Embed Size (px)
Citation preview
SPH-7 Slurry
SPH-7 slurry was developed for polishing C-axis Sapphire. In order to meet the production volume increase and requirement of cost reduction, SPH-7 slurry achieves more than 3 times removal rate compared with colloidal silica under the same polishing condition such as pressure, plate rotation, pad, slurry flow etc. Baikowski is offering drastic improvement of productivity and reduce of polishing cost without additional investment.
Removal rate advantage
Grinding 600 grit
Polish 30 min
Polish 60 min
Polish 90 min
Colloidal silica RR 1.97µm/hour
SPH-7 RR 6.28µm/hour
Surface roughness
【Polishing condition】 Machine Pad Plate rotation Down force Slurry flow Work Slurry dilution
：φ15” single side ：SUBA 600 ：80 rpm ：400 g/cm2
：50 mｌ/min ：Sapphire C axis ：1 : 2
Packaging : ２０KG container, ４KG bottle
Ra : 0.168nm Baikowski Japan Co., Ltd. 6-17-13 Higashinarahino Narashino-city Chiba, 275-0001 Japan TEL 81(0)47 4738150 FAX 81(0)47 4738153 [email protected]
Container Bottle
D50(µm） PH DilutionSPH-7 0.25 11-13 1:2
【Slurry formulation】
