Session 1 Chair: D. Cadman 1. Harrison: Development of

Session 1Chair: D. Cadman

Speakers:

1. Harrison: Development of Textiles for Electrical EnergyGeneration and Storage

2. Li: Resistance switching device with applications insensors and adaptable circuits

3. Somjit: 3D Microwave and Millimetre-waveSystem-on-Substrate using RF MEMS Components

4. Hutt: Copper Filled Adhesive Pastes for PrintedElectronics Applications

5. Dhadyalla: Complex Electrical Systems Research at WMG

6. Zhu: Computer Simulation on Electromigration

R2i – Connecting Research to Industry

Fulian Qiu, David Harrison, John Fyson, Yanmeng

Xu, Rui Zhang, School of Engineering and Design

Brunel University Darren Southee (Lboro)

[email protected]

Development of Textiles for Electrical Energy

Generation and Storage.


• Powerweave ,13 European members from 7 countries, coordinated by TWI.

• Objective of the project is a fabric to generate (10W/m2) and store (10Wh/m2) energy within a totally fibrous matrix through:

• photovoltaic fibres based on the dye sensitized solar cell • rechargeable energy storage fibres based on supercapacitors • textile design to ensure reliability and most efficient operation • reliable interface and interconnection methods to integrate the

generation and storage fibres • demonstration in technical large area applications

• Fibres will be combined together by weaving into a textile, with

benefits of reduced weight, an unobtrusive appearance, flexibility, conformability, easier storage and transportation.


Market opportunity for the research • New applications and design opportunities in

smart clothing (e.g. biomedical diagnostics and monitoring, sensing and display),

• telecoms (e.g. power for mobile devices and base stations),

• transport and safety (e.g. integrated power in inflatable rafts, safety clothing),

• disaster relief (e.g. smart energy generating tents, rescue gear) and

• leisure wear (e.g. sports goods incorporating sensors, telecoms and wearable portable devices).


Current Status of research:

Initial results for the energy storage fibre have been published online in Phys. Chem. Chem. Phys., 2013, DOI: 10.1039/C3CP52036F Title: Coaxial single fibre supercapacitor for energy storage

CL= 0.2 mF/cm


Next steps • What is being sought? • Brunel has an interest in developing our expertise in supercapacitor

materials into other application areas, including printed supercapacitors.

• What sort of collaboration is needed? • Partners who can provide support in kind for UK research

applications to complement the Powerweave project. • What type of partners are we looking for? –those that can provide

an industrial context for our R+D work

Summary • Thread supercapacitors with uniform coatings have been fabricated

successfully using a dip coating method • Electrochemically stable with specific length capacitance > 0.2 mF/cm,

and resistance ~ 2 Ohms/cm • Flexible and weavable,


Resistance switching device

with applications in sensors and

adaptable circuits

Dr Lijie Li

College of Engineering, Swansea University [email protected]

Key points of our research: • Ultra low cost for making discrete resistive switching / varying devices •Interesting resistive switching performance

mailto:[email protected]


• Background: Usually sophisticated equipments and expensive

materials are required to fabricate resistive switching /varying devices. These devices are still thought to have mainly on memory applications.

• Our research capability: Our team at Swansea has expertise in MEMS,

NEMS, sensors and actuators. We can innovatively produce resistive switching devices using low cost process based on printed circuit boards.


• What is memristor? Memristors are considered as ‘the future of computing

storage and memory’. Currently Hewlett Packard has invested heavily on this technology.

• Application: Discrete memristors can have promising applications in

sensors, and adaptable analog circuits. The device can also be used as varistor, a device protects

electronic components and equipments from voltage surge. • Potential business case: production of discrete resistive switching devices for sale on

component catalogue. (currently none on the market).


• Current status of our research: Prototype produced using printed circuit boards plus ZnO nanowires.

Fig. 1a, Schematic graph of the device, effective area is around 1000 µm x 1000 µm. Fig. 1b, Scanning electron photograph of ZnO nanowires on copper. Fig. 1c, photograph of a fabricated device.

(a) (b)

(c)



• Our aim: Develop a process that can yield highly reliable devices. Idea of such process has already been generated, funding

is needed to realize it. Collaboration with printed circuit board (PCB) company will be appreciated, and will boost the research to industry speed.

• How to collaborate: We design the process, the company implements the

process, and we do the device characterization. • What do we need: We are looking for partners that will be involved in R&D,

and early stage research funding is needed from research council or other alternative funding resources.


3D Microwave & Millimetre-wave System-on-Substrate using RF MEMS Components

N. Somjit, R.M. Lee, A. Sunday, I. D. RobertsonUniversity of Leeds

M. D’Auria, S. LucyszynImperial College London

D.N. Rathnayake-Arachchige, David Hutt, Paul ConwayLoughborough University

• 3D RF components for 10 GHz to 300 GHz - integrated into packages

• Aiming to make sophisticated communications and sensing systemsmore affordable


The frequency range 30-300 GHz is of increasing interest for communicationsand sensing applications

Traditional millimetre-wave waveguides are extremely low loss and cannoteasily be replaced by planar transmission lines.

An approach where 3D structures – including hollow waveguides – can beintegrated into LTCC modules is sought

94 GHz Sub-System for Medical Research www.hxi.com

Waveguides integrated into a“system-on-substrate” solution

Traditional millimetre-wavewaveguide system

Ke Wu et al.


• LTCC prototyping technology @Leeds

• Particular interest for harsh environments (auto, aerospace, military, medical)


Standard lumped elements

Excellent progress on fabricating prototype 3D structures (examples)

LTCC integrated waveguides to 40 GHz

Novel cantilevers and bridges

30 GHz waveguide antenna array(for plating using novel process @Loughborough)


• Next steps on our projectMake the LTCC in-house prototyping process more stable and

repeatableDemonstrate novel metallisation techniqueInvestigate moving parts (MEMS)Design a full range of demonstrators

• What sort of industry collaboration is neededUser-led Demonstrator applications and specificationsDemonstrate use of new materials and processesCommercial fabrication opportunities

• Interested to develop the work further in partnership withIndustry through TSB and EU projects, KTPs, EPSRC CASEawards, etc

R2i2 – Connecting Research to Industry 1

Copper Filled Adhesive Pastes for Printed Electronics Applications

D.A. Hutt1, S. Qi2, B. Vaidhyanathan2

1Wolfson School of Mechanical and Manufacturing Engineering 2Department of Materials

Loughborough University [email protected]

• Increasing demand for direct printing of

electronic circuits on a range of low cost substrates e.g. RFID, packaging

• Low cost materials and methods required



Electrically Conductive Adhesives / Inks Electrically conductive adhesives

and inks used for interconnect Combine a metal (conductive)

filler and adhesive resin Stencil or screen

print as a “paste” Resin shrinks /

hardens during cure Metal particles

pressed together

Silver filled adhesives provide good conductivity, but with high cost

Copper replacement of silver is difficult due to the non-conducting copper oxide

Curing

e.g. 80 OC –150 OC

adhesive

Conductive particle

Cu substrate

adhesive

component

Component attachment Printed

tracks


Copper Filled Adhesive Development Copper powder treatment method developed Remove oxide and apply protective coating (SAM) Coating breaks down during thermal cure

Protected copper powder mixed with resin

to make a conductive adhesive Resistivity comparable to silver filled

materials is achieved after curing Using copper provides raw metal cost saving Silver >100x more expensive than copper

CuCu

Cu oxide

coatingCu

SAM

etch

Adhesive

Cu

SAM coating

Bare Cu

Cured Adhesive


Functional Printed Copper Circuits Conductive adhesive enables

combined circuit fabrication and component attachment

Functional test circuits have been demonstrated Stencil printing Surface mount component

placement Thermal cure (150oC,

Argon atmosphere) Low curing temperature of

resin enables low cost plastic substrate usage

Glass substrate

Thermal Cure

Stencil print copper paste on substrate

Place components into uncured paste

Functional circuit

stencil

blade

pasteCu paste deposit


Conclusion

Proof of concept has been demonstrated Repeatable powder preparation method developed Seeking partners to scale up

We are seeking collaborations with: Adhesive suppliers / ink / paste formulation experts End users of the printed electronics technology Applications, testing, trials

Thank you for your attention [email protected]



Complex Electrical Systems Research at WMG

Gunwant Dhadyalla

The University of Warwick

[email protected]

+44(0) 2476 575940

Promoting capability and track record in the area of Automotive Complex Electrical Systems research



The Challenge – System Complexity

• Complexity at many different levels

• 80% to 90% of vehicle innovations via embedded systems

• 50% to 70% of development costs embedded systems related

• Wiring

– 50kg+

– 750+ wires

– 1.5km long

Premium car 100 million lines of code

Boeing 787 6.5 million lines of code

Boeing 777 4 million lines of code

F-35 Joint Strike 5.7 million lines of code

F-22 Raptor 1.7 million lines of code


• Robustness of Electrical and Embedded systems – hardware and software

– Design

– Validation

• The future - Smart and Connected

– Communication and control

• Intra-vehicle

• Inter-vehicle

• Vehicle to ‘X’

– Contactless power transfer for HEV / EV (charging)

Research facilities and opportunities

http://www.google.co.uk/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&docid=cy86tHmXn5WumM&tbnid=Z4tdOO8_-dEtXM:&ved=0CAUQjRw&url=http://www.zigbee.org/Specifications/ZigBee/Overview.aspx&ei=B6fJUZugLcOb1AW3-IH4CQ&bvm=bv.48293060,d.d2k&psig=AFQjCNErMtP2hiPlYBrUB5qtyY_zfz5qYA&ust=1372256383113096


Track record, capability and research fit

EVoCS (2005 – 2010)

£10M Electrical project (TSB)

JLR, Qinetiq, add2

HVM Catapult (2011 – )

Self Healing Vehicle (2009 – 2011)

£600k (EPSRC)

JLR, IBM, Autotext

Non-Functional Testing (2011 – )

Industry funded

Low voltage testing

Automated testing

Hardware-in-the-loop

Automated data analysis

High voltage architectures

Hardware-in-the-loop

Wireless networks & charging

Classification Trees

Combinatorial Testing

Sequence Testing

Statistical data analysis

Expert systems

DNA Sequencing

TRL 9

TRL 1

Catapult Driven Collaborative R&D

TSB, ERDF, FP7, RGF

50% Industry Funding

3-24 month

University Driven Basic Research

RCUK

0-50% Industry Funding

24-60 month

Industry Driven Consultancy

Direct Funding

50-100% Industry Funding

0-3 month

PI Led Research Fellow

EngD/PhD

PM Led Project Engineer

Research Fellow

Basic Technology Research

Feasibility Study

Technology Development

Technology Demonstration

System Development

System Test

WMG/Catapult Operations

TRL 7

TRL 5

TRL 3

WMG Staffing Technology Readiness Level


• WMG driven by impact to industry and academic excellence

• Real world usage / conditions

• Industry / academic collaboration

– One to one

– One to many

– Many to many

• Transferrable capabilities - Automotive, Aerospace, Rail, Marine, Yellow Goods

• UK – TSB, AMSCI, EPSRC

• Directly funded research

• Invitations to join EU consortiums

– Horizon 2020 announced

What is being sought?


Computer Simulation on Electromigration

Xiaoxin Zhu

PhD student

University of GreenwichSchool of Computing and Mathematical Sciences, University of Greenwich, 30

Park Row, London SE10 9LS, UK

Email: [email protected]

Telephone: +44 (0)20 8331 8761

• Mass migration in electronic component structures

• Design for Reliability

• Multi-disciplinary research


� Electro-migration (EM): EM causes void generation or open circuit at the

cathode and extrusion or hillock at the anode.

� Research Objectives:

� Develop a tool to numerically simulate EM

� Understand influences of Electro-Migration, Thermo-Migration and Stress-

Migration on void formation

� Use tool to optimize design of electronics devices and prolong their life

Research Challenges


Business Case

• ITRS Roadmap– Electromigration of solder joints will

become a more limiting factor.– must be addressed through

materials changes together with modeling.


Current Status of Research• EM modelling is at TRL2-3

– Multi-physics models developed

– Number of papers published

– Best paper at ICEPT in China


Future Work

• Complete PhD thesis (4th year)

• Future Research Funding

– Exploit modelling capability within Industry/Academia research project

– Bids being considered with EU and Asia partners

• Provide expertise to industry

– Ability to predict risk of mass migration for new device designs

– Support design for reliability methodology

Thank you for your attentionAny Questions?

Speakers:

1. Harrison: Development of Textiles for Electrical EnergyGeneration and Storage

2. Li: Resistance switching device with applications insensors and adaptable circuits

3. Somjit: 3D Microwave and Millimetre-waveSystem-on-Substrate using RF MEMS Components

4. Hutt: Copper Filled Adhesive Pastes for PrintedElectronics Applications

5. Dhadyalla: Complex Electrical Systems Research at WMG

6. Zhu: Computer Simulation on Electromigration

Documents

Session 1 Chair: D. Cadman 1. Harrison: Development of