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2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Heterogeneous integration
Presenter : Chia-Min Lin (9535811)
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Outline
Motivation Introduction Design concept / Fabrication process Results Conclusion Reference
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Motivation
Y. –C. Tung et al., J. MEMS, 2005
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Introduction
K. Tsui et al., JMM, 2004
Pick/place method
Connector/socket techniqueSAM technique to
assemble the LED
X. Xiong et al., J. MEMS, 2003
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Introduction
Low melting point solder
H. O. Jacobs et al., Science, 2002
Self-assembly, transfer, integration
T. Kraus et al., Adv. Mater., 2005
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Design concept / Fabrication process
Liftoff technique
Stamp transfer techniqueH. Onoe et al., MEMS’07, 200
7
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Aligning and loading mechanism
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Results – Liftoff technique
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Results – Stamp transfer technique
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Yield and position accuracy
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
2D and 3D stacking of structures
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Bridge structure
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Si transfer to glass
M. A. Meitl et al., Nature materials, 2006
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
ConclusionImage
Tech. Pick/place
SAM SAM Stamp Stamp Stamp
Bonding Connector/socket
Plating Solder Van der waals
OH- Van der waals
Complex 3D 3D 3D 3D 3D 3D
Batch Hard Easy Easy Medium Medium Medium
Assemb. Difficult Easy Easy Medium Medium Medium
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Thanks for your attention !
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Reference Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama,
”3D integration of heterogeneous MEMS structures by stamping transfer,” 20th IEEE MEMS Conference, Kobe, Japan, 2007, pp175-178.
Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”Three-dimensional integration of heterogeneous silicon micro structures by liftoff and stamping transfer,” J. of Micromech. and Microeng., 17, pp1818-1827, 2007.
Kenneth Tsui, Aaron A Geisberger, Matt Ellis ,and George D Skidmore, “Micromachined end-effector and techniques for directed MEMS assembly,” J. of Micromech. and Microeng., 14, pp542-549, 2004.
Xiaorong Xiong, Yael Hanein, Jiandong Fang, Yanbing Wang, Weihua Wang, Daniel T. Schwartz, and Karl F. Böhringer, ” Controlled Multibatch Self-Assembly of Microdevices,” J. of Microelectromech. Syst., 12, pp117-127, 2003.
2007/10/17 Sensing and Actuation in Miniaturized Systems presentation#1 Chia-Min Lin
Reference Yi-Chung Tung, and Katsuo Kurabayashi, “A single-layer PDMS-o
n-silicon hybrid microactuator with multi-axis out-of-plane motion capabilities-part II: fabrication and characterization,” J. of Microelectromech. Syst., 14, pp558-566, 2005.
Heiko O. Jacobs, Andrea R. Tao, Alexander Schwartz, David H. Gracias, and George M. Whitesides, ” Fabrication of a Cylindrical Display by Patterned Assembly,” Science, 296, pp323-325, 2002.
Tobias Kraus, Laurent Malaquin, Emmanuel Delamarche, Heinz Schmid, Nicholas D. Spencer, and Heiko Wolf, “Closing the Gap Between Self-Assembly and Microsystems Using Self-Assembly, Transfer, and Integration of Particles,” Adv. Mater., 17, pp2438-2442, 2005.’
Matthew A. Meitl, Zheng-Tao Zhu, Vipan Kumar, Keon Jae Lee, Xue Feng, Yonggang Y. Huang, Ilesanmi Adesida, Ralph G. Nuzzo, and John A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Materials, 5, pp33-38, 2006.