Soldering+Processing+Manual

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  • 22

    Trouble shooting

    SOLUTIONSCAUSES

    Solder does not flow Adequately preheat the soldering object and the

    soldering base

    Observe recommended flame settings

    Use recommended flux

    Soldering gap is not completelyfilled

    Use adequate quantity and the recommended solder

    Check dimensions and the preparation of the soldering

    gap

    Prevent oxide formation

    Observe correct flame settings / temperature increase rate

    Ensure even heating of the metal framework and the

    soldering base

    Use recommended flux

    Porosity in the soldering gap Do not overheat the solder / observe processing

    temperature

    Prevent oxide formation; observe correct flame settings

    Even heating of the metal framework and the soldering

    base

    Use recommended flux

    Distortion of the bridge Observe recommended soldering gap width

    Observe recommended dimensions of the soldering

    connection

    Follow manufacturers instructions for mixing soldering

    investment

    Melted framework (hole) Even heating of the soldering object

    Observe recommended flame dimensions

    Observe recommended flame settings

    Weak soldering connections Prevent oxidation before and during soldering

    Observe recommended dimensions of the soldering

    connection

    Exact preparation of the soldering surface

    Ensure the homogeneity of the soldering structure

    Use recommended solder

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    Short Instructions

    PRE-SOLDERING

    The soldering gap with parallel walls should show awidth of at least 0.05 mm and 0.2 mm at the mostand demonstrate sufficiently large surfaces.

    Roughen the soldering surfaces with a suitable grin-ding instrument or by blasting with 50 micron Al2O3.The soldering surfaces must be clean, i.e. free ofgrease and oxide.

    Secure the individual framework elements on themodel in a stress-free fashion and close the solderinggap using modelling wax.

    Fabricate the soldering base as small as possible andwith rounded edges. After setting, remove the waxwith steam or hot water.

    While the object is still warm, apply flux into thesoldering gap and preheat the soldering base in thepreheating furnace at approximately 600 C/1112 Ffor 10 minutes.

    Heat up the soldering object to the processingtemperature of the solder.

    Heat the soldering object with the correctly set flame.Once the processing temperature has been reached,apply the solder to the soldering gap from theopposite direction.

    Allow the soldering object to cool slowly and divest.Remove oxides and flux residue by blasting and / orpickling.

    Grind the soldering site and prepare it for oxidation.

  • POST-SOLDERING

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    A correctly prepared wax-up serves as the basis.Soldering after ceramic firing requires solderingsurfaces with sufficient surface area.

    The soldering gap with parallel walls should show awidth of at least 0.05 mm and 0.2 mm at the mostand demonstrate sufficient surface dimensions.

    Roughen the soldering surfaces with a suitable grin-ding instrument or by blasting with 50 micron Al2O3.The soldering surfaces must be clean, i.e. free ofgrease and oxide.

    Secure the individual framework elements on themodel in a stress-free fashion and close the solderinggap using modelling wax. Cover the ceramic materialwith wax to prevent the soldering investment fromcoming into contact with the ceramic.

    Fabricate the soldering base as small as possible andwith rounded edges. After setting, remove the waxwith steam or hot water.

    While the object is still warm, apply flux into thesoldering gap. Make sure that the flux does not comeinto contact with the ceramic material.

    Form the suitable post-solder into a ball, wet it withflux, and position the flat end of the solder in thesoldering gap.

    Preheat the soldering object in the ceramic furnaceat approximately 600 C for 10 minutes andsubsequently heat up under vacuum to approximately50 C above the processing temperature of the solder.

    After soldering, allow the object to cool to room tem-perature slowly and then divest it. Remove oxides andflux residue using a pickling agent (PCT AScid).

    10Polish the bridge to a high gloss.

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