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Thermal Interface Material

High Performance Thermal PastePhase Change Material

Stay Cool – Heat Dissipation is Our Job

SEMIKRON

Thermal Grease Phase Change Material

Module familiySilicone-based Standard Grease

High Performance Thermal Paste, HPTP (silicone-based)

MiniSKiiP Gen. II 0-3 X X -

MiniSKiiP 8 X X -

MiniSKiiP 2/3 Dual X X -

SKiM 63/93 X X -

SKiM 4 X X -

SKiM 5 - X -

SEMITOP 3/4 X X -

SEMITOP E2 - X X

SEMiX 1s-4s - - X

SEMiX 13 - - X

SEMiX 33 - - X

SEMiX 3 Press-Fit - - X

SEMiX 5 - - X

SEMITRANS 2 - - X

SEMITRANS 3/4 - - X

SEMITRANS 10 - - X

SEMIPACK 2 - - X

SEMIKRON was the first power module manufacturer on the market to offerpower modules with a pre-applied thermal interface material. With more thantwo decades of field experience and more than 12 million pre-printed modules in the field, new reliability benchmarks are being set.

Different application requirements, environmental conditions and production processes call for different thermal interface materials.

For each requirement SEMIKRON offers the right choice of material. In addition to the standard silicone thermal grease, a phase change material and high performance thermal paste with improved thermal performance are also available. A thermal grease or a phase change material is recommended for the given customer needs for handling and module perfor-mance as well as module type (baseplate, baseplate-less).

Phase change materials with a rigid consistency at room tem-peratures can fully exploit the advantages that a non-smearing TIM layer offers on modules without any other drawbacks. Modules with no baseplate, on the other hand, usually require a lower-viscosity material to help improve robustness during assembly. Here, thermal grease is the preferred solution.

Advantages of modules applied using SEMIKRON’s automated silk screen and stencil process:- Increased productivity thanks to reduced handling

costs and improved logistics- Low thermal resistance with optimised TIM layer thickness- Improved lifetime and reliability- Improved assembly robustness- Modules can be shipped directly to the assembly line

without any additional treatment processes- Lower overall costs

Thermal Interface Material

Power Module

Baseplate

Phase Change Material

SEMiX 3 Press-Fit

Baseplate-less

High Performance Thermal Paste

Standard Grease Silicone-Based

MiniSKiiP

Phase Change Material

SEMIKRON

Outstanding thermal performance and increased lifetimeHigh Performance Thermal Paste is the new SEMIKRON solution forboosting the performance of baseplate-less modules. The material is asilicone-based thermal grease with outstanding thermal conductivity.Replacing standard TIM materials with High Performance Thermal Paste results in either a lower chip temperature and thereforelonger power module lifetime, or it allows for higher output currentsin the given application. Any combination of both benefits, longer life time and higher output current, is possible with small trade-offs.

A print layout developed individually for each module ensures highassembly robustness and means the client can always use the sameassembly process irrespective of the type of thermal grease used.

Key features

- Easy handling thanks to solid contact surfaces, no TIM layer smearing

- Optimised thickness for minimum thermal resistance

Key features

- Outstanding thermal performance

- Up to 50% lower chip-to-heat sink thermal resistance than with standard TIM

- Up to 25% more module output power or up to several decades more lifetime

- Fewer manufacturing processes and lower material costs

- No need for expensive ceramic substrates such as aluminium nitride

- Excellent assembly robustness for modules without baseplate

- Proven long-term reliability without pump-out

- No screw retightening required after first operation

- Up to 15% lower chip-to-heat sink thermal resistance than with standard TIM

High Performance Thermal Paste

Phase Change Material

Easier handling thanks to the dry contact surface The rigid and dry TIM layer ensures that accidental touching does not lead to any damage in the print pattern. For each module package size, a specific print pattern layout is developed in accordance with the intentional baseplate bending.

This layout ensures metal-to-metal contact between selected areas of the module baseplate and the heat sink. Only the cavities (baseplate bending and the heatsink roughness) are filled with thermal interface material. This approach has two main advantages:

- Thermal resistance Rth(j-s) is optimised

- No screw retightening required after first operation

-35

-30

-25

-20

-15

-10

-5

0

100 105 110 115 120 125 130

Output power [%]

Oper

atin

g te

mpe

ratu

re re

duct

ion

[K]

Based on MiniSKiiP Dual with conventional paste; Tj op. = 150°C

Power Increase

Life

time

Incr

ease

Baseplate bending for SEMiX Press-Fit

We are close to our customerswww.semikron.com/contact

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Not

e: A

ll in

form

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bas

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sent

kno

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and

is to

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used

for i

nfor

mat

ion

purp

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onl

y. T

he s

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ficat

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of o

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SEMIKRON INtERNatIONal GmbHSigmundstrasse 20090431 Nuremberg, GermanyTel: +49 911 6559 6663Fax: +49 911 6559 262sales@semikron.com

www.semikron.comshop.semikron.com