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SPECIFICATION SIPLACE HFSPECIFICATIONHigh-Flexibility SMD Placement System
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High-Flexibility SMD Placement SystemSIPLACE HFContents
High-Flexibility SMD Placement System 3Contents 3
Machine Description 5Overview 5Technical Data 7
Line Concept 8Description 8
Placement Heads 9Head Modularity 912-Segment Collect & Place Head for High-Speed Placement 106-Segment Collect&Place Head for High-Speed IC Placement 11Collect&Place Heads 12Technical Data 12TwinHead for high-precision IC placement 13Technical Data 14Nozzle Changers (Collect & Place Heads) 15Nozzle changers (TwinHead) 16Technical Data 17
PCB Conveyor 18Single conveyor 18Technical Data 19Dual conveyor 20Technical Data 21PCB Barcode for Product-Controlled Production (Option) 22
Component Feeding 23Component Changeover Table 23Technical Data 24Tape Feeders 25Bulk case feeder 26Dummy Feeders 27Manual Trays 28Matrix Tray Changer 29Technical Data 30
Technical Data 32Connections 32Dimensions and set-up conditions 34Placement system’s center of gravity 35Maneuvering radii 36MTC dimensions and set-up conditions 36Transport and Delivery Configuration 37
Sample Configuration 38
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Machine DescriptionOverview
Innovation
• Linear drives on every gantry → faster accelera-tion and braking of X and Y gantries → higher placement rate
• Gantry extensions con-structed from carbon fiber composite, 5 times lighter than steel and twice as rigid → increased speed and accuracy
• TwinHead places two components at the same time using the Pick & Place principle→ increased speed when placing large components→ greater flexibility due to broader range of compo-nents
• TwinHead component vision camera with 50 mm x 40 mm field of view → maximum speed together with more reliable recog-nition of even complex components such as CCGA or flip chip
Description
The SIPLACE HF placement system is particularly suitable for applications that demand a high level of flexibility and utmost precision. Two place-ment methods are used:
• the Collect & Place method for high-speed placement of standard components ( see diagram on page 6)
• the Pick & Place method for fast placement of special fine-pitch and super-fine pitch compo-nents
The HF/placement system has two gantries driven by linear motors. The gantries can be quickly and accurately positioned in the X and Y directions. There is a place-ment head on each gantry.
The following placement head configurations are possible:
Placement areas 1 and 2
• 12-segment Collect & Place head or
• 6-segment Collect & Place head or
• TwinHead
The head modularity prin-ciple allows the placement heads to be reconfigured to suit changing requirements.
The moving head picks up the components from their stationary feeder, and places them on the PCB, which is also stationary. This proven SIPLACE principle has many advantages:
• Short down times for refill-ing or splicing
• Even the smallest compo-nents (e.g. 0201) are picked up reliably
• The components cannot slip on the PCB
• Minimal traversing paths
High flexibility, cost-effec-tiveness and set-up reliability guarantee that the SIPLACE HF placement system will be highly productive. The mini-mal down times increase uti-lization, thus further increasing productivity.
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Machine DescriptionOverview
Upgrade
The following options are available to extend the machine's functionality:
• Additional component changeover tables in-crease machine utilization since set-up times can be reduced by carrying out preliminary set-up off the machine.
• The dual conveyor also increases machine utiliza-
tion by eliminating non-productive PCB transport times.
• Automatic nozzle chang-ers speed up and optimize the nozzle configuration process.
• PCB barcode scanners al-low the production set-up to be changed over when triggered by a new product.
• Component barcode scanners optimize the set-up and refill checks.
• Large and sensitive fine-pitch components can be supplied in trays by two matrix tray changers.
• The productivity lift imple-ments the concept of parallel placement, and thus improves the ratio between productive and non-productive times.
Placement principleCollect&Place
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Machine DescriptionTechnical Data
Types of placement head SIPLACE TwinHead (TH)6-segment Collect&Place head (C&P6)12-segment Collect&Place head (C&P12)
Number of gantries 2
Placement rate(benchmark)
Placement area 1 Placement area 2C&P12 C&P12 28,000 comp./hC&P12 C&P6 23,300 comp./hC&P6 C&P6 18,600 comp./h
C&P12 TH 17,700 comp./hC&P6 TH 13,000 comp./h
TH TH 7,400 comp./h
Range of components 0.6 x 0.3 mm² (0201) to 85 x 85 mm² / 125 x 10 mm²max. 200 x 125 mm² (with restrictions)
Component height C&P12: 6 mmC&P6: 8.5 mmTH: 25 mm (larger heights on request)
Placement accuracy C&P12: ± 60 µm standard, ± 55 µm DCA, ± 0.7° / (4 σ)C&P6: ± 60 µm standard, ± 55 µm DCA, ± 0.3° / (4 σ)TH: ± 35 µm standard, ± 30 µm FC, ± 0.07° / (4 σ)
PCB format(LxW)
Single conveyor50 x 50 mm² to 450 x 508 mm²50 x 80 mm² to 610 x 508 mm² ("Long board" option)Dual conveyor50 x 50 mm² to 450 x 250 mm²50 x 80 mm² to 610 x 250 mm² ("Long board" option)Dual conveyor in single conveyor mode50 x 50 mm² to 450 x 450 mm²50 x 80 mm² to 610 x 450 mm² ("Long board" option)
PCB thickness 0.3 - 4.5 mm (thicker PCBs on request)
Feeding capacity 180 tracks, width 8 mm (60 3 x 8 mm S feeder)120 tracks, width 8 mm (60 2 x 8 mm S feeder)60 tracks, width 12 or 16 mm (60 12/16 mm S feeder)40 tracks, width 24 or 32 mm (40 24/32 mm S feeder)28 tracks, width 44 mm (28 44 mm S feeder)24 tracks, width 56 mm (24 56 mm S feeder)20 tracks, width 72 mm (20 72 mm S feeder)16 tracks, width 88 mm (16 88 mm S feeder)
Component feeding 4 component changeover tables with tape roll holders and integral waste containers15 slots, 30 mm wide, per changeover table or up to 2 matrix tray changers, rather than component changeover tables
Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM feed-ers, surftape feeders (8, 12, 16 mm), manual trays
Compressed air connection 0.5 - 1.0 MPa (5 - 10 bar), ∅ 3/4" 350 st. l/min (C&P/TH)
Power supply 3 x 208/230 VAC ± 5 %, 50/60 Hz, 3 x 32 A3 x 380/400/415 VAC ± 5 %, 50/60 Hz, 3 x 16 A6.5 kW total power
Space required (L x W)Weight
2380 x 2515 mm² / 6.01 m²3800 kg (basic machine), 4700 kg (full configuration with feeders)
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Line ConceptDescription
Innovation
• Modularity, flexibility → the line can easily be adapted to suit production requirements
• Compactness, high power density → less space required for increased placement rate
Description
The SIPLACE HF is fully com-patible with other SIPLACE systems. This compatibility enables a production line to be configured from identical and different modules. If production requirements change, the individual place-ment systems can be quickly and easily recombined.
The SIPLACE family has exactly the right placement system, whatever the output requirements:
SIPLACE HF placement systems cover the SMD spec-trum of components from 0201 to 125 x 10 mm² with a high placement rate.
The SIPLACE HS-60 is a super high-speed placement system for processing com-ponents ranging from 0201 through to 18.7 x 18.7 mm².
The SIPLACE S-27 HM is a high-speed system for placing components from 0201 to 32 x 32 mm².
The flexible SIPLACE F5 HM system places large ICs, flip chips, bare dies and exotic components (OSC). It has a component range of 0201 to 55 x 55 mm².
SIPLACE set-up optimization is a tool for increasing the line's productivity. The soft-ware calculates individual set-ups for individual prod-ucts, individual set-ups for different products and
family set-ups for different products.
The program data can be exchanged between the indi-vidual lines - even for differ-ent machine configurations.
System SIPLACE SMD placement lines
Placement modules SIPLACE HF / SIPLACE HS-60 / SIPLACE S-27 HM / F5 HM
Peripheral modules Input/output stations, screen printers, soldering ovens, inspection stations, etc, available from Siemens L&A
Component range 0201 to 85 x 85 mm² / 125 x 10 mm² max. 200 x 125 ² mm² (with restrictions)
PCB conveyor Single and dual conveyor with auto-matic width adjustment unit
Placement rate Depends how modules are connected in series
Space required 4 m² per S module, 6 m² per HF module, 6.5 m² per HF/3 module, 7.5 m² per HS module
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Placement HeadsHead Modularity
Innovation
• TwinHead picks up two components at the same time using the Pick & Place principle→ increased speed when placing large components→ greater flexibility due to broader range of compo-nents
• Head modularity→ A simple placement head change adapts the machine to the current production requirements
• Reconfiguration kit→ Local placement head change
Description
One particular advantage of the SIPLACE family is its head modularity, which opens up the following opportunities for HF machines:
Placement areas 1 and 2
• 12-segment Collect & Place head or
• 6-segment Collect & Place head or
• TwinHead
If you order a SIPLACE HF placement system, you can choose between a 6-segment C&P head, a 12-segment C&P head or a TwinHead. The placement system will be configured and supplied as per your order.
There is also a reconfigura-tion kit if you wish to change the placement head locally.
This package contains the appropriate nozzle changers, assembly parts, cables, etc, in addition to the placement head.
Head modularity provides an easy way to match the place-ment system to your produc-tion needs without having to invest in additional machines.
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ponent visiondule
DP axisRotate compo-nent to place-ment angle
Pull offor insertsleeve
Placement heads12-Segment Collect & Place Head for High-Speed Placement
Innovation
• Compact construction→ Low centrifugal forces on the components
• Same cycle time for all components→ Placement rate does not depend on the component size
• High-speed placement of components ranging from 0201 to 18.7 x 18.7 mm²
Description
The 12-segment Collect & Place head works on the Collect & Place principle. This means that, within each cycle, twelve components are picked up by the place-ment head, are optically centered on the way to the board and are rotated into the required placement angle. Lastly, the component is placed gently and accu-rately on the board. The twelve nozzles on SIPLACE Collect &Place heads turn about a horizontal axis, in contrast to conventional chip shooters.
The compact construction has the following advan-tages:
• the centrifugal forces act-ing on the components are much lower than with con-ventional chip shooters
• The cycle time of the Collect & Place head is the same for all components, which means that the placement rate is not de-pendent on the compo-nent size.
Checking and self-learning functions
The reliability of the Collect & Place head is increased by various checking and self-learning functions.
• For example, vacuum checks at the nozzles indi-cate whether the compo-nent was picked up or set down correctly.
• A fiducial mark on the feeder is used to deter-mine the precise compo-nent pick-up position on the feeder.
• A camera on the place-ment head (component vision module) determines the precise angle of each component on the nozzle. Any deviations from the required pick-up position are corrected before place-ment takes place.
• The package form is also checked. and the compo-nent is not placed if the geometric data thus deter-mined differs from the programmed data.
The vertical axis for picking up and placing the compo-nent works in sensor stop mode, in which differences in height during pick-up and any unevenness of the PCB
surface are compensated during placement. A compo-nent sensor may be installed on the C&P head in order to increase placement reliabil-ity. This sensor checks the edge ratio in addition to the presence of the component at the nozzle.
DCA option
The 12-segment Collect& Place head can optically center and place compo-nents from 0.6 x 0.3 mm² to 13 x 13 mm² using the optional DCA vision module. The DCA vision module opti-mizes the speed and accu-racy when placing flip-chips and bare dies (values in table on page 12).
Commo
Z axisPick up or
place component
DR axis:Star rotation
Rejectcomponent
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Placement heads6-Segment Collect&Place Head for High-Speed IC Placement
Innovation
• High-speed placement of ICs → Components up to 32 x 32 mm²
Description
The 6-segment Collect & Place head also works on the Collect & Place principle. With the standard compo-nent vision module, the HF machine places components with an edge length of up to 32 mm both fast and accu-rately. It is therefore ideal for use with products containing a large proportion of ICs.
DCA option
The 6-segment Collect& Place head can optically center and place compo-nents from 0.6 x 0.3 mm² to 13 x 13 mm² using the optional DCA vision module. The DCA vision module opti-mizes the speed and accura-cy when placing high-speed flip-chips and bare die com-ponents. The values are shown in the table on page 12.
Checking and self-learning functions
The checking and self-learn-ing functions described on page 10 for the 12-segment Collect&Place head also apply to the 6-segment Collect & Place head.
Component vision module
DP axisRotate component to placement angl
Z axisPick up or
place component
DR axis:Star rotation
Reject component,pull off or insert
sleeve
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entce head sion le)
Componen chip,
Componenspecificatio
max. hemin. leamin. bumin. balmin. dimmax. dimmax. we
²
Programmplacement
Nozzle typ
X/Y accura
Angular ac
Placement headsCollect&Place HeadsTechnical Data
12-segmentCollect&Place head
(standard visionmodule)
12-segmentCollect&Place head
(DCA visionmodule)
6-segmentCollect&Place head
(standard vision module)
6-segmCollect&Pla
(DCA vimodu
t range 0201 to PLCC44, BGA, µBGA, flip-chip, TSOP, QFP, SO to SO32, DRAM
0201 to flip-chip, bare die
0603 to 32 x 32 mm² 0201 to flip-bare die
t ns
ightd pitchmp pitchl bump ∅ensionsensions
ight
6 mm0.5 mm0.35 mm0.2 mm0.6 x 0.3 mm²18.7 x 18.7 mm²2 g
6 mm0.4 mm0.2 mm0.11 mm0.6 x 0.3 mm²13 x 13 mm²2 g
8.5 mm0.5 mm0.56 mm0.32 mm1.6 x 0.8 mm²32 x 32 mm²5 g
8.5 mm 0.4 mm0.2 mm0.11 mm0.6 x 0.3 mm13 x 13 mm²5 g
able force
2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N
es 9 xx 9 xx 8 xx, 9 xx 8 xx, 9 xx
cy ± 60 µm/4 σ ± 55 µm/4 σ ± 60 µm/4 σ ± 55 µm/4 σcuracy ± 0.7°/4 σ ± 0.7°/4 σ ± 0.3°/4 σ ± 0.3°/4 σ
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orks
Placement headsTwinHead for high-precision IC placement
Innovation
• The TwinHead places two components at the same time using the Pick & Place method→ Increased speed when placing large components→ Greater flexibility due to broader range of compo-nents
Description
This sophisticated placement head consists of two place-ment heads of the same type coupled together (twin head). Both heads work using the Pick&Place princi-ple. The TwinHead is suitable for processing particularly difficult or large compo-nents. Two components are picked up by the placement head, optically centered on the way to the placement position and rotated into the necessary placement angle. The components are then
placed gently and accurately on the board.
In addition to the vacuum nozzles specially developed for the TwinHead, the place-ment head can also use the nozzles for the Pick&Place head. Collect &Place head nozzles can also be used.
Checking and self-learning functions
The TwinHead's reliability can be further increased with various checking and self-learning functions.
• For example, vacuum checks at the nozzles indi-cate whether the compo-nent was picked up or set down correctly.
• High-resolution, intelli-gent vision modules, such as the fine-pitch and flip-chip vision modules, iden-
tify and correct minute deviations from the desired component posi-tion, thus guaranteeing a correct placement posi-tion. The vision modules are permanently fixed to the machine frame.
• The component package form is also checked, and the component is not placed if the geometric data thus determined dif-fers from the programmed data.
• A force sensor measures and monitors the specified component placement forces.
Z axis
DP axis
Nozzle
How the TwinHead w
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Placement headsTwinHead for high-precision IC placementTechnical Data
*) A special nozzle is needed for forces < 1 N
Optical centering with Fine-pitch vision module Flip-chip vision module
Component range 0603 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips
0201 to SO, QFP, sockets, plugs, BGA, special compo-nents, bare dies, flip-chips, shields
Component specifications
max. height
min. lead pitchmin. bump pitchmin. ball bump ∅min. dimensionsmax. dimensions
max. weight
25 mm (larger heights on request)0.4 mm0.56 mm0.32 mm1.6 x 0.8 mm²50 x 40 mm²(single measurement)For use with two nozzles50 x 50 mm² or69 x 10 mm² For use with one nozzle:85 x 85 mm² or125 x 10 mm² max. 200 x 125 mm² (with restrictions)100 g
25 mm (larger heights on request)0.25 mm0.14 mm0.08 mm0.6 x 0.3 mm²8 x 8 mm²(single measurement)
100 g
Programmable placement force
0.5 N - 15 N* 0.5 N - 15 N*
Nozzle types 5 xx (standard)4 xx + adapter8 xx + adapter9 xx + adapter
5 xx (standard)4 xx + adapter8 xx + adapter9 xx + adapter
Nozzle spacing on the two Pick&Place heads
70.8 mm 70.8 mm
X/Y accuracy ± 35 µm/4 σ ± 30 µm/4 σAngular accuracy 0.07° / 4 σ 0.07° / 4 σ
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Placement headsNozzle Changers (Collect & Place Heads)
Innovation
• Nozzle changers increase the flexibility of placement heads when processing different components→ nozzle configuration can be quickly modified for new placement jobs→ accurate nozzle seat minimizes radial eccen-tricity→ defective nozzles are quickly replaced
Description
Up to 6 nozzle changers can be installed for the 6-seg-ment or 12-segment Collect & Place heads (C&P6 or C&P12):
Location 1: 2 nozzle changers (NC 6 or NC 12)
Location 2: 1 nozzle changer (NC 6 or NC 12)
Location 3: 2 nozzle changers (NC 6 or NC 12)
Location 4: 1 nozzle changer (NC 6 or NC 12)
Magazine for 12 type 9xx nozzles
Magazine for 6 type 9xx nozzles
Magazine for 6 type 8xx nozzles
Nozzle changer for the 12-segment Collect&Place head (NC12)
Nozzle changer for the 6-segment Collect&Place head (NC6)
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Placement headsNozzle changers (TwinHead)
The nozzle changer (NCTH) for the TwinHead (TH) can be installed at location 1 and location 3. The supporting plate can hold up to 12 mag-azines for standard or special nozzles.
Position of the nozzle changers
Magazine for 2 standard nozzles
Magazine for 1 special nozzle,gripper
TH
NC12 / NC12 orNC6 / NC6
NC6/NC12
NCTH
C&P12/C&P6
PCB
PCB
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Placement headsNozzle changersTechnical Data
Nozzle changers for the 12-segment Collect&Place head
Dimensions (length x width x height) 449 x 62.7 x 77.7 mm³
Number of magazines min. 1 / max. 5, each with 12 nozzle holders
Number of nozzle holders min. 12 / max. 60
Nozzle types 9 xx
Nozzle change time < 200 ms per nozzle
Compressed air connection 0.48 MPa (4.8 bar)
Nozzle changers for the 6-segment Collect&Place head
Dimensions (length x width x height) 448 x 122.5 x 97.7 mm³
Number of magazines min. 1 / max. 6, each with 6 nozzle holders
Number of nozzle holders min. 6 / max. 36
Nozzle types 8 xx, 9 xx
Nozzle change time < 200 ms per nozzle
Compressed air connection 0.48 MPa (4.8 bar)
Nozzle changers for the SIPLACE TwinHead
Dimensions (length x width x height) 448 x 68.5 x 49 mm³
Number of magazines min. 4 / max. 12
Number of nozzle holders min. 7 / max. 20
Nozzle types 4 xx with adapter5 xx (standard)9 xx with adapterSpecial nozzle, gripper
Nozzle change time < 2 s per nozzle
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nt area 2
Placement area 1
Placeme
Output conveyor
Intermediate conveyor
Input conveyor
PCB ConveyorSingle conveyor
Innovation
• The PCB is clamped from below for placement → distance between the PCB and placement head is always constant→ placement rate does not depend on the PCB thickness→ fiducial contours are always sharply displayed → improved PCB fiducial centering
• The width adjustment unit has a dedicated control circuit→ independent of other machine components → faster and easier to adjust
Description
For placement, the PCB is clamped from below. The dis-tance between the top of the PCB and the placement head thus remains unchanged for each PCB, and is no longer dependent on the thickness of the PCB. The placement rate is thus also independent of the PCB thickness.
Since the distance between the PCB surface and the PCB camera remains the same, the PCB camera is always focussed on the PCB surface with the same level of sharp-ness.
The PCB fiducial contours are optimally mapped on the CCD chip of the PCB camera.
The inline PCB conveyor system quickly adapts to a wide range of PCB widths. The setting is made using the placement program or via the station software menu. The width of the PCB con-veyor is monitored by an integral control circuit.
The transport height can be modified, thus allowing the machines to be integrated into lines with a transport height of 830, 900, 930 or 950 mm.
The PCB conveyors can com-municate with the individual machines via the SMEMA interface.
The fixed transport side can be located on the left or right for both the dual conveyor and the single conveyor. With this conveyor, the fixed side can be easily switched from right to left or vice versa.
Movement and clamping of the PCBs are monitored and controlled by sensors. When the board has reached the placement area and passed the light barrier, it is braked. A laser light barrier deter-mines the position of the board. As soon as the circuit board has reached its target position, the conveyor belt is stopped and the board is clamped from the underside. The placement process then starts immediately.
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PCB conveyorSingle conveyorTechnical Data
Fixed conveyor side Right or left
PCB formatStandard (length x width)"Long board" option
50 x 50 mm² to 450 x 508 mm²50 x 80 mm² to 610 x 508 mm²
PCB thicknessStandard 0.3 mm to 4.5 mm (± 0,2 mm)
(thicker PCBs on request)
Max. PCB warpage Up: 6 mm - PCB thicknessDown: 0.3 mm + PCB thickness
PCB weight max. 3 kg
Clearance on PCB undersideStandardOption
25 mm ± 0.2 mmmax. 40 mm ± 0.2 mm
Component-free PCB handling edge 3 mm
PCB changeover time < 2.5 s
PCB positioning accuracy ± 0.5 mm
PCB transport height 830mm ± 15mm (standard)900mm ± 15mm (optional)930mm ± 15mm (optional)950mm ± 15mm (SMEMA: optional)
Type of interface SMEMA / SIEMENS
Ink spot recognition possible
Automatic width adjustment possible
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onveyor mode
Asynchronous conveyor mode
Synchronous c
PCB conveyorDual conveyor
Innovation
• As for single conveyor
Plus:
• The dual conveyor can be configured online to create a single conveyor → no mechanical conversion work required
• Reduced down times → increased production throughput
Description
The PCB dual conveyor can greatly increase throughput with shorter down times - depending on the placement program. It allows two PCBs to be carried simultaneously (synchronously) or alter-nately (asynchronously) through the placement machine.
In asynchronous mode, only one PCB in a transport track is processed. At the same time, another PCB in the second transport track is moved into the placement position. This saves the full conveying time of one PCB, thus considerably increasing performance, par-ticularly for PCBs with a short cycle time. The placement process starts as soon as one PCB is transported into the processing area.
In synchronous mode, two PCBs are moved into the placement position at the same time. They are pro-cessed as a common panel.
In this way, the top and bottom of a PCB can be pro-cessed on a single line, The proportion of non-productive time is reduced as two circuit boards are always conveyed simultaneously.
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PCB conveyorDual conveyorTechnical Data
Fixed conveyor side Right or left
PCB formatStandard (length x width)"Long board" option
Dual conveyor in "single conveyor" modeStandard"Long board" option
50 x 50 mm² to 450 x 250 mm²50 x 80 mm² to 610 x 250 mm²
50 x 50 mm² to 450 x 450 mm²50 x 80 mm² to 610 x 450 mm²
PCB thicknessStandard 0.3 mm to 4.5 mm (± 0,2 mm)
(thicker PCBs on request)
Max. PCB warpage Up: 6 mm - PCB thicknessDown: 0.3 mm + PCB thickness
PCB weight max. 3 kg
Clearance on PCB undersideStandardOption
25 mm ± 0.2 mmmax. 40 mm ± 0.2 mm
PCB transport height 830mm ± 15mm (standard)900mm ± 15mm (optional)930mm ± 15mm (optional)950mm ± 15mm (SMEMA: optional)
Type of interface SMEMA / SIEMENS
Component-free PCB handling edge 3 mm
PCB changeover time < 2.5 s
PCB positioning accuracy ± 0.5 mm
Conveyor mode synchronous or asynchronous
Components on each conveyor same or different
PCB width on each conveyor same or different
Ink spot recognition synchronous: not possible, asynchronous: possible
Automatic width adjustment synchronous: not possible, asynchronous: possible
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PCB conveyorPCB Barcode for Product-Controlled Pro-duction (Option)
Label dimensions Stroke width (W): 0.19 < W ≤ 0.3 mm (corresponds to high and medium density), stroke length: ≥ 4 mm, length of the barcode template window: ≤ 90 mm
Recommended label colors
Coding: black, dark green, dark blue, background: white, beige, yellow, orange (contrast ratio > 70% to DIN 66236
Code types Code 39, Code 128 / EAN 128, Codabar, 2/5 IATA 2/5 industrial, 2/5 inter-leaved, UPC, EAN, Pharma Code, EAN Addendum (others available upon request), max. 25 digits, a barcode filter may be defined
Laser scanner safety
Laser diode 670 nm (red) / 1.2 mWLaser protection class 2, degree of protection IP65
PCB barcode reader Q [mm]2D on top 3901D on top 390
2D on bottom 4301D on bottom 430
PCB barcode reader L [mm]1D on top 320 - 350
1D on bottom 380 - 410
PCB barcode reader PCB overshoot [mm]2D on bottom (dual conveyor) 17
PCB barcode reader LQ [mm] RQ [mm]2D on top 3 31D on top 3 3
2D on bottom 5 51D on bottom 5 5
PCB dimensions/conveyor LO [mm] RO [mm]460 mm SC 3 20508 mm SC 3 44
216 mm DC1 3 24250 mm DC1, 450 mm SM1 3 58
216 mm DC2 3 3250 mm DC2, 450 mm SM2 3 3
PCB dimensions/conveyor LU [mm] RU [mm]460 mm SC 20 3508 mm SC 44 3
216 mm DC1 3 3250 mm DC1, 450 mm SM1 3 3
216 mm DC2 24 3250 mm DC2, 450 mm SM2 58 3
SC - Single conveyor, DC1/2 - Dual conveyor, track 1/2, SM1/2 - Dual conveyor in Single conveyor mode, track 1/2
Downstreammachine
PCB barcode scanner 1D on top
PCB barcode scanner 1D bottom
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Component FeedingComponent Changeover Table
Innovation
• Automatic coupling and uncoupling
• Combined interface for both electrical and pneu-matic connections → Cables no longer have to be connected and discon-nected manually
• Precise alignment → particularly important for small components
• Easy to convert for other PCB transport heights
• Tape reel diameter from 7“ up to 19“ → high flexibility
Description
Up to four component changeover tables may be coupled to the machine. Optionally, a matrix tray changer may be installed at locations 2 or 4.
The component changeover tables are stand-alone mod-ules that can be set up at an external set-up area with feeders. In this way, changes only interrupt the production process for a short time. The chassis runs smoothly and is easy to maneuver. There are pockets for holding set-up list print-outs on both sides of the component changeover table. The operator has un-hindered access to the docu-ments, even during production.
The component feeder table has a capacity of up to 15 locations for 30 mm wide feeders. The total capacity with four component changeover tables is thus 180 x 8 mm tracks.
Bulk case feeders and vibra-tory stick feeders may be set
up in addition to the tape feeders. Dummy feeders are used at unassigned locations to protect the operators.
The communication unit sends the necessary voltages and control signals to the feeders.
The component feeders are at rest during the placement process, which means that components can be refilled (in sticks, for example) and tapes may be spliced without stopping the machine.
An optional component bar-code reader can be used to scan and check the barcodes on the tape reels, thus guar-anteeing that the compo-nents are allocated to the correct tracks.
Location 2
Location 3
Location 4
Location 1
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Component feedingComponent Changeover TableTechnical Data
Length x width 633 x 592 mm²
Height 859 mm for 830 mm PCB transport height929 mm for 900 mm PCB transport height959 mm for 930 mm PCB transport height979 mm for 950 mm PCB transport height
PCB transport height 830 mm ± 15 mm (standard)900 mm ± 15 mm (SMEMA)930 mm ± 15 mm (SMEMA)950 mm ± 15 mm (SMEMA)
Weightwithout feederwith feeders at every locationwith compressed air supply for bulk case feeder and adapter for the 3rd tape reel
approx. 105 kgapprox. 145 kg
approx. 170 kg
Reel diameterstandardmaximum
up to 432 mm (17“)483 mm (19“)
Feeder locations max. 15
Changeover time less than 1 min.
Pocket forset-up listprint-outs
Component feeder table
Centering
Communication unit
Waste containerfor pieces of used tape
Tape container
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Component feedingTape Feeders
Technical data
a) Fiducial for feeder position recogni-tion;
b) for 0201 and 0402 only;
c) variable in 4 mm increments.
Description
Only 9 different feeder sizes are needed to feed tapes from 8 mm to 88 mm. Reels are kept in the tape container on the component change-over table. A cutting device
automatically cuts the used tape. SIPLACE feeders have short cycle times and high-precision pick-up positions. Even multiple products and small batch sizes are easy to handle since the feeders can be quickly changed over:
Packaging Model Loca-tions
Transport distance
Max. CO height
Paper and blister tapes
2 x 8 mm S a)
3 x 8 mm S3 x 8 mm S b)
12/16 mm S
1111
2/4 mm2/4 mm2/4 mm4/16 mm c)
2.5 mm2.5 mm0.7 mm14 mm
Blister tapes 24/32 mm S1 x 44 mm S1 x 56 mm S1 x 72 mm S1 x 88 mm S
1.52.02.533.5
4/40 mm c)
4/52 mm c)
4/68 mm c)
4/80 mm c)
4/88 mm c)
Tape reels 178 - 483 mm diameter (7" - 19")
Feeder cycle S feeder up to 20 mm transport distance < 150 ms
Both the tape cycle incre-ment and the use of tape materials are variable. SIPLACE feeders are suitable for both paper and plastic tapes. This represents a sig-nificant benefit in terms of both cost and logistics. A signal from the communi-cation unit enables the feed-ers to automatically control the entire feeder sequence, including automatic strip take-up.
The S feeders have shorter cycle times and can process tapes with a pocket pitch of 2 mm (8 mm S). The 8 mm S and 12/16 mm S also have a component cover.
The feeders can also be used in other SIPLACE placement machines.
2 x 8 mm S
3 x 8 mm S
3 x 8 mm S 0201
12/16 mm S
24/32 mm S
44 mm S
56 mm S
72 mm S
88 mm S
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Component feedingBulk case feeder
Technical data
a) Fiducial for feeder position recognition
Bulk case feeder a)
Packaging form Bulk case
Feeder rails Chip 0402, CO height: 0.35 mmChip 0402, CO height: 0.50 mmChip 0603, CO height: 0.45 mmChip 0603, CO height: 0.80 mmChip 0805, CO height: 0.45 mmChip 0805, CO height: 0.60 mmChip 0805, CO height: 0.85 mmChip 0805, CO height: 1.25 mmMicro-Melf: 1.05 ± 0.05 mmMini-Melf: 1.4 ± 0.1 mm
Location 1 location for 2 different component types
Vibratory stick feeder, type 3
with control circuit
Number of tracks and width
3 x 9.5 mm2 x 15 mm1 x > 15 mm1 x 30 mm
Location 1 location
Description
The SIPLACE bulk case feeder processes bulk cases on two tracks. It feeds rectangular and round, passive compo-nents. The PCB magazines (bulk cases) are simply replaced for refilling - with-out stopping the machine.
The module essentially con-sists of the basic element plus two feeder rails and PCB mag-azines to suit the component type and height. The compo-nents are separated and fed along the rails by compressed air.
The principle of the fixed component pocket has proven most suitable, even when using bulk cases: the vibrations that occur with other placement machine concepts can greatly impair the component quality due to friction, for example.
The stationary component feeder also has significant advantages with stick maga-zines: the universal vibratory stick feeder can be refilled during placement.
Bulk case feeder
Vibratory -stick feeder, type 3
27
Component feedingDummy Feeders
Danger
To ensure that your SIPLACE placement machine runs safely, a feeder must be assigned to every location on the component changeover table. If you do not have enough feeders, then you should use dummy feeders as space holders.
The following dummy feeders may be used:
SIPLACE dummy feeder for 1 locationSIPLACE dummy feeder for 6 - 10 locationsSIPLACE dummy feeder for 11 - 20 locations
Dummy feeder for 1 location
Dummy feeder for 6 - 10 locations
Dummy feeder for 11 - 20 locations
28
Component feedingManual Trays
Manual tray
Component feeder table
Waffle tray
Description
The manual tray is a device for holding JEDEC trays used to supply components. The waffle trays are changed manually. The manual tray is placed on the component feeder table just like a feeder. There are two different ver-sions of the waffle tray: one fills 5 locations, while the other takes up 9 locations on the component feeder table.
On the SIPLACE HF, the man-ual tray is used at location 2 or location 4. This option is recommended if there are only a few types of compo-nent to be placed from a tray.
Technical data
Manual tray - possible positions
Sizes 136 x 360 mm²; requires 5 locations260 x 360 mm²; requires 9 locations
Max. tray height
12.5 mm, including component
Parts Waffle tray carrierTray holder
JEDEC waffle tray
Directly in the waffle tray carrier136 mm wide
29
Tray supply 2
Component feedingMatrix Tray Changer
Innovation
• Two mutually-indepen-dent magazine towers → optional, programmable access to all waffle trays
• Capacity of up to 100 JEDEC trays → production is not interrupted when the tray is changed
• Integral chassis → easy to couple
• PCB transport height can be changed with just a few easy actions
Description
If components are supplied to the placement process in several waffle trays, we recommend an automatic magazine change using a matrix tray changer (MTC). The MTC set-up is precisely matched to the placement sequence in order to opti-mize the timings and dis-tances traveled. Two towers with waffle trays move inde-pendently of one another in the vertical direction until the desired magazine is within range of the feed axis. The horizontal feed axis trans-
ports the waffle-pack tray from the tower into the access area of the placement head. The first magazine is made available as soon as a PCB moves onto the PCB con-veyor, and valid panel and set-up data is available. All other magazine changes are carried out time-neutrally during the placement pro-cess. The magazines can be refilled without stopping the machine. Defective compo-nents are returned to the original tray.
Tray supply 1
Feed axis 1
Feed axis 2
30
Component feedingMatrix Tray ChangerTechnical Data
*) Waffle tray carrier
Tray supply 1 (XL) Tray supply 2
Dimensionslength x widthheight
1305 x 600 mm²1490 mm for 830 mm PCB transport height1560 mm for 900 mm PCB transport height1590 mm for 930 mm PCB transport height1640 mm for 950 mm PCB transport height
Weight (basic equipment) approx. 500 kg (with PCB magazines and waffle tray carriers)
Weight (fully equipped) approx. 534 kg (with components)
Weight (moving mass) approx. 80 kg approx. 43.5 kg
PCB magazine size (L x W x H) 391.2 x 305.6 x 93.3 mm³ 352.7 x 154.8 x 133.8 mm³
PCB magazine weight(fully equipped)(without waffle tray carrier)
approx. 11 kgapprox. 1.7 kg
approx. 7.5 kgapprox. 1.35 kg
Weight of thewaffle tray carrier
850 g 150 g
Dimensions of the waffle tray carrier (L x W x H) 386.5 x 295.8 x 11.1 mm³ 371 x 146 x 10.1 mm³
Distance from PCB mag. to mag. 96 mm 135 mm
Distance from level to level 12 mm 11.8 mm
Vertical travel 444 mm (1st to 30th WTC*) 511.2 mm (1st to 40th WTC*)
Horizontal travel between out-going and pick-up position approx. 647 mm approx. 638 mm
Storage capacity 30 XL waffle-pack tray carriers with 60 JEDEC or 30 special magazines of
maximum size
40 waffle tray carriers with40 JEDEC waffle trays
Changeover time (over 5 levels) approx. 2 sec approx. 1.5 sec
Max. height of component and waffle tray, including tolerances
all levels filledone level freetwo levels free
8.5 mm19.5 mm31.5 mm
8.5 mm19.5 mm
-
Max. floor loading (fully equipped)
per footper roller
6.93 kg/cm²356 kg/cm²
31
Component feedingMatrix Tray ChangerTechnical Data
Electrical ratings
Noise emissions
Permitted environmental factors
Supply voltage 3 x 400 VAC, 50 Hz (Europe)3 x 208 VAC, 60 Hz (USA)
Total power 1.5 kW
Rated current 2.7 A at 3 x 400 VAC4.2 A at 3 x 208 VAC
Fuses 3 x 16 A
Rated power consumption of the largest consumer 2 A
Maximum noise emissions 74 dB (A)
Room temperature between 15 °C and 35 °C
Atmospheric humidity30 - 75 %(No higher than 45% on average to prevent any possibility of condensation on the machine)
32
Technical DataConnections
Electrical ratings
Compressed air specifica- tion
* Collect & Place head
** TwinHead
Supply voltage 3 x 208 VAC ± 5 %; 50/60 Hz (for the U.S.A. version)3 x 230 VAC ± 5 %; 50/60 Hz3 x 380 VAC ± 5 %; 50/60 Hz3 x 400 VAC ± 5 %; 50/60 Hz (Europe)3 x 415 VAC ± 5 %; 50/60 Hz
Fuses 3 x 32 A (3 x 208 VAC / 3 x 230 VAC)3 x 16 A (3 x 380 VAC / 3 x 400 VAC / 3 x 415 VAC)
Total connected load 11.1 kVA
Total power 6.5 kW
Rated power consumption of the larg-est consumer
8.4 A
Power failure max. 20 msec
pmin 0.5 MPa = 5.0 bar
pmax 1.0 MPa = 10 bar
Connection 3/4"
Compressed air consumption350 st. l/min (C&P*/ TH**), 450 st. l/min (2 x C&P*),300 st. l/min (2 x TH**)
Particle size 0.1 µm
Particle density 0.1 mg/m³
Maximum oil content (class 1) Particle density 0.01 mg/m³
Pressure dewpoint (class 4) Dewpoint + 3°
33
Technical DataConnections
Compressed air connectionSMEMA interface
PC an
d LAN
conn
ection
Power connector 5 x 6 mm² cable with CEKON plug 5 x 32 A
34
Technical DataDimensions and set-up conditions
Lengthwith both extension kitswith one extension kitwith no extension kits
2380 mm2103 mm1826 mm
Width of basic machinewith monitorwith tilted, fold-down keyboard
2515 mm2614 mmplus 132 mm for each keyboard
Weight of basic machineWeight, machine fully equipped
3800 kg4700 kg
Footprint 6.01 m²
Specific floor loading with 6 machine feet3 machine feet
75.3 N/cm² 150.6 N/cm²
Load per unit area of the foundation min. 1561 kg/m²
Height of the machine with main fault indicator for PCB transport height of:
830 mm900 mm930 mm950 mm
up to 1955 mmup to 2025 mmup to 2055 mmup to 2075 mm
Machine ground clearance for PCB transport height of:
830 mm900 mm930 mm950 mm
120 mm190 mm220 mm240 mm
Maximum noise emissions 74 dB (A)
Room temperature between 15 °C and 35 °C
Atmospheric humidity30 to 75 % (no higher than 45% on average to prevent any possibility of condensation on the machine)
35
Technical DataDimensions and set-up conditionsPlacement system’s center of gravity
36
Technical DataManeuvering radiiMTC dimensions and set-up conditions
37
ent point fork-lift
Engagement point for the fork-lift
Engagemfor the
Technical DataTransport and Delivery Configuration
Transport dimensions and weight
Means of transport
A fork-lift truck with the following specification will be needed to carry the machine in its crate:
Machine weight and floor loading
Vibration limits
LengthWidthHeight
2404 mm2790 mm1600 mm
Weight 4287 kg (ready for dispatch)
Fork lengthLifting powerClear fork width
min. 1800 mmmin. 6000 kgmin. 350 mm
Weight of basic machineWeight (fully equipped)
3800 kg4700 kg
Footprint 6.01 m²
Number of machine feet 6
Load per unit area of the foundation min. 1561 kg/m²
Specific floor loading per footfor 6 machine feetfor 3 machine feet
75.3 N/cm²150.6 N/cm²
Third-octave spectral value of the vibration speed 5 - 100 Hz v < 250 µm/s
vmax value on the time curve vmax < 1.5 mm/s
Description
The placement machine is supplied in a wooden crate, mounted on a stable wooden pallet.
Configuration when delivered
• The extension kit on the PCB input side and the computer unit are discon-nected from the basic machine.
• All electrical cables to the basic machine are discon-nected.
• Each track on the single or dual conveyor is set to a width of 136 mm.
• The input conveyors of the single and dual conveyor are dismantled. The electri-cal cables to the conveyor motors and light barriers are disconnected.
• Both keyboards are folded down vertically.
• The main fault indicator is dismantled.
38
Fin
F
ent changeover h 15 locations
Sample Configuration
Services
As a service, SIEMENS L&A can fully integrate the SIPLACE HF placement machine into your produc-tion line. With our extensive expertise and by using the right tools and equipment, we can ensure that the instal-
lation process runs smoothly and efficiently. However, this will require you to clarify the infrastructure aspects in advance and make any necessary changes at your production facility.
Safety instructions
Read the operating instruc-tions before starting to set up and commission the place-ment machine. The appli-cable accident prevention regulations concerning the transportation of heavy goods must be followed.
PCB transport direction
Nozzle changer C&P12
e pitch vision module
Nozzle changer C&P12
lip chip vision module
TH
C&P12Compontable wit
Component reject bin TH
Nozzle changer TH
5-part conveyor beltwith automatic width adjustment
from 50 mm to 508 mm (2“ to 20“)
39
The information in this brochure is merely a general description and lists performance features that will not necessarily be present as described in the specific application, or that may be modified if the product is further developed. The desired performance features are only binding if expressly agreed when the contract is concluded.
Edition 3 0504-HF-eOrder no. A10002-P141-T1-X-7600
We reserve the right to make changes.Printed in Germany
Siemens AGInternet: http://www.siplace.com
Siemens AGLogistics and Assembly SystemsElectronics Assembly Systems Rupert-Mayer-Str. 44D-81359 MunichTel: +49 - 89 - 208 00 - 278 19Fax: +49 - 89 - 208 00 - 366 92E-mail: [email protected]
Siemens Pte. Ltd.Logistics and Assembly SystemsElectronics Assembly SystemsThe Siemens Centre, 60 MacPherson RoadSingapore 348615Tel: +65 - 64 90 - 60 00Fax: +65 - 64 90 - 84 59e-mail: [email protected]
Siemens DematicElectronics Assembly Systems Inc.3140 Northwoods Parkway, Suite 300Norcross, GA 30071, USATel: +1 - 888 - SIPLACEFax: +1 - 770 - 797 - 30 94E-mail: [email protected]
Siemens Dematic China Ltd.Electronics Assembly Systems 20F Majesty Building, No. 138 Pu Dong Avenue, ShanghaiP. R. China, 200120Tel: +86 - 21 - 58 87 - 30 30Fax: +86 - 21 - 58 87 - 61 00e-mail: [email protected]
