SPI HS70

Remote Control of Multiple Lines withRMCworks

It costs highly to post process analysis technicians for eachproduction line. RMCworks provides solution that onetechnical manager monitors multiple lines at remote to savemanpower and enables to control all lines consistently andsystematically. It displays intuitively main index and trend ofprinting process for each machine as well as machine statusin real time. Remote technician calls field operator when anyactions are required to the machine, which leads to save inmanpower of field operators.

Systematic Process Management byInspection Spec Server

Tolerance is the judgment factor between Good and Bad PCB,which is always required to be adjusted during every Jobchange, it should be managed by each part for more strictprocess management. However, it requires much effort andtime for users to remember all tolerance values and applythem during every job change. Inspection spec server reduceswork loads of users by managing tolerance for each part andrequired common tolerance for the inspection at the mainserver. Main function is that database of the server managesall tolerance values registered or modified by SPI systemswhich are connected through LAN, and each SPI systemrequests tolerance values to the server when there is a jobchange which would set tolerance for every part of the PCBautomatically.

Machine Status Monitoring : It displays current machinestatus whether machine is in operation, waiting after detectingdefects or stopped.

Production Yield Monitoring : The most important factor,yield status and trend, for production manager are displayedin various ways.

Printing Process Status Monitoring : It displays height, area,volume and offset trend of solder paste by histogram.

PCB Shrink Status Monitoring : It displays PCB shrink rate byline graphs.

Remote Control : It enables to control the machine at remotesite as if controlling the machine at production line.

Alarming : Alarm window is created to notify remotetechnician when the machine detects defect PCB.

Machine Status Monitoring

Production Trend Monitoring

Printing Process Status Monitoring

Inspection Spec Server

Specifications

Measurement

Board Specification

System Dimensions

Hardware System

Software System

Interface

Options

PARMI CO., LTD.Daeduk Atomic Valley 461-63Jeonmin-dong, Yuseong-gu, Daejeon, 305-811, KOREA www.parmi.comparmi@parmi.comTEL. +82-42-478-9900FAX. +82-42-478-9905

SPI HS70

3D solder paste inspection system

Innovating printing processRealizing zero false-call & escape rateEnhancing yield dramatically

SPI HS70TM

3D solder paste inspection system

Innovating printing processRealizing zero false-call & escape rateEnhancing yield dramatically

Green SRon pad

Paste Silk Pad Green SRon epoxy

Black SR

Real-Time Warp Tracking

SPI HS70 system is optimized to enhance yield on solder paste printing processof real production line rather than off-line tests. Highly improved 3D measuringperformance guarantees zero false-call and escape-rate on high speed andfinest component placement production lines, together with various processanalysis tools, it provides fast and accurate analysis and stabilization of printingprocess.

Real 3D with Superior Accuracy & Speed

SPI HS70 with RSCVI sensor head has distincttechnological specialties which guarantee the best GageR&R capability and measure with excellent reliability on01005 chip, diameter of 150um CSP, and fine pitch leadsparts. Printer process analysis and stabilization isensured by high accuracy only, reliable Gage R&Rcapability would be one of necessary conditions but notonly necessary sufficient condition for the processanalysis and stabilization.

Dual Laser Projection : is standard which leads to onestep higher measuring accuracy with no shadow effect.

3D Data Generation at 10x10um Interval : It enables toextract 4 times more data on the same area than with20x20um resolution, which results an epoch-makingimprovement of measuring reliability on finest pads.

High Adaptability to Diverse Panel Conditions : Thesensing technology with wide bandwidth managesperfectly on various brightness range and finishingconditions which show clear distinction with othertechnologies that could extract only solder paste shape.

Sensor Head Tracks Panel Warp in Real Time : Theheight of 3D sensor is always controlled dynamically to bein DOF (depth of focus) which leads consistent accuracyon warped PCBs.

80 cm2/sec : It meets the cycle time of high speedproduction lines at 10x10um without loss of accuracy.

Paste over QFP pads Paste, SR over epoxyPaste, Silk, PadPaste, SR over trace

Comparison between Laser and Light Bandwidth

RSCVI Sensor Head

Light intensity to Camera

Necessary Unique Features for CompleteProcess Control

From experience, there are slight differences between eachproduction line, the cause of printing process defects are notonly from screen printers but it is actually contributed todefects on bare PCBs and misuse of screen printer byoperators. SPI HS70 provides unique functions only by PARMIto control screen printing process more ideally.

Measuring PCB Dimension Variation : Measuring shrink andexpansion of PCB to find out the original cause of theproblem on PCB defects as well as it compensates positionaloffset of printed solder paste.

Measuring PCB Warp : PCB warp actually proves to largelyaffects on general printing, mounting and soldering process.Only PARMI provides warp measuring function prevents PCBdefects when mounting parts.

Intuitive Monitoring of Printing Status : The main viewer ofthe system shows 2D & 3D images and measured values incolors for each pad in real time which enables to see printingstatus and debugging with parameters at a very short time.Each pad is colored according to measured value(height,area, volume and offset) which help to operator to see printerstatus by position and size of the pads, and also the pads arecolored according to sigma and defect frequency.

Tracing Defect PCBs and Operator Treatment : The origin ofa defect should be clearly checked whether it is from printingprocess by operator, SPI system or tolerance settingproblem. For this, operator’s work history and defect panelreviewer information are provided.

Solder paste defect causes & analysis

Positional Offset by Panel Shrink

PCB Warp 3D image

Tracing Defect PCBsIntuitive Monitoring of Printing Status

SPI HS70

Yield Enhancing with SPCworksPro

Main roles of SPI systems are 1) complete defectdetection and 2) enhancement on yield by accurateanalysis and stabilization of printing process. For the firstrole, the accuracy of SPI system should be guaranteedand for the second role, practical SPC tool should beprovided. SPCworksPro of PARMI is no more based ontextbook but it is live SPC considering actual fieldenvironment, designed to immediateness, intuitivenessand dimensional analysis of process detection be asstandard. For immediateness, every process is connectedwith network so it can be connected from any terminalsand all data are updated in real time. User interface isdesigned to be used and understand easily by managersand operators. Moreover, for dimensional analysis of theprocess, various functions are provided as following.

Production Yield Graph : It displays yield trendaccording to production rate by hourly, weekly andmonthly.

Defect Type Analysis : It displays whole defects by eachdefect type.

Defect Frequency Analysis : It displays pads with defectdetected frequently in different colors and it enables totrace defects on PCBs by defect history display andbarcode search function.

Module Yield Statistics : It creates production yield liston PCBs and produces yield statistics by hourly, dailyand each shift.

Variable Analysis : X-bar & R, Sigma, Cp and CPKcharts are provided for variable analysis.

Report : Customized report form is automaticallycreated and measured data are exported as a file to beimported to Minitab and Excel on request.

Variable Analysis

Network based SPCworksPro

Production Yield Graph

Defect Frequency Analysis