost and Time-to-Market with New Sensing and Communication Technologies

While consumer devices led the introduction of solid-state sensors, Industrial applications are driving innovations for best-in-class sensors coupled with communication technologies. Designing for Industrial environments requires addressing the unique challenges of noise robustness, interoperability and real-time operation. This session will cover:• Latest developments in sensors (Accelerometers, Gyroscopes, Microphones, Temperature, Humidity

and Time-of-Flight);

• Communication solutions (real-time Ethernet and IO-Link) for the Industrial applications;

• Examples of ready-to-implement solutions that address challenges in cost and time-to-market.

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Page 3: Reducing Cost and Time-to-Market with New Sensing and

Smart IndustrySmart Industry Focus 3

Internet connected Industrial devices

Billionsof installed devices

ST SAM ($Bn) 2017 2020 CAGR

Manufacturing & Process Automation

9.4 12.8 12%

Medical 4.3 5.9 11%

Military & CivilAerospace

3.0 3.7 8%

Power & Energy 5.0 6.9 11%

Source: IHS Markit, ABI Research

Focus Growth Areas

0

2

4

6

8

10

12

2017 2018 2019 2020 2021

Utilities, Industrial IoT, Retail, Advertising, and Supply Chain

Page 4: Reducing Cost and Time-to-Market with New Sensing and

1st

Mechanical production equipment driven by water

and steam power

Industrial Revolution 2nd

Mass production achieved by division of labour

concept and the use of electrical energy

Industrial Revolution 3rd

Based on the use of electronics and IT to

further automate production

Industrial Revolution 4th

Use of cyber-physical systems, communications,

IoT and decentralized decisions

Industrial Revolution

18th century 20th century 1970’s Today

All new machines Change of driving mechanism

Machines largely replaced

Machines partially replaced - connected

From Industry to Smart Industry 4

Page 5: Reducing Cost and Time-to-Market with New Sensing and

Big data & Cloud computing

Local, mass customized production

Producing more efficiently and in more environmentally friendly manner

Evolved man-machine cooperation

Safer working environments

More efficient operation

Less waste

Collecting and using manufacturing and supply chain data better

Responding to demand more flexibly and with more

customization

With a better and safer human experience

How will Industry evolve? 5

Page 6: Reducing Cost and Time-to-Market with New Sensing and

Industrial Sensors 6

Temperature sensorsAnalog and digital contact temperature sensors

Humidity sensorsCombo humidity and temperature sensor

Pressure sensorsWith water proof solutions

Accelerometer Ultra Wide Bandwidth, Ultra low power

GyroscopeWide Bandwidth and Smart Features

MagnetometerLow-Noise, Low Power

MicrophonesAnalog, digital, top and bottom port solutions

Time of FlightHigh precision, surface agnostic distance measure

Environmental

Motion

Acoustic

Optical

Page 7: Reducing Cost and Time-to-Market with New Sensing and

Time of FlightVL53L0X: World’s smallest ToF Ranging sensor

• Fully integrated (IR 940nm Vcsel emission, filters, SPAD receiving array, advanced µC)

• Various operating modes available:• Long range: Up to 4 meters (white target, dark, 33ms)• High-Accuracy: Up to +/- 3%• Low power: 10uA-standby, ~200uA in nominal operation • High-Speed: Configurable timing budget (up to 30Hz)

• Better ambient light robustness and no visible red glow (940nm)• Laser Class1 device (eye safe)• Complete Android SW driver provided by ST

7

OLGA: 4.9x2.5x1.56 mmFoV: 15-27° (programmable)

VL53L1X ApplicationsObject / user detection• Autonomous mode with interrupts• Vacuum cleaners: Obstacle avoidance• Smart home• IoT

Simple & robust gesture recognition• Control of devices• Loudspeaker• Coffee machines• White goods

Page 8: Reducing Cost and Time-to-Market with New Sensing and

Connectivity Optionsto Match the Needs of Industrial Environments

8

P2p, Industrial Fieldbus, Industrial Ethernet

Wired Connectivity Wireless Connectivity

Retrofit, flexibility of technologies and protocols, interoperability with Ethernet and Cloud

Any Industrial protocol for any STM32

And more ..

Page 9: Reducing Cost and Time-to-Market with New Sensing and

Wired ConnectivityIO-Link: from ICs to Development support

9

STEVAL-IFP016V2

L6360Single port Master PHY for IO-Link and SIO mode

• Supply voltage up to 32.5 V• Up to 200 mW max. power dissipation• Over-voltage (>36 V) and over-temperature protection• ESD protection according IEC 61000-4-2• Conform to IEC 61000-4-4, IEC 61000-4-5

L6362ATransceiver Device for IO-Link and SIO mode

• Configurable Output stage: High Side, Low Side, Push-Pull• Reverse Polarity and Surge protections on chip• Up to 400 mA output Current with Overload and Cut-OFF

protections • 5 V or 3.3 V / 8 mA selectable linear regulator

STEVAL-IFP017V3

Page 10: Reducing Cost and Time-to-Market with New Sensing and

10

Wide STM32 offer as host controller

All real-time Ethernet slave stacks available

Industrial IoT and Industry 4.0MQTT and OPC-UA

Hilscher netX connects the STM32 to Real-Time Ethernet

Wired ConnectivityRT Ethernet development partner

Page 11: Reducing Cost and Time-to-Market with New Sensing and

11

IEEE 802.3 Ethernet PHY

IEEE 802.3 Ethernet MAC Dedicated slave controller

TCP/IP UDP

Ethernet/IPPROFINETModbus TCP

Ethernet/IPPROFINET

RT…

Ethernet/IPEtherCATCC-Link IE

PROFINET IRTSercos IIIVaran …

Hardware

Software

User application

IEEE 802.3 Ethernet PHY

User application

Real-timecapability

~1 ms ~10 µs

Priority Scheduling

Latency

Managed switch controller

Bandwidth

NUCLEO-F767ZI + netSHIELDSTM32 Nucleo-144 development

board with STM32F767ZI

Wired ConnectivityDemanding real-time application solutions

Page 12: Reducing Cost and Time-to-Market with New Sensing and

Connectivity Optionsto Match the Needs of Industrial Environments

12

P2p, Industrial Fieldbus, Industrial Ethernet

Wired Connectivity Wireless Connectivity

Retrofit, flexibility of technologies and protocols, interoperability with Ethernet and Cloud

Any Industrial protocol for any STM32

And more ..

Page 13: Reducing Cost and Time-to-Market with New Sensing and

ST BLE Portfolio Roadmap13

PERFORMANCE LINE

FEAT

UR

ES

BlueNRG-MSBLE4.1 Network processor

QFN32, WLCSP34

BlueNRG-2BLE5.0 Application processor

Cortex-M0 32MHz, 256KB QFN32, QFN48, WLCSP34

STM32WBxxBLE5.0 Application processor

Multi-standard: Thread, Zigbee, prop 2.4GHzDual core Cortex-M4 / M0+

Flash: 256K up to 1MBRAM: 128K up to 256K

UQFN48, VQFN64, WLCSP100

BlueNRG-LPBLE5.0 Application processorCortex-M0+ 64MHz, 256KB

Flash, up to 36 GPIOsQFN, WLCSP

(in development)

Single Core BLE

Dual-Core BLE

BlueNRG-1BLE4.2 Application processor

Cortex-M0 32MHz, 160KB QFN32, WLCSP34

VALUE LINE

Page 14: Reducing Cost and Time-to-Market with New Sensing and

BlueNRG-2 SoC at a GlanceThe lowest power

consumption

>3 years lifetime on CR2032(*)

25 µA/MHz0.9 µA sleep

(*) Based on the average current consumption in connection mode (7.059 μA, connection interval 1000 ms)

Low-power architecture, Cortex-

M0 @ 32 MHz

Flexible memoryarchitecture

256 KB eFLASH24 KB ULL SRAM

(with full SRAM data retention)

Processing power on demand

Maximum security

ECC-256AES-128

Factory UIDSecure KEY

Optimized BLE Radio stack

70 kB FLASH8 kB RAM

0.9uA with full RAM retention

Sensors

Robust and Reliable BLE Link

Comprehensive tools for developers

Seamless connection with SENSORS

Small form factor

Privacy 1.2 and secure connection 4.2

Faster and more reliable data transfer

Bluetooth 5.0 certified

Low power budget

5 data

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Page 15: Reducing Cost and Time-to-Market with New Sensing and

BlueNRG for 2.4 GHz Proprietary RadioWireless Link Through a Proven 2.4 GHz Radio

Open RF SoC solutionUltra-low latency RF link (~100µs) for HID and gaming solutions

• Built-in acknowledge mechanism• Proprietary implementation possible• Improved data rate (~600 Kbps)• Small memory footprint (~5 Kbyte)• Encryption feature supported

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Page 16: Reducing Cost and Time-to-Market with New Sensing and

Extending Bluetooth’s Capabilities

one-to-onePAIRING

DATA TRANSFER- Sports & fitness devices- Health and wellness devices- Peripherals and accessories

one-to-manyBROADCASTING

LOCALIZED INFORMATION- Point of interest beacons- Item finding beacons- Way finding beacons

many-to-manyMESH

LARGE DEVICE NETWORKS- Building automation- Wireless sensor networks- Asset tracking

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Page 17: Reducing Cost and Time-to-Market with New Sensing and

Bluetooth Mesh TopologyManaged Flooding

PROXYNODE

RELAYNODE

RELAYNODE

RELAYNODE

NODENODE

NODE

NODE

RELAYNODE

LOW POWER NODELOW

POWER NODE

Advertising Bearer

Advertising “not relayed”

Advertising “Low power”

GATT (BLE connection)

The Bluetooth Mesh working group chose a flooding protocol for mesh network mechanism. Compared to routed protocols, it is much simpler to deploy. To stay

efficient, the BLE Mesh takes advantage of a managed flooding network.

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Page 18: Reducing Cost and Time-to-Market with New Sensing and

ST EnablersProducts & Solutions

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Page 19: Reducing Cost and Time-to-Market with New Sensing and

End-to-End Approachfrom Sensors to Cloud

19

Sensing

Processing

Products Solutions and fast prototyping Long lifetime support

Reference Design

Fast Prototyping and Development KitsSecurity

Connectivity

Page 20: Reducing Cost and Time-to-Market with New Sensing and

Feature highlight, prototyping

Discovery Kits

Full features evaluation

Evaluation BoardsSTM32 Nucleo Boards

Fast agile prototyping

ST EnablersFocus on products: STM32 and hardware tools 20

Sensing ProcessingSecurityConnectivity

Page 21: Reducing Cost and Time-to-Market with New Sensing and

Modular Hardware 21

32 expansion boards and growing… covering all the key functionsSense

5

Connect

9

PowerDrive

3

Move Actuate

12

Translate

3

27 development boards and growing… in two flavors (Processing and Security)

Covering all STM32 microcontroller families and different development needs

Motion & environmental sensors

Proximity sensorMicrophone

BLEWi-Fi

Sub-GHzNFC

Power managementLED boost

Motor driveActuator

Audio amplifierOp-Amp

Page 22: Reducing Cost and Time-to-Market with New Sensing and

Pre-integrated Application Packages 22

integrating functionality from several expansion boards

Function PacksPre-packaged functionalities

used in most popular application domains

Smart Industry

Cloud Prototyping

STM32Cube Hardware Abstraction Layer (HAL)

STM32 Nucleo development boards

STM32 Nucleo expansion(X-NUCLEO)

STM32Cube middleware STM32Cube

expansion HAL

High value middleware STM32Cube expansions

Pre-integrated application examples (Function Packs)

3 Cloud providers SDK supported for direct connection to the Cloud

Libraries (Audio, Connectivity, Sensor ..) with examples and free license

Pre-integrated drivers and libraries with usage examples for STM32 Nucleo expansion boards

22

32

Page 23: Reducing Cost and Time-to-Market with New Sensing and

23

MEMS Sensors

& Drivers

SW Tools

HW Tools

ST Sensors & Motion AlgorithmsComplete package to support development of custom application

MEMS Sensors & Drivers

http://www.st.com/content/st_com/en/support/resources/product-longevity.html

X-CUBE_MEMS1• Package with example

code, libraries and sample apps for STM32 dev ecosystem

X-CUBE_MEMS_XT1• Sensor and DSP

algorithm expansion software pack for STM32

Algobuilder• SW tool for libriary

development

SW ToolsHW Tools

STM32 Nucleo board • Evaluation board based

on different MCU core: M0+, M3, M4

X- Nucleo expansion board• MEMS sensor Plug-in

board for Nucleo

Unicleo-GUI• GUI to configure MEMS

devices and display sensor & apps output

Accelerometer

Gyroscope / IMU

Magnetometer eCompass

Pressure Sensor

Page 24: Reducing Cost and Time-to-Market with New Sensing and

ST MEMS complete software solution 24

Low-level Drivers

Standard C Platform Independent driversWindows driversLinux drivers

X-CUBE-MEMS-XT1X-CUBE_MEMS1

Development Tool based on Low level drivers Runs on STM32Sample implementation of device embedded features

Libraries

Generic sw librariesAccuracy, Calibration, Positioning, Activity tracking, Health monitoring

Dedicated sw librariesFSM & Prog Sensor Libs

AlgoBuilder Tool Dedicated software Tool for libraries developmentGraphical design apps to build and use algorithms

Go to st.com

Go to ST.com

MEMS and Sensors Software -STMicroelectronics

Open.MEMS - STMicroelectronics

From drivers to software development tools

Page 25: Reducing Cost and Time-to-Market with New Sensing and

25System Solutions Development Platforms

General Purpose Wearable & IoT

AudioMEMS Evaluation ProfiMEMSMainboard supports most MEMS devices via 24-pin socket

STEVAL-MKI109V3

X-NucleoSet of modular developer boards Designed around the STM32 microcontroller family motherboards and sensor expansion boards as for Motion MEMS, Environmental and Microphones

Sensor TileBluetooth low energy, with a wide spectrum of motion and environmental MEMS sensors, and microphone

STEVAL-STLKT01V1

Blue CoinMultiple microphones, Proximity, Environmental and Motion sensing + BLE

STEVAL-BCNKT01V1

NFC Tag Sensor Node SmarTAGDynamic NFC Tracker with sensors

STEVAL-SMARTAG1

IoT & CloudIoT DiscoverySensorized IoT node, allows direct cloud connections

STM32F0DISCOVERY

Page 26: Reducing Cost and Time-to-Market with New Sensing and

Thanks

26

Page 27: Reducing Cost and Time-to-Market with New Sensing and

Motion MEMS Sensors for Smart Industry

16

IIS2DLPCAccelerometer - Wide Bandwidth, Ultra-low-power

ISM330DLCCombo accelerometer & Gyroscope & -

Wide Bandwidth

IIS3DWBAccelerometer - Ultra Wide Bandwidth LGA-14 2.5x3mm2

3D Accelerometer – 16g Full ScaleDigital Output Ultra Low Noise / Bandwidth (Min 5KHz)Up to 105°C Operating Temp

IIS2MDC3-axis, High Accuracy Magnetometer

Low-Noise, Low Power

LGA-14 2.5x3mm2

LGA-12 2x2mm2

3D Accelerometer + 3D Gyro - Digital OutputAccelerometer with Wide Bandwidth (up to 3 kHz)Ultra Low Power and Smart Features

3D Accelerometer – Digital OutputWide Bandwidth (up to 2.3 kHz)Ultra Low Power – Ultra Compact

3D Magnetometer – Digital OutputAMR Technology - up to 50 Gauss Full ScaleUltra Low Noise, Low Power

LGA-12 2x2mm2

I3G4250D3-axis, High Accuracy Magnetometer

Low-Noise, Low Power

Image stabilizationHigh thermal stability

LGA-12 2x2mm2

Page 28: Reducing Cost and Time-to-Market with New Sensing and

Environmental Sensors for Smart Industry

HTS221Humidity and Temp Sensor – High Accuracy

LPS33HWPressure Sensor – Water Resistant

LPS22HHPressure Sensor: Dust resistant,

High Accuracy – Compact Size HLGA-10L 2x2x0.76 mm

Absolute Pressure Sensor260 to 1260 hPa Range - Digital OutputHigh Accuracy (±1 hPa)Low noise (0.75 Pa RMS)Ultra Compact full molded package

STTS751Digital Temperature Sensor

3.3x3.3x2.9 mm

HLGA-6 2x2x0.9mm2

Absolute Pressure Sensor260 to 1260 hPa Range - Digital OutputHigh Accuracy (±2.5 hPa)Low noise (0.8 Pa RMS)Water resistant up to 10 ATM

Digital OutputHigh Accuracy:

• Humidity: ±3.5 %RH• Temperature: ±0.5 deg

Low Power; Supply voltage: 1.7 to 3.6 V

Accuracy: ±1.0 ºC ; Programmable resolutionUDFN-6L or SOT23-6L

TO92/SO8 Accuracy ±1.0 °C ; Op. Temp up to 150 °CLM235 / STLM20Analog Temperature Sensor

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Page 29: Reducing Cost and Time-to-Market with New Sensing and

MEMS Microphones for Smart Industry

3.35x2.5x0.98 mm

Bottom Port MicrophoneAnalog Differential OutputWide Acoustic Bandwidth (up to 80 kHz) Wide Dynamic Range (AOP up to 130 dBSPL)

3.25x1.9x0.8 mm

Bottom Port MicrophoneAnalog Differential OutputWide Acoustic Bandwidth (up to 80 kHz) Wide Dynamic Range (AOP up to 135 dBSPL)

Integrated Temperature Sensor With High Accuracy (+/-0.5 °C)

3x4x1 mm

Top Port MicrophoneDigital OutputWide dynamic range (AOP up to 122 dBSPL)-26dBFS + 3 dB sensitivity

STTS751EMTemperature sensor and Microphone Module

MP23ABS1Analog Differential Microphone

IMP34DT05Digital Top Port Microphone

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