BGA1517

SOT1848-2BGA1517, plastic ball grid array package; 1517 balls, 1 mmpitch, 40 mm x 40 mm x 3.36 mm body18 December 2017 Package information

1. Package summaryTerminal position code B (bottom)

Package type descriptive code BGA1517

Package style descriptive code BGA (ball grid array)

Package body material type P (plastic)

Mounting method type S (surface mount)

Issue date 18-12-2017

Manufacturer package code 98ASA01023D

Table 1. Package summarySymbol Parameter Min Typ Nom Max Unit

D package length - - 40 - mm

E package width - - 40 - mm

A2 package height - - 3.36 - mm

e nominal pitch - - 1 - mm

n2 actual quantity of termination - - 1517 - A/A

NXP Semiconductors SOT1848-2BGA1517, plastic ball grid array package; 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body

SOT1848-2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved

Package information 18 December 2017 2 / 5

2. Package outline

Fig. 1. Package outline SOT1848-2

NXP Semiconductors SOT1848-2BGA1517, plastic ball grid array package; 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body

SOT1848-2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved

Package information 18 December 2017 3 / 5

Fig. 2. Package outline note BGA1517 (SOT1848-2)

NXP Semiconductors SOT1848-2BGA1517, plastic ball grid array package; 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body

SOT1848-2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved

Package information 18 December 2017 4 / 5

3. Legal information

DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an informationsource outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.

Notwithstanding any damages that customer might incur for any reasonwhatsoever, NXP Semiconductors’ aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

NXP Semiconductors SOT1848-2BGA1517, plastic ball grid array package; 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body

SOT1848-2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved

Package information 18 December 2017 5 / 5

4. Contents1. Package summary........................................................ 12. Package outline............................................................ 23. Legal information......................................................... 4

© NXP B.V. 2017. All rights reservedFor more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.comDate of release: 18 December 2017