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SEMICONDUCTOR DEVICE FABRICATION
AN OVERVIEW
Presented to
EE 1001
11 October 2012
by
Stan Burns
MWAH 153
OUTLINE
What is a Monolithic Integrated Circuit (IC)? Dimensions State-of-the-art in size and density Materials Basic process sequence Photolithography Define some key terms Typical Device Cross-Sections Packaging Challenges and Opportunities in the Semiconductor
Industry For EE Graduates
DIMENSIONS AND UNITS 1 micrometer (1 m) = 10-6m = 10-4cm 1 Å = 10-10m = 10-8cm (Å =Angstrom) 10,000 Å = 1 m = 1000 nm 1 nanometer (1 nm) = 10-9 m = 10 Å Wavelength of visible light 0.4 m(violet) to 0.7 m(red)
{400 nm to 700 nm, 4,000 Å to 7,000 Å } 1 mil = 0.001 inch = 25.4 m Sheet of notebook paper about 4 mils 1 human hair = 75 m to 100 m = 75,000-100,000 nm Atomic spacing in a crystal ~ 3 to 5 Å Fingernail growth rate about 1-3 m/hour (Not personally verified) Aggressive production minimum feature sizes ~0.022 to 0.12 m
i.e. tens of nm Research and some prototypes< 0.022 m = < 22 nm
Integrated Circuit Overview
Stanley G. Burns
UMD-ECE
<$50
OTHER DEVICES AND TECHNOLOGIES
Thin-Film Transistors (TFT) Displays-Liquid Crystal Displays (LCD), Plasma, LED Backlit, etc. Photonic-Light Emitting Diodes (LED), Organic Light Emitting Diodes
(OLED), LASERS, Optical Chips, etc.) Photovoltaics-Conventional Crystalline and Flexible Thin-Film Devices and Systems on Flexible Substrates Micro-Electro-Mechanical Systems (MEMS) integration of mechanical
elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. Electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes) Micromechanical components are fabricated using compatible "micromachining"
processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.
6gear.avi
BASIC PROCESSING STEPSDesign Then
Repeated Application Of:Oxidation
Nitridation
Photolithography
Wet Etching (Chemical)
Dry Etching (Plasma)
Diffusion
Evaporation
Sputtering
Plasma Assisted Deposition
Ion Implantation
Epitaxy
Many Processing Steps are at temperatures to 1200°C
EE Student Challenges in the Semiconductor Industry
Design devices Design circuits and systems Device modeling System design and fabrication Circuit/system simulations
Testability
Materials
How small? Nanomaterials?
How large?
Speed and performance, for analog, digital and mixed-mode applications
Increased functionality
Biological integration
Optoelectronic integration
Displays
Sensors
MEMs (Design/Application)
Non-traditional substrates
Packaging
Process development
Process Control “Tool” and plant design Cradle to grave materials handling