COMPANY PROFILESince 1999

C H E M I T C O M P A N Y L I M I T E D P R O F I L E

Company

Products

Equipments List

Quality Management

>> Company> Information………………………………………… 03> History……………………………………………… 04> Organization ……………………………………… 05

>> Products

> Precision Printer parts …………………………… 06> IC Sockets for Semiconductor…………………… 07

- Burn in socket for DDR memory ………… 08- Burn in socket for TSOP/LGA …………… 09- Burn in socket for MCP/POP……………… 10

> Test Sockets and Connector……………………… 11> Tools & Electric Components …………………… 12

>> Equipments List………………………………………… 13

>> Quality Management > Quality Assurance System………………………… 14

C O N T E N T S

3

회사소개

Information

캠아이티는 반도체관련 부품 및 정보통신기기 부품 분야에서 세계적 기업으로 도약하고 있는 초 정밀부품

전문업체 입니다.

캠아이티는 IT 분야의 첨단 기술력과 우수한 인재를 자산으로 품질제일주의를 지향하는 것을 기업 최고의

가치로 삼고 있습니다.

캠아이티는 금성알프스전자를 모태로 출발하여 LG전자부품, LG정밀을 거쳐 30년간의 기술과

경험을 바탕으로 다수의 특허와, 개발제품군을 보유하고 있습니다.

캠아이티는 IT관련분야의 초 정밀 부품을 지속적으로 개발 및 전문화 하여, 관련분야의 World Leader가

될 것입니다.

ChemIT was established by Employee-Buy-Out from LG Innotek Corp.

(Former LG Precision Co., Ltd.)

ChemIT is a specialized manufacturer of precision electronic parts and components such

as integrated circuit sockets, cellular phone components, and precision tools for the

semiconductor, telecommunication, defense, and automobile industries.

ChemIT holds a number of intellectual properties and technology which have been

accumulated from more than thirty years of experiences.

ChemIT maintains well-trained workforces, best engineers, and integrated manufacturing

faculties to meet customers’needs.

LG Inno Tek EBO

4

회사연혁

History

1999. 12. 11 EBO 방식으로 LG이노텍에서 분사

Employee-Buy-Out & Establishment from LG InnoTek Corp.2000. 7 ‘반도체 칩 검사용 소켓장치’특허 제 0269953호

‘반도체 칩 검사용 소켓’특허 제 0220916호

Acquired 2 patents of “Sockets for testing semiconductor”2000. 8. 26 벤처기업 등록 (사업성 평가 우수. 경남지방 중소기업청)

Acquired certificate of “Company with excellent technology”by government agency2000. 9. 8 정밀기술 1급공장 인증 (산업자원부 산업기술시험원)

Acquired certificate of “Precision Technology 1st class plant”from government.2000. 11. 27 기술신용보증기금 우량기술기업 선정

Acquired certificate of “Superior Technology Company”from Korea Technology creditGuarantee Fund

2001. 3. 16 삼성전자 협력업체 등록

Registered as a subcontractor of Samsung Electronics Co., Ltd.2001. 4. 3 국민은행 유망중소기업 선정

Acquired certificate of “Promising Small and Medium Enterprise”from Kookmin Bank.2002. 7 경남중소기업대상 벤처창업부문 수상

Awarded Grand Prize for Venture Company by Kyung-nam Provincial Government2002. 10. 21 중국 곤산 Chem-Kujike IT Co.,Ltd. 설립

Established Assembly Plant in Kunshan, China (Chem-Kujike IT Co., Ltd.)2002. 11. 8 Hewlett-Packard사와 StarWheel 공급계약체결

Made Supply Contract with Hewlett-Packard Company2002. 12. 6 중소기업은행 기술개발시범기업 지정

Appointed as “Demonstration Enterprise for Technology Development”by Kiup Bank2003. 9. 5 ISO 9001 인증 획득

Acquired certificate of “ISO 9001 : 2000”2004. 9. 24 ISO 14001 인증 획득

Acquired certificate of “ISO 14001:2001”2006. 4 TS 16949 인증 획득

Acquired certificate of “TS16949”2006. 11. 30 무역의 날 수출 300만불 탑 수상

Awarded prize for 3million dollars exportation2006. 12 Hewlett-Packard 품질 감사패 수상

Awarded quality achievement award from Hewlett Packard2006. 12 무역협회 우수 무역인상 수상

Awarded prize of KITA (Korea International Trade Association) President2007. 2 삼성 SMD 납품계약 체결 (AMOLED 베젤)

Start business with Samsung SMD (AMOLED Bezel parts)2008. 2. 11 DDR3 480PARA (96ball) burn-in socket 개발

Semi-conductor DDR3 480PARA burn-in Test socket(96ball) designed 2008. 3. 3 LGA 52Pin burn-in socket 개발

Semi-conductor LGA 52Pin Burn-in socket designed2009. 12 0.5 Pitch Burn-in socket 개발

Semi-conductor 0.5 Pitch Burn-in socket designed

5

회사조직도

Organization

지원팀General

AdministrationDept

대표이사President

연구소

Laboratory

개발 1팀

Development1Team

개발 2팀

Development2Team

생산/영업/품질 총괄

Production/Sales/QA/

Group

부품공장

PartManufacturing

Factory

영업관리팀

SalesAdministration

Team

품질보증팀

QualityAssurance

Team

생산기술팀

ManufacturingTechnology

Team

생산팀

ProductionTeam

6

제품안내

Products

정밀프린터부품Precision Printer Parts >

스타휠Starwheel

프린트 용지 출력시 잉크가 묻은 면에 자국을

내지 않으면서 원활한 출력물 배출을 도움.

Provides downward pressure on media

as it passes through the feed rollers.

•C6490-60001 : A’ssy-Starwheel

(Insert Molded)

•C8963-00019 : Hubless Starwheel

스프링돔Spring Dome

잉크 카트리지와 기판간의 접촉이 원활하도록

동일한 접촉 압력을 유지시켜 줌.

Provides tension for ink cartridge.

•C8941-00032

7

제품안내

Products

반도체를위한 IC 소켓IC Sockets for Semiconductor >

프로필

반도체, 메모리,비메모리 분야에 사용되는 모든 IC의 최종 성능 검사용 Sockets.

모든 IC가 제품으로 장착되기 전 꼭 거쳐야 하는 TEST 과정에 쓰이는 Sockets.

IC Sockets are used to test the final performance(Burn-In Test) for

semiconductor in memory and non-memory fields.

8

제품안내

Products

Burn-in socket for DDR Memory

Model PACKAGE PKG SIZE Offeset DEVICE DENSITY BALL DIA PITCH SOCKET SIZE10X13 08X12 0 128M SDRAM

FBGA54 8X13.5 0 256M SDRAM8X8 08X10 0 128M SDRAM

SDRAM 8X10 0.8 26X17X17.7FBGA60 10X13 X0.4

8X1210X13 0 DC 512M

FBGA9011X13 08X13 512M SDRAM

8X13.5 08X13 0 PC

FBGA60 8.5X13.5 0 BC8X16 0 GC 0.8X1.0 26X17X17.7

FBGA62 8.5X16 0 DDPFBGA62 10X12 0 512/1G DDR

10.5X10 0 DC 512M DDR212X14 0 GC 512M DDR2

FBGA60 8X13 0 DC 256M DDR28X11.4 011X9.5 0

FBGA68(60)11.9X20.9 011X17.5 0

1G DDR2192 0.45

FBGA71(63) 11X17.5 0FBGA74(66) 11.9X20.9 0FBGA82(78) 10X14.4 0

DDR3FBGA100(96) 10X14.4 X0.410.5X13 0 DC 512M DDR2

FBGA8412X14 0 GC 512M DDR28X13 0 DC 256M DDR2

12X12.5(대만) 0 512M DDR2FBGA92(84) 11X17.5 0

FBGA63 12.33X14 0GC 512M DDRII DDPFBGA71(63) 12.33X20.9 0

8X11.4 0 Tiva 1G DDR2 DDP

FBGA6311X10 0 28X22X15.412X9.5 0

12.33X14 01G DDR2 DDPFBGA71(63) 12.33X20.9 0

12X14 0Tiva 2G DDR2 DDPFBGA66 12.3X14 0

11X11.4 0 QDP 4G DDR2DDR/ FBGA78

11X140

DC 512M DDR3FBGA9611X14 GC 256M GDDR3 0.8

DDR2/FBGA136

12X14Y0.4

DC 512M GDDR3 180 0.510X14 GDDR310X15 1GV DDR3N DDP 192 0.4

DDR3 FBGA63 9X11X0.4/Y0.4

256M FLASH112

0.45FBGA128 10.5X13.5 DDR2 DDP 0.4FBGA170 12X14 Y0.4 GDDR5 180

8X11.5 0.45FBGA78 8.4X11.6

X-0.80.4

12.2X13.3 1G DDR3 DDP192

0.4/0.45FBGA82(78) 9.4X11.1

FBGA96 8X13X0.4

0.45FBGA100(96) 9X13 2G VEGA DDR3

FBGA84 10.5X13 0DC 512M DDR2FBGA60 10.5X10 0

FBGA84 8X13 0 DC 256M DDR2FBGA60 8X11.4 0 Tiva 1G DDR2 DDPFBGA60 11X9.5 X1.6 ORION 2G DDR2

9X13 Vega 2G DDR3

FBGA969.4X13

X0.4Vega 4G DDR3 SDP

8X137.5X138X11.5

FBGA787.5X11 DDR3 320 0.45 23X20X15.47.9X11

8.4X11.610X14.4

X-0.812.2X13.3 Tiva 2G DDR3 S/DDP

FBGA829.4X11.1 ORION 2G DDR3 SDP10.1X11.1 ORION 2G DDR3 DDP

9X11.1 Vega 2G DDR39.9X11 Vega 2G/4G(DDP) DDR3

FBGA136 11X14 Y0.4DDR3FBGA100 10X14.4 X0.4

FBGA96 8X13 0DDR3 480 0.45 20X18X15.4FBGA78 8X11.5 X1.2

9

제품안내

Products

Burn-in socket for TSOP/LGA

Model PACKAGE PKG SIZE Offeset DEVICE DENSITY BALL DIA PITCH SOCKET SIZE

TSOP66 400 0 256M DDR 0.65 28X20.2X15.4

12X20 0512/1G FLASH

112 38x20x14.3

TSOP12X20 0 240 28X20X15.4

TSOP48 12X17 0 512/1G FLASH WSOP 112 0.5 35x20x14.3

12X200 512/1G FLASH DDP 96

38x20x14.30 512M FLASH 112

LGA 52LGA 14X18 0 192 0.7 1 26X25X17

10

제품안내

Products

Burn-in socket for MCP/POP

Model PACKAGE PKG SIZE Offeset DEVICE DENSITY BALL DIA PITCH SOCKET SIZE

FBGA115 12x18

FBGA107(96) 10.5X13 MCP

FBGA115X0.4

MCP FBGA107(96) 9X12/Y0.4

MCP(256M F+256M SD)112 0.45 0.8 28X22X15.4

FBGA127

FBGA137 10.5X13 Y0.4 MCP

FBGA149 10X14 X0.4/Y0.4 MCP(512M F +256M SD)

POP FBGA200 14X14 0 0.325 0.5 26X26X15.4

11

제품안내

Products

테스트소켓& 커넥터류Test Socket and Connector >

프로필

반도체, 메모리, 비메모리 분야에 사용되는 모든 IC의 최종 성능 검사용 Sockets.

보드와 보드간에 연결을 도와주는 커넥터류.

Test Sockets are used to test AC/DC function of semiconductor in

memory and non-memory fields.

Connectors are used to interlink board to board.

12

제품안내

Products

금형& 전기구성요소Tools & Electric Components >

프로필

반도체관련부품, 정보통신기기 부품의 생산

- 참고 : 정밀기술 1급공장 인증

(산업자원부 산업기술시험원)

Tools for precision electric components.

- Reference : Acquired certificate of

“Company with excellent technology”

by government agency.

보유기술Technical Holding

Press •박판포밍기술

Ultra thin forming

•적층금형기술

Multiple laminations

•형내조립금형기술

Insert mold assembly

Mold •자동Insert 금형기술

Automatic insert injection molding

•정밀Gear 금형기술

Miniature precision gear molding

•박막사출 성형기술

Ultra thin injection forming

•2색사출성형기술

Two color injection forming

•고온사출성형기술

High temperature injection forming

프레스금형

Press tools

몰드금형

Mold tools

13

설비일람

Equipments List

NAME QT’Y MAKERMilling M/C 1 NAMSUN (Korea)Jig Grinding M/C 1 MITSUI SEIKI (Japan)CNC Engraving M/C 2 IIDA (Japan)Surface Grinding M/C 1 NICCO (Japan)Surface Grinding M/C 2 Johns & Shipment (England)Forming Grinding M/C 2 Brown & Wharpe (USA)Forming Grinding M/C 3 Johns & Shipment (England)Forming Grinding M/C 2 EtcForming Grinding M/C 2 NICCO (Japan)Jig Boring M/C 1 MITSUI SEIKI (Japan)Profile Grinding M/C 2 WAIDA (Japan)Electro Discharging M/C 3 CHARMILLES (Swiss)Electro Discharging M/C 1 JAPAX (Japan)Wire Cutting M/C 2 MITSUBISHI (Japan)Wire Cutting M/C 2 CHARMILLES (Swiss)Vacuum Furnace 1 IHI-IPSEN (Japan)

NAME QT’Y MAKERProfile Projector 2 NIKON (Japan)Hardness Measuring M/C 1 AKASHI (Japan)Hardness Measuring M/C 1 MATSUZAWA (Japan)Depth Measuring M/C 1 HISOMET (Japan)Tool Microscope 2 TOPCON (Japan), NIKON (Japan)Universal Testing M/C 1 MOOATEC (Korea)Surface illuminometer M/C 1 MITUTOYO (Japan)Temp & Humidity Chamber 1 YACHIMA (Japan)M Ω Meter 1 HIOKI (Japan)Withstanding & insulation Tester 1 ZENTECH (Taiwan)3D Micro Scope 1 Union (Japan)Vision system 1 Moatech (Korea)Force Testing M/C 1 AIKOH (Japan)CNC Vision measuring system 1 Nikon (Japan)

NAME QT’Y MAKERPress (30Ton) 2 Dobby (Japan)Press (30Ton) 2 Samdo (Korea)Press (30Ton) 3 Aida (Japan)Press (35Ton) 1 Changsin (Korea)Press (60Ton) 1 Samdo (Korea)Press (80Ton) 1 Samdo (Korea)Press (125Ton) 1 ChangShin (Korea)Injection Machine (50Ton) 11 LG (Korea)Vertical Injection Machine(55Ton) 2 DK (Korea)Injecting Machine (60Ton) 1 Sodick (Japan)

Tool Manufacturing Equipments

Testing Equipments

Production Equipments

14

품질보증체계

개발단계Development Stage 양산승인단계Approval Sta

개발의뢰Request

설계시작Design Start

시작품생산Sample Production

개선조치ImprovementManagement

개선대책수립Corrective Measure

원인분석Cause Analysis

FMEA분석FMEA Analysis

검사Inspection

자체승인Internal Approval

양산준비Mass production

preparation

NoYes

Client

Client

개발접수Acceptance

개발준비Preparation

양산시제품제작Sample for

Mass-production

검사Inspection

승인의뢰Request for

Approval

검C

양산시Sam

Mass-p

15

Quality Assurance System

Stage 양산단계Mass Productiion Stage

양산Mass production

지속적인 개선Corrective Measure

출하Production

공정(4M)변경Process(4M)change

입고Approval

공정변경통보Report for Process change

공정투입In use

관련표준정비Relative standard change

품질문제발생Defect

승인통보Approval report

품질문제 발생Defect

긴급통보/조치Dispatch & management

접수/등록Defect Report

통보Report

승인통보Approval

출하Shipping

원인분석및개선대책수립Cause analysis andcorrective measure

개선조치및담당자교육/훈련Correction

Training/Education

Yes

No

No

No

No

No

Yes

Yes

Yes

Yes

Client

Shipping

검토Client

검사Inspection

검토Examination

검사Inspection

검토Examination

산시제품제작Sample forss-production

626-851 경상남도양산시상북면상삼리 748번지

748,Sangsam-Ri,Sangbuk-Myeon,Yangsan-Si,Kyungsangnam-do, Korea #626-851

Tel. 055-375-7979 Fax. 055-375-9797http://www.chemit.co.kr