S330 Technical

ZXMP S330(V1.10)SDH-Based Multi-Service Node Equipment

Technical Specification

Document Version R3.1

ZTE CORPORATION ZTE Plaza, Keji Road South, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P. R. China 518057 Tel: (86) 755 26773000 Fax: (86) (86) 755 0755-25737515, 0755-25732914 URL: http://www.zte.com.cn

LEGAL INFORMATION Copyright © 2005 ZTE CORPORATION. The contents of this document are protected by copyright laws and international treaties. Any reproduction or distribution of this document or any portion of this document, in any form by any means, without the prior written consent of ZTE CORPORATION is prohibited. Additionally, the contents of this document are protected by contractual confidentiality obligations. All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE CORPORATION or of their respective owners. This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose, title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the use of or reliance on the information contained herein. ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications covering the subject matter of this document. Except as expressly provided in any written license between ZTE CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter herein. The contents of this document and all policies of ZTE CORPORATION, including without limitation policies related to support or training are subject to change without notice.

Revision History

Date Product version Document Version Serial No. Description

2005/10/18 V1.10 R3.1 TS001R31 Technical Specification of ZXMP S330

Target Readers

This document is intended for any one who needs a general command of the features, applications, structure and technical specifications of ZXMP S330.

Structure of This Specification

This specification describes the system functions, hardware structure and configuration, network application and technical indices of ZXMP S330.

Chapter 1 System Functions

This chapter introduces typical functions and features of ZXMP S330, including cross-connect, service access, protection functions, system control & communication, etc.

Chapter 2 System Mechanical Structure

This chapter introduces system hardware mechanical structure and the adaptable cabinet installation of ZXMP S330.

Chapter 3 Boards And Slots

This chapter introduces the slots and boards of ZXMP S330, including names (code), applying rule and unit power consumption, etc.

Chapter 4 Application Of MSTP

This part presents basic networking characteristics and applications of MSTP service.

Chapter 5 Networking And Protection

This chapter presents protection modes (including equipment level and network level) and characteristics of ZXMP S330.

Chapter 6 Performances And Indexes

This chapter details the technical parameters, physical and networking performance of the ZXMP S330.

Chapter 7 Environment Adaptability

This chapter lists the environmental indices which ZXMP S330 can operate normally for a long term.

Chapter 8 Appendix

This chapter lists international standards to which S330 conforms and the reference abbreviations terms used in this specification.

CONTENTS CONTENTS............................................................................................................................... 1

CHAPTER 1 ........................................................................................................................... 4

SYSTEM FUNCTION ................................................................................................................ 4 1.1 SYSTEM OVERVIEW ....................................................................................... 4

1.2 CROSS-CONNECTION AND EXTENSION CAPABILITIES ....................................... 4

1.3 SERVICE ACCESS CAPABILITIES ..................................................................... 4

1.4 EQUIPMENT AND NETWORK PROTECTION CAPABILITIES ................................... 5

1.5 SYNCHRONOUS TIMING PROCESSING CAPABILITIES......................................... 5

1.6 SYSTEM CONTROL AND COMMUNICATION ....................................................... 6

1.7 OVERHEAD PROCESSING .............................................................................. 7

1.8 NETWORK MANAGEMENT CAPABILITIES.......................................................... 7

1.9 ALARM INPUT/OUTPUT .................................................................................. 8

1.10 SYSTEM POWER SUPPLY.............................................................................. 8

1.11 MAINTENANCE AND UPGRADE ...................................................................... 8

1.12 PERFECT EMC AND OPERATION SAFETY ..................................................... 8

CHAPTER 2 ........................................................................................................................... 9

SYSTEM MECHANICAL STRUCTURE ................................................................................... 9 2.1 APPEARANCE OF SUB-RACK........................................................................... 9

2.2 CABINET STRUCTURE .................................................................................... 9

2.3 SUB-RACK STRUCTURE ............................................................................... 10

2.4 DIMENSIONS AND WEIGHTS OF COMPONENTS ............................................... 10

CHAPTER 3 ......................................................................................................................... 12

BOARDS AND SLOTS ........................................................................................................... 12 3.1 INTRODUCTION TO THE BOARDS ................................................................... 12

3.2 SLOTS........................................................................................................ 12

3.3 CONNECTOR-TYPE FOR ALL KINDS OF SERVICE INTERFACE ........................... 14

CHAPTER 4 ......................................................................................................................... 15

APPLICATION OF MSTP........................................................................................................ 15

4.1 APPLICATION OF ETHERNET SERVICE........................................................... 15

4.2 APPLICATION OF ATM SERVICE.................................................................... 17

4.3 APPLICATION OF RPR SERVICE ................................................................... 18

CHAPTER 5 ......................................................................................................................... 20

NETWORKING AND PROTECTION ...................................................................................... 20 5.1 APPLICATION OF BASIC SERVICE.................................................................. 20

5.2 HARDWARE-LEVEL PROTECTION .................................................................. 20

5.3 NETWORK-LEVEL PROTECTION..................................................................... 22

5.4 PROTECTION SWITCH TIME .......................................................................... 23

CHAPTER 6 ......................................................................................................................... 24

PERFORMANCES AND INDEXES......................................................................................... 24 6.1 STM-N OPTICAL INTERFACES PERFORMANCE............................................... 24

6.2 PDH ELECTRICAL INTERFACES PERFORMANCE ............................................. 25

6.3 ERROR PERFORMANCE ............................................................................... 25

6.4 SFE×6 PERFORMANCE............................................................................... 25

6.5 AP1×4 PERFORMANCE ............................................................................... 28

6.6 OBA PERFORMANCE................................................................................... 29

6.7 OPA PERFORMANCE................................................................................... 29

6.8 DCM PERFORMANCE.................................................................................. 30

6.9 OPTICAL INTERFACE INDEXES ...................................................................... 31

6.10 ELECTRICAL INTERFACE INDEXES ............................................................... 31

6.11 JITTER INDEX AT INTERFACES ..................................................................... 32

6.12 CLOCK TIMING AND SYNCHRONOUS CHARACTERISTICS ................................ 36

CHAPTER 7 ......................................................................................................................... 38

ENVIRONMENT ADAPTABILITY ........................................................................................... 38 7.1 POWER SUPPLY REQUIREMENTS .................................................................. 38

7.2 GROUNDING REQUIREMENTS ....................................................................... 38

7.3 ENVIRONMENT REQUIREMENTS.................................................................... 38

7.4 EMC REQUIREMENTS.................................................................................. 41

7.5 SAFETY REQUIREMENTS .............................................................................. 43

CHAPTER 8 ......................................................................................................................... 45

APPENDIX .............................................................................................................................. 45 8.1 FOLLOWED STANDARDS............................................................................... 45

8.2 ABBREVIATIONS .......................................................................................... 48

Confidential and Proprietary Information of ZTE CORPORATION 4

C h a p t e r 1

SYSTEM FUNCTION 1.1 System overview

ZXMP S330 equipment is a brand-new, multi-functional and compact 2.5G MSTP equipment launched by ZTE. It’s a STM-16/STM-4/STM-1 integrated equipment, small in size, low in cost, and powerful in data service access capability. S330 is applicable to the construction of various transmission networks.

Based on a modular design, ZXMP S330 can fulfill the functions of different systems such as TM, ADM，MADM and REG without changing hardware. The TM and REG systems can be smoothly upgraded to ADM.

The protection capabilities of hardware and network level greatly enhance the reliability and stability of the system.

1.2 Cross-connection and extension capabilities The high-order cross-connection capability is 104×104 VC4, and the low-order cross-connection capability is 48×48TU-3（1008×1008 TU-12）.

The CS (cross-switch) board implements high-order and low-order cross-switching functions. CS supports matrix of AU-4, TU-3 or TU-12 level. The cross-connection is also used for protection switching.

The CS board of S330 can implement functions of DXC equipment to fulfill the straight-through, broadcast, add/drop, and cross-connection of services. In the equipment, both the tributary electrical interface and the optical line interface enter the cross-connection network and have equivalent connections.

1. Containing an APS protocol processor, which implements the APS protect switching of the multiplex section.

2. Monitoring the alarm information of AUs in all directions and implementing channel protection switching.

3. Monitoring the state of all service boards and implementing the 1: N board protection.

4. Working in the 1+1 backup mode.

1.3 Service access capabilities

Optical Interfaces ZXMP S330 provides three types of optical interfaces: STM-16, STM-4 and STM-1, as shown in Table 1-1. Table 1-1 Optical Interfaces Provided by ZXMP S330

Interface Type Rate (Mbit/s) No. of Channel per

Board

Maximum Access

Quantity

Chapter 1 - System Function


STM-16 2488.320 1 4

STM-4 622.080 1/2 12

STM-1 155.520 1/2 24

Electrical Interfaces ZXMP S330 provides the STM-1 electronic interface and PDH electrical interfaces, as shown in Table 1-2. Table 1-2 Electrical Interfaces Provided by ZXMP S330

Interface Type Rate (Mbit/s) No. of Channel per

Board

Maximum Access

Quantity

STM-1 155.520 1/2 24

E3 34.368 3 36

T3 44.736 3 36

E1 2.048 21 252

T1 1.544 21 252

Data Interfaces 1. The SFE×6 board provides 4 10M/100M adaptive Ethernet interfaces and the layer-2 switching function. The virtual cascading function of VC-12 is supported.

2. There are two types of Ethernet interface boards, namely, OIS1×4 board and EIFE board. Both can provide 4 ETH optical/electronic interfaces.

ZXMP S330 fully supports data services and provides 155M POS optical interfaces and Ethernet interfaces shown in Table 1-3. Table 1-3 Ethernet Interfaces Provided by ZXMP S330

Board

Name Interface Type

No. of Channel per

Board

Maximum Access

Capacity

OIS1×4 100 M Ethernet optical interface 4 channels 48

EIFE 100 M Ethernet electrical interface 4 channels 48

RSEB 4×10/100M+2×GE 16×10/100M+8×GE

AP1×4 155M ATM optical interface 4 channels 48

SFE×6 100 M Ethernet optical interface 4 channels 48

1.4 Equipment and network protection capabilities Clock boards (SC) and cross-switch boards (CS) are provided with 1+1 protection.

The electrical interface boards are provided with 1: N redundancy protection.

ZXMP S330 adopts the dual power supply system. Each functional board adopts the distributed power supply mode. This eliminates the power supply influence among the boards, and greatly reduces the impact during the hot plugging of the boards.

ZXMP S330 can implement all networking features recommended by ITU-T. For details please refer to Chapter 5.

1.5 Synchronous timing processing capabilities S330 supports synchronous priority switching based on the SSM algorithm, optimizes synchronous timing distribution of the network, prevents the

Technical Specification of ZXMP S330


occurrence of timing loops and keeps network synchronization the optimal status.

The input clock references can be 4 external 2.048M clocks or 8 lines (or tributaries) 8k timing input references. Synchronization can select external clocks, line clocks or E1/T1 tributary clocks. S330 provides E1 tributary re-timing function.

1. The timing/synchronization function is carried out on SC (Synchronous Clock) board. SC board has three working modes:

1) Normal tracing mode

2) Holdover mode

3) Free-run mode

2. SC boards can run in a 1+1 hot backup mode.

3. SC board implements the following functions:

1). Selecting the clock source

The NE extracts its timing reference from the following interface:

2.048MHz/2.048Mbps

STM-N interface, tributary interface

Internal SDH Equipment Clock.

2). Switching the clock source

The system supports maximum 8 clock directions for any optical STM-N interface. The system clock supports synchronous priority switching and SSM algorithm-based automatic switching.

3). Clock output

Four external reference clocks are provided. SCI board provides two 2.048Mbit/s and two 2.048MHz clock interfaces, which can be 75Ω or 120Ω.

1.6 System control and communication 1. The system control and communication functions are mainly implemented by the NCP (Net Control Processor) board.

2. NMS information exchange between NEs via the ECC channel.

3. Orderwire interworks between NEs via the E1 and E2 bytes. It provides a 4-digit DIP switch to set different software states.

4. OW board provides two voice channels that are not mutually cross-switched. The system can support up to 16 orderwire directions. It achieves calls based on PTP, PMP, point-to-group (group calling), and broadcast.

5. The Qx interface is a communication interface between the NE and the Subnet Management Control Center (SMCC).

6. The f interface is the interface between NE and portable equipment.

7. The NCP board conducts the intelligent monitoring on the fan box of the current NE.

8. NCPI board provides one DB15 connector used as F1 interface or input interface of external alarms (smoke, flooding, opening door, fire alarm and temperature, etc.), and one DB9 connector used as output of alarms (warning, critical alarm and audio alarm) generated in the first cabinet of the row.

Chapter 1 - System Function


1.7 Overhead Processing The CS board achieves the cross-connection dispatching of overheads and configures them to any port according to the configuration requirements of NMS. Following is the Overhead-Byte Usage List Table 1-4 Overhead-Byte Usage List

Overhead type

Overhead name

S330 application

A1, A2 Frame position indication for regeneration section, A1:11110110,A2:00101000

J0 Used for regeneration section trace. It may be set.

Z0 Not applied

D1~D12 Transport the management information with D1~D3

E1, E2 The orderwire connection path for voice communication; E1 for regeneration section access, E2 for MS terminal access

F1 Used for special maintenance purpose supplying temporary data/audio path connection; and providing 64K co-directional data interface

B1 Used for the error code monitor of regeneration section

B2 Used for the error code monitor of MS

K1, K2 Used for the auto-protection switchover (APS) command of MS

S1 b5~b8 used for synchronous status message

RSOH/MSOH

M1 Used for MS far-end difference indication

AU pointer AU PTR The rate adjustment on AU level

J1 Used for high-order path trace, able to be set

B3 Used for path error code monitoring

C2 Used for expressing the composition or maintenance status of VC-3／VC-4／VC-4X, able to read and write

G1 Used for returning the status and performance of path terminal to the path origin of VC3/VC4/VC4XC

F2, F3 Not applying

H4

Affording the general position indication to payload, as well as the special payload Position (i.e. H4 may be the multi-frame position indication of VC12 and VC2); and performing VC3/VC4 virtual concatenation

K3 Not applied

N1 Not applied

V5 Providing the functions of error code test, signal mark and channel status for VC1/VC2

J2 VC1, VC2 path trace byte, able to be set

N2 Not supported

POH

K4 Used for the virtual concatenation process of low-order path

ECC uses the D1~D3 (DCCr) or D4~D12 (DCCm). It supports 24 DCC channels. DCCr

are supported by any optical interface.

1.8 Network management capabilities ZXMP S330 adopts ZXONM E300 network management system. E300 can manage all equipments of ZXMP series. E300 has perfect management functions, providing friendly GUI.



1.9 Alarm input/output The equipment provides 4 external alarm input and 2 alarm output interfaces.

1.10 System power supply ZXMP S330 equipment employs the dual-power system to access the -48V power and distributes it by the power distribution unit.

Two independent external -48V DC power supplies, -48VGND and the system protection GND are connected to the sub-rack power distribution board. The power distribution (PD) unit provides following functions as power switch, distribution, isolation, EMI filtering, protection against lightening and surge, fan power supply and control. PD provides four lines of output power after filtering the EMI and ripples. Two lines of output power are provided for the sub-racks and the other two are provided for the fan plug-in box.

The power distribution unit provides the processed -48V DC power to each board via the motherboard. A DC/DC power conversion module on each board converts -48V DC voltage into the required voltage of the board circuit.

The power distribution unit can achieve the 1+1 hot backup protection.

1.11 Maintenance and upgrade With the following functions, the system becomes more reliable, featuring good maintainability and easy upgrade:

1. Supports the 155M, 622M, and 2.5G optical power monitoring function.

2. Supports online downloading and remote upgrade functions of the board software (including the FPGA logic).

3. Routine maintenance can quickly locate the fault to the board level.

4. Provides temperature monitoring for the boards.

1.12 Perfect EMC and Operation Safety EMC, operation safety and fire/explosion protection of the equipment are fully considered in the circuit board design.


C h a p t e r 2

SYSTEM MECHANICAL STRUCTURE 2.1 Appearance of sub-rack

Figure 2-1 Appearance of S330 Sub-rack

2.2 Cabinet structure S330 equipment include sub-rack, cabinet, power plug-in box. S330 uses the uniform transmission cabinet. Table 2-1 Configurations of S330

Rack Height Power Frame Sub-rack 2.0m (Valid height 42U) 4U 11U + 11U +11U (3 PCS) 2.2m (Valid height 47U) 4U 11U + 11U +11U (3 PCS) 2.6m (Valid height 56U) 4U 11U + 11U +11U + 11U (4 PCS)

The above configurations have already taken the number of E1 and cabling in case of full configurations into account.

The structure and configurations of ZXMP S330 are shown in Fig. 2-2:

Figure2-2 Structure and configurations of the cabinet.



2.3 Sub-rack structure The S330 sub-rack includes board, fan plug-in box and dustproof unit.

Structure of sub-rack is shown in Fig. 2-3. It contains two rows of boards, with 17 25.4mm-wide slots in each row. The sub-rack bottom contains a 1U fan plug-in box that contains three fans working independently. Its top is furnitured with a decorative door and has the functions such as decoration, ventilation and shielding. Fig. 2-3 Sub-rack structure

Top wiring area

Deco door

Board area

Lower wiring area

Fan shelfDust-proof unit

Top wiring area

Deco door

Board area

Lower wiring area

Fan shelfDust-proof unit

2.4 Dimensions and weights of components Table 2-2 Dimensions and weights of the equipment components

Mechanical parts Dimensions Weight (kg) ZXMP S330 cabinet 2,000mm(H) X 600mm(W) X 300mm(D) 70

Power distributionbox

Subrack

Fan subrack

Dust-proof unit

Telephone bracket

Cabinet

Alarm LED

Back panel

Front door

Power distributionbox

Subrack

Fan subrack

Dust-proof unit

Telephone bracket

Cabinet

Alarm LED

Back panel

Front door

Chapter 2 - System Mechanical Structure


2,200mm(H) X 600mm(W) X 300mm(D) 80

2,600mm(H) X 600mm(W) X 300mm(D) 90 ZXMP S330 sub-rack 443.7mm(H) X 482.6mm(W) X 270mm(D) 15 Power distribution box 177 mm(H) X 482.6mm(W) X 269.5mm(D) 5 Fan plug-in box 43.6mm(H) X 436mm(W) X 245mm(D) -- Dustproof unit 10.5mm(H) X 436mm(W) X 240mm(D) -- Service interface board 160mm(H) X 2mm(W) X 70mm(D) -- Service board 160mm(H) X 2mm(W) X 210mm(D) --

Note: The weight of the cabinet refers to the weight of an empty cabinet, and that of the power distribution box is the weight when it is installed with power distribution boards.


C h a p t e r 3

BOARDS AND SLOTS 3.1 Introduction to the boards

Table 3-1 Boards/unit list（with Power consumption）

No. Name Type code Code meaning Power consumption (w) Remarks

1 Motherboard MBA Mother Board 0 2 CS board CSA Cross-Switch type 15 3 SC board SC Synchronous Clock 7 4 SCI board SCI-75 Synchronous Clock Interface 0.6

5 NCP board NCP Net Control Processor 6 With the orderwire function

6 NCPI board NCPI Net Control Processor Interface 0.5 7 PWR board PWR Power 4 8 OL16 board OL16 Optical Line STM-16 12 9 LP1 board LP1/LP1x2 Line Process STM-1 7/10

10 LP4 board LP4/LP4x2 Line Process STM-4 7/10 11 OIS1 board OIS1 Optical Interface STM-1 2.5/1.3 12 OIS4 board OIS4 Optical Interface STM-4 3/1.5 13 BIS1 board BIS1 Tributary Protect STM-1 1 14 ESS1 board ESS1 Tributary Switch Electric STM-1 2 15 EPE1 board EPE1 Electrical Tributary Process E1 7 16 EPT1 board EPT1 Electrical Tributary Process T1 7 17 EIE1 board EIE1 Tributary Interface E1/T1 0 18 BIE1 board BIE1 Tributary Protect E1/T1 0.5 19 ESE1 board ESE1 Tributary Switch E1/T1 0.5 20 E3 board EPE3 Electrical Tributary Process E3 6 21 T3 board EPT3 Electrical Tributary Process T3 6 22 BIE3 board BIE3 Tributary Protect E3/T3 0.2 23 ESE3 board ESE3 Tributary Switch E3/T3 0.2 24 FAN board FAN Fan board 4.2

25 SFE×6 board SFE×6 Smart Fast Ethernet Processing Board 20

26 RSEB board RSEB RPR board 25 27 AP1×4 Board AP1×4 ATM Board 27

3.2 Slots Fig. 3-1 Typical Board Configuration

Chapter 3 – Boards And Slots


1716151413121110987654321

1716151413121110987654321

NCP

Service card

Service card

Service card

Service card

Service card

Service card

CSCSSCSC

Service card

Service card

Service card

Service card

Service card

Service card

NCPI

Service interface card






SCI







1716151413121110987654321

1716151413121110987654321

NCP

Service card

Service card

Service card

Service card

Service card

Service card

CSCSSCSC

Service card

Service card

Service card

Service card

Service card

Service card

NCPI

SCI

PWR

PWR

Table 3-2 Boards and relative slots

Board Code meaning Slot available Interface type OL16 Optical Line STM-16 SLOT 5~6/11~12 S-16.1and L-16.2, LP4 Line Process STM-4 SLOT3~6/11~14 LP4 and LP4×2 OIS4 Optical Interface STM-4 SLOT3~6/11~14 S-4.1, L-4.1, L-4.2 LP1 Line Process STM-1 SLOT1~6/11~16 LP1 and LP1×2 OIS1 Optical Interface STM-1 SLOT1~6/11~16 S-1.1, L-1.1, L-1.2 ESS1 Tributary Switch Electric STM-1 SLOT1~6/11~16 ESS1×2 BIS1 Tributary Protect STM-1 SLOT1/16 None

SFE×6 Smart Fast Ethernet Processing Board SLOT1~6/11~16 10BASE-T and 100BASE-TX and

100BASE-FX

RSEB RPR board SLOT 5~6/11~12 10BASE-T and 100BASE-TX and 100BASE-FX，1000BASE-FX

OIS1×4 Optical Interface STM-1×4（FE/ATM/SDH） SLOT1~6/11~16

EIFE Electric Interface of Smart Fast Ethernet SLOT1~6/11~16 10BASE-T and 100BASE-TX

AP1×4 ATM Processor with 4 STM-1 port SLOT1~6/11~16 STM-1×4 EPE3×3 Electrical Tributary Process E3×3 SLOT1~6/11~16 75Ω E3 electrical interface EPT3×3 Electrical Tributary Process T3×3 SLOT1~6/11~16 75Ω T3 electrical interface ESE3×3 Tributary Switch E3/T3 SLOT1~6/11~16 75Ω E3/T3 electrical interface BIE3×3 Bridge Interface E3/T3 SLOT1/16 None

EPE1×21 Electrical Tributary Process E1×21 SLOT1~6/11~16 120Ω and 75Ω E1 electrical interfaces

EPT1×21 Electrical Tributary Process T1 SLOT1~6/11~16 100Ω T1 electrical interfaces ESE1×21（75） Electrical Switch E1(75Ω) SLOT1~6/11~16 75Ω E1 electrical interfaces

ESE1×21（120） Electrical Switch E1/T1(120/100Ω） SLOT1~6/11~16 120Ω E1and 100Ω T1 electrical

interfaces BIE1×21 Bridge Interface E1/T1 SLOT1~6/11~16 None CSA Cross-Switch type SLOT 9/10 None SC Synchronous Clock SLOT 7/8 75Ω E1 electrical interfaces SCI（75） Synchronous Clock Interface(75Ω) SLOT 7 75Ω E1 electrical interfaces SCI（120） Synchronous Clock Interface(120Ω) SLOT 7 120Ω E1and electrical interfaces NCP Net Control Processor SLOT 17 f/Qx/6P4C NCPI Net Control Processor Interface SLOT 17 6P4C/DB9/DB15 PWR Power SLOT 8/9 a D-sub connector with 3 pins FAN Fan unit None None OBA Optical Booster Amplifier SC/PC OPA Optical Preamplifier Amplifier SC/PC



3.3 Connector-type for All kinds of Service Interface Table 3-3 Connector-type of interface

Service Interface Connector Type remark

E1/T1(75 Ohm) SCI

E1/T1(120 Ohm) SCI

E3,T3,STM-1e(75 Ohm) CC4

External Clock(75 Ohm) CC4/DB9 External Clock(120 Ohm) DB9

FE(100Base-Tx) RJ45 Full-Duplex/Half-Duplex

FE(100Base-Fx) LC/PC Full-Duplex

ATM(o) SC/PC Full-Duplex

STM-1/4/16 SC/PC

Alarm DB15/DB9


C h a p t e r 4

APPLICATION OF MSTP 4.1 Application of Ethernet Service

EPL: Ethernet Private Line Fig 4-1 EPL

MSTP access node accesses data of important clients via FE interface, as shown in the above figure. After adapted with GFP encapsulation rate rather than L2 switching, user data is mapped into SDH VCG, then transmitted from end to end via SDH network to destination node. In the above process, link bandwidth depends on VCG. It is occupied only by a user just like a physical private line, so end-to-end QoS of services can be ensured. Different from conventional private line, MSTP can employ LCAS protocol or NM configuration to adjust link bandwidth flexibly and dynamically, and support traffic control.

EPL can ensure transparent transmission of Ethernet service, e.g., Ethernet MAC frame and VLAN label. Ethernet service can be protected in SDH protection mode.

EVPL (Ethernet Virtual Private Line) Fig 4-2 EVPL

In the above figure, user data are accessed via several user ports, and share the bandwidth of one network-side port (WAN port), i.e., one physical private line. The bandwidth at WAN port can also be configured. It is required to adopt



VLAN technique to ensure service intervals between different user ports.

The advantage of the scheme is that all user ports can share bandwidth at WAN port, CIR and PIR should be configured to ensure QoS at user ports, and user Ethernet service adopts SDH physical-layer protection.

EPVL is applied to virtual private line interconnection of different users (interconnected via VLAN) between two nodes. For example, VLAN1 and VLAN2 are two branches of industrial and commercial systems, and VLAN3 and VLAN4 are two branches of tax system.

EPLAN (Etherrnet Private LAN) Fig 4-3 EPLAN

The services at 3 branches can be converged to headquarter via star network composed of SDH timeslot links. MSTP at central node is embedded with L2 switching function. For central converged services, link bandwidth from branches to headquarter is exclusive, so end-to-end QoS can be ensured. And the network is highly reliable. When a branch fails, services at other branches still work. User Ethernet service adopts SDH physical-layer protection. Fig 4-4 EPLAN

The services between 3 branches and headquarter can form Ethernet shared ring through SDH virtual connections via VCAT. But it is required in the configuration that each MSTP node in the ring support L2 switching and STP. In this way, less fiber bandwidth is occupied when large quantities of nodes are available in the ring. In order to avoid unfair bandwidth allocation among the nodes, the supervision is required to control LAN port traffic at each node. The ring adopts SDH physical-layer protection. Because Ethernet ring crosses several SDH rings, STP protection can also be used. Fast STP can reduce protection time to less than 3 seconds.

Chapter 4 – Application of MSTP


EVPLAN (Ethernet Virtual Private LAN) Fig 4-5 EVPLAN

The services between branches and headquarters of company A and B can form virtual Ethernet shared ring through SDH virtual connections via VCAT. But it is required in the configuration that each MSTP node in the ring support L2 switching and STP. The services of two companies are isolated by VLAN. In this way, less fiber bandwidth is occupied when large quantities of nodes are available in the ring. In order to avoid unfair bandwidth allocation among the nodes, the supervision is required to control LAN port traffic at each node. The ring adopts SDH physical-layer protection. Because Ethernet ring crosses several SDH rings, STP protection can also be used. Fast STP can reduce protection time to less than 3 seconds.

EPL is applied to private line interconnection between two users.

4.2 Application of ATM Service

VP-RING Networking ATM service can be converged to one 155M channel in VP-RING. In the following figure, one 155M channel can carry ATM services of node B,C,D, all the converged services go to BAS via node A. Fig 4-6 ATM VP-RING

155M VP-RING is based on SDH network. It can coexist with SDH ring



transmitting other services. In addition, ATM transparent transmission on SDH network can connect several VP-RINGs in serial to form a mixed ring.

4.3 Application of RPR Service

The deepened function of RPR by ZTE 1. The RPR board of S330 has integrated RPR MAC function following the IEEE 802.17 standard

2. RPR board (RSEB) can build up 1.25G RPR ring，and its bandwidth towards Backplane is 2.5G.

3. The interface of MAC layer is 4×FE＋2×GE，it can carry out the n×FE to FE ，n×FE to GE and n×GE to GE converging.

4. Using powerful function of service classification the service can be differentiated based on the interface or VLAN.

5. Powerful function of flow control: The maximum number of data streams carried on the RPR ring is 1000, every data stream can be set as Class A0, A1, B, and C, also the flow control parameter of stream can be set and the granularity of flow control is 20Kbps.

6. The station supports plug and play，and the configuration is very simple, RPR ring can find the incorrect fiber connection voluntarily.

7. The wrapping and steering protection is available on RPR layer, and the conflict of protections between SDH layer and RPR layer can be avoided by setting switching time delay.

8. The capability of MAC address is very large, every station can learn and store 64,000 MAC addresses， it can avoid the unnecessary flood frame and reduce the waste of bandwidth when building up complex network.

9. The fairness arithmetic of autonomous intellectual property can share the bandwidth properly, make the bandwidth converge quickly and make the bandwidth fluctuation little.

10. CID (Customer Identifier Domain) in RPR. can carry out double isolation as CID plus VLAN ID, so it can isolate the data belonging to the same VLANs in different VPN domain and carry out EVPL and EVPLAN in network.

Networking of RPR over SDH :Point to PointⅠ Fig 4-7 Point to Point

Chapter 4 – Application of MSTP


Networking of RPR over SDH :MultiⅡ -points to Multi-point Fig 4-8 Multi-points to Multi-point


C h a p t e r 5

NETWORKING AND PROTECTION 5.1 Application of Basic Service

ZXMP S330 is mainly applied to the local, metropolitan and backbone transmission networks.

ZXMP S330 can provide all the networking features recommended by ITU-T, such as TM, REG, ADM, and MADM. Fig. 5-1 Basic Physical Topologies for ZSMP S330

1. Chain

2. Star

3. Tree

4. Ring

5. Mesh

TM

TM

TM

TM

TM TM TM

TM

TM

TM

ADM

ADM

ADM

ADM

ADM

ADM

ADM

ADM

DXC/ADM

DXC/ADM

DXC/ADM

DXC/ADM

DXC/ADM

DXC/ADM

TM

5.2 Hardware-level Protection

Power supply protection Out-of-cabinet power protection

Chapter 5 – Networking and Protection


For ZXMP S330 equipment, one or two –48V power cables are introduced to the cabinet via the air switch in the power distribution box. When two groups of equipment room power supplies are introduced to the device, the power supply works in 1+1 protection mode to make sure that the device works well in the case of either the power group failure.

Inside-cabinet power protection

The -48V power is filtered in the power distribution board in the power distribution box to provide power for the sub-rack and fan shelf. ZXMP S330 uses two power distribution boards for power distribution. The two power distribution boards can provide power jointly or separately.

Board power protection

The board adopts the distributed power supply mode to reduce the power affect between boards to zero. All boards have over-current and over-voltage protection.

Power polarities inversely connected: Use fuse for protection.

Cross-switch protection ZXMP S330 uses two CS boards. The 1+1 protection for the CS board is realized. Namely, two CS boards, i.e., active and standby, can be configured in the system. In case of failure, the NMS sends commands to control the switching of the CS board.

Clock protection ZXMP S330 uses two SC boards to achieve the protection for the clock. To ensure reliable synchronization and timing, the SC board may work in the hot backup mode or independently, that is, two system clock boards, i.e. active and standby, may be configured in this system. When both boards are in position and work normally, only the clock of the main system clock board is output to the backplane. In case of failure in either of the boards, the clock is switched to the other SC board.

1:N protection for the tributary board The system has totally twelve slots for the tributary board, which are divided into left and right groups. Each group provides the 1: N (N≤5) protection for the E1/T1 and FE tributary board and the protection board can be inserted in any service slot in the local group. It also provides the 1: N (N≤5) protection for the E3/T3 tributary board and EL1 board and the protection board must be inserted in the designated position.

The 1: N protections for the service boards in the left and right groups are independent from each other, and different protection modes may be supported.

Automatic Laser Shutdown function All STM-1/4/16 optical interfaces of S330 support the ALS function and satisfy G.664 standard. The course of ALS is illustrated in Fig.5-2. When the cable is broken at A point, the receive port detects the loss of continuity of optical transmission signal (LOC-OTS) at R2, which will cause T2 transmission port to shut down, and the LOC-OTS detected at R1 also causes the T1 transmission port to shut down. In such way, it guarantees the optical power, in the OTS section at A point where failure occurred, being in safety. Fig.5-2 the ALS principle



After it is reconnected in the OTS section, resume the transmission within the OTS section by restarting automatically or manually. (Attention: when it disconnects or after an (unsuccessful) restart, do not enable the restart within 100s.)

5.3 Network-level protection ZXMP S330 equipment can realize all the network protective modes specified by ITU-T:

1. MSP1:N,

2. 2F UPSR,

3. 2F BPSR,

4. 4F BPSR,

5. DNI protection,

6. SNCP,

7. Unique Logical Sub Network Protection scheme ：

ZXMP S330 presents and implements a very new network protection concept on the basis of ITU-T recommendation: virtual logical subnet protection. This function can meet the requirements of more complex network structure, enhance the network security and increase the bandwidth utilization, such as Multi-ADM (M-ADM) and M-ADM with subtending rings.

The logical subnet is the result of dividing a network according to the logic topology and logical capacity on the basis of the physical network. One physical network can be divided into several logical subnets，the logical subnets can be further divided by service type, capacity, network topology and protection mode as shown in Fig. 5-3. The protection and management of each logical subnet is independent of one another. Fig.5-3: Logical Sub network Protection

Chapter 5 – Networking and Protection


AA

STM-64

PhysicaPhysical ringl ring

BB DD

CC

C2

A2A2

3xVC-4B2B2 D2D2

C2C2 C3

A1A1

8xVC-4B1B1 D1D1

C1C1

A3A3

47xVC-4B3B3 D3D3

C3C3

C1

Logic sub-netw ork based on customer and capacity

++AA

DD

CC

EE

GGFF4xVC-4

Logic ring 3: Path Logic ring 3: Path protectionprotection

Physical ringPhysical ring

AA

DD

CC

B1B1STM-64

EE

GGFFSTM -64

B2B2

AA

DD

CC

BB40xVC-4

Logic ring 1: Logic ring 1: MSPMSP

BB

EEBB

GGFF20xVC-4

Logic ring 2: Logic ring 2: Path Path protectionprotection

BB

Logic sub-netw ork based on topology and capacity

A1

B1

C1

E1

D1

TDM

A

B

C

E

D

TDM, IP, ATM...

STM -NA2

B2C2

IP

A3

B3C3

E3D3

ATM

Logic sub-netw ork based on service type

Circuit

Low-order Path

RS

Physical M edia

High-order Path

M S

Path

Section M edia

Sub-network

Link

Layered sub-

network

Vertical Vertical partitionpartition

HorizontaHorizontal partitionl partition

Unique Logical Sub Network Protection SchemeUnique Logical Sub Network Protection Scheme

5.4 Protection switch time Table 5-1 SDH system protection switch time

Protection scheme Type Time

SC <50ms

CS <50ms

STM-1/e <50ms

Ethernet(e) <50ms

34M <50ms

45M <50ms

Unit protection

1.5M/2M <50ms

MS-ring <50ms Network level

SNCP <50ms


C h a p t e r 6

PERFORMANCES AND INDEXES 6.1 STM-N optical interfaces performance

Performance of the STM-16 /4/1 optical interfaces is shown as follows.

Table 6-1 Performance of the STM-1 optical interface of ZXMP S330

Nominal bit rate 155520kbit/s Classification code S-1.1 L-1.1 L-1.2 Working wavelength (nm) 1310 1310 1550 Source type MLM SLM SLM Min transmitting optical power（dB） -15 -5 -5 Max transmitting optical power（dB） -8 0 0 Minimum extinction ratio（dB） 8.2 10 10 Poorest sensitivity（dB） -28 -34 -34 Minimum overload point（dB） -8 -10 -10 Transmitter at reference point S Optical path between Point S and R Receiver at reference point R

G.957-compliant G.957-compliant G.957-compliant


Nominal bit rate 622080kbit/s Classification code S-4.1 L-4.1 L-4.2 Working wavelength (nm) 1310 1310 1550 Source type MLM SLM SLM Min transmitting optical power（dB） -15 -3 -3 Max transmitting optical power（dB） -8 2 2 Minimum extinction ratio（dB） 8.2 10 10 Poorest sensitivity（dB） -28 -28 -28 Minimum overload point（dB） -8 -8 -8 Transmitter at reference point S Optical path between Point S and R Receiver at reference point R

G.957-compliant G.957-compliant G.957-compliant


Nominal bit rate 2488320kbit/s Classification code S-16.1 L-16.2 Working wavelength (nm) 1310 1550 Source type SLM SLM Min transmitting optical power（dBm） -5 -2 Max transmitting optical power（dBm） 0 3 Minimum extinction ratio（dBm） 8.2 8.2 Poorest sensitivity（dBm） -20 -28 Minimum overload point（dBm） -3 -9 Transmitter at reference point S Optical path between Point S and R Receiver at reference point R

G.957-compliant G.957-compliant

Chapter 6 – Performances and Indexes


6.2 PDH electrical interfaces performance Table 6-4 Performance of the PDH electrical interface of ZXMP S330

Type 1544kbit/s 2048kbit/s 34368kbit/s 44736kbit/s 139264kbit/s 155520kbit/s

Code pattern AMI or B8ZS

HDB3 code HDB3 code B3ZS code CMI code CMI code

Bit rate of signals at output port Attenuation tolerance at input port Frequency deviation tolerance at input port

G.703- compliant

G.703- compliant

G.703- compliant

G.703- compliant

Anti-interference capability of input port

G.703- compliant

G.703- compliant

- - - -

6.3 Error Performance For each circuit direction and for bi-directional section and path, the error performance is monitored separately, the SDH performance of ZXMP complies with ITU-T G.784, G.828 and G.826. The SDH performance includes performance items such as BBE, ES, SES, FBBE, FEES, FESES, PSC, PJC+, PJC-, UAS, etc.

The long term and short-term error performances of ZXMP S330 are complied with ITU-T G.828 and M.2101 recommendation. According to ITU-T G.821 and G.826, in 420km HRDP (Hypothetical Reference Digital Path), SDH system error performance of ZTE’s transmission product is as follows, these figures are tested in field and test duration is not less than 24 hour. Table 6-5 SDH system error performance of ZTE’s transmission product

Bit rate(kbit/s) 2048 44736 139264/155520 622080 2488320

ESR 1.848×10-6 3.466×10-6 7.392×10-6 1.848×10-5 3.7×10-5

SESR 9.24×10-8 9.24×10-8 9.24×10-8 9.24×10-8 9.24×10-8

BBER 9.24×10-9 9.24×10-9 9.24×10-9 9.24×10-9 9.24×10-9

The performance of S330 is better than ITU-T recommendation.

6.4 SFE×6 Performance

Performance of SFE×6 Table 6-6 Performance of SFE×6

Equipment name ZXMP S330

Characteristics of Ethernet Board Function and Specification of Board

Name of Board Smart Fast Ethernet Processing Board SFEx6，interface Board OIS1x4. EIFEx4

Interface type 10BASE-T /100BASE-TX /100BASE-FX

Connector RJ45/SFP-LC

Interface number per board 4 Settable working modes (Rate. Full Duplex. Half-Duplex） Comply

Ethernet interface

Pluggable optical module OIS1x4

Interface board type OIS1x4 EIFEx4



1:N protection For SFEx6 N < =5

Maximum port number at SDH side (VC－Group) 6

Total mapping bandwidth of back board 252×VC12（at most 63×VC12 per VCG）

Virtual Concatenation (VC-12-Xv) Comply

Multidirectional convergence rate 6:1 The dynamic addition/reduction of VCG bandwidth does not lead to the service loss.

Comply

LCAS management function (Enable alarm and event report) Comply LCAS Protocol

VCG-level multi-path protection with the time of <300ms Comply

Support GFP encapsulation and comply with ITU-T G.7041 Recommendation Comply

Maximum frame is 1536 bytes and minimum frame is 64 bytes Comply

Bandwidth adjustment granule based on interface 1M-rate restriction granule based on interface

Support the trunk of the port Comply. At most binded 4×FE

Capability of Layer 2 Switch Bi-Directional capability: 1Gbps Layer 2 switching: Support dynamic learning and static configuration of MAC address. Comply with IEEE802.1D bridge function. The learning speed of MAC address is in compliance with the index: >1024 pieces/second. The aging time can be set.

Comply

Support layer 2 switching/forwarding function, the switching is at local side and at SDH side. Comply

Support learning space of MAC address 64K

Support Stack Vlan (Q-in-Q) encapsulation and conversion. Comply

Support STP and RSTP Comply

Support STP, RSTP and multi-STP based on VLAN. Comply

VLAN number and scope supported Support 255 VLANs with the scope of 1－4095.

QoS Support WFQ

Layer VPN function (EVPL and EVPLAN service) Support in Stack Vlan (Q-in-Q) mode.

Support port-level Ethernet performance supervision Comply

Ethernet interface types and followed standard： Table 6-7 Ethernet interface index

Type Rate (bps)

followed standard Interface type interface

10BASE-T 10M IEEE 802.3 Electronic interface RJ45, category 3 UTP

100BASE-TX 100M IEEE 802.3u Electronic interface RJ45, category 3 UTP

100BASE-FX 100M IEEE 802.3u

M-1.1 S-1.1 L-1.1 SFP-LC

All optical interface indices are described as following:

FE MMF optical interface（M-1.1） Table 6-8 transmission index of FE MMF optical interface



Item 62.5/125μm MMF Unit

Transmission unit type MMF LD

Transmission distance ≤2 KM

Interface SFP-LC

Wavelength （λ，range） 1270~1380 nm

Trise/Tfall (maximum;10%~90%) 3 ns

RMS spectrum width（maximum） 63 nm

Output optical power（maximum） -14 dBm

Output optical power（minimum） -20 dBm Output optical power when the LD is shut down（maximum） -45 dBm

Extinction ratio（minimum） 10 dB

Table 6-9 receiver index of FE MMF optical interface

Item 62.5/125μm MMF Unit

wavelength（λ ，range） 1270~1380 nm

input optical power（maximum） -14 dBm

Receiver sensitivity -30 dBm

FE short distance SMF optical interface（S-1.1）， Table 6-10 transmission index of FE short distance SMF optical interface

Item 10/125μm SMF Unit

Transmission unit type SMF LD


Interface type SFP-LC Wavelength（λ ，range） 1261~1360 nm

Trise/Tfall (maximum;20%~80%) 2.5 ns

RMS spectrum width（maximum） 7.7 nm

output optical power（maximum） -8 dBm

output optical power（minimum） -11.5 dBm Output optical power when the LD is shut down（maximum） -45 dBm


Table 6-11 receiver index of FE short distance optical interface

Item 10/125μm SMF unit

Wavelength (λ ，range) 1261~1360 nm

Input optical power (maximum) -8 dBm


FE long distance SMF optical interface（L-1.1） Table 6-12 transmission index of FE long distance SMF optical interface




Transmission unit type SMF LD


Interface type SFP-LC Wavelength (λ ，range） 1261~1360 nm

Trise/Tfall (maximum;20%~80%) 2.5 ns

RMS spectrum width (maximum） 3 nm

output optical power（maximum） 0 dBm

output optical power（minimum） -5 dBm Output optical power when the LD is shut down（maximum） -45 dBm


Table 6-13 receiver index of FE long distance optical interface


Wavelength（λ ，range） 1261~1360 nm

Input optical power（maximum） -9 dBm


6.5 AP1×4 Performance Performance of the AP1×4

Table 6-14 Performance of the AP1×4 of ZXMP S330

Equipment name ZXMP S330

Features of ATM Board Functions and Specifications of Board

Name of Board Processing Board AP1x4，Interface Board OIS1x4

Features of Interface STM-1

Connector LC

Interface number per board 4 Interface

Pluggable optical module Comply

Interface type Interface Board OIS1x4

Upgraded and loaded on-line Comply

Total mapping bandwidth of back board 4 (VC4)

ATM interface Support UNI/NNI Comply

ATM Switching Element Capability 622M Bi-Directional

VP/VC Switching Function Support Switching between VP and VC， and the Capability is 16K

VPI scope UNI：0－255 NNI：0－4095

VCI scope 1－16383

PVC scope Bi-Directional 8K

CAC Comply

Continuous cell detection Comply

OAM Loop-back Comply

Service Type Supported CBR Comply



rt VBR Comply

nrt VBR Comply

UBR Comply

The function of transmission PRI Comply

Space Multicast Comply

Logic Multicast Comply

ATM Automatic Protection Switching Comply

VP-Ring ATM forced protection Switching Comply

SDH side Comply Loop-Back of Port

Consumer side Comply

Alarm of ATM layer Comply

6.6 OBA Performance Performance of the OBA Module

Table 6-15 Performance of the OBA Module

Performance Unit OBA12 OBA14 OBA17 OBA19 Remark Operating wavelength nm 1530~1565 1530~1565 1530~1565 1530~1565

-12~4（10G）Input power dBm -12~4

-6~4（2.5G）-6~4 -6~4

Output power(maximum) dBm 12 14 17 19 Life origination value

Dynamic range of output power (dB) dB 3 3 3 3 Only

decrease 7~26(10G)

Gain dB 5~24 7~20(2.5G)

10~23 12~25 Output power lock mode

Small Signal Gain dB >25 >25 >23 >25

Noise Index dB 5 5 5 5

Input return loss dB 45 45 45 45

output return loss dB 45 45 45 45

Output pump leakage dBm -30 -30 -30 -30

Input pump leakage dBm -30 -30 -30 -30

PDG dB 0.5 0.5 0.5 0.5

PMD ps 1 1 1 1

power（full temperature range） W <25 <25 <25 <25

Operating temperature -15~65 -15~65 -15~65 -15~65

Operating humidity ％ 5~95 5~95 5~95 5~95

Storage temperature -40~75 -40~75 -40~75 -40~75

Operating voltage V +5±5% +5±5% +5±5% +5±5% Note：OBA19 Only operating at 155M and 622M bit rate; the Connector type is SC/PC.

6.7 OPA Performance Table 6-16 Performance of the OPA Box



Performance unit OPA(2.5G) OPA(10G) remark

Operating wavelength nm 1530~1561 1530~1561

Tunable wavelength range nm 31 31

filter-3dB bandwidth nm 0.45 0.45

Filter -20dB bandwidth nm 1.2 1.2

Input power dBm -38 -32

Output power(maximum) dBm -9 -4

Dynamic range of output power (dB) dB ±3 ±3

Gain dB 26~32 25~31

Small Signal Gain dB 30 30

Noise Index dB 4.5 4.5

Input return loss dB 45 45

output return loss dB 45 45

Output pump leakage dBm -30 -30

Input pump leakage dBm -50 -50

Forward ASE level dBm -30 -30

Backward ASE power level dBm -30 -30

Pump wavelength nm 980 980

PDG dB 0.2 0.2

PMD ps 1 1

Power W 15 15

Power supply V -48±10% -48±10%

Operating temperature -15~65 -15~65

Operating humidity ％ 5~95 5~95

Storage temperature -40~75 -40~75

Optical Connector SC/PC SC/PC

6.8 DCM Performance The Dispersion Compensating Modules compensates the dispersion of conventional single mode fiber (G.652/G.655)

Performance of the DCM

Table 6-17 Performance of the DCM

Type DCM-20 DCM-40 DCM-60 DCM-80 DCM-100Dispersion compensated range（ps/nm） -329±15 -680±21 -1020±31 -1360±41 -1640±41

Insert loss(dB) ≤4.1 ≤5.1 ≤7.0 ≤8.9 ≤12.1

typical value -3.2 -4.4 -6 -7.7 -11.5

PMD(2-step) ≤0.5 ≤1.0 ≤1.2 ≤1.3

PMD（Typical）(ps) -0.4 -0.4 -0.5 -0.6

PMD cost(dB) ≤0.1 ≤0.1 ≤0.1 Note： 1. Each DCM needs a 1U-high DCM-Box. 2. Generally Only 10G system need to consider dispersion problem； 3. DCM80 can only be located in front of OBA and cannot be located after OPA



6.9 Optical interface indexes Eye Pattern of the optical sending signals

Fig. 6-1 the eye diagram pattern for sending optical signals

The eye pattern of ZXMP S330 equipment conforms to the template in Fig. 6-1. Permitted frequency deviation of optical input interface

The allowable frequency deviation of ZXMP S330 optical input port is greater than ±20ppm.

AIS Rate of optical output port The AIS rate at ZXMP S330 optical output port is within ±20ppm.

6.10 Electrical interface indexes Permitted input port attenuation, permitted frequency deviation and

output port signal bit rate tolerance Table 6-18 Input port permitted attenuation, frequency deviation and output port signal bit rate tolerance

Interface rate Permitted input port frequency

deviation(regular squared attenuation)

Permitted input port frequency deviation Output port rate tolerance

1544kbit/s -- Greater than ±32ppm Less than ±32ppm

2048 kbit/s 0dB~6dB, 1024kHz Greater than ±50ppm Less than ±50ppm

34368 kbit/s 0dB~12dB, 17,184kHz Greater than ±20ppm Less than ±20ppm

44736 kbit/s -- Greater than ±20ppm Less than ±20ppm

139264 kbit/s 0dB~12dB, 70MHz Greater than ±15ppm Less than ±15ppm

155520 kbit/s 0dB~12.7dB, 78MHz Greater than ±20ppm Less than ±20ppm

Reflection attenuation at the input/output ports For input/output port reflection attenuation index of various electronic ports of ZXMP S330, please refer to Table 6-19. Table 6-19 Requirements for the input/output port reflection attenuation

Interface bit rate Test frequency range Reflection attenuation (dB)

51.2kHz~102.4kHz 12　

102.4kHz~2048kHz 18　 2048Kbit/s input port

2048kHz~3072kHz 14　

860kHz~1720kHz 12　

1720kHz~34368kHz 18　 34368Kbit/s input port

34368kHz~51550kHz 14　 139264Kbit/s input/output port 7MHz-210MHz 15　



155520Kbit/s input/output port 8MHz~240MHz 15　

Anti-interference capability of the input port The ratio of main signals to interference signals is 18dB. ZXMP S330 can satisfy the above requirement.

Output port waveform

The output port waveform complies with template specified in G.703 Recommendation.

Over-voltage protection of the input and output interfaces

The input and output interfaces must bear 10 continuous standard pulses (5 positive and 5 negative) without being damaged. The rising time of a standard pulse is 1.2μs, the width is 50μs and the voltage amplitude is 20V.

6.11 Jitter index at interfaces For ZXMP S330, the jitter and wander tolerance for G.703 PDH and SDH interface conform to ITU-T G.823, G.824 (45Mbps) and G.825 respectively.

Jitter and wander tolerance of PDH input interface The jitter and wander tolerance at the ZXMP S330 PDH input interface meets the requirements shown in Fig. 6-2a, 6-2b and Table 6-20. Fig. 6-2a the jitter and wander tolerance at PDH input interface (E1 HIERARCHY)

Peak-peak jitter and wander(logarithm)

A0

A3

A1

A2

f0 f10 f9 f8 f1 f2 f3 f4 Jitter frequency(logarithm)

Slope: -20dB/10 octave

Fig. 6-2b The jitter and wander tolerance at PDH input interface (1.5M HIERARCHY)

Table 6-20 The input jitter and wander tolerance of the PDH interface

Interface rate

UIp-p Frequency (Hz) Pseudo-random



(kbit/s) A0 A1 A2 A3 f10(T1/T3 is f0)

f9 f8 f1 f2 f3 f4 signal

1544 18 5.0 UI

0.1UI 1.2×10–5 10 120 6k 40K 220 – 1

2048 36.9 18 0.2 18 4.88×10-3 0.01 1.667 20 2.4k 18k 100k 215-1

34368 618.6 1.5 0.15 ffs ffs ffs ffs 100 1k 10k 800k 223-1

44736 18 5.0 UI

0.1UI 1.2× 10–5 10 600 30k 400k 220 – 1

139264 2506.6 1.5 0.075 30.511 8.11×10-3 0.08 10.267 200 500 10k 3500k 223-1

Jitter and wander tolerance of PDH output interface Table 6-21 The output jitter and wander tolerance of the PDH interface

Parameter value Network limit Measurement filter bandwidth

B1 unit interval B2 unit interval Band-pass filter having a lower cut-off

peak-to-peak peak-to-peak frequency f1 or f3 and an upper cut-off

frequency f4

Digit rate (kbit/s)

f1 f3 f4

1 544 5 0.1 10Hz 8kHz 40KHz

18 kHz 2 048 1.5 0.2 20 Hz (700

Hz) 100 kHz

34 368 1.5 0.15 100 Hz 10 kHz 800 kHz

44736 5 0.1 10Hz 30kHz 400kHz

139 264 1.5 0.075 200 Hz 10 kHz 3500 kHz NOTES:

1 For the codirectional interface only.

2 The frequency values shown in parenthesis only apply to certain national interfaces.

3 UI Unit Interval:

for 2048 Kbit/s 1 UI = 488 ns

for 34 368 Kbit/s 1 UI = 29.1 ns

for 139 264 Kbit/s 1 UI = 7.18 ns

Jitter and wander tolerance of SDH input interface The capability of STM-N input interface to stand jitter and wander is specified and tested with the digital test signal of sine modulated phase. The input jitter and wander tolerance of ZXMP S330 SDH terminal multiplexer satisfies the requirements in Fig. 6-3 and Tables 6-22 and 6-23. The input jitter and wander tolerance of ZXMP S330 SDH regenerator satisfies the requirements shown in Fig. 6-4 and Table 6-24. Fig. 6-3 The jitter tolerance of STM-N terminal multiplexer input interface



Peak-peak jitter and wander (logarithm)

A0

A1

Slope: -20dB/10 octaveA2

A3

A4

f0 f12 f11 f10 f9 f8 f1 f2 f3 f4 Frequency

Table 6-22 Input jitter and wander tolerance (UIP-P) of the SDH terminal multiplexer

A0 (18μs) A1 (2 s)　 A2 (0.25 s)　 A3 A4

STM-1 2800 311 39 1.5 0.15

STM-4 11200 1244 156 1.5 0.15

STM-16 44790 4977 622 1.5 0.15

Table 6-23 Input jitter and wander tolerance (frequency: Hz) of the SDH terminal multiplexer

f0 f12 f11 f10 f9 f8 f1 f2 f3 f4

STM-1 1.2×10-5 1.78×10-4 1.6×10-3 1.56×10-2 0.125 19.3 500 6.5k 65k 1.3M

STM-4 1.2×10-5 1.78×10-4 1.6×10-3 1.56×10-2 0.125 9.65 1000 25k 250k 5M

STM-16 1.2×10-5 1.78×10-4 1.6×10-3 1.56×10-2 0.125 12.1 5000 100k 1M 20M Fig. 6-4 The input jitter tolerance of STM-N SDH regenerator

Input jitter amplitude（UI

P-P）

Frequency

A2

A1

0 f1f2


Table 6-24 Input jitter tolerances of STM-1, STM-4 and STM-16 regenerators

f1 (kHz) f2 (kHz) A1 (UIP-P) A2 (UIP-P)

A 65 6.5 0.15 1.5 STM-1 B 12 1.2 0.15 1.5

A 250 25 0.15 1.5 STM-4 B 12 1.2 0.15 1.5

A 1000 100 0.15 1.5 STM-16 B 12 1.2 0.15 1.5

Inherent output jitter of STM-N interface of SDH equipment and the output jitter of network interface

For the ADM, TM and DXC equipment of ZXMP S330, the STM-N output



jittering indexes meet the requirements in Tables 6-25 and 6-26. Because of the randomness of jitter, the test value might exceed, and it is acceptable when over 99% test values satisfy the indexes during the test (for 1 to 2 minutes). Table 6-25 STM-N interface inherent output jitter indexes of SDH equipment

STM interface Test filter Peak value of jitter

500Hz~1.3MHz 0.50 UI STM-1

65kHz~1.3MHz 0.10 UI

1000Hz~5MHz 0.50 UI STM-4

250kHz~5MHz 0.10 UI

5000Hz~20MHz 0.50 UI STM-16

1MHz~20MHz 0.10 UI

Table 6-26 STM-N network interface output jitter indexes of SDH equipment

STM interface f1 (Hz) f3 (kHz) f4 (MHz) B1 (UIp-p) B2 (UIp-p)

STM-1 optical interface 500 65 1.3 1.5 0.15 STM-1 electrical interface 500 65 1.3 1.5 0.075

STM-4 optical interface 1000 250 5 1.5 0.15

STM-16 optical interface 5000 1M 20 1.5 0.15

For the REG equipment, when the test filter adopts 12kHz high-pass filter, its root mean square value (RMS) created from jitter should not be greater than 0.01UIrms.

Mapping jitter of PDH tributary The mapping jitter at the ZXMP S330 PDH tributary can satisfy the requirements listed in Table 6-27.

Table 6-27 Mapping jitter specifications

G.703 interface

High-pass filter 20dB/10 multiplication

Maximum peak value of mapping jitter

(kbit/s) Tolerance (ppm)

f1 (Hz) f3 (Hz) f4 (Hz) f1~f4 f3~f4

2048 50　 20 18k 100k Undetermined 0.08

34368 20　 100 10k 800k Undetermined 0.08

44736 20　 100 10k 800k Undetermined 0.08

139264 15　 200 10k 3.5M Undetermined 0.08

Combined Jitter In the SDH system, generally, there are both mapping jitter and pointer adjusting jitter. The combined jitter of both is called the combined jitter. Under various test sequences, the value detected by ZXMP S330 should meet the ones listed in Table 6-28. Table 6-28 Combined jitter

PDH interface

Bit rate tolerance

High pass filter 20dB/10 octave Maximum peak-peak value combined jitter UIP-P

(kbit/s) (ppm) f1 (Hz)

f3 (Hz)

f4 (Hz) f1~f4 (UIp-p) f3~f4 (UIp-p)

2048 50　 20 18k 100k 0.4 0.4 0.4 0.075 0.075 0.075

34368 30　 100 10k 800k 0.4 0.4 0.4 0.75 0.075 0.075 0.075 0.075

44736 30　 100 10k 800k 0.4 0.4 0.4 0.75 0.075 0.075 0.075 0.075

139264 15　 200 10k 3.5M 0.4 0.4 0.4 0.75 0.075 0.075 0.075 0.075

Test sequence a b c d a b c d



Jitter transfer function of the regeneration relay The jitter transfer function of the regeneration relay is defined the ratio of output STM-N signal jitter to the input STM-N signal jitter versus frequency. The jitter transmission characteristic of ZXMP S330 SDH regeneration relay is shown in Fig. 6-5. Fig. 6-5 The jitter transfer characteristics of a regeneration relay

Input jitter amplitude(UI )P-P

Frequency

A2

A1

0 f1f2


The jitter transmission parameters of regeneration relay are shown in Table 6-29. Table 6-29 Jitter transmission parameters of a regeneration relay

STM-N fc (kHz) P (dB)

A 130 0.1 STM-1

B 30 0.1

A 500 0.1 STM-4

B 30 0.1

A 2000 0.1 STM-16

B 30 0.1

6.12 Clock timing and synchronous characteristics The SEC Index list

Table 6-30 The SEC Index list

Vendor ISOTEMP

Type OCXO

Standard Central Frequency 77.76MHz

Day aging rate ≤1×10-8

Year aging rate ≤5×10-7

Central frequency precision 1×10-7(0V)

Short time stability ≤±1×10-10/s

Temperature characteristic ±5×10-8(0～50°C)

Output jitter When there is no input jitter, the inhered jitter of ZXMP S330 2M clock output interface should not be over 0,05 UIP-P. The test is conducted at an interval of every 60 seconds with a single-pole band-pass filter in 20Hz and 100kHz turnover frequencies.

Permitted input/output attenuation and others For ZXMP S330 the bit rate tolerance of clock output signal is ±4.6ppm.

Long-term phase variation in clock locking mode



The long-term phase variation in the clock locking mode refers to the phase noise generated at the SEC output terminal when there is an ideal input reference signal. Usually, they are expressed by the Maximum Time Interval Error (MTIE) and time deviation error (MTIE). ZXMP S330 can satisfy the requirements shown in Tables 6-31, 6-32 and 6-33. Table 6-31 The wander limit value under constant temperature (MTIE)

MTIE limits Observation interval

40 ns 0.1s<τ≤1s

40τ0.1 ns 1s<τ≤100s

25.25τ0.2 ns 100s<τ <1000s

Table 6-32 The wander limit value under temperature impact (MTIE)

Additional MTIE permitted value Observation interval

0.5τns 0.1s<τ≤100s

50ns 　τ>118s

Table 6-33The wander limit value under constant temperature (TDEV)

MTIE limits Observation interval

3.2 ns 0.1s<τ≤25s

0.64τ0.5 ns 25s<τ≤100s

6.4 ns 100s<τ≤1000s

Clock accuracy in the hold mode Once all the timing references are lost, SEC will enter the hold mode after instantaneous phase variation. Now, SEC will use the last frequency information saved before the timing reference signal loss as its timing reference. Meanwhile, the oscillation frequency of the oscillator will slowly wander, but can still ensure that SEC frequency only has very small frequency deviation from the reference frequency in a long time base; therefore, the sliding loss will be within the allowed index requirement. This mode can be used to deal with an external clock failure lasting several days. When SEC loses its reference source and enters the hold mode, the phase error ΔT of the SEC output signal to the input signal should not be over the following limits when observation time S is greater than 15s from the moment that the reference source loses. ΔT (S) = [(a1+a2)S+0.5bS2+c] ns a1= 50ns/s corresponds to the initial frequency deviation of 5 × 10-8. a2=2000ns/s refers to the frequency deviation caused by the temperature change after the clock enters the hold mode. If there is no temperature change in 2 × 10-6, there will be no a2S in the phase error. b = 1.16 × 10-4ns/s. It is caused by aging, corresponding to 1×10-8/day frequency wander. c = 120ns, includes any additional phase deviation that might be generated after entering the transition stage of hold mode. ZXMP S330 meets the above requirements.

Frequency Accuracy of Internal Oscillator in the Free-run Mode When the internal oscillator of SEC works in the free-run mode if SEC loses all of the clock references, and their memories or SEC has no hold mode at all, it is required that its output frequency accuracy be within a certain range. For a reference that can follow the G.811 clock, the SEC output frequency accuracy in the free-run mode should not be greater than 4.6ppm for SDH terminal equipment and 20ppm for REG equipment. ZXMP S330 can satisfy the above requirements.


C h a p t e r 7

ENVIRONMENT ADAPTABILITY 7.1 Power supply requirements

Working voltage and current:

Rated working voltage: -48V

Rated working current: 6A

Nominal voltage: -48VDC

Range: -57VDC~-40VDC

7.2 Grounding requirements If separate grounding is adopted in the equipment room, the grounding resistance should meet the following requirements:

1. The grounding resistance in case of –48V DC is less than or equal to 4Ω.

2. The grounding resistance for the system working ground is less than or equal to 4Ω.

3. The grounding resistance for the lightning protection ground is less than or equal to 4Ω.

If the combined grounding is adopted in the user equipment room, the grounding resistance should be less than or equal to 1Ω.

The voltage difference among lightning protection ground, system working ground and -48V GND should be less than 1V.

The tandem requirements between all groundings are as follows:

1. The -48V ground of the board is isolated from the -48V GND.

2. The board shielding plate is connected to the cabinet via the front panel, and there is an electrical connection with the co-module filter capacitor inside a board.

The lightening protection GND only connects to the protection component, and converges with the system working GND at the grounding terminal on the bus bar of the rack. The -48V GND can converge with the PGND, or the combined GND on the bus bar of the rack, or be grounded outside.

7.3 Environment requirements

Operation Environment 1) Climate Table 7-1 Climate requirement

Item Range

Chapter 7 - Environment Adaptability


Altitude ≤ 4000m

Air pressure 70 ~ 106kPa

Temperature -5 ~ +45

Temperature change rate ≤ 0.5/min

Relative humidity 5% ~ 90%

Heat radiation ≤ 300W/s²

2) Biological environment Avoid multiplication of microbe, such as eumycete and mycete. Avoid the rodent, e.g., mice.

3) Air cleanliness Table 7-2 Density requirements for chemical active substances

Content Chemical active substance

mean (mg/m³) Max( mg/m³)

SO2 0.3 1

H2S 0.1 0.5

NH3 1 3

Cl2 0.1 0.3

HCl 0.1 0.5

HF 0.01 0.03

O3 0.05 0.1

NO2 0.5 1

Table 7-3 Density requirements for mechanical active substances

Mechanical active substance Content

Precipitable dust/ = 15 mg/m²·h

4) Mechanical stress Table 7-4 Requirements for mechanical stress

Item Unit Value Acceleration m/S2 0.1

Frequency range Hz 5～100, 100～5

direction X，Y，Z

duration Min 90

5) Condition of earthquake

According with： NEBS GR－63

IEC721-2-6 “Environmental conditions appearing in nature - Earthquake vibration”

IEC68-3-3 “Environmental testing - Part 3: Background information - Subpart 3: Guidance. Seismic test methods for equipment”



Environment for Storage The following international standards are taken as the reference for framing the environment requirements：

IEC721-3-1 Classes 1K4/1Z2/1Z3/1Z5/1B2/1C2/1S3/1M2

1) Climate Table 7-5 Climate requirement

Item Range

Altitude ≤ 4000m

Air pressure 70 ~ 106kPa

Temperature -40 ~ +70

Temperature change rate ≤ 0.5/min

Relative humidity 10% ~ 100%

Solar radiation ≤ 600W/s²

Air speed = 30m/s²

2) Mechanical stress Table 7-6 Requirements for mechanical stress

Item unit value Acceleration m/S2 0.1

Frequency range Hz 5～100, 100～5

direction X，Y，Z

duration Min 90

The earthquake-proof performance of the whole equipment complies with Earthquake-proof Performance Detection for SDH Optical Communications Equipment (Provisional) and Earthquake-proof Performance Detection for SDH Optical Communications Equipment (Provisional). The earthquake-proof performance detection reaches the eight-level intensity

Cleanness requirements Cleanness involves dust and harmful gases in the air. The equipment should be operated in the equipment room that meets the cleanness requirements described below:

1).In the transmission equipment room, there is no explosive, electrically conductive, magnetically conductive or corrosive dust.

2).The density of dust particles with the diameter greater than 5µm should be no more than 3X104 particles/m3.

3).No corrosive metal or gases that is detrimental to the insulation exist in the equipment room, such as SO2 and NH3.

4).The equipment room should be always kept clean, with doors and windows being closed.

Bearing Requirements of the Equipment Room The bearing capability of the equipment room should be over 450kg/m2 to hold ZXMP S330 equipment.



7.4 EMC requirements Before introducing the EMC (Electromagnetic Compatibility) requirements, firstly specifies 3 criteria for test results:

Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After the electromagnetic interference, the number of errors shall not exceed the maximum of the normal requirement.

Performance B: Transient phenomenon. During the electromagnetic interference, the degradation of function is allowed, the equipment can work as expected without the operator’s interference, the loss of frame and synchronization is not allowed, and neither pattern out-of-sync, nor AIS alarm is generated. The equipment shall work normally after the electromagnetic interference.

Performance R: Resistive phenomenon. The fuse or other special devices can be replaced or restarted.

Electronic Static Discharge (ESD)

1). Anti-interference for static discharging

The static discharge anti-interference index of ZXMP S330 equipment is shown in Table 7-7. During the operation in the interface area, be sure to wear an antistatic wrist strap. Table 7-7 Static discharge anti-interference

Contact discharge Air discharge Criterion for test results

6kV 8kV Performance B

8kV 15kV Performance R

2). RF electromagnetic radiated susceptibility

The RF electromagnetic radiated susceptibility of ZXMP S330 equipment is shown in Table 7-8. Table 7-8 RF electromagnetic radiated susceptibility

Test frequency (80MHz~1000MHz)

Electric field intensity Amplitude modulation Criterion for test results

10V/m 80%AM (1kHz) Performance A

3). Electrical fast transient burst susceptibility

The electrical fast transient burst susceptibility of ZXMP S330 equipment is shown in Tables 7-9 and 7-10. Table 7-9 Electrical fast transient burst susceptibility at the DC power port

Generator waveform 5/50ns

Test voltage Repeated frequency Criterion for test results

1kV 　 5kHz Performance B

Table 7-10 Electrical fast transient burst susceptibilities at the signal cable and control cable ports

Generator waveform 5/50ns

Test voltage Repeated frequency Criterion for test results

1kV 　 5kHz Performance B



4). Surge susceptibility

The surge susceptibility of ZXMP S330 equipment is shown in Tables 7-11, 7-12, and 7-13. Table 7-11 Surge susceptibility of DC power

The waveform of generators 1.2/50us (8/20μs), internal resistance 12　

Test mode Test voltage Criterion for test results

Line to ground 1kV 　 Performance B

Line to ground 2kV 　 Performance R

Table 7-12 Surge susceptibility of the outdoor signal cable

The waveform of generators 10/700µs, internal resistance 40　


Line to line


Line to line


Table 7-13 Surge susceptibility of the indoor signal cable

Generator waveform 1.2/50μs (8/20μs), internal resistance 42　




5). Conductivity susceptibility of RF field

The conductivity susceptibility of RF field of ZXMP S330 equipment is shown in Table 7-14. Table 7-14 Conductivity susceptibility of RF field

Test frequency 0.15MHz ~ 80MHz

Test intensity Amplitude modulation Criterion for test results

3V 80%AM (1kHz) Performance A

Electromagnetic Interference (EMI)

1). Conductive emission electromagnetic interference

The conductive emission electromagnetic interference of ZXMP S330 equipment is shown in Table 7-15. Table 7-15 Conductive emission electromagnetic interference at the direct current port

Limits (dBuV) Testing frequency (MHz)

Quasi-peak Mean value

0.02~0.15 79 --

0.15~0.5 79 66

0.5~30 73 60

2). Radioactive emission electromagnetic interference



The radioactive emission electromagnetic interference of ZXMP S330 equipment is shown in Table 7-16. Table 7-16 Radio active emission electromagnetic interference

Quasi-peak demodulating limit (dBµV/m) Testing frequency (MHz)

10m 3m

30~230 40 50

230~1000 47 57

7.5 Safety requirements This product adopts the technical requirements specified in the following standard:

IEC/EN 60950:2000 Safety of information technology equipment

1. Working voltage and current

Rated working voltage: -48V

Max. working voltage: -57V

Min. working voltage: -40V

Rated working current: 6A

2. Insulation classification of the equipment

The power supply of the equipment provides the SELV circuit with safe and excessively low voltage, without self-generating dangerous voltage. It belongs to the equipment of the class III insulation (Class III equipment).

3. Optical interface

The optical module of the maximum power belongs to (Class 3A). All the optical modules shall be under strict control and certified by authorities (such as UL, TUV and NEMKO), and comply with EN60825.

4. Fuse

All the fuses and power modules, including recoverable fuses, shall be certified by authorities such as CE, UL and TUV.

5. Safety mark

On the package of the equipment, there are striking labels about antistatic, fragile, waterproof, and damp-proof.

The maximum optical power satisfies the 3A safety standard. An obvious label warning against the laser shall be pasted at the optical interface.

Cables of different colors shall be used for the power input, shielding GND and lightening protection GND to avoid incorrect connection. Different power connectors shall use coding keys. There shall be a power label at the power inlet.

Both the equipment and each board shall have an antistatic label.

Grounding symbol . ” ” indicates switch-on, and ” ” indicates switch-off.

6. Mechanical structure

In installation, four bolts are designed at the rack bottom (may also be used to adjust balance) to fix the rack to the ground. At the rack top, the corresponding screws are designed to fix the rack to the cabling rack. When installed in the



equipment room, the rack shall be fixed both at the top and bottom to ensure the stability and safety of the equipment.

The corners of both the rack and sub-rack are processed to avoid hurting people.

7. Fire protection

The materials of the circuit boards in the equipment use the fireproof materials of the V-2 level to prevent the circuits from burning in case of failure.

The structural parts use unburnable materials with a good fireproof performance, including surface processing materials.

With the effective heat dissipation design, it ensures that the temperature does not exceed 70ºC to prevent heat aggregation and reduce the possibility of burning.

Safe parts passing the safety authentication (CE, UL, etc.) are used.

8. High temperature protection

In abnormal conditions, the temperature does not exceed 70ºC. The plastic parts, components, wires and cables, and safety labels shall all comply with the requirements specified in the safety standard-GB4943/EN60950.

9. Lightening protection

In this system, good grounding and isolation and protection of electrical interfaces are used to prevent the dangerous voltage of lightening.


C h a p t e r 8

APPENDIX 8.1 Followed standards

International standards of ITU 1. Overall concept recommendations G.707 and G.780

G.707(03/1996) Network Node Interface for the Synchronous Digital Hierarchy.

G.780(11/1994) Vocabulary of Terms for Synchronous Digital Hierarchy (SDH) Networks and Equipment

2. Recommendations G.783, G.784, G.785 and G.813 for SDH equipment

G.783(04/1997) Characteristics of Synchronous Digital Hierarchy (SDH) Equipment Functional Blocks.

G.784 (01/1994) Synchronous Digital Hierarchy (SDH) Management. It involves SDH management, including the control and supervision functions related to SDH network elements (NE).

G.785 (11/1996) Characteristics of a Flexible Multiplexer in a Synchronous Digital Environment.

G.813 J.132, Transport of MPEG-2 Signal in SHD Networks. .

3. Recommendations G.957, G.958, G.681, G.691, G.692 and F.751 for the physical layer transmission

They include G.652~G.958, G.681, G.691, G.692, and F.751 recommendations.

G.957 (07/1995) Optical Interfaces for Equipment and Systems Relating to Synchronous Digital Hierarchy.

G.958 (11/1994) Digital Line Systems based on the Synchronous Digital Hierarchy for use on Optical Fiber Cables

G.691(original G.scs)

Optical Interfaces for Single-Channel SDH Systems with Optical Amplifiers, and STM-64 Systems.

G.652 (04/1997) Characteristics of a Single-Mode Optical Fiber Cable. The optical fiber specified in G.652 has been widely used; namely, it is called as a normal single-mode optical fiber.

G.653 (04/1997) Characteristics of Dispersion-Shifted Single-mode Optical Fiber Cable.

G.654 (04/1997) Characteristics of a Cut-off Shifted Single-mode Optical Fiber Cable.

G.655 (10/1996) Characteristics of a Non-zero Dispersion Shifted Single-mode Optical Fiber Cable

G.661 (10/98) Definition and test methods for the relevant generic parameters of optical amplifier devices and subsystems

G.662 (07/1995) Generic Characteristics of Optical Fiber Amplifier Devices and Sub-Systems.

G.663 (10/1996) Application Related Aspects of Optical Fiber Amplifier Devices and Sub-Systems

G.671(02/1998) Transmission Characteristics of Passive Optical Components

G.681 (10/1996) Functional Characteristics of Interoffice and Long-haul Line Systems Using Optical Amplifiers, Including Optical Multiplexing

G.861 (08/1996) Principles and Guidelines for the Integration of Satellite and Radio



Systems in SDH Transport Networks

G.703(04/1991) Physical/Electrical Characteristics of Hierarchical Digital Interfaces.

F.751-2(09/1997) Transmission Characteristics and Performance Requirements of Radio-relay Systems for SDH Based Networks.

4. Recommendation G.803 (G.805, F.750-3) for network structure

G.803 (06/1997) Architecture of transport Networks based on the Synchronous Digital Hierarchy (SDH).

G.805 (11/1995) Generic Functional Architecture of Transport Networks.

F.750-3 (09/1997) Architectures and Functional Aspects of Radio-Relay Systems for SDH-Base Networks

5. Recommendations G.810~G.813 and G.synce (G.781) for synchronization and timing

G.810 (08/1996) Definitions and Terminology for Synchronization Networks

G.811 (02/1997) Timing Requirements at the Outputs of Primary Reference Clock Suitable for Plesiochronous Operation of International Digital Links.

G.812 (02/1997) Timing Requirements at the Outputs of Slave Clocks Suitable for Plesiochronous Operation of International digital Links

G.813 (08/1996) Timing Characteristics of SHD Equipment Slave Clocks.

G.synce (G.781) Synchronization Layer Functions.

6. Protection and interworking recommendations G.841 and G. 842

G.841(07/1995) Types and Characteristics of SHD Network Protection Architecture

G.842 (04/1997) Interworking of SDH Network Protection Architecture.

7. Performance and measure recommendations G.825, G.826, O.172, O.181, M.1201, M.2110 and M.2120

G.825 (03/1993) The Control of Jitter and Wander within Digital Networks which are based on the Synchronous Digital Hierarchy (SDH).

G.826 (08/1996) Error Performance Parameters and Objectives for International, constant Bit Rate Digital Paths at or Above the Primary Rate.

O.181 (05/1996) Equipment to Assess Error Performance on STM-N Interfaces.

O.172 Timing Jitter and Wander Measuring Equipment for Digital Systems Which are Based on the Synchronous Digital Hierarchy (SDH)

M.2101.1 (04/1997) Performance Limits for Bringing-into-service and Maintenance of International SDH Paths and Multiplex Sections.

M.2110 (04/1997) Bringing-into-service of International PDH Paths, Sections and Transmission Systems and SDH Paths and Multiplex Sections.

M2120 (04/1997) PDH Path, Section and Transmission System and SDH Path and Multiplex Section Fault Detection and Localization Procedures.

8. Network management recommendations G.784, G.831, G.774, G.774.01~G774.09 and G.773 (G.851~G.854, M.3010, M.3100, Q.811, Q.812)

G.784 (01/1994) SDH management

G.831 (08/1996) Management Capabilities of Transport Networks Based on the Synchronous Digital Hierarchy (SDH).

G.774 (11/1996) Synchronous Digital Hierarchy (SDH) Performance Monitoring for the Network-Element View.

G.774.02 (11/1996) Synchronous Digital Hierarchy (SDH) configuration of the Payload Structure for the Network Element View. This

Chapter 8 - Appendix


recommendation offers an information model for the payload management of SDH network.

G.774.03 (11/1996) Synchronous Digital Hierarchy (SDH) Protection Management for the Network Element View.

G.774.04 (11/1996) Synchronous Digital Hierarchy (SDH) management of Sub-network Connection Protection for the Network Element View.

G.774.05 (11/1996) Synchronous Digital Hierarchy (SDH) management of Sub-network Connection Supervision Functionality (HCS/LCS) for the Network Element View.

G.774.06 (04/1997) Synchronous Digital Hierarchy (SDH) Unidirectional Performance Monitoring for the Network Element View

G.774.07 (11/1996) Synchronous Digital Hierarchy (SDH) - G.774 Implementer’s Guide.

G.774.08 (04/1997) Synchronous Digital Hierarchy (SDH) Management of Radio-Relay Systems for the Network Element View.

G.774.09 (02/1998) Synchronous Digital Hierarchy (SDH) Configuration of Linear Multiplex Section Protection for the Network Element View.

ITU-T/M.3010(02/00) Principles for a Telecommunications management network

ITU-T/M.3010 (2000) Amendment 1 (12/03) TMN conformance and TMN compliance

ITU-T M.3400 TMN management functions

9. EMC, Safety and Environmental Standard

For EMC Standard:

1. EMI Standard---CISPR22(EN55022)

2. EN50082-1:1992 or EN55024:1998 (Mandatory by 1 July 2001)（ EN61000-4-2, 3, 4, 5, 6 series ）

FOR TNE (Telecommunication network equipment)

3. ETSI EN 300 386 V1.2.1 (2000-03)

Electromagnetic compatibility and Radio spectrum Matters (ERM); Telecommunication network equipment; Electromagnetic Compatibility (EMC) requirements

Safety Standard---IEC950(EN60950)

Environmental standard--ETS 300 019 (T/TR02-12)

Storage: Environmental class 1.1

Transport: Environmental class 2.3

Operation: Environmental class 3.4

The relevant recommendations are as follows:

G.773 (03/1993) Protocol Suites for Management of Transmission Systems.

G.851.1 (11/1996) Management of the Transport Network-Application of the RM-ODP Framework.

G.852.1 (11/1996) Management of the Transport Network-Enterprise Viewpoint for Simple Sub-network Connection Management.



G.853.1 (11/1996) Common Element of the Information Viewpoint for the Management of a Transport Network.

G.853.2 (11/1996) Sub-network connection Management Information Viewpoint.

G.854.1 (11/1996) Management of the Transport Network-Computational Interfaces for Basic Transport Network Model.

M.3030 (05/1996) Principles for a Telecommunications Management Network.

M.3100 (07/1995) Generic Network Information Model.

G.664(03/2003) Optical safety procedures and requirements for optical transport systems.

ITU-T G.7041 Generic frame procedure（GFP）

ITU-T G.7042 Link capacity alignment scheme（LCAS）for virtual concatenated signals

G.828 (03/00) Error performance parameters and objectives for international, constant bit rate synchronous digital paths

G.823 (03/00) The control of jitter and wander within digital networks which are based on the 2048 Kbit/s hierarchy.

G.824 (03/00) The control of jitter and wander within digital networks which are based on the 1544 Kbit/s hierarchy.

ITU-T/V.11/V.11(10/96) Electrical characteristics for balanced double-current interchange circuits operating at data signaling rates up to 10 Mbit/s.

ITU-T/V.24/V.24(02/00) List of definitions for interchange circuits between data terminal equipment (DTE) and data circuit-terminating equipment (DCE)

ITU-T V.28(03/93) Electrical characteristics for unbalanced double-current interchange circuits

ETSI EN 300 119-3 Environmental Engineering (EE) European telecommunication standard for equipment practice; Part 3: Engineering requirements for miscellaneous racks and cabinets

ETSI EN 300 119-4 "Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 4: Engineering requirements for sub-racks in miscellaneous racks and cabinets"

IEEE 802.1d Information Technology- Telecommunications and information exchange between systems--Local and metropolitan area networks—Common Specific requirements--Part 3: MAC Bridge

IEEE 802.1q IEEE Standards for Local and metropolitan area networks—Virtual Bridged Local Area Networks

IEEE 802.1s Multiple spanning tree

IEEE 802.3 IEEE Standard for Information technology --Telecommunications and information exchange between systems--Local and metropolitan area networks--Specific requirements--Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications

Ethernet standard is ISO/IEC 8802-3 (ANSI/IEEE Std 802.3)

Fast Ethernet standard is IEEE Std 802.3u-1995

Corporate standards and other standards Q/ZX04 001-1997 Component Derating Principles

Q/ZX 23.011.04-2001 Guide to Electromagnetic Compatibility Test of Electronic Communication Equipment---Transmission Equipment

Q/ZX 04.014–1998 Regulations regarding Product Testability Design

Q/ZX04.030–999A Technological Requirement for PCB Design

8.2 Abbreviations Abbreviations Full Name

ADM Add-Drop Multiplexer



Abbreviations Full Name

AIS Alarm Indication Signal

ANSI American National Standards Institute

APS Automatic Protection Switching

ASIC Application Specific Integrated Circuit

ATM Asynchronous Transfer Mode

AU Administrative Unit

AUG Administration Unit Group

AU-n Administration Unit, level n

AU-PTR Administration Unit Pointer

BBE Background Block Error

BBER Background Block Error Ratio

BER Bit Error Ratio

BITS Building Integrated Timing Supply

BML Business Management Layer

CBR Constant Bit Rate

CDM Code Division Multiplexing

CLP Cell Loss Priority

CMI Coded Mark Inversion

C-n Container- n

CORBA Common Object Request Broker Architecture

CV Code Violation

DB Data Base

DBMS Data Base Management System

DCC Data Communications Channel

DCE Data Circuit-terminating Equipment

DCF Data Communications Function

DCN Data Communications Network

DDN Digital Data Network

DLL Dynamic Link Libraries

DNA Distributed Network Architecture

DNI Dual Node Interconnection

DQDB Distributed Queue Double Bus

DTE Data Terminal Equipment

DWDM Dense Wavelength-division Multiplexing

DXC Digital Cross Connect

ECC Embedded Control Channel

EDFA Erbium Doped Fiber Amplifier

EM Element Management

EMC ElectroMagnetic Compatibility

EMI ElectroMagnetic Interference

EML Element Management Layer

EMS Element Management System

EOS Ethernet Over SDH

ES Error Second

ESD Electronic Static Discharge




ESR Error Second Ratio

ETSI European Telecommunication Standards Institute

FDDI Fiber Distributed Data Interface

FDM Frequency Division Multiplexing

FE Fast Ethernet

FEBBE Far End Background Block Error

FEES Far End Errored Second

FESES Far End Severely Errored Second

GUI Graphical User Interface

HDLC High Digital Link Control

HPC Higher order Path Connection

HW High-Way

IEC International Electrotechnical Commission

IEEE Institute of Electrical & Electronic Engineers

IP Internet Protocol

ITU-T International Telecommunication Union-Telecommunication Standardization

Sector

L2 Layer 2

LAN Local Area Network

LAPD Link Access Procedure On D-channel

LAPS Link Access Procedure for SDH

LCD Loss of ATM Cell Delineation

LCT Local Craft Terminal

LOF Loss Of Frame

LOP Loss Of Pointer

LOS Loss Of Signal

LPC Lower order Path Connection

MAC Medium Access Control

MAN Metropolitan Area Network

MCF Message Communication Function

MCU Micro Control Unit

MD Mediation Device

MF Mediation Function

MII Medium Independent Interface

MM Multi Mode

MS Multiplex Section

MS-AIS Multiplex Sections - Alarm Indication Signal

MSOH Multiplex Section OverHead

MSP Multiplex Section Protection

MS-PSC Multiplex Sections - Protection Switching Count

MS-PSD Multiplex Sections - Protection Switching Duration

MS-SPRing Multiplexer Section Shared Protection Ring

MST Multiplex Section Terminal

MTIE Maximum Time Interval Error

NE Network Element




NEF Network Element Function

NEL Network Element Layer

NML Network Manager Layer

NMS Network Management System

NRZ Non-Return-to-Zero

OAM Operation, Administration and Maintenance

OFS Out of Frame Second

OOF Out of Frame

OS Operation System

OSF Operation System Function

OSI Open System Interconnect

PCB Printed Circuit Board

PCM Pulse Code Modulation

PDH Plesiochronous Digital Hierarchy

PGND Protection GND

PHY physical Layer Device

PJE- Pointer Justification Event -

PJE+ Pointer Justification Event +

POH Path OverHead

PPP Point to Point Protocol

PRC Primary Reference Clock

QA Q Adaptor

QAF Q Adaptor Function

QoS Quality of Service

RAM Random Access Memory

RDI Remote Defect Indication

REG Regenerator

REI Remote Error Indication

RFI Remote Failure Indication

RIP Router Information Protocol

RMII Reduced Medium Independent Interface

RS Regenerator Section

RSOH Regenerator Section OverHead

SAR Segmentation and Reassembly

SDH Synchronous Digital Hierarchy

SEC SDH Equipment Clock

SEMF Synchronous Equipment Manage Function

SES Severely Errored Second

SESR Severely Errored Second Ratio

SETS Synchronous Equipment Timing Source

SM Single Mode

SMCC Sub-network management control center

SML Service Management Layer

SMN SDH Management Network

SMS SDH Management Sub-Network




SMT Surface Mount Technology

SNC Sub-network Connection

SNCP Sub-network Connection Protection

SOH Section Overhead

SPRING Shared Protection Ring

SSF Service Signal Fail

SSM Synchronization status messaging

SSM Synchronous State Message

STM-N Synchronous Transport Module Level-N

TCP Transport Control Protocol

TDEV Time Deviation

TDM Time Division Multiplex

TM Terminal Multiplexer

TMN Telecommunications Management Network

TTL Transistor-Transistor Logic

TU Tributary Unit

TUG-m Tributary Unit Group, level m

TU-m Tributary Unit, level m

UART Universal Asynchronous Receiver Transmitter

UAS Unavailable Second

UBR Unspecified Bit Rate

UNI User-Network Interface

UPC Usage Parameter Control

VBR Variable Bit Rate

VC Virtual Channel

VC Virtual Container

VCI Virtual channel Indicator

VC-n Virtual Container, level n

VDN Virtual Data Network

VLAN Virtual Local Area Network

VP Virtual Path

VPI Virtual Path Indicator

VPG VP Group

WAN Wide Area Network

WDM Wavelength Division Multiplexing

WS Work Station

WSF Work Station Function

ZXMP Zhong Xing MSTP

Documents

S330 Technical