SPECIFICATION - TRULY AMERICA · 32 48 mA IDD-IO 78 100 mA IDD-A active (operating) current with external DVDD 2592 x 1944 @ 15 fps 32 48 mA IDD-IO 1.8 2.4 mA IDD-D 72 94 mA IDD-A

CAMERA MODULE CM9067-B500BF-E Version :1.2 Dec 13, 2013

TRULY OPTO-ELECTRONICS LTD. P.1

SPECIFICATIONRevision: 1.2

CM9067-B500BF-E

TRULY OPTO-ELECTRONICS LTD.: CUSTOMER:

PRODUCT : CAMERA MODULE

MODEL NO. : CM9067-B500BF-E

SUPPLIER : TRULY OPTO-ELECTRONICS LTD.

DATE : Dec 13, 2013

Approved by:

Quality Assurance Department:

Technical Department:

Approved by:

If there is no special request from customer, TRULY OPTO-ELECTRONICS LTD. will notreserve the tooling of the product under the following conditions:1. There is no response from customer in two years after TRULY OPTO-ELECTRONICS LTD.submit the samples;2. There is no order in two years after the latest mass production.And correlated data (include quality record) will be reserved one year more after tooling wasdiscarded.



REVISION RECORD

REV NO. REV DATE CONTENTS REMARKS

1.0 2013-07-25 First release Preliminary

1.1 2013-09-24 Add sensor bonding picture P.15

1.2 2013-12-13 Update version Full



CONTENTS

KEY INFORMATION

PIN ASSIGNMENT

ELECTRICAL CHARACTERISTICS

MECHANICAL DRAWING

COMPONENT PART LIST

LENS DRAWING

SCHEMATIC

PCB LAYOUT

SENSOR BONDING PICTURE

APPEARANCE SPECIFICATION

IMAGE SPECIFICATION

PRECAUTIONS FOR USING CCM MODULES

PACKAGE SPECIFICATION

PRIOR CONSULT MATTER

FACTORY CONTACT INFORMATION

WRITTEN BY CHECKED BY APPROVED BY

LIN XU DONG LIANG XIAO LONG LIU TIE NAN



Key Information

Module No. CM9067-B500BF-EModule Size 7.00mm × 7.00mm × 4.35mmSensor Type OV5648Array Size 2592 × 1944

Power SupplyAnalog 2.6~3.0V (2.8V typical)I/O 1.7~3.0V

Lens Size and Structure 1/4 inch 5PlasticLens F.NO 2±5%Lens View Angle 80°IR Cutter 648nmObject Distance 33-69cmInput Clock Frequency 6~27MHz

Temperature RangeOperating -20°C to 70°CStable image 0°C to 50°C

Output Formats 8-/10-bit RGB RAW outputOTP Contents ID and AWBMaximum ImageTransfer Rate

QSXGA 15fpsVGA 90fps

Pixel Size 1.4µm × 1.4µmSensitivity 690mV/Lux-secMax S/N Ratio 36dBDynamic Range 72dB@8x gainSensor PowerRequirement(Typ)

Active 219 mWStandby 36µW

IC Package COBSubstrate R-FPCPackage Antistatic Plastic



Electrical Characteristics

1. Absolute Maximum Ratings

2. DC Characteristics

parameter absolute maximum ratinga

a. exceeding the absolute maximum ratings shown above invalidates all AC and DC electrical specifications and may result in permanent damage to the device. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

supply voltage (with respect to ground)

VDD-A 4.5V

VDD-D 3V

VDD-IO 4.5V

electro-static discharge (ESD)human body model 2000V

machine model 200V

all input/output voltages (with respect to ground) -0.3V to VDD-IO + 1V

I/O current on any input or output pin ±200 mA

symbol parameter min typ max unit

supply

VDD-A supply voltage (analog) 2.6 2.8 3.0 V

VDD-IO supply voltage (digital I/O) 1.7 1.8 3.0 V

VDD-D supply voltage (digital core)a 1.425 1.5 1.575 V

typical power conditions: AVDD = 2.8V, DOVDD = 1.8V, and DVDD = 1.5V

IDD-A active (operating) currentwith internal DVDD2592 x 1944 @ 15 fps

32 48 mA

IDD-IO 78 100 mA

IDD-Aactive (operating) currentwith external DVDD2592 x 1944 @ 15 fps

32 48 mA

IDD-IO 1.8 2.4 mA

IDD-D 72 94 mA

IDD-A active (operating) currentwith internal DVDD720p @ 60 fps

34 48 mA

IDD-IO 70 91 mA

IDD-Aactive (operating) currentwith external DVDD720p @ 60 fps

34 45 mA

IDD-IO 1.8 2.4 mA

IDD-D 65 85 mA



3. AC Characteristics (TA=25℃, VDD-A=2.8V)

4. Format and frame rate

digital inputs (typical conditions: AVDD = 2.8V, DVDD = 1.5V, DOVDD = 1.8V)

VIL input voltage LOW 0.54 V

VIH input voltage HIGH 1.26 V

CIN input capacitor 10 pF

digital outputs (standard loading 25 pF)

VOHd output voltage HIGH 1.62 V

VOLd output voltage LOW 0.18 V

serial interface inputs

VILd SIOC and SIOD -0.5 0 0.54 V

VIHd SIOC and SIOD 1.26 1.8 2.3 V

a. when internal regulator is bypassed

b. external clock is stopped during measurement

c. standby current is based on room temperature

d. based on DOVDD = 1.8V

standby current

IDDS-SCCBb

standby currentc20 70 µA

IDDS-PWDN 20 70 µA

symbol parameter min typ max unit

oscillator and clock input

fOSC frequency (XVCLK) 6 24 27 MHz

tr, tf clock input rise/fall time 5 (10a)

a. if using the internal PLL

ns

format resolution frame rate methodology pixel clock

5 Mpixel 2592x1944 15 fps full resolution 84 MHz

1080p 1920x1080 30 fps cropping 84 MHz

quarter 5Mp 1296x972 45 fps cropping, subsampling/binning 84 MHz

720p 1280x720 60 fps cropping, subsampling/binning 84 MHz

VGA 640x480 90 fps cropping, subsampling/binning 84 MHz



5. Power up sequence

Power up with internal DVDD

Based on the system power configuration (1.8V or 2.8V for I/O power), using external DVDD or internal DVDD, the power up sequence will differ. If 1.8V is used for I/O power, using the internal DVDD is preferred. If 2.8V is used for I/O power, due to the high voltage drop of the internal DVDD regulator, there is a potential heat issue. Hence, for a 2.8V power system, OmniVision recommends using an external DVDD source. Due to the higher power-down current when using an external DVDD source, OmniVision strongly recommends cutting off all power supplies, including the external DVDD, when the sensor is not in use.

For powering up with the internal DVDD and SCCB access during the power ON period, the following conditions must occur:

1. when DOVDD and AVDD are turned ON, make sure DOVDD becomes stable before AVDD becomes stable

2. PWDNB is active low with an asynchronized design (does not need clock)

3. PWDNB must be low during the power up period

4. for PWDNB to go high, power must first become stable (AVDD to PWDNB ≥ 5 ms)

5. RESETB is active low with an asynchronized design

6. state of RESETB does not matter during power up period once DOVDD is stable

7. master clock XVCLK should be provided at least 1 ms before the host accesses the sensor’s registers

8. host can access SCCB bus (if shared) during entire period. 20 ms after PWDNB goes high or 20 ms after RESETB goes high if reset is inserted after PWDNB goes high, the host can access the sensor’s registers to initialize the sensor

power up timing with internal DVDD

DOVDD

AVDD

SCCB activity is okay during entire period

power down

DOVDD first, then AVDD, and rising time is less than 5 ms

PWDNB

SCCB

note T0 ≥ 0 ms: delay from DOVDD stable to AVDD stableT2 ≥ 5 ms: delay from AVDD stable to sensor power up stable

T0

T2

power on period



6. Reset

7. Hardware and software standby

Two reset modes are available for the OV5648:

• hardware reset• SCCB software reset

The OV5648 sensor includes a RESETB pad that forces a complete hardware reset when it is pulled low (GND). The OV5648 clears all registers and resets them to their default values when a hardware reset occurs. A reset can also be initiated through the SCCB interface by setting register 0x0103[0]to high.

The whole chip will be reset during power up. Manually applying a hard reset upon power up is recommended even though the on-chip power up reset is included. The hard reset is active low with an asynchronized design. The reset pulse width should be greater than or equal to 1 ms.

Two suspend modes are available for the OV5648:

• hardware standby• software standby

To initiate hardware standby mode, the PWDNB pad must be tied to low while in MIPI mode. Set register 0x3018[4:3] to 2’b11 before the PWDNB pin is set to low. When this occurs, the OV5648 internal device clock is halted and all internal counters are reset and registers are maintained.

Executing a software standby (0x0100[0]) through the SCCB interface suspends internal circuit activity but does not halt the device clock. All register content is maintained in both modes.

8. One time programmable memory (OTP)

The OV5648 supports 256 bits of one-time programmable (OTP) memory. It can be controlled through the SCCB.The concrete contents of OTP include ID and AWB.

For the detail procedure of load OTP, please contact our FAE for more assistance.

Note: For more information of sensor please refer to the OV5648 specification.



Mechanical Drawing



Component Part List

No. Items Supplier Specification Qty Remarks

1 FPC MUTUALTEK 9067R-A1-E(4layers) 1pcs

2 SENSOR OVT OV5648 1pcs

3 LENS LARGAN 50019A1 1pcs

4 HOLDER HUAYE 50019A-HOLDER 1pcs

5 CONNECTOR JAE WP7-P024VA1 1pcs

6 IR CRYSTAL BG58582-648N6-CR-B 1pcs

7 CAPACITOR MURATA/TAIYO 0201-0.1UF/10V+/-10%-X5R 4pcs

8 CAPACITOR TDK/MURATA 0201-1UF/6.3V+/-20%-X5R 3pcs



Lens Drawing



Schematic



PCB Layout



Sensor bonding picture



Appearance Specification

NO. Item StandardImportance

Class

1 Top side of Lens

1.No obvious impurity and No feeling nickdefect and oil impurity on the surface of lenswithin 1/2 area;2.there is no chip or crack on the lens atanother 1/2 area

A

2 Screw glue

Normally screw glue shall be symmetricaldistributed around lens circle side.Particular circs, glue distribution must notdisturb customer’s assembly operation.

A

3 Sealed glue

Sealed glue distributing between holder andFPC must be symmetrical and smooth. Notallow glue leakage and asymmetric thickness.After holder assembly, the thickness distancebetween one side and its opposite side shallbe less than 0.2mm. Excess glue over theholder shall not make the outside dimensionbe out of control.

A

4 FPC/PCB

Edge defect limitation: width≤1/2H (H isminimum.)、length≤1mm、defect numbersper edge≤2(No tearing gap inby edge forFPC); Edge outshoot limitation (width≤0.3mm, length≤1mm).No obvious impurity and crease on thesurface. If there was shield film on thesurface, the spot size of the film shall be lessthan 0.3mm×1mm and no line is exposed. If itwas not be cleaned and did not influence thetotal thickness, it would be permitted. Labeland mark shall be clear enough to bediscerned.

A

5 ConnectorNo dust, fingerprint, and not allows to turningcolors, distortion; Solder must be well; Noopen circuit or short circuit.

A

6 Protective filmNo dust in the glue side. Not allows to float ordrop.

B



Remark:1. The definition of the appearance importance class

A：The defect can be found in the finished product, or have obvious visual differences fromgood products, such as crack, defect and dust, or influence image quality, or are appointedby the customer. We will emphasize these items and check all products.

B：The defect can be found in the finished product and has visual difference from the good one,but will not affect customer’s aesthetic judgement. Or the defect can not be found in thefinished product and will not generate functional problem, but will slightly influencesequential manufacture process or condition. We will supervise these items in themanufacturing process and check products selectively.

C：Check method: distance 30cm, visual vertical or 45°reflection.

2. Sampling standardReferenced standard: GB/T 2828.1-2003/ISO 2859-1:1999 and ANSI/ASQC.4-1993 Ⅱ



Image Specification

NO. Item Standard

1

TV Line

Center≥13000.7 viewing field ≥1100

2

Blemish

Full screen

IC Blemish: Contrast>10%, Pixel number≤4*5

IR Blemish: Contrast>1.0%, Pixel number≤100*100

3

Distortion

-1.5%<TV Distortion<1.5%



Precautions for Using CCM Modules

Handing Precautions—DO NOT try to open the unit enclosure as there is no user-serviceable component inside. To

prevent damage to the camera module by electrostatic discharge, handling the camera module onlyafter discharging all static electricity from yourself and ensuring a static-free environment for thecamera module.

—DO NOT touch the top surface of the lens.—DO NOT press down on the lens.—DO NOT try to focus the lens.—DO NOT put the camera module in a dusty environment.—To reduce the risk of electrical shock and damage to the camera module, turn off the power before

connect and disconnect the camera module.—DO NOT drop the camera module more than 60 cm onto any hard surface.—DO NOT expose the camera module to rain or moisture.—DO NOT expose the camera module to direct sunlight.—DO NOT put the camera module in a high temperature environment.—DO NOT use liquid or aerosol cleaners to clean the lens.—DO NOT make any charges or modifications to the camera module.—DO NOT subject the camera module to strong electromagnetic field.—DO NOT subject the camera module to excessive vibration or shock.—DO NOT impact or nip the camera module with speculate things—DO NOT alter, modify or change the shape of the tab on the metal frame.—DO NOT make extra holes on the printed circuit board, modify its shape or change the positions of

components to be attached.—DO NOT damage or modify the pattern writing on the printed circuit board.—Absolutely DO NOT modify the zebra rubber strip (conductive rubber) or heat seal connector—Except for soldering the interface, DO NOT make any alterations or modifications with a soldering

iron.—DO NOT twist FPC of CCM.



Precaution for assemble the module with BTB connector:

Please note the position of the male and female connector position, don’t assemble or assemble likethe method which the following picture shows



Precaution for assembling the module to terminal unit

The temperature of running module is high base on the high-integrated sensor. In order to enhancethe heat dissipation and reduce the noise infection from high temperature, TRULY recommend that themodule’s backside should be touched with rigid material directly, like as PCB or metal. If necessary,it’s recommended the module backside is affixed with the materials which can transfer heat, like aselectric-fabric, electric-adhesive, or electric-sponge.

Precaution for soldering the CCM:

Manual soldering Machine drag soldering Machine press soldering

Non-RoHSproduct

290°C ~350°CTime: 3-5s

330°C ~350°CSpeed: 4-8mm/s

300°C ~330°CTime: 3-6sPress: 0.8~1.2Mpa

RoHSproduct

340°C ~370°CTime: 3-5s

350°C ~370°CSpeed: 4-8mm/s

330°C ~360°CTime: 3-6sPress: 0.8~1.2Mpa

(1) If soldering flux is used, be sure to remove any remaining flux after finishing to solderingoperation. (This does not apply in the case of a non-halogen type of flux.) It is recommendedthat you protect the lens surface with a cover during soldering to prevent any damage due toflux spatters.

(2) The CCM module and board should not be detached more than three times. This maximumnumber is determined by the temperature and time conditions mentioned above, though theremay be some variance depending on the temperature of the soldering iron.



Other precautions

For correct using please refer to the relative criterions of electronic products.

Limited Warranty

Unless agreed between TRULY and customer, TRULY will replace or repair any of its CCMmodules which are found to be functionally defective when inspected in accordance with TRULY CCMacceptance standards for a period of one year from date of shipments. Cosmetic/visual defects must bereturned to TRULY within 90 days of shipment. Confirmation of such date shall be based on freightdocuments. The warranty liability of TRULY limited to repair and/or replacement on the terms set forthabove. TRULY will not being responsible for any subsequent or consequential events.

Return CCM under warranty

No warranty can be granted if the precautions stated above have been disregarded. The typicalexamples of violations are:

-Holder is apart from module.-Holder or Connector is anamorphic.-Connector is turn-up.-FPC is lacerated or discon-nexion, and so on.

Module repairs will be invoiced to the customer upon mutual agreement. Modules must bereturned with sufficient description of the failures or defects. Any connectors or cable installed by thecustomer must be removed completely without damaging the PCB eyelet, conductors and terminals.



Package Specification

Packaging Design One

Product No. CM9067-B500BF-E Release date

Product name Compact Camera Module Releaser

SupplierTRULY

OPTO-ELECTRONICS LTD.Recycle □YES ■NO

Quantity/ each box 2800PCS Material for box ■paper □plastic

Outer carton box size 405mm*290mm*290mm

Box type ■new □updateQuantity / inner box *Quantity / outer box

70PCS×10=700 PCS700PCS×4=2800 PCS

Packing Standards:

There are 70modules in eachplastic plate.

There are 700modules in each innercarton box.

There are 4 innercarton boxes in eachouter carton box.

Requirements of outer carton box :1．Weight(Max): TBD Kg2．Height (Max): 0.29 M3．Prohibition: Box made by log

Material for Plastic trayIt is made of antistatic polystyrene which has no chemical pollution. Surface resistivity : 106 ohm/sq



Packaging Design Two

Product No. CM9067-B500BF-E Release date

Product name Compact Camera Module Releaser

SupplierTRULY

OPTO-ELECTRONICS LTD.Recycle □YES ■NO

Quantity/ each box 1400PCS Material for box ■paper □plastic

Outer carton box size 405 mm *290 mm *170 mm

Box type ■new □updateQuantity / inner box *Quantity / outer box

70PCS×10=700 PCS700PCS×2=1400 PCS

Packing Standards:

There are 70modules in eachplastic plate.

There are 700modules in each innercarton box.

There are 2 innercarton boxes in eachouter carton box.

Requirements of outer carton box :4．Weight(Max): TBD Kg5．Height (Max): 0.17 M6．Prohibition: Box made by log

Material for Plastic trayIt is made of antistatic polystyrene which has no chemical pollution. Surface resistivity : 106 ohm/sq



Prior Consult Matter

1.① For Truly standard products, we keep the right to change material, process for improving theproduct property without notice on our customer.

②For OEM products, if any change needed which may affect the product property, we will consultwith our customer in advance.

2. If you have special requirement about reliability condition, please let us know before you start thetest on our samples.

Factory Contact Information

FACTORY NAME: TRULY OPTO-ELECTRONICS LTD.FACTORY ADDRESS: Truly Industrial Area, ShanWei City, GuangDong, ChinaURL: http://www.trulyopto.com

Documents

SPECIFICATION - TRULY AMERICA · 32 48 mA IDD-IO 78 100 mA IDD-A active (operating) current with external DVDD 2592 x 1944 @ 15 fps 32 48 mA IDD-IO 1.8 2.4 mA IDD-D 72 94 mA IDD-A