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SIEMENS DIGITAL INDUSTRIES SOFTWARE
Building the infrastructure for holistic, end-to-end manufacturing
Integrating PCB production and box-build
Executive summaryIn this paper, we look briefly at some of the essentials needed to build a connected end-to-end manufacturing environment that can respond to today’s market challenges. We look at a real-world case study that implements this approach and discuss some of the ways Siemens helps manufacturers build a holistic PCB manufacturing and assembly operation.
Oren Manor Director of Business Development, Valor
As we rely more heavily on electronic devices in
our daily lives, these products are becoming
increasingly complex and customized. Companies
are driven to generate constant innovations to
compete in a limited, demanding and increasingly
sophisticated market.
In manufacturing, there is a traditional separation
between the manufacturing of electronics and
mechanical parts for a product. One company or
location designs the product, another produces
the PCB, and another completes the final product
assembly (box-build). Each has its own data and
processes that are siloed and disconnected.
That must change. An entirely different, holistic
approach is required to succeed in today’s market
and remain competitive in the future.
Managing PCB production and box build as a
holistic, end-to-end process allows manufacturers to
boost efficiency and reduce time-to-market. But
how can manufacturers adapt and create a smart,
agile manufacturing process that is connected from
end to end? How can they break down the silos
between disciplines?
Introduction
Electronics are everywhere, across multiple industries.
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Seven trends keeping manufacturing executives up at night
1. Rapid time to market
Whether introducing an existing product into a new
geographical area or a new product into an existing
market, industry executives say time to market is
one of the top factors that impact its success.
Product lifecycles might last several years, but a
significant portion of the lifetime profit is often
earned in the first few quarters.
2. Increasing market demand
In the last century, many new and exciting products
became available to anyone who could afford to buy
them. Today, consumer demand has become a beast
with a voracious appetite. Snowballing innovations
allowed companies to build and sell more products
at more affordable prices, and electronic devices are
now ubiquitous globally. Electronic products have
improved communication, safety and quality of life
for many people, and the expectation for contin-
uous supply has become a market mindset.
Companies are under constant pressure to meet that
demand.
In addition, small appliance companies are short-
ening their refresh cycle to encourage people to buy
new appliances to get new features, rather than
only when they wear out. Because supplies are
finite, it is harder than ever to meet the demand.
3. Sustainability requirements
Opportunities are expanding in new energy technol-
ogies, and there is a growing demand for greater
efficiency and longer product life. Sustainable
Common trends across all industries where electronics are integrated.
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White Paper – Building the infrastructure for holistic, end-to-end manufacturing
product manufacturing is becoming a must, but it
presents challenges that manufacturers will be
required to address in the future.
4. Expanded use of electronics
Electronics are now used in everything from cars to
appliances to infrastructure. Bosch, a high-end
appliance manufacturer, mentioned recently in one
of Siemens’ public forums that embedding elec-
tronics into their appliances and making them smart
and connected was imperative to maintain their
premium status in the marketplace.
5. Globalization
In today’s globalized world, electronic design, manu-
facturing and market fulfillment are conducted
across countries, continents and between compa-
nies, and more businesses are outsourcing manufac-
turing. For example, leading smartphones are
designed by brand-name companies in the United
States, built by Foxconn and other contract manu-
facturers in China and shipped to customers around
the world.
6. Fast pace of innovation
Futurist Ray Kurzweil predicts that this century will
create 20,000 years’ worth of progress if we
continue to advance at the current rate, and the
electronic products market is one of the most inno-
vative emerging technology industries. Take 5G, for
example. There is an entire ecosystem, from
network infrastructure players such as Nokia and
Ericsson, to smartphone providers like Samsung
looking to use 5G to enhance performance.
However, to take advantage of this new technology,
manufacturers must overcome significant design
and test challenges; for instance, how to pack more
electronic functions into small mechanical enclo-
sures, access a wider bandwidth and use the new
beamforming technology.
7. Mixed product lifecycles
As electronics manufacturers evolve their operations
toward the high-mix, high-volume future, they face
the added complexity created by key operational
differences between PCB and box-build manufac-
turing. Box-build design and production volume
tend to vary somewhat less than the PCB (a change
to PCB design does not always entail a change to the
enclosure). However, the box-build manufacturing
process is not as standardized as PCB production
and requires the remodeling the production line
often. It is less automated, requiring a more
hands-on management. These differences create
mixed product lifecycles, with more complex
product assembly.
We are entering an age where change is seemingly
chaotic. Companies are driven to redefine them-
selves at an increasingly rapid pace. Electronics
technology includes infinite opportunities, but
challenges have led to an unprecedented level of
industry complexity and disruption that are
expected to increase in the coming years. Those
who have the vision to navigate and adapt to
change will be the companies building the future.
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Case study
Scanfil is a midsize EMS company (1,200 employees)
with a plant in Suzhou, China, where the company
is instituting a smart operations program, which is a
five-year initiative to integrate digitalization and
automation within their manufacturing operations.
Scanfil has ten sites worldwide on three continents
and seven countries, with headquarters in Finland.
Their customers are global.
As an end-to-end provider, Scanfil conducts PCB
assembly, mechatronics box-build, final assembly
and more. The company sells its manufacturing
services as well as providing services to its own
electronics manufacturing, mechanical assembly
and system integration throughout the product life
cycle. It serves industrial, medical, advanced
consumer applications and energy automation
companies.
The company’s motivation for implementing a
holistic manufacturing operation system was to
improve manufacturing services to customers. A key
priority was to continuously improve productivity,
quality control and planning efficiency to keep
customers happy, as well as
provide professional new product
introductions (NPIs) and trace-
ability to comply with regulatory
requirements.
Because the company works with
mechanical products as well as
electronics manufacturing and
wanted to integrate the two
businesses internally, Siemens’
strong offering in SMT control, as
well as NPI tools and process
preparation offered the ideal
solution.
The scope of implementation had
to cover the full production
environment from SMT to inte-
gration testing, as well as
assembly inspection, and it
needed to be fully integrated
with Scanfil’s ERP system. One of
their goals, and a major chal-
lenge, was to streamline Photo courtesy of Scanfil.
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White Paper – Building the infrastructure for holistic, end-to-end manufacturing
“To be honest, it has been a roller coaster, taking a significant effort from our team and from Siemens support, but today I can say that we have successfully been able to roll out the system. We may have started with a plan that was too ambitious for the challenges that 2020 presented. We were forced to work remotely, resulting in a delay of four to six months. Now, I’m happy to say that we are seeing benefits every day.”
Christian Guest, General Manager Scanfil Suzhou, China
processes between factories in different countries,
to harmonize the processes and everything between
the between factories. They worked with a Siemens
project manager who worked with them throughout
the entire process.
The company has transformed its factory in China, is
rolling out the plan at a plant in Poland and is
continuing with an ongoing rollout of the NPI tools
in its other electronics manufacturing sites. Scanfil
has seen direct improvements in productivity of at
least 10 percent as the result of more efficient
changeover, eliminating some manual data collec-
tion, and gaining other efficiency improvements.
Costs related to poor quality have been reduced by
approximately 20 percent. Other benefits come
from improved quality control throughout the entire
manufacturing process.
Process preparation time has been significantly
reduced, with an efficiency improvement in the
range of 40 percent. This enables quicker implemen-
tation, time to market and introduction of new
products on the manufacturing shop floor.
Scanfil’s experience illustrates that good control of
your current processes and production environment
is the starting point when going digital. In addition,
a well-documented process is needed to be
successful, forming the foundation for digitalization
and realizing improvements.
Scanfil focused on simplicity, implementation and
security. It is now using predictive analytics to
better control the manufacturing process, and the
company plans to apply machine learning, prescrip-
tive analytics and autonomous operations soon to
reach its goal of intelligent manufacturing.
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Individual siloed systems for PCB and box build
cannot collaborate horizontally. As we see digitaliza-
tion as the most effective approach to manufac-
turing for end-to-end electronics manufacturers,
Siemens looks first at the broader picture of digital
transformation that starts with an integrated manu-
facturing execution system (MES) solution. Such a
system is needed to create an end-to-end process
from design to automation to human operations.
Siemens aims to offer a holistic approach that
transforms a siloed landscape into a unified, inte-
grated product and production lifecycle—from
product design to production planning, engineering,
execution and service (from idea to shelf). A fully
digitalized business model with a consistent digital
thread has the power and flexibility to accelerate
processes and optimize production operations. This
approach also requires a joint data storage and data
management system—a unified data backbone that
delivers a collaboration platform throughout all
steps of the value chain.
The Siemens approach is built on virtual representa-
tions of physical products and associated processes.
The Xcelerator platform enables the integration of
digital twins of product and performance, creating
support for the entire value chain. With digital
twins, manufacturers gain foresight by simulating
products, people, processes and resources in the
virtual realm before implementing production on
the manufacturing floor. Then, by matching the real
world to predicted performance, manufacturers gain
additional insights that can be used to drive contin-
uous improvement.
As part of the Xcelerator portfolio, the Opcenter
Execution Electronics MES ensures complete visi-
bility of all operations on the shop floor. It gives PCB
and box-build electronics manufacturers insight into
the raw materials, equipment and personnel
working on each product, as well as process and
product characteristics for each individual produc-
tion run.
Opcenter Execution Electronics enables standardiza-
tion of production processes, making sure that
coordinated PCB and box-build manufacturing
workflows are rolled out easily and consistently.
Best practices can be clearly identified and adopted
to help increase production efficiency and quality.
This MES also provides real-time orchestration of
manufacturing orders and tasks, stitching separate
production steps and resources together into a
unique and efficient manufacturing flow.
Opcenter Execution Electronics grants end-to-end
tracking and enforcement of all manufacturing
resources. It ensures the right material is available,
unexpired and used per the latest revision of the bill
of materials (BOM). It ensures correct operator
actions with electronic work instructions and certifi-
cation that each operator is properly trained and
allowed to perform each task. It ensures the right
equipment is available, well-maintained and certi-
fied for use.
Opcenter Execution Electronics helps end-to-end
electronics manufacturers optimize manufacturing
efficiencies as well as manufacturing quality. The
intelligence gleaned from a single MES orches-
trating the PCB and the box-build processes detects
Siemens provides the MES to support a holistic approach
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White Paper – Building the infrastructure for holistic, end-to-end manufacturing
root causes between assembly and PCB production.
This is a unique capability for a holistic system,
enabling improvements across product revisions.
With a unified MES system assisting the operator,
and data acquired from PCB manufacturing in the
same facility, you can implement more advanced
analyses for quality improvement.
With all the above, Siemens delivers a comprehen-
sive solution for an optimized product and produc-
tion lifecycle: tools for collaboration across
planning, execution, assembly and quality, harmo-
nizing human operations with automation and
electronic PCB manufacturing with box build.
An end-to-end, holistic product lifecycle begins in the design phase and carries through manufacturing.
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About Siemens Digital Industries Software
Siemens Digital Industries Software is driving transformation to
enable a digital enterprise where engineering, manufacturing
and electronics design meet tomorrow. Xcelerator, the compre-
hensive and integrated portfolio of software and services from
Siemens Digital Industries Software, helps companies of all sizes
create and leverage a comprehensive digital twin that provides
organizations with new insights, opportunities and levels of
automation to drive innovation. For more information on
Siemens Digital Industries Software products and services, visit
siemens.com/software or follow us on LinkedIn, Twitter,
Facebook and Instagram. Siemens Digital Industries Software –
Where today meets tomorrow.
About the author
Oren Manor serves as the director of business development for
Valor Division of Siemens Digital Industries Software. His respon-
sibilities include business ownership of Valor’s engineering and
pre-production tools as well as partnerships and OEM engage-
ments. Oren brings over 15 years of experience in sales and
marketing of embedded and industry software. Oren was the
global sales and marketing director for Jungo’s embedded
connectivity business unit which was later acquired by NDS and
Cisco. Before joining Mentor Graphics (now part of Siemens),
Oren was the vice president, sales and marketing of Signature-IT,
a SaaS cloud-based solution for configuring, pricing and quoting
(CPQ) of heavy-industry mechanical products.
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