Smart Things Require

Smart Packaging

Semicon West

David Bolognia

July, 2016

Copyright 2016 Analog Devices, Inc.

IoT and the Semiconductor Solutions Provider

Progress through sensing, amplifying, converting, sharing and processing information with the things in our lives!

Convert Process Convert

Control & Power

Sense Amp Amp Output

Communications

Cloud Services

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A Typical System Level Solution

Passives

Battery Power Management

MicroprocessorCommunications

LAN/WAN/BAN

Connectors

Optical

Sensor

Motion

Sensor

Temp

Sensor

ECG

Memory User Interface

Other

Sensors

Energy Harvesting

Electrodes

Etc..

Antennas

Packaging the Solution

System in Package

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Understanding Packaging Trade-Offs

Value of size, weight

Miniaturization

Design Challenges

Integration, form factor

High speed/frequency

Heat dissipation

Power consumption (ULP)

Cost of manufacturing

Cumulative yield loss

Wafer probe, KGD

Market driven

Over design

Time to market risk

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System on Chip

- May benefit from Moore’s Law

- All or most functions on one die

- Analog & digital integration challenge

- Small ‘tweaks’ require new mask set

System in Package

- Best fab technology for each function

- Re-use of qualified silicon

- Customization

- Passive integration

- Lower NRE

Two Paths to System Solution Integration

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► Primary package-level technology for integration of the signal chain

► Integration of various process & product technologies

Silicon (many), SiGe, GaAs, GaN

Amplifier, convertor, micro-controller, sensors, etc.

Passive integration (discrete and IPD)

► SiP package formats

Rigid laminate

Flex

Ceramic

Leadframe

Others?

System in Package Technology at ADI

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Enabling technologies

Advanced laminate & flex technologies

Chip & wire

Flip chip (plated & copper pillar)

Die stacking (pyramid, spacer, FOW, flip-stack)

Discrete passives & IPDs

Embedded components

Mechanical integration & shielding

Optical SiPIPD (2.45GHz Matching Circuit)

SiP is the Integration of Enabling Packaging Technologies

Film Over Wire

Mixed Interconnect

Technologies

Laminate

Technologies

Copper Pillar BOL

High

Density

Flex

Flip Stack

Stacked Boards7

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Sensor integration in 3D

Applications

Medical imaging

Vital signs

Consumer

Industrial

Advance flex technologies

Ultra-fine geometries (25um pitch, 20um via)

1, 2, 4+ layers

PI, LCP, Teflon

SMT, W/B, F/C, & TCB interconnect

Embedded features (RLC, antennas)

Mechanical assembly (stiffeners, lids, etc.)

System on Flex (SOF)

2 Metal High Density Flex

(Stiffeners, Antennas)

Single Metal System on Flex

3D Industrial

Sensor Node

Optical Sensor

on Flex

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IoT Example: Remote Sensor Node (Smart Factory)

► Core hardware technologies

Sensors: acceleration, vibration, humidity, temperature

Amplifiers, converters, MCUs

Wireless radios

Energy harvesting and power management

► Packaging challenges

RF + digital integration (isolation & signal integrity)

Ultra-low power design

Sensor location, orientation, exposure to the environment

Antenna performance, boundary conditions

Battery packaging and energy harvesting

Breadboard Circuit

Partitioning (SiP Radio Modules)

Evaluation Cards & PCB Products

Complete Sensor Nodes

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► Body worn sensor node

Sensors and AFEs

Radio + antenna

NFC + antenna

PMU

Microcontroller

Batteries

Wrapped flex

IoT Examples: Vital Signs (Smart Wearables)

A-side

B-side

► VSM module

Microcontroller

Optical HRM + ECG

LEBT, matching circuit on IPD &

antenna

XL

Cap Sense

Folded flex

LEBT Tx

w/antennaBatteries

MCUSensor

NFC Antenna

PMU

Sensor

Flex & Housing

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The Flex Interconnect Density Challenge

► Coexistence of plated and printed flex

► Interconnect to ICs require HD flex

2-4 routing layers (interconnect at SI)

30um line and space

Through & blind metal filled micro-vias

Solder mask w/30um registration

Supports solder attach and wire

Plating technologies

► Printed flex supports size and cost

necessary to stretch across body

Rigid or HD flex interposers

Larger discretes and electrodes

RF (42p)

2.80

2.40

0.40AFE (36p)

2.60

2.60

0.40Micro (64p)

2.80

2.80

0.35► 10’s of centimeters

► 5-20 interconnects

► 10’s of millimeters

► 5-10 interconnects

Power

Ground

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IoT Packaging – The Tail Wags the Dog!

Communication

Robustness

Purposeful

Safe

Comfortable

Fashionable

Small Size

Low Power/

Re-chargeable

Affordable

Ecosystem

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Thank You!

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