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The new technology era has a huge
impact on Non-Volatile Memory (NVM),
demanding memories with faster speed
and higher storage capacity.
Manufacturers have therefore channeled
investment into the development of new
NVMs with more memory cells in a single
chip.
Samsung continues to dominate the
semiconductor industry, including the
memory industry, as shown by the
magnificent $22 billion revenue in 2018
generated by its NAND memory business.
Its manufacturing techniques change from
one generation to another to produce
reliable memory chips with higher
capacity.
This report presents a detailed technology
study of the latest Samsung 3D Vertical-
NAND memory made with 92-Layer word
lines. Thanks to high quality optical
images and high-resolution scanning
electron microscope (SEM) images, the
physical analysis shows details of die cross
sections, including material identification.
The report includes a detailed process to
better understand the major fabrication
steps. It also includes a cost estimation of
producing Samsung’s new generation 3D
NAND chips and the packaging cost.
Finally, this report features a comparison
of Samsung’s previous NVM generation
with the latest generation. This identifies
the different and similar features in the
two generations, and compares the
fabrication cost and the impact of the
added layers.
COMPLETE TEARDOWN WITH
• Detailed optical and SEM photos and
cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Comparison of 92-layer with 64-layer
V-NAND
• Estimated sales price
Fifth generation 3D NAND memory chip reveals Samsung’s latest memorytechnology and fabrication methods.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Samsung 3D V-NAND 92-Layer Memory
Pages: 100
Date: September 2019
Format: PDF & Excel file
Price: EUR 3,990
Samsung 3D V-NAND 92-Layer Memory
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - MEMORY - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Reverse Costing Methodology
Samsung Company Profile
Market Analysis
• NAND Flash Market Revenue
• NAND Market Shipments
• Samsung NAND Flash RoadMap
Physical Analysis
• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• 970 EVO Plus SSD Teardown
• Package View and Dimensions
• Memory Die
View, dimensions & marking
Cross-section
Contacts and metallization
• 3D NAND Patents
Manufacturing Process Flow
• Overview
AUTHORS
• Fab Unit
• Process Flow
Cost Analysis
• Summary of the Cost Analysis
• Yields Explanation & Hypotheses
• Memory 3D 92-Layer
Memory front-end cost
Memory front-end cost per process steps
• Process Steps
• Component
Bonding front-end cost
Memory wafer & die cost
Back-end: Final test cost
Memory 3D 92-layer component cost
Selling Price
Comparison between Samsung 92-Layer and 64-Layer V-NAND
SAMSUNG 3D V-NAND 92-LAYER MEMORY
RELATED REPORTS
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Toshiba SanDisk 64 Layers 3D NAND MemoryThe latest 3D NAND Flash memory produced by Toshiba and SanDisk for the IPhone X.November 2018 - EUR 3,990*
NAND Service –Memory ResearchNAND market downturn continues into early 2019, with recovery expected in the second half.June 2019 - EUR 30,000*
Belinda Dube is working for SystemPlus Consulting as Analyst inSemiconductor Memories andIntegrated Circuits. She holds aMasters degree in Nano Scienceand Nanotechnologies from EcoleCentral Lyon and INSA Lyon.
Véronique Le Troadec has joinedSystem Plus Consulting as alaboratory engineer. Coming fromAtmel Nantes, she has extensiveknowledge in failure analysis ofcomponents and in deprocessing ofintegrated circuits.
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