STATUS OF AIM PHOTONICS...Strategic – differentiation potentials Long Term – competitiveness Short Term – performance proof 2018 – > 5 $/Gbs* 2019 – < 2 $/Gbs* 2020

American Institute for Manufacturing Integrated Photonics

STATUS OF AIM PHOTONICS September 26th, 2017 Michael Liehr

Manufacturing USA SUNY Poly Integrated Photonics

Manufacturing USA Strategic Goals

https://www.manufacturingusa.com/resources/national-network-manufacturing-innovation-nnmi-program-strategic-plan

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With permission from Mike Molnar

Federal startup investment: minimum $70M/institute over 5 years Institute Consortium owners must have minimum 1:1 co-investment

Manufacturing Institute Framework

Applied Research + Education/Workforce Skills = Development of Future “Manufacturing Hubs”

• Federal funding is the catalyst to bring

stakeholders into shared space to de-risk innovation.

• Focus is on industry-relevant problems impacting commercial production, MRL 4-7.

• Institutes must be self-sustaining after federal startup investment ends.

• Workforce training and development is an essential component in institute focus.

Standards organizations

Presenter

Presentation Notes

If you read the design report the executive summary highlights that there are TWO principal missions for each institute, equally important. Applied Research – this is to “de-risk” and speed up ideas and inventions into solutions that U.S. manufacturers can use in their products and processes. Education and Workforce – U.S. manufacturers continue to face a critical shortage of skilled workers. Each institute has a role to play for education and workforce skills related to their chartered topic. In this contest Institutes are not competing with universities and community colleges, but partnering with them on advancing the knowledge needed. Together, the goal is to catalyze “manufacturing hubs” – building the supply chain and capabilities so that the U.S. leads in each respective area. (add in any amplifying message about workforce, supply chains)

Manufacturing USA Today

Regional Hubs with National Impact

Regenerative Manufacturing

Manchester,

NH

Advanced Fibers and

Textiles

Cambridge MA

Digital Manufacturin

g & Design

Chicago, IL

Sustainable Manufacturing

Rochester, NY

Integrated Photonics

Albany, NY Rochester,

NY

Modular Chemical Process

Intensification

New York, NY

Bio-pharmaceutical Manufacturing

Newark, DE

Wide Bandgap Semiconductor

s

Raleigh, NC

Advanced Robotics

Pittsburgh, PA

Advanced Composites

Knoxville, TN

Additive Manufacturing

Youngstown, OH

Lightweight Metals

Detroit, MI

Smart Sensors and Digital

Process Control

Los Angeles, CA

Flexible Hybrid Electronics

San Jose, CA

Presenter

Presentation Notes

Version:May 5, 2017

high performance embedded computing data centers

SiPh Interconnect Network

Memory Stack

Blades

CMPs

EXA FLOP SCALE SYSTEM

dense WDM multi Tb/s low energy integrated transceivers

high radix nanosecond scale photonic switch fabric HP HyperX

© Copyright AIM Photonics 2015 5

Scaling Impediment Power

Silicon or InP?

• CMOS processing of photonics is already happening, yet high cost and small size of III-V wafers remains an issue.

• Goal: Grow III-V active components on larger and cheaper silicon substrates without sacrificing laser performance for lower cost and higher throughput.

[1] Bowers, John E., et al. "A Path to 300 mm Hybrid Silicon Photonic Integrated Circuits.” OFC 2014

(Photo courtesy of Dr. Jordan Lang, Yale)

300 mm Silicon - ~$0.2 cm-2 100 mm InP - ~$4.0 cm-2

With permission from John E. Bowers

Yole Forecast (Oct 2016)

$1.6B $300M

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Market Segments Market Forecast

• High performance computing earliest adapters • Medical, consumer and chip-chip drive “real” volumes

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http://www.semiconductor-today.com/news_items/2012/SEP/YOLE_270912.html

Heterogeneous Photonic Circuit Manufacturing

Silicon photonics PIC using silicon foundries

Package assembly using silicon Assembly and Test Infrastructure

Low cost optical connector attach

With permission from John E. Bowers

American Institute for Manufacturing (AIM) Integrated Photonics

Datacommunications Sensing

PIC Array Technologies RF Photonics

Electronic-Photonic Design Automation

Multi-Project Wafer and Assembly

Inline Controls and Test

Test Assembly and Optical Packaging

Vision: Establish a technology, business and education framework for industry, government and academia to accelerate the transition of integrated photonic solutions from innovation to manufacturing-ready deployment in systems spanning commercial and defense applications.

Lead: American Institute for Manufacturing Integrated Photonics (AIM Photonics) (Research Foundation SUNY) Established: July 2015 Hub location: New York State Funding: $110M federal investment combined with >$500M Industry/State cost share

Manufacturing innovation Centers of Excellence

Key Technology Manufacturing Areas

Presenter

Presentation Notes

Director of the National Economic Council Gene B. Sperling, Acting Secretary of Commerce Rebecca M. Blank and Under Secretary of Defense Frank Kendall along with Brett B. Lambert, Deputy Assistant Secretary of Defense Manufacturing & Industrial Base Policy, Ohio Senator Sherrod Brown, Congressman Tim Ryan and DOE’s David Danielson, Assistant Secretary for Energy Efficiency and Renewable Energy Dr. Blanc said, “We’re not interested in building your grandfather’s research institute. The approaches that worked for us in the 20th century aren’t good enough anymore. Instead, we need to build a 21st century model that reflects a strategic, global approach to competitiveness and innovation. This model has to be based on close partnerships between the academic and business world, with support from government as well. This type of collaboration is absolutely essential to ensure that Made in America remains a strong slogan well into the future.” Secretary Kendall commented, “It’s no mystery why Additive manufacturing was chosen as the institute’s focus-area. It’s simply revolutionary. But it is simply not enough to develop revolutionary technology. We need to find a way to insert it into our supply chains. But that is full of challenges. The key is to find a prime contractor-- a Lockheed, Northrop, Honeywell, Boeing– to decide to use additive manufacturing on their production floor or in their supply base. So how can we ensure Primes adopt these advances into their production? How can we ensure innovative small businesses can gain access to expensive capital equipment and collaborate with national experts in this field? And how can we build a new generation of experts in this exciting craft? We may need to look no further than partnerships like the one we celebrate today.”

Core Tenets of the AIM Approach 1. Establish a long-term partnership with leading edge

universities and industry

2. Provide an open-access public-private partnership Si Photonics capability with a low threshold for entry to SMEs, academia, federal agencies and large enterprises

3. Significant State matching funds dedicated to

establish state-of-the-art capability for Wafer Fabrication, Test, Assembly and Packaging

AIM facilitates tech transfer with capability at MRL 9

Include the best integrated photonics experts in the U.S.

AIM focuses on financial drivers for manufacturability

Consortium Concept

Cost-driven wafer manufacturing @ 300mm 1st tier tool suppliers; leading-edge processes Packaging and test supply chain Multi Project Wafer infrastructure Established consortia and road mapping

Si photonics processes are non-standard Need to integrate optically active materials, e.g. InP Foundry infrastructure immature

Adapt the semiconductor infrastructure to photonics

“Derive from” basic Semiconductors Moving fiber, lasers and photodetectors onto a wafer to take advantage of scaling and the semiconductor design and equipment infrastructure for unprecedented advances in productivity and novel applications

Presenter

Presentation Notes

Today at 15nm 65nm ideally suited for 3Di Open access model

CNBC ranks “New York first in innovation among all U.S. states”

SUNY Poly, is NOT a Traditional University:

• Public and private investments in excess of $20B with >$300 M in annual sponsored R&D

• Over 3,200 jobs on site (2,700 from industrial partners)

• > 1,670,000 sq.ft. of cutting-edge facilities, 135,000 sq.ft. of industry compliant 300mm cleanrooms

• More than 300 industry partners including electronics, energy, defense & biohealth

Presenter

Presentation Notes

Core Competency: Silicon

Leading-edge silicon pilot line Key industry players and consortia as anchor tenants Full set of 300 mm wafer tools

Leading-edge lithography (MUV, 193i, EUV) Since 32nm, used now for 5 nm CMOS node development Backwards compatible to 65 nm; license to produce Building commercial Si-Photonics parts Capacity of ~5,000 wafer starts per month 24/7 pilot line operation, capable of 3 DPML TAT

Advanced 2.5D / 3D packaging development

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TAT – turn-around-time DPML – Days per Mask Layer

MUV – mid-UV 365nm “i-line” EUV – extreme UV 13.5nm

5nm

Presenter

Presentation Notes

Today at 15nm 65nm ideally suited for 3Di Open access model

Closing the Gap Between University and Industry

It‘s not enough to establish a pilot line. It‘s about paving the way to take research results into manufacturing.

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Mfg Basics / Concepts Identified

Proof of Concepts / Lab Production Environment

Component / System / Subsystem Prototypes – Production Environment

Pilot Line Capability – Low Volume Production

High Volume Mfg

2 3 4 5 6 7 8 9 10 MRL Manufacturing

Readiness Level

Closing the Gap

Commercial Investments

University Research

Research & Development Phase

Pilot / Prototype / Demo Phase

Manufacturing Ramp-Up Phase

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Membership 2017

Members – 78 Interest – 12 Countries / 34 US States

Key Technology Manufacturing Areas Projects

Datacom High Capacity Photonic Interconnected Systems:

Scalable Datacenter Switching & Interposer Solutions

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Analog/RF Applications High Dynamic Range RF Photonics for

Wideband Systems Integrated Photonic Analog Link and Processing

on InP

Photonic Integrated Circuit (PIC) Sensors Universal Transducer Components and

Microfluidic Systems for Sensing

Photonic Integrated Circuit (PIC) Array Technologies Free-Space Communications with PIC Array

P-Contact N-Contact

Datacom / Telecom - Transmission Two significant challenges for the Datacenter and more

broadly for Datacom System • high-capacity communications • high efficiency switching

Cisco VNI Forecasts 194 EB per Month of IP Traffic by 2020

Optical Transmission market trend for Data Centers

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DataCom Transceiver Roadmap - preliminary

Strategic – differentiation potentials

Long Term – competitiveness Short Term –

performance proof

2018 – > 5 $/Gbs* 2019 – < 2 $/Gbs*

2020 – ~0.5 $/Gbs*

Market Price Estimates ($/Gbs)

Wafer/2.5D/3D

Lasers CMOS

Packaging

Capsulation Licenses Customer Margin

2020/21 – <<0.5 $/Gbs*

Architecture 4x 100Gbs 4 Lasers / 4 CMOS

Architecture 8x 320Gbs 8 wavelength’ 64 Lasers / 8 CMOS

2.56Tbs 400Gbs

100Gbs

* estimates

Manufacturing Center of Excellence Projects

Electronic Photonic Design Automation (EPDA) Reference Design and System Co-sim Modeling EPDA Standards Development DFM Methods, PDK Extensions and Tools for

Photonic Systems

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Multi-Project Wafer and Assembly (MPWA) Si Photonics MPWA: SUNY Poly 300 mm Si

Photonics process moving to 3D integration Optical/Electrical WAC Testing & Automated

probe development 2.5D Integration of Lasers/PICs on passive and

active interposers InP MPW & EPDA Heteroepitaxy growth of Q-dot lasers on

300mm Si wafers

EPDA Effort

Manufacturing Center of Excellence Projects

Test, Assembly and Optical Packaging (TAP) Chip Scale Packaging Rochester Packaging Facility Development Functional Testing Development for Automated

Scaled Manufacturing High Density Fiber Connectivity OPCB & Polymer WG Connectivity

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AIM Photonics Manufacturing at ON Semiconductor in Rochester, NY

AIM Summer Academy 2017

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Dies attached to a 300mm photonic interposer wafer at SUNY Poly

500 Gb/sec Infinera InP transceiver

SUNY Poly 14nm FinFET and III-V FINs

SiC power module

Contact Us http://www.aimphotonics.com/contact/

This material is based on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5220

Documents

STATUS OF AIM PHOTONICS...Strategic – differentiation potentials Long Term – competitiveness Short Term – performance proof 2018 – > 5 $/Gbs* 2019 – < 2 $/Gbs* 2020