34
Model Description MODEL BRAND Printing Specification 1. Trim Size (Format) : 215mm x 280 mm 2. Printing Colors Cover : LG COLORS Inside : Black 3. Stock (Paper) Cover : Snow White 150 g/Inside : Snow White 100 g/4. Printing Method : 5. Bindery : Saddle stitch 6. Language : English 7. Number of pages : 32 ( Including blank 4pages) Part No. 1. 2. Service Guide Specification Changes 4. REV. NO. MM/DD/YY SIGNATURE CHANGE NO. CHANGE CONTENTS 1 2 3 4 5 7 6 SUFFIX LEE H.J 05.03.04 L1750S-S(G)NN L1950S-S(G)NN LG 3828TSL096Q KIM J.O 05.03.04 (1) Origin Notification * LGEDI : Printed in Indonesia * LGEWA : Printed in U.K. * LGESP : Printed in Brazil * LGEMX : Printed in Mexico * LGENT : Printed in China * LGEIL : Printed in India 8 Special Instructions 3. Product Name FLATRON L1750S FLATRON L1950S ANAUER

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Page 1: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

담 당 관 리 자

Model Description

MODEL BRAND

Printing Specification

1. Trim Size (Format) : 215mm x 280 mm

2. Printing Colors• Cover : LG COLORS• Inside : Black

3. Stock (Paper)• Cover : Snow White 150 g/• Inside : Snow White 100 g/

4. Printing Method : 5. Bindery : Saddle stitch6. Language : English7. Number of pages : 32 ( Including blank 4pages)

Part No.

1.

2.

Service Guide SpecificationService Guide Specification

Changes 4.

REV.NO. MM/DD/YY SIGNATURE CHANGE NO. CHANGE CONTENTS

1

2

3

4

5

7

6

SUFFIX

LEE H.J05.03.04

L1750S-S(G)NNL1950S-S(G)NN LG

3828TSL096Q

KIM J.O05.03.04

(1) Origin Notification* LGEDI : Printed in Indonesia * LGEWA : Printed in U.K.* LGESP : Printed in Brazil * LGEMX : Printed in Mexico* LGENT : Printed in China * LGEIL : Printed in India

8

Special Instructions3.

Product Name FLATRON L1750SFLATRON L1950S

ANAUER

Page 2: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

Pagination sheetPagination sheet P/NO.3828TSL096QTotal pages : 32pages

CoverEnglish

2

English

3

English

4

English

….

English

…..

Rear Cover

Front coverInside

blank

English

….

English

26

English

27

English

blank

English

blank

Rear coverInside

blank

Page 3: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

COLOR MONITORSERVICE MANUAL

Website:http://biz.LGservice.comE-mail:http://www.LGEservice.com/techsup.html

CAUTIONBEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : CL-82

MODEL: L1750S (L1750S-SNN.AN**QP,AG**QP)L1750S (L1750S-GNN.AN**QP,AG**QP)L1950S (L1950S-SNN.AN**QP)L1950S (L1950S-GNN.AN**QP)

( ) **Same model for Service

*To apply the MSTAR Chip.

Page 4: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

Blank Page1

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- 2 -

CONTENTS

SPECIFICATIONS ................................................... 2PRECAUTIONS ....................................................... 3TIMING CHART ....................................................... 7DISASSEMBLY ....................................................... 8BLOCK DIAGRAM ................................................... 9DESCRIPTION OF BLOCK DIAGRAM....................10ADJUSTMENT ...................................................... 12

SERVICE OSD ...................................................... 13

TROUBLESHOOTING GUIDE .............................. 14

WIRING DIAGRAM ............................................... 18

EXPLODED VIEW...................................................19

REPLACEMENT PARTS LIST ...............................22

SCHEMATIC DIAGRAM......................................... 24

1. LCD CHARACTERISTICSType : TFT Color LCD ModuleActive Display Area : 17 inch-L1750S

: 19 inch-L1950SSize : 358.5(W) x 296.5(H) x 17.0(D)-L1750S

: 404.2(W) x 330(H) x 22.0(D)-L1950SPixel Pitch : 0.264 (H) x 0.264 (V)-L1750S

: 0.294 (H) x 0.294 (V)-L1950SColor Depth : 16.2M colorsElectrical Interface : LVDSSurface Treatment : Hard-coating(3H), Anti-GlareOperating Mode : Normally White, Transmissive modeBacklight Unit : 4-CCFL

2. OPTICAL CHARACTERISTICS2-1. Viewing Angle by Contrast Ratio ≥ 10L1750SLeft : -60°min., -70°(Typ) Right : +60°min., +70°(Typ)Top :+45°min., +60°(Typ) Bottom : -50°min., -60°(Typ)

L1950SLeft : -70°min., -80°(Typ) Right : +70°min., +80°(Typ)Top :+75°min., +85°(Typ) Bottom : -75°min., -85°(Typ)

2-2. Luminance : 185(min), 250(Typ)

2-3. Contrast Ratio : 300(min), 450(Typ)-L1750S: 300(min), 500(Typ)-L1950S

3. SIGNAL (Refer to the Timing Chart)3-1. Sync Signal

• Type : Separate Sync, SOG,

3-2. Video Input Signal1) Type : R, G, B Analog2) Voltage Level : 0~0.71 Va) Color 0, 0 : 0 Vp-pb) Color 7, 0 : 0.467 Vp-pc) Color 15, 0 : 0.714 Vp-p

3) Input Impedance : 75 Ω

3-3. Operating FrequencyHorizontal : 30 ~ 83kHzVertical : 56 ~ 75Hz

4. Max. ResolutionD-sub Analog : 1280 x 1024@75Hz

5. POWER SUPPLY5-1. Power : AC 100~240V, 50/60Hz , 1.0A

5-2. Power Consumption

6. ENVIRONMENT

6-1. Operating Temperature : 10°C~35°C 6-2. Relative Humidity : 10%~80%6-3. MTBF : 50,000 HRS with 90%

Confidence levelLamp Life : 50,000 Hours(Min)

7. DIMENSIONS (with TILT/SWIVEL)L1750SWidth : 368 mm (14.49'')Depth : 230.5 mm (9.07'')Height : 389.2 mm (15.32'')

L1950SWidth : 413 mm (16.26'')Depth : 230.5 mm (9.07'')Height : 421.4 mm (16.59'')

8. WEIGHT (with TILT/SWIVEL)L1750SNet. Weight : 4.9 kg (10.80 lbs)Gross Weight : 6.5 kg (14.33 lbs)

L1950SNet. Weight : 5.7 kg (12.57 lbs)Gross Weight : 7.9 kg (17.42 lbs)

SPECIFICATIONS

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPMS OFF

H/V SYNC

ON/ON

OFF/ON

ON/OFF

OFF/OFF

POWER CONSUMPTION

less than 43 W-L1750S

less than 45 W-L1950S

less than 1 W

less than 1 W

less than 1 W

LED COLOR

GREEN

AMBER

AMBER

AMBER

VIDEO

ACTIVE

OFF

OFF

OFF

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- 3 -

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCDmonitor that are important for safety. These parts aremarked on the schematic diagram and thereplacement parts list. It is essential that these criticalparts should be replaced with the manufacturer’sspecified parts to prevent electric shock, fire or otherhazard.

• Do not modify original design without obtaining writtenpermission from manufacturer or you will void theoriginal parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULEWITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arrangedin four corners.

• Do not press on the panel, edge of the frame stronglyor electric shock as this will result in damage to thescreen.

• Do not scratch or press on the panel with any sharpobjects, such as pencil or pen as this may result indamage to the panel.

• Protect the module from the ESD as it may damage theelectronic circuit (C-MOS).

• Make certain that treatment person’s body aregrounded through wrist band.

• Do not leave the module in high temperature and inareas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit withinthe module.

• If the surface of panel become dirty, please wipe it offwith a softmaterial. (Cleaning with a dirty or rough clothmay damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) orinverter circuit, must disconnect the AC adapterbecause high voltage appears at inverter circuit about650Vrms.

• Handle with care wires or connectors of the invertercircuit. If the wires are pressed cause short and mayburn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTIONPlease use only a plastic screwdriver to protect yourselffrom shock hazard during service operation.

1.5 Kohm/10W

To Instrument'sexposed METALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

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- 4 -

SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by thisservice manual and its supplements and addenda, readand follow the SAFETY PRECAUTIONS on page 3 of thispublication.NOTE: If unforeseen circumstances create conflictbetween the following servicing precautions and any of thesafety precautions on page 3 of this publication, alwaysfollow the safety precautions. Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC

power source before;a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.CAUTION: A wrong part substitution or incorrectpolarity installation of electrolytic capacitors mayresult in an explosion hazard.

d. Discharging the picture tube anode.2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltagemeasuring device (DVM, FETVOM, etc) equipped witha suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) firstconnecting one end of an insulated clip lead to thedegaussing or kine aquadag grounding system shieldat the point where the picture tube socket ground leadis connected, and then (b) touch the other end of theinsulated clip lead to the picture tube anode button,using an insulating handle to avoid personal contactwith high voltage.

4. Do not spray chemicals on or near this receiver or anyof its assemblies.

5. Unless specified otherwise in this service manual,clean electrical contacts only by applying the followingmixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator;10% (by volume) Acetone and 90% (by volume)isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual,lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlockswith which receivers covered by this service manualmight be equipped.

7. Do not apply AC power to this instrument and/or any ofits electrical assemblies unless all solid-state deviceheat sinks are correctly installed.

8. Always connect the test receiver ground lead to thereceiver chassis ground before connecting the testreceiver positive lead.Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified inthis service manual.CAUTION: Do not connect the test fixture ground strapto any heat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can bedamaged easily by static electricity. Such componentscommonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integratedcircuits and some field-effect transistors andsemiconductor "chip" components. The followingtechniques should be used to help reduce the incidence ofcomponent damage caused by static by static electricity.1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drainoff any electrostatic charge on your body by touching aknown earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device,which should be removed to prevent potential shockreasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped withES devices, place the assembly on a conductivesurface such as aluminum foil, to prevent electrostaticcharge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder orunsolder ES devices.

4. Use only an anti-static type solder removal device.Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient todamage ES devices.

5. Do not use freon-propelled chemicals. These cangenerate electrical charges sufficient to damage ESdevices.

6. Do not remove a replacement ES device from itsprotective package until immediately before you areready to install it. (Most replacement ES devices arepackaged with leads electrically shorted together byconductive foam, aluminum foil or comparableconductive material).

7. Immediately before removing the protective materialfrom the leads of a replacement ES device, touch theprotective material to the chassis or circuit assemblyinto which the device will be installed.CAUTION: Be sure no power is applied to the chassisor circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motionsuch as the brushing together of your clothes fabric orthe lifting of your foot from a carpeted floor cangenerate static electricity sufficient to damage an ESdevice.)

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- 5 -

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tiptemperature within the range or 500。F to 600。F.

2. Use an appropriate gauge of RMA resin-core soldercomposed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a

mall wire-bristle (0.5 inch, or 1.25cm) brush with ametal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron t ip to reach normal

temperature.(500。F to 600。F)

b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solderbraid.CAUTION: Work quickly to avoid overheating thecircuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal

temperature (500。F to 600。F)b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction ofthe component lead and the printed circuit foil, andhold it there only until the solder flows onto andaround both the component lead and the foil.CAUTION: Work quickly to avoid overheating thecircuit board printed foil.

d. Closely inspect the solder area and remove anyexcess or splashed solder with a small wire-bristlebrush.

IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong)through which the IC leads are inserted and then bent flatagainst the circuit foil. When holes are the slotted type,the following technique should be used to remove andreplace the IC. When working with boards using thefamiliar round hole, use the standard technique asoutlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation

by gently prying up on the lead with the soldering irontip as the solder melts.

2. Draw away the melted solder with an anti-staticsuction-type solder removal device (or with solderbraid) before removing the IC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad

and solder it.3. Clean the soldered areas with a small wire-bristle

brush. (It is not necessary to reapply acrylic coating tothe areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as

close as possible to the component body.2. Bend into a "U" shape the end of each of three leads

remaining on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the

corresponding leads extending from the circuit boardand crimp the "U" with long nose pliers to insure metalto metal contact then solder each connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor

leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the

circuit board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close

as possible to diode body.2. Bend the two remaining leads perpendicular y to the

circuit board.3. Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuitboard.

4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder

joints of the two "original" leads. If they are not shiny,reheat them and if necessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board

hollow stake.2. Securely crimp the leads of replacement component

around notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between thereplaced component and adjacent components and thecircuit board to prevent excessive componenttemperatures.

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- 6 -

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printedcircuit board will weaken the adhesive that bonds the foilto the circuit board causing the foil to separate from or"l i f t-off" the board. The following guidelines andprocedures should be followed whenever this condition isencountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections usethe following procedure to install a jumper wire on thecopper pattern side of the circuit board. (Use thistechnique only on IC connections).

1. Carefully remove the damaged copper pattern with asharp knife. (Remove only as much copper asabsolutely necessary).

2. carefully scratch away the solder resist and acryliccoating (if used) from the end of the remaining copperpattern.

3. Bend a small "U" in one end of a small gauge jumperwire and carefully crimp it around the IC pin. Solder theIC connection.

4. Route the jumper wire along the path of the out-awaycopper pattern and let it overlap the previously scrapedend of the good copper pattern. Solder the overlappedarea and clip off any excess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copperpattern at connections other than IC Pins. This techniqueinvolves the installation of a jumper wire on thecomponent side of the circuit board.1. Remove the defective copper pattern with a sharp

knife.Remove at least 1/4 inch of copper, to ensure that ahazardous condition will not exist if the jumper wireopens.

2. Trace along the copper pattern from both sides of thepattern break and locate the nearest component that isdirectly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the leadof the nearest component on one side of the patternbreak to the lead of the nearest component on theother side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire isdressed so the it does not touch components or sharpedges.

Page 10: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

TIMING CHART

- 7 -

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

H + 31.469 800 640 16 96 48

V – 70.09 449 350 37 2 60

H + 37.879 1056 800 40 128 88

V + 60.317 628 600 1 4 23

H – 31.469 800 640 16 96 48

V – 59.94 525 480 10 2 33

H – 37.5 840 640 16 64 120

V – 75 500 480 1 3 16

H – 31.468 900 720 18 108 54

V + 70.08 449 400 12 2 35

H + 46.875 1056 800 16 80 160

V + 75.0 625 600 1 3 21

H +/– 49.725 1152 832 32 64 224

V +/– 74.55 667 624 1 3 39

H – 48.363 1344 1024 24 136 160

V – 60.0 806 768 3 6 29

H – 60.123 1312 1024 16 96 176

V – 75.029 800 768 1 3 28

H +/– 68.681 1456 1152 32 128 144

V +/– 75.062 915 870 3 3 39

H +/– 61.805 1504 1152 18 134 200

V +/– 65.96 937 900 2 4 31

H + 63.981 1688 1280 48 112 248

V + 60.02 1066 1024 1 3 38

H + 79.976 1688 1280 16 144 248

V + 75.035 1066 1024 1 3 38

Mode H/VSort

1

2

3

4

5

6

7

8

9

10

11

12

13

25.175

28.321

25.175

31.5

40.0

49.5

57.283

65.0

78.75

100.0

92.978

108.0

135.0

640x35070Hz

800x60060Hz

640x48060Hz

640x48075Hz

720x40070Hz

800x60075Hz

832x62475Hz

1024x76860Hz

1024x76875Hz

1152x90075Hz

1152x90065Hz

1280x102460Hz

1280x102475Hz

Sync Polarity FrequencyDot

ClockTotal Period

(E)Video Active

Time (A)Sync Duration

(D)Back Porch

(F)Front Porch

(C) Resolution

VIDEO

SYNC

B

C

E

A

D

Page 11: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

- 8 -

DISASSEMBLY

Disassembly Hinge Cover.

Disassemble back cover.

# 1

Remove the screws.

Pell off Al-tape from panel.Remove the 6 screws from each up of metal frame.

# 2

# 3 # 4

# 5 # 6

Remove Al-tape from control pcb fix. Remove the 4 screws from each side of metalframe

1. Pull the front cover upward.2. Then, let the all latches are separated.3. Put the front face down.

# 7 # 8

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- 9 -

D-S

UB

TS

U16

AL

incl

ud

ing

(AD

C/L

VD

S/S

CA

LE

R/IN

PU

T S

WIT

CH

ING

/TM

DS

)

MT

V31

2M

ICO

M

LC

D M

od

ule

R,G

,B

dif

fere

nti

al

LIP

S

5V

5V

TS

U16

AL

&T

R(K

TA12

73)

12V

R,G

,B, H

/V S

ync

1.8V

3.3V

1.8V

3.3V

3.3V

Reg

. 7

8D33

5V 3.3V

LVD

S(L

ow

Vo

ltag

eD

iffe

ren

tial

Sig

nal

ing

)

AC

Inp

ut

BLOCK DIAGRAM

Page 13: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

- 10 -

DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to thedigital video signal using a pixel clock.The pixel clock for each mode is generated by the PLL.The range of the pixel clock is from 25MHz to 135MHz.This part consists of the Scaler, ADC convertor and LVDS transmitter.The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal andoutputs 8-bit R, G, B signal to transmitter.

2. Power Part.This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.12V is provided for inverter, 12V is provided for LCD panel and 5V for micom.Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.

3. MICOM Part.This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset ICand the Micom.The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.The controlled data of each modes is stored in EEPROM.

Page 14: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

- 11 -

EMICOMPONENTS

LINE100 ~ 240V

INPUT RECTIFIERAND FILTER

ENERGYTRANSFER

OUTPUT RECTIFIERAND FILTER

12V

5V

GND

SIGNALCOLLENT-

ION

PHOTO- COUPLERISOLATION

HVDC 100KHz

PRIMARY SECONDARY

50 ~ 60Hz

PWMCOMTROLCIRCUIT

Operation description_LIPS

LIPS Board Block Diagram

1. EMI components.This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, thecircuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.This part function is transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.This part function is to make a pulse width modulation control and to provide the driver signal to power switch, toadjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and alsothe over power protection is also monitor by this part.

5. Photo-Coupler isolation.This part function is to feed back the dc output changing status through a photo transistor to primary controller toachieve the stabilized dc output voltage.

6. Signal collection.This part function is to collect the any change from the dc output and feed back to the primary through phototransistor.

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- 12 -

ADJUSTMENT

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XPPort Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.This program is available to LCD Monitor only.

1. Port Setupa) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folderb) Run Userport.exe

c) Remove all default numberd) Add 300-3FF

e) Click Start button.f) Click Exit button.

2. EDID Read & Write1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Numbera) Input User Info Datab) Click “Update” buttonc) Click “ Write” button

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- 13 -

220

IBMCompatible PCVideo Signal

Generator

PARALLEL PORT

Power inlet (required)

Power LED

ST Switch

Power Select Switch(110V/220V)

Con

trol

Lin

e

Not u

sed

RS232

C

PARAL

LEL

V-SY

NC

POW

ER

ST

VGS

MONITOR

E

E

V-Sync On/Off Switch(Switch must be ON.)

F

F

A

A

BB

C

C

15105

5

69

1

1

1

14

13

25

6

5V

5V

5V

4.7K4.7K

4.7K

74LS06

74LS06

OFF ON

OFF

ON

11

Figure 1. Cable Connection

SERVICE OSD

1) Turn off the power switch at the front side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) Auto Color : W/B balance and Automatically sets the gain and offset value.b) NVRAM INIT : EEPROM initialize.(24C08)c) CLEAR ETI : To initialize using time.d) AGING : Select Aging mode(on/off).e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)i) MODULE : To select applied module.

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- 14 -

TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER(POWER INDICATOR OFF)

CHECK KEY CONTROLCONNECTOR ROUTINE

CHECK U201

NO

NO

NO

CHECK POWER BOARD,AND FIND OUT A SHORTPOINT AS OPENING EACH POWER LINE

CHECK 5VS LINE(OPEN CHECK)

CHECK 3.3V LINE

NOCHECK X-TAL

YES

YES

YES

YES

CHECK J705VOLTAGE

PIN5, PIN6 (5V)?

CHECK U501 PIN 8 Voltage

(5V) ?

IS U201 PIN90 (3.3V) VOLTAGE ?

CHECK U201 PIN 96 PULSE

1

NO PROBLEM

1

Waveforms

U201-#96

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- 15 -

2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

NO RASTER(OSD IS NOT DISPLAYED)

NO

NO

NO

NO

REPLACE CCFL LAMPIN THE LCD MODULE

CHECK POWER BOARD,AND FIND OUT A SHORTPOINT AS OPENING EACH POWER LINE

CHECK MICOM INVON/OFF PORT.

1. CONFIRM BRIGHTNESSOSD CONTRL STATE.

2. CHECK MICOM DIM-ADJ PORT

LIPS

YES

YES

YES

YES

J705 PIN5, PIN6

5V?

J705 PIN92.5V?

J705 PIN105V?

CHECK PULSE AS

CONTACTING SCOPE PROBE TO CAUTION LABEL.

(CONTACT PROBE TO CAUTION LABEL.

CAN YOU SEE PULSE AT YOUR SCOPE?

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- 16 -

3. NO RASTER (OSD IS NOT DISPLAYED) – MSTAR

NO RASTER(OSD IS NOT DISPLAYED)

NO

NO

NO

TROUBLE IN CABLE OR LCD MODULE

CHECK U801 (17", 19")CHECK U803 (15")

1. CHECK PIN122, 123 SOLDERING CONDITION

2. CHECK X5013. TROUBLE IN U201

CHECK CONNECTION LINE FROM D-SUB TO U501

YES

YES

YES

U201PIN 18, 90

3.3V?

U201 PIN96, 97

OSCILLATE AS12MHZ?

U501PIN43 IS 48KHz H-SYNC?PIN44 IS 60Hz V-SYNC?IS PULSE APPEARED

AT SIGNAL PINS?AT MODE 12?

1

2

1 2

Waveforms

U201-#96, 97 U501-#43 H-SYNC 2 U501-#44 V-SYNC

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- 17 -

4. TROUBLE IN DPM

TROUBLE IN DPM

NO

NO

TROUBLE IN U501

CHECK PC PC IS NOT GOINGINTO DPM OFF MODE

CHECK H/V SYNC LINE

YES

YES

CHECK R216, R217R778, R781

CHECKU501 PIN 43.44SYNC PULSE ?

3

3

Waveforms

R216, R778 H-Sync 3 R217, R781 V-Sync

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- 18 -

WIRING DIAGRAM

Connector Ass’y P/N: 6631T11017X-L1750S6631T11017Y-L1950S

Connector Ass’y P/N: 6631T20034M

or 6631T20023A

Connector Ass’y P/N: 6631T11012W

or 6631T11020W

Page 22: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

EXPLODED VIEW

- 19 -

010

020

070

080

090

100

030

110

040

050

060

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- 20 -

EXPLODED VIEW PARTS LIST

010

020

030

040

050

060

3091TKL143T CABINET ASSEMBLY, L1750S BRAND L122 SILVER ABS TCO03+12MS LIFE GOOD AU-Austrailia

3091TKL143C CABINET ASSEMBLY, L1750S BRAND L122 SILVER ABS350,89483 TCO03-Panama,Russia,Singapore,UK

3091TKL176G CABINET ASSEMBLY, L1750S BRAND L122 ABS350 SILVER WA LOCAL

3091TKL176K CABINET ASSEMBLY, L1750S BRAND L122 ABS350 SILVER MX LOCAL

3091TKL143Q CABINET ASSEMBLY, L1750S BRAND L122 SILVER ABS TCO03+12MS FLATRON NT LOCAL

3091TKL176F CABINET ASSEMBLY, L1750S BRAND L122 ABS350 SILVER DI LOCAL

3091TKL143A CABINET ASSEMBLY, L1750S BRAND L122 ABS350 TCO03-GRAY

3091TKL176D CABINET ASSEMBLY, L1750S BRAND L122 ABS350 GRAY 89483 WA LOCAL

3091TKL143V CABINET ASSEMBLY, L1750S BRAND L122 GRAY ABS TCO03+12MS NT LOCAL

3091TKL176C CABINET ASSEMBLY, L1750S BRAND L122 ABS350 GRAY 89483 DI LOCAL

3091TKL143G CABINET ASSEMBLY, L1750S BRAND L122 GRAY ABS350,89483 TCO03 A-C/SKD-India

3091TKL144S CABINET ASSEMBLY, L1950S BRAND L123 SILVER ABS350 12MS+TCO03+LIFE,AU-VER-Austrailia

3091TKL144C CABINET ASSEMBLY, L1950S BRAND L123 SILVER ABS350,89483 TCO03-Singapore,UK

3091TKL175D CABINET ASSEMBLY, L1950S BRAND 123 SILVER ABS 12MS+TCO03 MX LOCAL

3091TKL144Y CABINET ASSEMBLY, L1950S BRAND L123 SILVER SPRAY ABS350 12MS+TCO03 LOCAL-C/SKD-Europe

3091TKL144J CABINET ASSEMBLY, L1950S BRAND L123 SILVER ABS350,89483 TCO03 C-C/SKD-Russia

3091TKL144W CABINET ASSEMBLY, L1950S BRAND L123 GRAY ABS350 12MS+TCO03 LOCAL-C/SKD-Europe

3091TKL144G CABINET ASSEMBLY, L1950S BRAND L123 GRAY ABS350,89483 TCO03 A-C/SKD-Russia

6304FLP110B LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5N5 LG PHILPS TFT COLOR PART NUMBER CHANGE FOR COST COMPENSATION

or 6304FLP180B LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6K1 LG PHILPS TFT COLOR LPL NJ,PB FREE,EGI,TI S D-IC,SXGA,LVDS COST COMPENSATION

or 6304FLP179B LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6 LG PHILPS TFT COLOR LPL NJ,PB FREE,NEC S D-IC,EGI,250NITS,SXGA,LVDS COST COMPENSATION

or 6304FLP179A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6 LG PHILPS TFT COLOR LPL NJ,PB FREE,NEC S D-IC,EGI,250NITS,SXGA,LVDS

or 6304FLP110A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5N5 LG PHILPS TFT COLOR LPL NJ,250NITS,SXGA,LVDS

or 6304FLP228A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A5KT LG PHILPS TFT COLOR PB FREE OF A5KS,NEC D-IC,250NITS,SXGA,LVDS

6304FCI005D LCD(LIQUID CRYSTAL DISPLAY), M170E5-L05 CHIMEI TFT COLOR COST COMPS.280NITS 16MS TCO-03 TN SXGA COST COMPENSATION

6304FLP142A LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4K1 LG PHILPS TFT COLOR 20T,TN,250NITS,SXGA,LVDS

6304FLP210A LCD(LIQUID CRYSTAL DISPLAY), LM190E03-B4N9 LG PHILPS TFT COLOR PB FREE OF B4N2,NJ,20T,TN,250NITS,SXGA,LVDS

3809TKL100A BACK COVER ASSEMBLY, L1750S L100 ABS350 9930(BK)

3809TKL100M BACK COVER ASSEMBLY, L1750S L100 ABS350 9930(BK) ANALOG -Panama

3809TKL100C BACK COVER ASSEMBLY, L1750S L100 ABS350 9930(BK) A-C/SKD-India

3809TKL101A BACK COVER ASSEMBLY, L1950S L101 BRAND ABS350 9930(BK)

3809TKL101G BACK COVER ASSEMBLY, L1950S L101 BRAND ABS350 9930(BK) PANAMA SVC-LABEL-C/SKD-Mexico

3809TKL101C BACK COVER ASSEMBLY, L1950S L101 BRAND ABS350 9930(BK) A-C/SKD-Russia

3043TKK227A TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY

3043TKK227J TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY WA-LOCAL

3043TKK227G TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY MX-LOCAL

3043TKK227E TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY NT-LOCAL

3043TKK227M TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY DI LOCAL

3043TKK227B TILT SWIVEL ASSEMBLY, L1950S - TILT STAND BODY.

3043TKK227H TILT SWIVEL ASSEMBLY, L1950S - TILT STAND BODY MX-LOCAL

3043TKK227K TILT SWIVEL ASSEMBLY, L1950S - TILT STAND BODY WA-LOCAL

3043TKK227F TILT SWIVEL ASSEMBLY, L1950S - TILT STAND BODY NT-LOCAL

3043TKK228A TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BASE-L1750S,L1950S

3043TKK228E TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE WA LOCAL

3043TKK228D TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE MX LOCAL

3043TKK228C TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE NT LOCAL

3043TKK228G TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE DI LOCAL-L1750S

6871TST798A PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND KEY

6871TST798B PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND NT LOCAL C/SKD

6871TST798C PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND MX LOCAL C/SKD

6871TST798D PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND LGEDI LOCAL C/SKD LF

DescriptionPart No.Ref. No.

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- 21 -

EXPLODED VIEW PARTS LIST

060

070

080

090

100

110

6871TSTA03A PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND JEAN-C/SKD

6871TST911A PWB(PCB) ASSEMBLY,SUB, L1950 CONTROL TOTAL BRAND KEY

6871TST911C PWB(PCB) ASSEMBLY,SUB, L1950 CONTROL TOTAL BRAND MX LOCAL C/SKD LF

4951TKS199A METAL ASSEMBLY, FRAME MAIN L1750 LPL-A5 KUMI

4951TKS199B METAL ASSEMBLY, FRAME MAIN L1750 A-C/SKD

4951TKS199C METAL ASSEMBLY, FRAME MAIN L1750 CMO(E5-L05)-C/SKD

4951TKS200A METAL ASSEMBLY, FRAME MAIN L1950 LPL-E03 TN/AUO-EN04-V2 KUMI

4951TKS200C METAL ASSEMBLY, FRAME MAIN L1950 LPL-E03 TN/AUO-EN04-V2 A-C/SKD

6871TPT282C PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 1720 DOCKING,2PIN,450V POWER TOTAL LIEN CHANG PB FREE-L1750S

6871TPT282Q PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 19INCH TN & 1720 DOCKING,2PIN,450V POWER TOTAL LIEN CHANG PB FREE & ANALOG-L1950S

3313TL7100A MAIN TOTAL ASSEMBLY, L1750SN TSU16AL - LPL BRAND CL-82

3313TL7100C MAIN TOTAL ASSEMBLY, L1750SN TSU16AL NT,WA LOCAL C/SKD - LPL BRAND CL-82

3313TL7100E MAIN TOTAL ASSEMBLY, L1750SN TSU16AL MX LOCAL C/SKD - LPL BRAND CL-82

3313TL7100F MAIN TOTAL ASSEMBLY, L1750SN.KNEUED BRAND CL-82 LF-C/SKD-UK-LPL

3313TL7124A MAIN TOTAL ASSEMBLY, L1750SN MST JEAN BRAND CL-82 LF-C/SKD-CMO

3313TL9079A MAIN TOTAL ASSEMBLY, L1950SN AUO MSTAR BRAND CL-66

3313TL9079E MAIN TOTAL ASSEMBLY, L1950SN C/SKD MSTAR BRAND 10-LANGUAGE CL-66

4951TKS203A METAL ASSEMBLY, REAR SHIELD LX50 KUMI

4951TKS203B METAL ASSEMBLY, REAR SHIELD LX50 KUMI A-C/SKD-Europe

3550TKK740A COVER, L1750 BACK DOOR BRAND

3550TKK740B COVER, L1750 BACK DOOR BRAND A-C/SKD-India

3550TKK741A COVER, L1950 BACK DOOR BRAND

3550TKK741B COVER, L1950 BACK DOOR BRAND A-C/SKD-Russia

DescriptionPart No.Ref. No.

Page 25: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

- 22 -

DATE: 2005. 03. 04. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C204 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC205 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC206 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC207 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC211 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC213 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC214 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC215 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC216 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC217 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC218 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC219 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC220 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC221 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC222 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC223 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC224 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC225 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC226 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC230 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC231 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC232 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC233 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC240 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC251 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC503 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC504 0CH8106F611 10UF 16V M 85STD(CYL) R/TPC506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NPC507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0C508 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC701 0CK105CD56A 1UF 1608 10V 10% R/TP X7RC707 0CC680CK41A 68PF 1608 50V 5% R/TP NP0C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7RC732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC744 0CC680CK41A 68PF 1608 50V 5% R/TP NP0C803 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"C803 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T"-L1750S-MX LOCALC805 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R-L1750SC809 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC812 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"C812 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T"-L1750S-MX LOCALC814 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"C814 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T"-L1750S-MX LOCALC817 0CK105CD56A 1UF 1608 10V 10% R/TP X7R-L1950SC818 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0-L1950S

DATE: 2005. 03. 04. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C819 0CK105CD56A 1UF 1608 10V 10% R/TP X7R

D701 0DS226009AA KDS226 TP KEC SOT-23 80V 30D702 0DS226009AA KDS226 TP KEC SOT-23 80V 30D706 0DS226009AA KDS226 TP KEC SOT-23 80V 30ZD701 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"ZD702 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"ZD703 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"ZD704 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"ZD711 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"ZD712 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"

U201 0IPRPM3017A "TSU16AL-LF MSTAR 100P,QFP TR"U501 0IZZTSZ595A L1750SN MSTAR MICOM ASSY - 1-L1750SU501 0IZZTSZ597A "IC,DRAWING"-L1950SU502 0ICS240813B "CAT24WC08J-TE13 8P,SOIC R/TP"U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3VQ502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT

Q503 0TR390409AE FAIRCHILD KST3904(LGEMTF) TPQ504 0TR390409AE FAIRCHILD KST3904(LGEMTF) TPQ505 0TR390409AE FAIRCHILD KST3904(LGEMTF) TPQ703 0TR390609FA KST3906-MTF TP SAMSUNG SOT2Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT2Q801 0TR127309AA KTA1273-Y(KTA966A) TP KEC TO-L1750SQ802 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP-L1750SQ803 0TR127309AA KTA1273-Y(KTA966A) TP KEC TOU802 0TFVI80023A VISHAY SI3865DV R/TP TSOP-6-L1950S

R201 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR202 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR203 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR207 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TPR208 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR209 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR210 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR216 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR217 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR220 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR240 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TPR501 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR503 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP

REPLACEMENT PARTS LIST

CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS, READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.

* NOTE : S SAFETY MarkAL ALTERNATIVE PARTS

MAIN BOARDCAPACITORS

DIODEs

ICs

TRANSISTOR

RESISTORs

Page 26: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

DATE: 2005. 03. 04. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

R522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR530 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TPR534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TPR537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TPR543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TPR549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TPR555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR560 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP-L1750SR560 0RJ4702D677 47000 OHM 1/10 W 5% 1608 R/T-L1950SR701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TPR702 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TPR704 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TPR708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR709 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR712 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TPR716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR720 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR723 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TPR724 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TPR726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TPR727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TPR737 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR751 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR752 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR753 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR754 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR755 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR769 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR778 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR781 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR803 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% DR804 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP-L1750SR805 0RH2000D622 200 OHM 1 / 10 W 5% D R/TP-L1750SR806 0RH2000D622 200 OHM 1 / 10 W 5% D R/TP-L1750SR808 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR814 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TP-L1950SR815 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/TP-L1950SR816 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TPR820 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR821 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% DR824 0RJ0272D677 27 OHM 1/10 W 5% 1608 R/TPR825 0RJ2000D677 200 OHM 1/10 W 5% 1608 R/TP

X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP

C1 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R

DATE: 2005. 03. 04. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C2 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RLED1 0DLLT0208AA LITEON LTST-C155KGJSKT R/TPR1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR3 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR4 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR5 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPSW1 6600TR1002A SKQGACE010 J-ALPS NON 12V 50SW2 6600TR1002A SKQGACE010 J-ALPS NON 12V 50SW3 6600TR1002A SKQGACE010 J-ALPS NON 12V 50SW4 6600TR1002A SKQGACE010 J-ALPS NON 12V 50SW5 6600TR1002A SKQGACE010 J-ALPS NON 12V 50ZD1 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"ZD2 0DZ560009GB "BZT52C5V6S-(F),LF DIODES R/T"

- 23 -

OTHERs

CONTROL BOARD

Page 27: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

SCHEMATIC DIAGRAM

- 24 -

1. TSU56AL / TSU16AL

1

Wavefo

rms

U201-#96, 97

3R

216, R778 H

-Sync

3R

217, R781 V

-Sync

1

3

Page 28: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

- 25 -

2. MICOM

2U

501-#43 H-S

YN

C2

U501-#44 V

-SY

NC

Wavefo

rms

2

Page 29: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

- 26 -

3.POWER

Page 30: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

- 27 -

4. CONNECTOR & JACKS

3

Wavefo

rms

R216, R

778 H-S

ync3

R217, R

781 V-S

ync

3

Page 31: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

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Page 34: Service Guide SpecificationService Guide …archive.espec.ws/files/lg_l1750,1950s-sn.pdf- 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate

Mar. 2005P/NO : 3828TSL096Q Printed in Korea