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WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 1 Revision: 01
Self Qualification Report
SOT186A&SOD113 second source compound
(Qual Plan ref. 70403)
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 2 Revision: 01
Table of Contents
1. Introduction ..................................................................................................................................................... 3
2. Material details ................................................................................................................................................ 3
3. Equipment details ........................................................................................................................................... 3
4. Constructional Details of Test Vehicles ......................................................................................................... 4
4.1 Package structure ………......................................................................................................................4 4.2 Assy & Testing process flow .… ………………...................................................................................5
5. Self-qualification results ................................................................................................................................. 6
6. Packing method .................................................................................................................................... ......... 6
7. Marking……………………………………………………………………………………………………….7
8. POD and Appearance.................................................................................................................................... 7
9. Drop test report………………………………………………………… ………………………………… 7
10. Thermal ………………………………………………………………… …………………………………. 8
11. Reliability test……………………………………………… ……………………………………………… 9
12. Conclusions ..................................................................................................................................................... 9
13. Document Revision Sheet ............................................................................................................................. 10
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 3 Revision: 01
1. Introduction The qualification is to qualify SOT186A&SOD113 second source molding compound Eternal-EK3600T (Non-HF)
& EK3600GT(HF).
Qualification vehicles are MAC223A8X/ ACTT8X-800C0/ BT136X-600 with EK3600T,
and BYV34X-600/ BUJ103AX/ BT136X-600E/BYC20X-600/BYV25FX-600 with EK3600GT.
The first source materials are ST-7100HK(Non-HF) & SG-8300HK(HF).
2. BOM
Materials Type Vendor
Remark
Leadframe TO-220F LDF Hualong No change
Solder Pb88Sn10Ag2 Solder wire Heraeus No change
Bonding wire Al wire Heraeus No change
Molding compound EK3600T&EK3600GT Eternal Changed
Plating Pure Sn Jielong No change
3. Equipment Details No change.
4. Constructional Details of Test Vehicles
4.1 Package structure
No change.
4.2 Assembly & Testing process flow
No change on assembly process flow.
No change on molding process and machine.
5. Self-qualification results
5.1 Terminal strength
No change.
5.2 Solderability Test
No change.
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 4 Revision: 01
5.3 Assembly and FT summary Lot1 Lot2 Lot3 Lot4 Lot5 Lot6 Lot7 Lot8 Lot9 Lot10
Part BYV34X-600 BYC20X-600 BYV25FX-600 BUJ103AX BT136X-600E BYV34X-600 MAC223A8X MAC223A8X ACTT8X-800C0 BT136X-600
Package SOT186A SOD113 SOD113 SOT186A SOT186A SOT186A SOT186A SOT186A SOT186A SOT186A
Assembly Lot W0351D176 W2792D171 W3973D172 W1396D173 W1514D174 W0351D175 W3176D182 W3176D181 W4173D183 W0976D184
Wafer Lot F3G0351#02 F3G2792#50 F3H3973#01 F3H1396#25 F3H1514#17 F3G0351#01 F3H3176#03 F3H3176#1#2 F3H4173#50 F3H0976#02
Compound Type SG8300HK EK3600GT EK3600GT EK3600GT EK3600GT EK3600GT ST-7100HK EK3600T EK3600T EK3600T
Assembly Yield 99.54% 99.65% 99.89% 99.88% 100% 100% 99.63% 99.91% 100% 99.75%
FT Yield 99.43% 99.39% 99.45% 99.53% 99.54% 98.20% 99.82% 99.72% 99.28% 99.50%
Total Yield 98.97% 99.04% 99.34% 99.41% 99.54% 98.20% 99.45% 99.63% 99.28% 99.25%
HF Compound Non HF Compound
5.4 C-SAM check
MAC223A8X with EK3600T (Non HF)
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 5 Revision: 01
BT136X-600 with EK3600T (Non HF)
BT136X-600E with EK3600GT (HF)
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 6 Revision: 01
BYV34X-600 with EK3600GT (HF)
Result: The result of C-SAM is accepted.
6. Packing Method
No change.
7. Marking No change.
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 7 Revision: 01
8. POD and Appearance
Remark: no change on POD and package appearance
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 8 Revision: 01
9. Drop Test No change.
10. Thermal Resistance
Part.NO Number P(W) Tj(ºC) Vj(V) Tr(ºC) inst Øjr(ºC/W) Ave Øjr(ºC/W)
1# 12.89 81.4 0.401 33.7 3.7 3.696
2# 12.6 81.2 0.402 33.5 3.783 3.790
3# 13.22 81 0.402 35.2 3.469 3.469
4# 13.26 81 0.404 34.9 3.475 3.478
5# 13.29 81.1 0.404 35.6 3.42 3.421
Avg 3.571
1# 12.35 80.8 0.403 34.1 3.779 3.780
2# 12.46 80.4 0.403 33.5 3.762 3.770
3# 12.58 80.3 0.404 33.8 3.698 3.695
4# 12.95 80.4 0.4 34 3.583 3.583
5# 12.78 80.6 0.402 34.3 3.621 3.615
Avg 3.689
Thermal Resistance test data
BYV34X-600
(EK3600GT)
BYV34X-600
(SG8300HK)
Part.NO Number P(W) Tj(ºC) Vj(V) Tr(ºC) inst Øjr(ºC/W) Ave Øjr(ºC/W)
1# 16.08 82.2 0.753 36.5 2.845 2.850
2# 15.92 82.5 0.751 36.1 2.913 2.916
3# 16.57 82.7 0.748 36.4 2.795 2.792
4# 16.66 82.5 0.752 36.5 2.756 2.755
5# 15.83 81.7 0.751 35.5 2.918 2.916
Avg 2.846
1# 15.99 81.4 0.756 35.5 2.873 2.879
2# 15.44 81.3 0.756 35.5 2.965 2.971
3# 16.35 81.7 0.754 36 2.798 2.795
4# 16.2 81.6 0.755 36.7 2.771 2.773
5# 16.28 81.7 0.755 36.3 2.789 2.788
Avg 2.841
Thermal Resistance test data
MAC223A8X
(EK3600T)
MAC223A8X
(ST7100HK)
Remark: no change on the data sheet.
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 9 Revision: 01
11. Relibility Test Test Test Condition Device Type(Package) Package SS / Lot Result
Temperature Cycle (TMCL) 500 cycles at -65C to 150C.
MAC223A8X(EK3600T)
ACTT8X-800C0(EK3600T)
BT136X-600(EK3600T)
BYV34X-600(EK3600GT)
BUJ103AX(EK3600GT)
BT136X-600E(EK3600GT)
BYC20X-600(EK3600GT)
BYV25FX-600(EK3600GT)
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOD113
SOD113
1x80
1x80
1x80
1x80
1x80
1x80
1x80
1x80
Passed
Unbiased Highly Accelerated
Stress Test (UHST)
96 hours at Ta = 130C, RH =
85%
MAC223A8X(EK3600T)
ACTT8X-800C0(EK3600T)
BT136X-600(EK3600T)
BYV34X-600(EK3600GT)
BUJ103AX(EK3600GT)
BT136X-600E(EK3600GT)
BYC20X-600(EK3600GT)
BYV25FX-600(EK3600GT)
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOD113
SOD113
1x80
1x80
1x80
1x80
1x80
1x80
1x80
1x80
Passed
High Temperature, Humidity &
Reverse Bias (THBS)
1000 hours at Tj = 85C, RH =
85% with Reverse Bias
MAC223A8X(EK3600T)
ACTT8X-800C0(EK3600T)
BT136X-600(EK3600T)
BYV34X-600(EK3600GT)
BUJ103AX(EK3600GT)
BT136X-600E(EK3600GT)
BYC20X-600(EK3600GT)
BYV25FX-600(EK3600GT)
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOD113
SOD113
1x80
1x80
1x80
1x80
1x80
1x80
1x80
1x80
Passed
Thermal Fatigue (TFAT)10000 cycles, Tj = 25ºC to 125ºC,
DTj ≥ 80ºC,
MAC223A8X(EK3600T)
ACTT8X-800C0(EK3600T)
BT136X-600(EK3600T)
BYV34X-600(EK3600GT)
BUJ103AX(EK3600GT)
BT136X-600E(EK3600GT)
BYC20X-600(EK3600GT)
BYV25FX-600(EK3600GT)
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOD113
SOD113
1x80
1x80
1x80
1x80
1x80
1x80
1x80
1x80
Passed
Static High Temperature Life
(SHTL)
1000 hours – Tj = max operating
temp, Reverse Bias = 80% rated
voltage.
MAC223A8X(EK3600T)
ACTT8X-800C0(EK3600T)
BT136X-600(EK3600T)
BYV34X-600(EK3600GT)
BUJ103AX(EK3600GT)
BT136X-600E(EK3600GT)
BYC20X-600(EK3600GT)
BYV25FX-600(EK3600GT)
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOD113
SOD113
1x80
1x80
1x80
1x80
1x80
1x80
1x80
1x80
Passed
High Temperature Storage (HTSL)1000 hours at Ta = 150°C or
Ta=175°C
MAC223A8X(EK3600T)
ACTT8X-800C0(EK3600T)
BT136X-600(EK3600T)
BYV34X-600(EK3600GT)
BUJ103AX(EK3600GT)
BT136X-600E(EK3600GT)
BYC20X-600(EK3600GT)
BYV25FX-600(EK3600GT)
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOT186A
SOD113
SOD113
1x80
1x80
1x80
1x80
1x80
1x80
1x80
1x80
Passed
Remark: All life test items were passed.
WeEn Semiconductors Self Qualification Report:
Molding compound of SOT186A&SOD113
second source
Document Number
70403
Date: 2017-09-18 Author: Liang Zhao Page: 10 Revision: 01
12. Conclusions Based on the qualification data, the molding compounds of EK3600T (Non-HF) & EK3600GT(HF) can fully meet
WeEn quality & reliability requirement. We are going to release both molding compounds in SOT186A&SOD113
packages as the second source.
13. Document Revision Sheet
R E V I S I O N S H E E T
DATE REV
.
DESCRIPTION AUTHOR
2017-09-18 01 Self qualification report for SOT186A&SOD113
second source material at assembly site.
Liang Zhao
