Upload
dangdien
View
218
Download
0
Embed Size (px)
Citation preview
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trade mark or service marks of their respective owners. All analysis is done without participation, authorization, or endorsement of the manufacturer. Ewise Technology extends no warranties with respect to any information in this document, and shall bear no liability what so ever for the use of the information.Copyright © 2014, Ewise Technology. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Ewise Technology.
MiCS-5524
SGX Sensortech
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trade mark or service marks of their respective owners. All analysis is done without participation, authorization, or endorsement of the manufacturer. Ewise Technology extends no warranties with respect to any information in this document, and shall bear no liability what so ever for the use of the information.Copyright © 2014, Ewise Technology. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Ewise Technology.
Structure Analysis Report
MiCS-5524
The MiCS-5524 is a robust MEMS sensor for indoor carbon monoxide and natural gas
leakage detection; suitable also for indoor air quality monitoring; breath checker and
early fire detection.
3
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
更改为所做项目对应机器的规格参数描述文档 字体:微软雅黑12号
SGX Sensortech
SGX Sensortech Limited is a manufacturer and research company of sensors and detec
tors for Industrial Safety, Environmental Monitoring and Materials Analysis. It is headq
uartered in High Wycombe, United Kingdom with research and manufacturing sites in
High Wycombe and Chelmsford in the United Kingdom and Neuchatel in Switzerland.
SGX Sensortech Introduction SGX Sensortech Products Sensor Comparison
4
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
SGX Sensortech Product
Automotive & Indoor Air
Quality
Industrial Air Quality
X-ray detector
SGX Sensortech Introduction SGX Sensortech Products Sensor Comparison
5
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Manufacture Part number Type Package Gas Type Feature
SGX Sensortech MiCS-5524 Gas Sensor SMD7x5x2.25mm
CO/H2/VOC• 32mA heater current• Maximum heater power dissipation 88mW• For harsh environments
SGX Sensortech MiCS-5914 Gas Sensor SMD7x5x1.55mm NH3 • 30mA heater current
• High resistance to shocks and vibrations
Cambridge CMOS Sensors CCS801 Gas Sensor SMD
2x3x0.9mm CO/VOC• Ultra-low power consumption for battery
operated devices • High sensitivity and fast heating times
Micronas GAS 8616B Gas Sensor QFN206 ×8×1.4 mm
NO2/NH3/H2/VOC
• Two independent gas sensor units• Low cross-sensitivities• Low current consumption (<10 μA) • Long product life time (>10 years)
Gas Sensor in the Marketing
SGX Sensortech Introduction SGX Sensortech Products Sensor Comparison
6
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Part Number MiCS-5524
Manufacturer SGX Sensortech
Description CO/VOC Sensor IC
Package Type SMD
Package Size 7x5x2.25mm
Die Mark BF2b MICS 09
Die Size 1.86x1.67mm
Sensor Type Resistance
7
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Top Bottom Side Decap
Package top image
8
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Top Bottom Side Decap
Index Mark
Rs1
Rh1
Rh2
Rs2
Package bottom image
Rs: sensor resistance
Rh: heater resistance
9
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Top Bottom Side Decap
Side Image
10
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Top Bottom Side Decap
Decap Image
Rs1Rh1
Rh2Rs2
Rs: sensor resistance
Rh: heater resistance
11
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Sensor Photo Remove Cover
Sensor Top and SizeTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout
12
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Sensor Bottom and Size
Sensor Photo Remove CoverTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout
13
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Sensor Mark Photo 1BF2b
Sensor Mark Photo 2MICS 09
Die Mark
Sensor Photo Remove CoverTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout
14
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Function Layout
RH1 RH2
RS2
RS1
Tungsten Oxide Sensor Resistor
Poly Heater Resistor
Sensor Photo Remove CoverTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout
15
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Remove CoverTop Image ︱ Sensor Center
Sensor Photo Remove Cover
16
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
SizeTop Image ︱ Sensor Center
Sensor Photo Remove Cover
17
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Silicon Substrate Poly Resistor Tungsten oxideGolden Pad
175µm
250µm
375µ
m
Die Cross-Section Diagram
Die Cross-Section Diagram Cut1 Cut2 Cut3
18
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Die Cross-Section Cut1
Die Cross-Section Diagram Cut1 Cut2 Cut3
19
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Poly Resistor
Silicon Oxide
Golden Wire
Silicon Oxide
Silicon Oxide
Poly Resistor
Die Cross-Section Cut2
Die Cross-Section Diagram Cut1 Cut2 Cut3
20
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
Die Cross-Section Cut3
Die Cross-Section Diagram Cut1 Cut2 Cut3
21
Market Analysis Die Information Major Findings Package Overview
SGX SensortechMiCS-5524
Device Summary Structure Analysis
MiCS-5525 is CO/VOC sensor for harsh environments. The device
integrates resistor heater and resistor sensor(page 14).
The resistor heater is polysilicon resistor and resistor sensor material is
tungsten oxide(page 17).
Pad bonding line is Au(page 17).