SolidWorks Flow Simulation

SolidWorks 2013

SolidWorks Flow Simulation:

Electronics Module

2012 Dassault Systmes SolidWorks Corporation.Not for resale.

Dassault Systmes SolidWorks Corporation

175 Wyman StreetWaltham, Massachusetts 02451 USA

1995-2012, Dassault Systmes SolidWorks Corporation, a Dassault Systmes S.A. company, 175 Wyman Street, Waltham, MA. 02451 USA. All rights reserved.

The information and the software discussed in this document are subject to change without notice and are not commitments by Dassault Systmes SolidWorks Corporation (DS SolidWorks).

No material may be reproduced or transmitted in any form or by any means, electronically or manually, for any purpose without the express written permission of DS SolidWorks.

The software discussed in this document is furnished under a license and may be used or copied only in accordance with the terms of the license. All warranties given by DS SolidWorks as to the software and documentation are set forth in the license agreement, and nothing stated in, or implied by, this document or its contents shall be considered or deemed a modification or amendment of any terms, including warranties, in the license agreement.

Patent Notices

SolidWorks 3D mechanical CAD software is protected by U.S. Patents 5,815,154; 6,219,049; 6,219,055; 6,611,725; 6,844,877; 6,898,560; 6,906,712; 7,079,990; 7,477,262; 7,558,705; 7,571,079; 7,590,497; 7,643,027; 7,672,822; 7,688,318; 7,694,238; 7,853,940; 8,305,376 and foreign patents, (e.g., EP 1,116,190 B1 and JP 3,517,643).

eDrawings software is protected by U.S. Patent 7,184,044; U.S. Patent 7,502,027; and Canadian Patent 2,318,706.

U.S. and foreign patents pending.

Trademarks and Product Names for SolidWorks Products and Services

SolidWorks, 3D PartStream.NET, 3D ContentCentral, eDrawings, and the eDrawings logo are registered trademarks and FeatureManager is a jointly owned registered trademark of DS SolidWorks.

CircuitWorks, FloXpress, PhotoWorks, TolAnalyst, and XchangeWorks are trademarks of DS SolidWorks.

FeatureWorks is a registered trademark of Geometric Ltd.

SolidWorks 2013, SolidWorks Enterprise PDM, SolidWorks Workgroup PDM, SolidWorks Simulation, SolidWorks Flow Simulation, eDrawings, eDrawings Professional, and SolidWorks Sustainability are product names of DS SolidWorks.

Other brand or product names are trademarks or registered trademarks of their respective holders.

COMMERCIAL COMPUTER SOFTWARE PROPRIETARY

The Software is a "commercial item" as that term is defined at 48 C.F.R. 2.101 (OCT 1995), consisting of "commercial computer software" and "commercial software documentation" as such terms are used in 48 C.F.R. 12.212 (SEPT 1995) and is provided to the U.S. Government (a) for acquisition by or on behalf of civilian agencies, consistent with the policy set forth in 48 C.F.R. 12.212; or (b) for acquisition by or on behalf of units of the department of Defense, consistent with the policies set forth in 48 C.F.R. 227.7202-1 (JUN 1995) and 227.7202-4 (JUN 1995).

In the event that you receive a request from any agency of the U.S. government to provide Software with rights beyond those set forth above, you will notify DS SolidWorks of the scope of the request and DS SolidWorks will have five (5) business days to, in its sole discretion, accept or reject such request. Contractor/Manufacturer: Dassault Systmes SolidWorks Corporation, 175 Wyman Street, Waltham, Massachusetts 02451 USA.

Copyright Notices for SolidWorks Standard, Premium, Professional, and Education Products

Portions of this software 1986-2012 Siemens Product Lifecycle Management Software Inc. All rights reserved.

This work contains the following software owned by Siemens Industry Software Limited:

D-Cubed 2D DCM 2012. Siemens Industry Software Limited. All rights reserved.

D-Cubed 3D DCM 2012. Siemens Industry Software Limited. All rights reserved.

D-Cubed PGM 2012. Siemens Industry Software Limited. All rights reserved.

D-Cubed CDM 2012. Siemens Industry Software Limited. All rights reserved.

D-Cubed AEM 2012. Siemens Industry Software Limited. All rights reserved.

Portions of this software 1998-2012 Geometric Ltd.

Portions of this software 1996-2012 Microsoft Corporation. All rights reserved.

Portions of this software incorporate PhysX by NVIDIA 2006-2010.

Portions of this software 2001-2012 Luxology, LLC. All rights reserved, patents pending.

Portions of this software 2007-2011 DriveWorks Ltd.

Copyright 1984-2010 Adobe Systems Inc. and its licensors. All rights reserved. Protected by U.S. Patents 5,929,866; 5,943,063; 6,289,364; 6,563,502; 6,639,593; 6,754,382; patents pending.

Adobe, the Adobe logo, Acrobat, the Adobe PDF logo, Distiller and Reader are registered trademarks or trademarks of Adobe Systems Inc. in the U.S. and other countries.

For more DS SolidWorks copyright information, see Help > About SolidWorks.

Copyright Notices for SolidWorks Simulation Products

Portions of this software 2008 Solversoft Corporation.

PCGLSS 1992-2010 Computational Applications and System Integration, Inc. All rights reserved.

Copyright Notices for Enterprise PDM Product

Outside In Viewer Technology, 1992-2012 Oracle

2011, Microsoft Corporation. All rights reserved.

Copyright Notices for eDrawings Products

Portions of this software 2000-2012 Tech Soft 3D.

Portions of this software 1995-1998 Jean-Loup Gailly and Mark Adler.

Portions of this software 1998-2001 3Dconnexion.

Portions of this software 1998-2012 Open Design Alliance. All rights reserved.

Portions of this software 1995-2010 Spatial Corporation.

This software is based in part on the work of the Independent JPEG Group.

Portions of eDrawings for iPad 1996-1999 Silicon Graphics Systems, Inc.

Portions of eDrawings for iPad 2003-2005 Apple Computer Inc.

Document Number: PMT1348-ENG

SolidWorks 2013

i

Contents

Lesson 1:Introduction to Electronics Module

Objectives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Electronic Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Case Study: Computer Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Project Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Stages in the Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Default Outer Wall Thermal Condition . . . . . . . . . . . . . . . . . . . . . 4

Printed Circuit Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Perforated Plates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Two-Resistor Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Heat Pipes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Mesh Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Conclusions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

SolidWorks 2013

ii

1Lesson 1

Introduction to Electronics

Module

Objectives Upon successful completion of this lesson, you will be able to:

Utilize the Electronic Module to design efficient cooling systems

for electronics.

Properly define two-resistor and heat pipe components.

Properly specify the PCB composite laminate.

Lesson 1 SolidWorks 2013Introduction to Electronics Module

2

Electronic Module

The Electronics module features new capabilities for the simulation of

heat pipes, two-resistor components and Joule heating by electric

current in solids. Additionally, the engineering database is enhanced

with multiple materials, two-resistor components, heat pipes and other

entries specific to the design and simulation of electronics products.

Case Study: Computer Box

In this lesson, we will introduce some of the features of the Electronic

module in Flow Simulation and learn how to post-process the results

and make judgments on the design of the computer box. It is expected

that the student is familiar with the Flow Simulation software. The

lesson will not teach the basic aspects of the Flow Simulation project

definition and postprocessing.

It is recommended to refer to the Flow Simulation documentation for

further details on the theory behind the solver.

Project Description

A computer box

containing CPU,

chipset

(northbridge and

southbridge), heat

sink, two heat

pipes and some

peripheral

connectors is

placed in a room

with ambient

temperature of

20C. The air at room temperature enters the box through the vents

located on the sides, on the top and on the bottom of the box. The air is

forced out of the box by the internal fan located on the back side of the

box next to the heat sink.

The objective of this lesson is to ensure that the temperature of the

critical electronics components, namely CPU and the chipset remains

below the maximum operating temperatures listed in the table below.

Component Maximum operating temperature

CPU 80C

Northbridge 85C

Southbridge 95C

SolidWorks 2013 Lesson 1Introduction to Electronics Module

3

Stages in the Process

Create the project.

The project will be created using the Wizard.

Define PCB.

PCB composite will be defined in the engineering database and

specified.

Apply boundary conditions.

Proper boundary conditions will be applied to simulate the air inlets

and outlets. Additionally, a wall condition will be used to simulate

the heat loss due to convection to the outside.

Specify perforated plates.

Custom perforated plates will be defined in the engineering

database and applied to the model.

Apply two-resistor components.

Two-resistor components will be applied to accurately model CPU

and the chipset (northbridge and southbridge).

Define heat pipes.

Heat pipe features of the Electronic module will be specified.

Define contact resistances.

Material contact resistances will be specified for the interface

between the heat pipes and the electronic components.

Furthermore, infinite contact resistances will be applied to the

exposed external faces of the heat pipes.

Define simulation goals and initial mesh.

Run the analysis.

Post-process the results.

Maximum temperatures on the critical components will be

determined.

1 Open an assembly file.

Open Electronics Assembly from the Case Study\Computer box folder.

2 Activate configuration.

Activate configuration Simulation.

This simplified configuration was prepared specifically for the flow

simulation. Notice that all peripheral components are modeled as boxes

and shapes of some of the electronic components are simplified.


4

3 Create a project.

Create a new study using the Wizard with the following settings:

Default Outer Wall Thermal Condition

In this lesson, we specified a Default Outer Wall Thermal Condition

as a convection coefficient and ambient temperature. This defines the

thermal condition outside of the computer box. We assume that the

external air has a temperature of 20.05C and moves slowly due to the

gravity effects only (convective coefficient of 10 W/m^2/K).

4 Apply solid materials.

Under Input Data, right-click Solid Materials and select Insert Solid Material.

Select Copper under Metals and apply it to the heatsink component.

Click OK.

Configuration

nameUse current:

Simulation

Project name Cooling

Unit system SI (m-kg-s)

Change the units for Temperature to C.

Analysis Type

Physical Features

Internal

Select Exclude cavities without flow conditions.

Select the Heat conduction in Solids check box.

Select the Gravity box.

The Y component of -9.81 m/s^2 is the correct direction and value for

this analysis.

Database of

FluidsIn the Fluids list, under Gases, double-click Air to add it to the Project Fluids.

Solids Default solid should be set to Aluminum.

Wall conditions Select Heat transfer coefficient as the Default outer wall thermal

condition. Enter 10 W/m^2/K and 20.05C as the Heat transfer

coefficient and Temperature of external fluid, respectively.

The default Roughness value of 0 micro meter is acceptable for this

analysis.

Initial conditions Default conditions.

Results &

Geometry

Resolution

Set the Result resolution to 3.


5

Note The rest of the components are modeled using the special features of

the Electronics module, (two-resistor components for CPU and the

chipset parts, for example). Solid materials are not assigned to these

components.

Printed Circuit

Boards

PCB composite laminates exhibits anisotropic material behavior. The

electronics module allows users to enter the detailed layup of various

PCB composites and store it in the Engineering database. Flow

Simulation then automatically calculates the effective material

properties (conductivities in all directions, for example).

5 Define PCB composite.

Under Flow Simulation, Tools open Engineering Database.

Under Database tree, expand Printed Circuit Boards and select the User Defined folder.

Click New Item and enter the following properties for conducting and

dielectric layers.

Effective composite

Material constants forconducting anddielectric layers

constants


6

When finished, click the

Tables and Curves tab

and input the composite

layup, as shown in the

figure.

Note The Layer Thickness implies the thickness of the conducting layer

defined by the thickness of the conductive material in each lamina. The

Percentage Cover parameters indicate the volume fraction of the

conducting material in the body of each conducting layer.

Click Save and close the Engineering Database window.

The effective properties of the PCB composite are automatically

computed and shown in the table (see the Engineering Database

figure).

6 Assign PCB material.

Under Input Data, right-click Printed Circuit Boards and select Insert Printed Circuit Board.

From the User Defined folder, select 6S2P

composite created in the previous step.

Select the PCB assembly part.

Click OK.


7

7 Specify pressure boundary conditions.

Define Environment Pressure boundary condition on four lids of the

Base. Use the internal faces of the lids.

Note The inlet is defined by the opening in the side walls of the Base rather than the perforated area of the Cover.

Define Static Pressure boundary condition on the bridge opening.

Use the internal face of the lid.


8

Specify Environmental Pressure boundary condition on the lid

covering the main four slits on the top of the Cover.

Note Flow Simulation will automatically detect four slits and correctly apply

the boundary condition.

Specify Environmental Pressure boundary

condition on the inside face of the fan outlet

lid.

8 Define internal fan.

Under Input Data, right-click Fans and select Insert Fan.

Under Type select Internal Fan.

Under Faces Fluid Exits Fan and

Faces Fluid Enters Fan select the two

faces as shown in the figure. Note that

the air is forced out of the enclosure.

Under Fan select Axial, Papst, Papst

405 from the Pre-Defined folder. Keep the rest of the parameters at their default

values.

Click OK.


9

Note The air is forced out of the enclosures.

Make sure that the faces for Faces Fluid

Exits Fan and Faces Fluid Enters Fan

are selected correctly and the direction of

the feature arrows points as shown in the

figure.

Note A reasonable simplification would be the outlet fan type defined

directly on the enclosure face. The current solution represents more

accurate position of the fan with respect to the heatsink.

Perforated Plates The perforated plates feature is used to model inlet and outlet flows

through thin perforated walls where a typical 3D mesh would result in

an excessive number of cells. The perforated plate condition must be

applied in conjunction with the environmental pressure boundary

conditions.

9 Define perforated places.

Similar to step 5, open the Engineering Database.

Expand the Perforated Plates folder. Under the User Defined folder define the following two perforated plate features.

Note The parameters of the Plate 1 and Plate 2 features correspond to the

perforated plates at the fan outlet and the four side air inlets,

correspondingly.


10

10 Assign perforated plates.

Under Input Data, right-click Perforated Plates and select Insert

Perforated Plate.

From the User Defined folder,

select Plate 1.

Select the inside face of the fan

outlet lid.

Click OK.

Note The perforated plate feature requires existing environmental pressure or

fan boundary condition. The selected face must therefore be the same

as the one used in the definition of the pressure condition in step 7.

Note To automatically select the correct face you may choose to click the

corresponding environmental pressure boundary condition in the Flow

Simulation analysis tree.

Similarly, assign

Plate 2 perforated

plate feature to the

four lids of the Base.


11

Two-Resistor Components

Two-resistor components are used to model thermal behavior of the

small electronic components such as CPU, chipsets, memories etc.

Rather than using a single body, two-resistor component simplifies the

complex shape with two parallelepiped parts. The Junction is the lower

part directly in contact with the PCB. The upper part is then referred to

as the Case.

Both parts are isolated at their sides forcing the heat to travel in the

direction normal to the plane of the parallelepiped. The thermal

properties are expressed using Junction-to-Case (JC) and Junction-to-

Board (JB) thermal resistances of the infinitely thin plates at the

respective interfaces.

Package

Junction

Adiabatic wallsAdiabatic walls Case

PCB board

JC

JB


12

Electronic module has an extensive library

of two-resistor components. The figure

shows parameters for

PBGAFC_40x40mm_2R consisting of the parallelepiped dimensions (thickness

and two planar dimensions), and two

thermal resistances.

Caution must be paid to the geometry of the parallelepiped components

in the SolidWorks model. Their physical dimensions must agree with

the dimensions in the engineering database.

11 Specify two-resistor

components.

Right-click the Two Resistor

Components icon and select Insert Two-Resistor

Component.

Select cpu 2r case as the Case Body and cpu 2r junction as the Junction Body.

Under Component select

PBGAFC_40x40mm_2R.

Under Source enter 14W for

the Heat Generation Rate.

Click OK.

Following the same procedure, specify the remaining two-resistor

components for the chipset (northbridge and southbridge).

Northbridge Southbridge

Case northbridge 2r case southbridge 2r case

Junction northbridge 2r junction southbridge 2r junction

Component PBGAFC_37_5x37_5mm_2R LQFP_256_28x28mm_2R

Heat Rate 4.3 W 2.5 W


13

Heat Pipes A heat pipe is an efficient heat transfer mechanism between two solid interfaces. It combines the principles of both thermal conductivity and

phase transition.

To define a heat pipe component, a solid body and two faces (one for

cold, one for hot interfaces) are required.

12 Specify heat pipes.

Right-click the Heat Pipes

icon and select Insert Heat

Pipe.

Select cpu heat pipe as the Components to Apply Heat

Pipe.

Select the face of the cpu heat pipe in contact with the CPU as Heat In Faces.

Select the two faces of the

cpu heat pipe in contact with the heatsink as Heat Out Faces.

Under Effective Thermal Resistance, enter 0.3 C/W.

Click OK.

Note The Effective Thermal Resistance parameter represents the

resistance of the heat pipe to the flow. This value is typically very small

as heat pipes are very efficient.

Following the same procedure, specify the remaining heat pipe

between the northbridge and the heatsink components. Use the same Effective Thermal Resistance.


14

13 Specify contact resistances for heat-in faces.

Right-click the Contact Resistances icon and select Insert Contact

Resistance.

Select the heat in faces on both heat pipes (see the figure). Identical

faces were used as Heat In Faces in the definition of the heat pipes in

the previous step.

Under Type select Resistance and under Interface Materials select

the Bond-Ply 660 @ 25 psi from the Pre-Defined, Interface Materials, Bergquist, Bond-Ply folder.

Note The Flow Simulation engineering database with the Electronics module

license features extensive list of the available interface materials.


15

14 Specify contact resistances for exposed heat pipe faces.

Heap pipes are very efficient heat conductors with minimum thermal

resistance. To simplify the calculation we will assume that no heat is

flowing from the heat pipes into the surrounding air. This will be done

by specifying infinite contact resistance.

Right-click the Contact Resistances icon

and select Insert Contact Resistance.

In the FeatureManager tree, using the CTRL

key, click both bodies of the cpu heat pipe and heat pipe short components. Flow Simulation will select all outside faces into

the Faces to apply the contact resistance

selection window.

Click the Filter Faces icon to open the filter

dialog, select Keep outer and fluid-

contacting faces and run the filter by

clicking the Filter button.

Under Type select Resistance.

Under Thermal Resistance select Infinite

resistance (Pre-Defined folder).

Click OK.

15 Specify volume goals.

Under Input Data, right-click Goals and select Insert Volume Goal.

Under Selection select cpu 2r case and cpu 2r junction components.

Under Parameter specify Av and Max for Temperature (Solid).

Edit the Name Template to CPU VG

.

Click OK.

Continue with the definition of the volume goals for the chipset

components (northbridge and southbridge) and the heatsink.


16

16 Specify surface goal.

Following similar procedure, define a separate Mass Flow Rate

surface goal for each air inlet and outlet.

Note A definition can be conveniently done with a

single command using the Create goal for

each surface option.

Mesh Considerations

As in any simulation project, mesh plays important role in the quality

of the solution. Proper mesh generation requires iterative approach

while adjusting various mesh parameters until the desired optimum

discretization is achieved.

In the current model, it is advisable to discretize the interface between

the PCB and the two-resistor components with cells terminating at this interface. We will achieve this by placing one control plane at the said

interface (figure in the next step). Also, to mesh the thin features of the

PCB and the two-resistor components, we will adjust the cell Ratio values accordingly.

Lastly, local mesh controls for the thermally important components,

heatsink and the two-resistor components, will be defined as well.

17 Specify initial mesh.

Right-click Input Data and select Initial Mesh.

Clear the Automatic settings checkbox.

Under Basic Mesh, Control Intervals, click the Add Plane button to

open the Create Control Planes window.

Select plane parallel to ZX, Reference

Geometry, and click the vertex on the

PCB face defining the plane of interface with the two-resistor components (see

the figure).

Click OK to close the Create Control

Planes window.

Back in the Initial Mesh window, under Basic Mesh, enter the Ratio

values of 2 and -3 for Y1 and Y2 intervals, respectively.


17

Note With Ratio values as specified, the cells adjacent to PCB will be smaller, growing in size with the distance.

Under Number of cells, enter the basic mesh parameters as indicated

in the figure below.

Click the Solid/Fluid Interface tab and reduce Small solid feature

refinement level to 1. Also, make sure that the rest of the parameters

are set as shown in the figure below.

Click OK.


18

18 Specify local initial mesh for two-resistor components.

Under Input Data, right-click Local Initial Meshes and select Insert Local Initial Mesh.

With the help of the CTRL key, multiple select all two-resistor

components. A total of six bodies should be selected.

Clear Auto settings.

Under Refining Cells, set both the Refine partial cells and Refine

solid cells parameters to level 2.

Click OK.

19 Specify local initial mesh for heatsink.Using the same procedure, create another local initial mesh for the

heatsink.

Use the settings from step 18 for the parameters under the Refining

Cells tab.

Under the Narrow Channels tab, set the Characteristic number of

cells across a narrow channel to 5 and Narrow channels

refinement level to 2.

20 Generate mesh.

Under the Flow Simulation menu, click: Solve, Run.

Uncheck the Solve checkbox.

Make sure that the Mesh and the Load results options are checked.

Click Run.

Note The above step will generate mesh only.


19

21 Mesh plots.

Show the mesh on the plane parallel to the assembly Front plane, at the position -0.0595 m.

It can be seen that the cells terminate at the interface between the PCB and the two-resistor components, Also, cells are growing in size with

distance from the PCB.

Show the mesh on the plane parallel to the assembly Front plane, at the position -0.00381 m.

At this position, the plane is passing through the heatsink. We can see that only one full cell is discretizing the narrow channel. This mesh

deficiency is caused purposely to reduce the computational time

required to solve this simulation. For more accurate solution in the

heatsink region, the Narrow channel refinement level specified in step 19 needs to be increased.


20

Show the mesh on the plane parallel to the assembly Right plane, at the position 0.0109 m.

At this position, the plane is passing through one of the heatsink narrow channels. The discretization seems fine in the direction.

However, as we found out the discretization would have to increase

somewhat to correctly mesh the width of the narrow channels.

22 Solve.

Similarly to step 20, execute the Solve, Run command.

This time, uncheck Mesh.

Check the Solve and the Load results checkboxes.

Click Run.

Note The solve time should take up to thirty minutes.


21

23 Show temperature results.

Define a Surface Plot for all thermally important components:

heatsink and all of the two-resistor components.

Make sure to set the plot legend limits to the plot rather than the global

maximums.

The temperature of the electronic components must now be compared

against the limits stated at the beginning of the lesson. We can

immediately see that the CPU temperature of 81.5 C exceeds the limit of 80 C. The cooling system is therefore insufficient.

The temperature of the other components can be checked easily with

the help of the goals or surface parameters.

24 List temperature of the important components.

Define a Goal Plot for all defined temperature goals and show the table

with the extremes for all important components.

The critical temperatures are marked in red. It is clear that the CPU overheats and the cooling must be redesigned. The chipset components

(northbridge and southbridge) are thermally safe with sufficient margin

of safety.


22

Conclusions In this lesson, we evaluated a design of cooling for electronic computer box. Advanced features of the electronics module, namely heat pipes,

two-resistor components, PCB composite interface were shown and

practiced in detail.

Two-resistor components are special features enabling users to model

thin electronic components such as CPUs with greater level of fidelity.

Heat pipes are efficient heat transporting devices employing both

principles of the heat conduction and phase transition. Lastly, the PCB

composite interface enables users to enter the layup composition of the

PCBs and store them in the engineering database. Flow Simulation then

automatically computes the effective material constants required for the

simulation.

In this lesson we found that with the proposed cooling the CPU unit overheats. Redesign of the cooling system is therefore necessary.

/ColorImageDict > /JPEG2000ColorACSImageDict > /JPEG2000ColorImageDict > /AntiAliasGrayImages false /CropGrayImages true /GrayImageMinResolution 300 /GrayImageMinResolutionPolicy /OK /DownsampleGrayImages true /GrayImageDownsampleType /Bicubic /GrayImageResolution 300 /GrayImageDepth -1 /GrayImageMinDownsampleDepth 2 /GrayImageDownsampleThreshold 1.50000 /EncodeGrayImages true /GrayImageFilter /DCTEncode /AutoFilterGrayImages true /GrayImageAutoFilterStrategy /JPEG /GrayACSImageDict > /GrayImageDict > /JPEG2000GrayACSImageDict > /JPEG2000GrayImageDict > /AntiAliasMonoImages false /CropMonoImages true /MonoImageMinResolution 1200 /MonoImageMinResolutionPolicy /OK /DownsampleMonoImages true /MonoImageDownsampleType /Bicubic /MonoImageResolution 1200 /MonoImageDepth -1 /MonoImageDownsampleThreshold 1.50000 /EncodeMonoImages true /MonoImageFilter /CCITTFaxEncode /MonoImageDict > /AllowPSXObjects false /CheckCompliance [ /None ] /PDFX1aCheck false /PDFX3Check false /PDFXCompliantPDFOnly false /PDFXNoTrimBoxError true /PDFXTrimBoxToMediaBoxOffset [ 0.00000 0.00000 0.00000 0.00000 ] /PDFXSetBleedBoxToMediaBox true /PDFXBleedBoxToTrimBoxOffset [ 0.00000 0.00000 0.00000 0.00000 ] /PDFXOutputIntentProfile () /PDFXOutputConditionIdentifier () /PDFXOutputCondition () /PDFXRegistryName () /PDFXTrapped /False

/CreateJDFFile false /Description > /Namespace [ (Adobe) (Common) (1.0) ] /OtherNamespaces [ > /FormElements false /GenerateStructure false /IncludeBookmarks false /IncludeHyperlinks false /IncludeInteractive false /IncludeLayers false /IncludeProfiles false /MultimediaHandling /UseObjectSettings /Namespace [ (Adobe) (CreativeSuite) (2.0) ] /PDFXOutputIntentProfileSelector /DocumentCMYK /PreserveEditing true /UntaggedCMYKHandling /LeaveUntagged /UntaggedRGBHandling /UseDocumentProfile /UseDocumentBleed false >> ]>> setdistillerparams> setpagedevice

Documents

SolidWorks Flow Simulation