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Residual Stresses and Thermoviscoelastic Deformationof Laminated Film Prepared for Film Insert Molding
Sung Ho Kim, Seong Yun Kim, Seung Hwan Lee, Jae Ryoun YounResearch Institute of Advanced Materials (RIAM), Department of Materials Science and Engineering,Seoul National University, Gwanak-Gu, Seoul 151 742, Korea
Residual stresses and thermoviscoelastic deformationof a laminated film utilized for film insert molding wasinvestigated through measurement of thermal expan-sion coefficient (CTE) and relaxation modulus. Thermo-viscoelastic deformation of the film was also analyzedwith numerical analysis by applying measured relaxa-tion modulus, CTE, and residual stress to finite ele-ment method (FEM). Stress relaxation of the pristinefilm showed significantly different behavior from thatof the unannealed film during annealing. Effects of theCTE and relaxation modulus on the thermoviscoelasticdeformation were predicted by considering thermalshrinkage and structural relaxation. Moreover, numeri-cal results on thermoviscoelastic deformation were ingood agreement with experiments when initial stressdistribution in the solid specimen was applied to thenumerical analysis. POLYM. ENG. SCI., 52:1121–1127, 2012.ª 2011 Society of Plastics Engineers
INTRODUCTION
Film insert molding (FIM), known as in-mold decorat-
ing, is one of the various coating technologies to perform
surface modification of injection molded parts. In general,
a film is inserted into a mold and then the cavity is filled
by a molten resin such that physical bonding is induced
at the interface between the film and the resin. Therefore,
it is possible to conduct the FIM process at short cycle
time and comparatively low cost due to one-step process
without post-processing, e.g., printing patterns on a film
and attaching it over the substrate. It has also been
applied to various products, such as mobile phone cases
with logo design, automotive parts, and packaging materi-
als, and will be utilized in more industrial fields. How-
ever, it is well known that many problems such as wash-
ing-off of printed ink, delamination, wrinkling, and
remelting of the laminated film occurred at the surface of
final film insert molded parts [1]. Frequently, cited studies
[2–4] reported that other processing defects, e.g., un-
desired creases, folded lines, and severe warpage, were
generated at the near weld-line region when high shear
rate was applied to FIM process. It has also been reported
that unusual problems were observed due to thermal con-
ductivity difference between the solid film and the molten
resin during FIM and asymmetric residual stresses over
the film and substrate regions [5–7].
It is essential to evaluate effects of various parameters
on internal structure and physical properties of final FIM
parts and understand FIM process. Processing parameters
such as mold geometries and molding conditions should
play an important role in determining physical properties
and decorating performance of final FIM products.
According to recent studies [8–10], effects of various
processing conditions on viscoelastic behavior and ther-
mal deformation of FIM parts were investigated by evalu-
ating injection speed, melt temperature, packing time, and
so on. On the other hand, material parameters, e.g., physi-
cal and thermal properties of biaxially oriented film and
polymer substrate used in FIM parts, should be investi-
gated accurately. Many studies have been reported to
understand effects of above parameters on internal struc-
ture, processability, and final properties of FIM parts.
However, there have been few studies on thermovisco-
elastic deformation of polymeric raw materials although
final FIM products are affected by their internal structure
and physical properties. Since most laminated films and
substrates are polymeric materials and have time-depend-
ent viscoelastic properties, it is essential to comprehend
effects of material properties on processability and long-
term deformation behavior of final FIM parts [11, 12].
It is well known that asymmetric deformation is
induced by the difference in thermal expansion coefficient
(CTE) and thermal shrinkage between the laminated film
and the polymeric resin used in FIM parts [13, 14]. Since
the films were produced by biaxial orientation and anneal-
ing, they showed anisotropic properties. When they are
employed in the FIM process, they experience thermal
treatment by the injected hot resin. Therefore, thermal
and physical properties of FIM parts are affected signifi-
Correspondence to: Jae Ryoun Youn; e-mail: [email protected]
Contract grant sponsor: National Research Foundation of Korea (NRF)
grant funded by the Korean government (MEST) through the Intelligent
Textile System Research Center (ITRC); contract grant number: R11-
2005-065.
DOI 10.1002/pen.22182
Published online in Wiley Online Library (wileyonlinelibrary.com).
VVC 2011 Society of Plastics Engineers
POLYMER ENGINEERING AND SCIENCE—-2012
cantly by thermoviscoelastic properties of laminated films
with or without thermal treatment. According to the previ-
ous studies [8–10, 15], thermoviscoelastic deformation,
i.e., warpage reversal phenomenon (WRP), occurred for
final FIM parts because asymmetric residual stresses were
generated owing to different shrinkage of laminated films
and substrates during FIM process. FIM parts prepared by
using unannealed films showed the WRP during anneal-
ing, and the degree of WRP was affected significantly by
the molding conditions and thermal shrinkage of the used
films.
Effects of material parameters on the WRP and ther-
moviscoelastic deformation of the laminated film prepared
for FIM parts were investigated in this study through
measurement of the CTE, relaxation modulus, and resid-
ual stresses. Numerical analysis was carried out by using
finite element method (FEM) with hexahedron meshes. In
general, FEM analyses are performed with elastic or
viscoelastic models by assuming zero initial stresses in
substrate domains. However, to comprehend the residual
stress distribution and thermoviscoelastic deformation of
the laminated films numerically, initial residual stresses
should be considered for the FEM analysis of the
laminated film. Accuracy of the numerical analysis on
thermoviscoelastic deformation of the laminated film was
improved by applying measured CTE and relaxation
modulus of the laminated film to the FEM analysis.
Numerical results were compared with the experimental
data to understand how thermoviscoelastic deformation
was affected by newly developed residual stresses and
thermal shrinkage of the laminated film.
EXPERIMENTAL
Materials
Poly(methylmethacrylate) (PMMA)/acrylonitrile-buta-
diene-styrene (ABS) laminated films (Type-P, Nissha
Printing, Japan) were used in this study to investigate re-
sidual stresses and thermoviscoelastic deformation of the
laminated film used for FIM. As shown in Fig. 1a, it has
total thickness of 0.5 mm and was composed of two dif-
ferent film layers, i.e., PMMA (Sumipex MH, Sumitomo
Chemical Co., Japan) layer of 0.05-mm thickness and
ABS (Techno ABS-545, Techno Polymer, Japan) layer of
0.45-mm thickness. PMMA layer was used for printing,
and ABS layer was used as the supporting sheet. Tensile
specimens were prepared from the laminated films by
following ASTM D638 to evaluate effects of the CTE,
residual stresses, and relaxation modulus on thermo-
viscoelastic deformation of laminated films. Three types
of laminated films, i.e., unannealed curved film (UCF),
annealed flat film (AFF), and annealed curved film
(ACF), were used to understand effects of annealing on
thermoviscoelastic deformation of the pristine laminated
film. After laminated films were annealed, both curved
and flat films were obtained depending on annealing con-
ditions. The CTE and relaxation modulus measured for
the UCF specimen were used as the initial input data for
numerical stress analysis of laminated films. Experimental
results obtained for AFF and ACF specimens were com-
pared with the output data of the FEM analysis.
Coefficient of Thermal Expansion
The CTE is one of the most important parameters to
understand deformation of laminated films and FIM parts.
It is well known that the biaxially drawn films suffer from
structural relaxation after first heating and cooling due to
molecular orientation, but they have the same CTE value
after second heating [2]. To investigate thermoviscoelastic
deformation of the laminated film, the CTE was measured
with thermomechanical analysis (TMA, Q400EM, TA
Instruments, Utah, USA) under nitrogen atmosphere and
temperature range of 2208C–1208C. The linear thermal
expansibility is defined as
aT ¼ l� l0ð Þl0 T � T0ð Þ (1)
where aT represents the lattice parameter at temperature
T0, and a298 is the corresponding value at 298 K. Constant
values are commonly applied to the film, but the lami-
nated films used in this study consist of two materials that
have different thermal properties. Therefore, the differ-
FIG. 1. (a) Composition of Type-P film (PMMA, printing and adhesive
layer: 0.05 mm, ABS layer for backing: 0.45 mm); strain gages bonded
on film specimens for IHD: (b) UCF using the curved jig to drill the
curved film, (c) AFF using a flat jig.
1122 POLYMER ENGINEERING AND SCIENCE—-2012 DOI 10.1002/pen
ence of CTE between the PMMA and ABS layers
affected the deformation, warpage, final shape, and buck-
ling of the film as the applied temperature was varied.
Relaxation Modulus
Relaxation modulus is obtained by measuring the stress
with respect to time while maintaining constant strain. It
is one of the fundamental properties of materials that
determine viscoelastic stress development in polymeric
materials and can also be obtained from the creep compli-
ance test under static loading. Relaxation modulus was
measured for each layer to predict relaxation behavior of
the laminated film composed of two different polymeric
materials. Relaxation modulus of each PMMA and ABS
layer was measured at the temperature of 258C, 408C,608C, 808C, and 1008C under nitrogen atmosphere with
the dynamic mechanical analysis (DMA, Q800, TA
Instruments, Utah, USA) equipment. Fixed strain was
applied to the laminated film and then held stationary
during measurement. Stress required to maintain the fixed
deformation was measured with respect to time.
Residual Stresses
A special three element strain gage, rosette (CEA-XX-
062UL-120, Vishay Micro-Measurements, NC, USA) was
installed at a point of the film surface to evaluate the
residual stress variation. An incremental hole drilling
(IHD) method was adopted, and a blind hole was gener-
ated by drilling 10 incremental depth of 0.05 mm at 400
rpm. Instead of drilling five incremental depth of 0.1 mm
at 2000 rpm as in the previous work, 10 incremental dril-
ling was conducted at lower velocity to improve thermal
stability. Each interval between incremental drilling lasted
for about 70 sec for stabilization (45–180 sec depending
on materials) [9]. Some considerations should be made to
obtain good results from the IHD method for injection
molded parts. The IHD method should be conducted care-
fully to obtain consistent raw data for calculation of resid-
ual stresses in an injection-molded polymeric product.
Proper amount of the adhesive should be applied to the
rosette for the whole area to be attached and hardened for
about 12 hr to achieve perfect bonding between the
rosette and the specimen. Soldering is required for wiring
of the strain gage circuit, and the soldering should be fin-
ished as soon as possible. Centering and fixing of the drill
determine the quality of the hole drilled incrementally.
After each incremental drilling, a time interval is needed
for stabilization of the residual stresses before reading the
signal from the strain gage amplifier. The hole of 1.575-
mm diameter is normally drilled up to 1-mm depth at the
center of a rosette (062UL type), and the maximum hole
depth is 0.4 times the hole diameter as described by the
ASTM E837. The equation employed to calculate elastic
strain at the periphery of the drilled hole is given as
err ¼ Aþ B cos 2b� �
smax þ A� B cos 2b� �
smin (2)
where b is an angle measured counterclockwise from
maximum principle stress direction to the axis of the
strain gage, A ¼ �a 1þ mð Þ= 2Eð Þ and B ¼ �b= 2Eð Þ are
calibration constants, and rmax and rmin are principle
stresses [10, 11].
As shown in Fig. 1b, a curved jig made from paper
clay was used to measure residual stress distribution in a
curved film. The films were not flattened during IHD,
because they were supported by the curved jig. Residual
stress distribution of the annealed film was also measured
by drilling an incremental hole on the curved surface of
the film. Because flattened films are inserted in the cavity
for FIM process, residual stresses in the flattened film
should be measured as shown in Fig. 1c. Residual stresses
were measured at three different points, i.e., center, inter-
mediate, and edge regions of each layer to understand
effects of the film geometry. Since residual stresses were
changed during injection of molten resin, experimental
results were obtained by averaging five measured values
for each point to lessen experimental errors.
THREE-DIMENSIONAL NUMERICAL ANALYSIS
Thermoviscoelastic Stress Analysis
Thermoviscoelastic stress analysis was performed to
investigate the long-term deformation of laminated films.
It is well known that residual stresses are developed in
the FIM parts due to nonuniform temperature and pres-
sure distribution during cooling. Residual stress distribu-
tion of the film has been predicted by thermal stress anal-
ysis considering thermal shrinkage and viscoelastic prop-
erties [12–16]. It was assumed in this study that the
laminated film is transversely isotropic, and the visco-
elastic behavior satisfies the assumption of the thermo-
rheological simplicity. Initial residual stresses of the film
have not been usually considered for the structural analy-
sis. However, they were considered for residual stress
analysis in this study. The constitutive equation for the
linear viscoelastic material is expressed as follows.
t tð Þ ¼ G0 yð Þ g�Z t
0
gR x Sð Þð Þ � g t� sð Þds� �
(3)
gR nð Þ ¼ dgR=dn;
where the instantaneous shear modulus G0 is temperature
dependent, and n(t) is the reduced time.
x tð Þ ¼Z
ds
A y Sð Þð Þ; (4)
where A(y(S)) is a shift function at time S. The reduced
time concept for temperature dependence is usually
DOI 10.1002/pen POLYMER ENGINEERING AND SCIENCE—-2012 1123
referred to as thermorheologically simple (TRS) tempera-
ture dependence. The shift function is often approximated
by the following Williams-Landel-Ferry (WLF) form.
log Að Þ ¼ � C1 y� y0ð ÞC2 þ y� y0ð Þ ; (5)
where y0 is the reference temperature based on the glass
transition temperature at which the relaxation data are
given, and C1 and C2(K) are calibration constants
obtained at the temperature. If h � h0 � C2, elastic defor-
mation will occur based on the instantaneous moduli [17–
23]. Normalized shear relaxation modulus of the two
polymeric melts measured by the DMA is shown in
Fig. 2 and was used directly for the viscoelastic stress
analysis.
Residual stress distribution and deflection of the
annealed laminated film were predicted for three loca-
tions, i.e., center, intermediate, and edge regions of the
film after annealing for 30 min. Rectangular specimens
were modeled numerically by considering 10 layers of
hexahedral meshes within the 0.05-mm thick film for con-
vergence. It was assumed for numerical analysis that each
layer of the laminated film has the same residual stress
distribution. Numerical analysis was performed to obtain
viscoelastic stresses for three homogeneous regions of
symmetrical half model.
Finite Element Analysis
Residual stresses measured for 10 layers (incremental
drilling) were applied to FEM analysis of thermoviscoe-
lastic deformation of the laminated film to obtain more
accurate numerical results. Incremental depth used in the
IHD method was selected as 0.05 mm, which was the
same as thickness of the PMMA layer. It is well known
that the WRP of FIM parts came from the difference in
physical properties between the inserted film and the
injected substrate. Although the film used in this study
was very thin, residual stress distribution in the film was
needed for numerical analysis on thermoviscoelastic de-
formation of FIM parts, because the laminated film was
composed of two layers. Material properties needed for
the thermoviscoelastic finite element analysis are listed in
Table 1. A commercial stress analysis code, ABAQUS,
was used for viscoelastic stress analysis of the laminated
film by using eight noded hexahedral meshes listed in
Table 2.
RESULTS AND DISCUSSION
CTE and relaxation modulus of each layer should be
investigated to analyze thermoviscoelastic deformation of
the laminated films since biaxially oriented laminated
FIG. 2. Normalized relaxation modulus versus time: (a) master curve
of PMMA layer at 258C and (b) master curve of ABS layer at 258C.
TABLE 1. Material properties of PMMA and ABS resins for numerical
analysis.
Properties
PMMA
(Sumipex MH,
Sumitomo Chem.)
ABS (Techno
ABS-545,
Techno Polymer)
Elastic modulus (GPa) 2.74 2.24
Poisson’s ratio 0.355 0.392
Thermal conductivity
(W/m 8C)0.116 @ 758C(Temperature
dependent)
0.184 @ 908C(Temperature
dependent)
CTE (1/K) 21.16609E24 29.1268E26
Specific heat (J/kg 8C) 2444 @ 2208C 2202 @ 2008CSolid density (kg/m3) 1044.6 kg/m3 1054.1 kg/m3
TABLE 2. Finite element employed for thermoviscoelastic stress
analysis.
Mesh Hexahedron
Type C3D8RT
Number of elements 38,400
(3,840 EA 3 10 layers)
Initial condition 258CAnnealing condition 808C for 30 min
Viscoelastic property Relaxation tested by DMA
CTE Tested by TMA
1124 POLYMER ENGINEERING AND SCIENCE—-2012 DOI 10.1002/pen
films were used in FIM process. They were determined
by TMA and DMA measurements. As shown in Fig. 3,
negative CTE value was obtained because biaxial molecu-
lar orientation had been developed in the film during film
fabrication processing. The measured CTE was applied to
numerical analysis to take the thermal shrinkage of each
layer into account. Master curve of the normalized relaxa-
tion modulus is shown in Fig. 2, and stress relaxation of
the ductile ABS layer needs longer time than that of the
PMMA layer. Thermoviscoelastic property of the film
was identified by considering the master curve of relaxa-
tion modulus and the WLF model at the same time.
One of the typical methods of measuring residual stress
is the layer-removal method for polymeric parts [4]. How-
ever, it is difficult to apply the method to curved poly-
meric parts or those with complicated geometries.
Although the IHD method has been developed for com-
plex metallic parts, there have been many attempts to uti-
lize the method for polymeric parts. However, there have
been few studies on its applicability to polymeric films.
In this study, residual stresses in the curved laminated
film were investigated with the IHD method. Residual
stress distribution of the UCF and films annealed at 808Cfor 12 hr (AFF and ACF specimens) is shown in Fig. 4
with respect to the depth in the thickness direction. The
residual stress distribution of the UCF specimen was var-
ied as compression, tension, compression, and tension
ranged from PMMA layer of 0.05 mm to ABS layer of
0.45 mm, respectively. However, residual stresses of the
AFF specimen were varied conversely, i.e., tension, com-
pression, tension, and compression. It was found from the
experimental results that residual stresses of the UCF
specimen had been relaxed during annealing and then
new residual stress distribution was developed owing to
the deformation generated by the difference in the CTE
between PMMA and ABS layers. As shown in Fig. 2,
thermal shrinkage of the film was observed in the early
stage of annealing due to the relaxation of molecular ori-
entation that had been generated by the biaxial drawing
during film manufacturing. Figure 1b and c shows that
the pristine film used in this study was curved such that
the thin PMMA layer was protruded and compressive re-
sidual stresses existed in the PMMA layer. However, the
laminated film was almost flattened by stress relaxation of
both PMMA and ABS layers during annealing and then
the residual stress distribution was reversed.
It is well known that thermal shrinkage and residual
stresses play an important role in predicting the thermo-
viscoelastic deformation of final FIM products composed
of two polymeric parts [24, 25]. Therefore, thermal
shrinkage and residual stresses of the biaxially drawn film
should be investigated to perform thermoviscoelastic
stress analysis. All the CTE and residual stress data
obtained by linear dimensional measurement and IHD
method were used as the input to the FEM analysis.
Shape of the film predicted by the numerical method
before and after annealing is shown in Fig. 5, and the
numerical results gave a good agreement with the experi-
mental results. Residual stress contours in the specimen
were obtained as shown in Fig. 5a. Residual stress distri-
bution of the film specimen is shown in Fig. 5b and com-
pared with experimental one. Numerical results indicated
that application of proper thermal expansion coefficients
to numerical analysis can describe the irreversible relaxa-
FIG. 3. CTE of PMMA and ABS layers calculated by linear dimen-
sional change at 808C with respect to annealing time; CTE of PMMA
and ABS were 21.16609E24 (1/K) and 29.1268E26 (1/K).
FIG. 4. Experimental and numerical results: (a) film shape, numerical
before and after annealing, (b) length and height of the annealed curved
film (ACF) and annealed flat film (AFF) before and after annealing.
DOI 10.1002/pen POLYMER ENGINEERING AND SCIENCE—-2012 1125
tion behavior of the laminated film, and the viscoelastic
behavior can be modeled by using a shift function based
on the time temperature superposition theory. As shown
in Fig. 6, compressive stress in the PMMA layer turns
into tensile stress as the curved film was flattened after
annealing. Residual stresses in the laminated film were
influenced significantly by thermal shrinkage, and residual
stresses newly developed as a function of temperature.
CONCLUSIONS
Thermoviscoelastic deformation of a laminated film
composed of PMMA and ABS layers was investigated
with measurement of the CTE, residual stress, and relaxa-
tion modulus. Numerical analysis of the thermoviscoelas-
tic deformation was carried out by applying the measured
CTE and relaxation modulus to FEM. Residual stresses
and deformation of the annealed laminated film were
measured and predicted by the numerical analysis. Experi-
mentally measured residual stresses were used as the ini-
tial stress condition for numerical analysis, and more
accurate numerical results were obtained for stress distri-
bution and thermoviscoelastic deformation of the lami-
nated film. The negative CTE was also measured and
applied to the numerical analysis to describe thermovis-
coelastic deformation of the biaxially drawn PMMA/ABS
film. The numerical method was useful to perform the
structural stress and deformation analyses of laminated
films composed of two different types of polymers. It was
concluded from experimental and numerical investigations
that the predicted results were in good agreement with ex-
perimental results at the center region of the laminated
film, but they were different from the experimental results
obtained at the edge region due to asymmetric geometry
of the laminated film at the location.
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